Lengthened AC optocoupler

Abstract

The utility model provides a lengthened AC optocoupler. The lengthened AC optocoupler comprises an IR lead frame and a PT lead frame. The two lead frame base islands are fixedly installed on the two sides of the surface of the IR lead frame respectively. The base island grooves are formed in the surfaces of the lead frame base islands, integrated circuit chips are arranged in the base island grooves, and a bonding wire is arranged between the two lead frame base islands. The utility model provides a lengthened AC optocoupler, which is composed of an IR lead frame and a PT lead frame, the lead frame is formed by arraying a plurality of frame units, the frame units are arranged in 9 rows and 24 columns, the middle 22 columns of pins are in reverse staggered distribution, and the IR lead frame unit is provided with two base islands and can bear a bidirectional LED chip. The IR lead frame and the PT lead frame form a complete AC optocoupler frame, the frame space can be fully utilized, the frame density can be improved to the maximum extent, and the function requirement of the AC optocoupler can be met.

Description

TECHNICAL FIELD

[0001] The utility model relates to the lead frame design field of semiconductor packaging industry especially relates to a lengthened AC optocoupler. BACKGROUND

[0002] In the fast development modern electronic technology, photoelectric coupler (optocoupler) becomes the key role in the circuit design by its excellent electrical isolation and signal transmission capacity, AC (AC) optoccoupler its unique bidirectional light emitting diode (LED) structure makes it can handle positive and negative alternating AC signal stably, under high frequency and high voltage environment, AC optoccoupler shows strong anti-interference ability, especially suitable for industrial automation, AC power control and signal isolation scenes, and not by signal polarity limit, can work stably in wider voltage range, lead frame as integrated circuit chip carrier, it is a kind of key structural member that the electrical connection of chip internal circuit lead-out end and external lead is realized by bonding material, it plays the bridge role of connection with external wire, and the lead frame is needed in the majority of semiconductor integrated blocks, and it is important basic material in electronic information industry.

[0003] The structure of traditional LSOP-4 direct current (DC) optocoupler is relatively simple, and it is designed for direct current signal processing, and the core is one-way LED, so the IR lead frame part carrying LED only needs one base island, cannot carry bidirectional LED chip, and the practicability is poor.

[0004] Therefore, it is necessary to provide a lengthened AC optocoupler to solve the above technical problems. UTILITY MODEL CONTENTS

[0005] The utility model provides a lengthened AC optocoupler, solve the structure of traditional LSOP-4 direct current (DC) optocoupler relatively simple, and it is designed for direct current signal processing, and the core is one-way LED, so the IR lead frame part carrying LED only needs one base island, cannot carry bidirectional LED chip, and the practicability is poor.

[0006] To solve the above technical problems, the utility model provides a lengthened AC optocoupler, including: IR lead frame and PT lead frame;

[0007] Lead frame base island, two lead frame base islands are fixedly installed on the two sides of the surface of the IR lead frame

[0008] Base island groove, the base island groove is arranged on the surface of the lead frame base island, integrated circuit chip is arranged in the inside of the base island groove, and bonding wire is arranged between the two lead frame base islands;

[0009] A lock hinge hole design is arranged on the surface of the IR lead frame, and the other side of the IR lead frame surface is provided with a pin.

[0010] Preferably, the lead frame is formed by a plurality of frame unit arrays, and the frame unit has 9 rows and 24 columns in total, and the middle 22 columns of pins are distributed in reverse and staggered, so that the frame space can be fully utilized and the frame density is maximized.

[0011] Preferably, the IR lead frame includes two lead frame base islands and two pins, the lead frame base islands are symmetrically distributed, and the PT lead frame has only one lead frame base island.

[0012] Preferably, one side of the surface of the IR lead frame is provided with a silicon nitride insulating ceramic substrate 7, the outer surface of the silicon nitride insulating ceramic substrate is provided with an epoxy plastic sealing shell, and the outer surface of the epoxy plastic sealing shell is provided with a heat dissipation copper substrate.

[0013] Preferably, the silicon nitride insulating ceramic substrate adopts a silicon nitride AMB ceramic substrate, and the upper and lower layers of the silicon nitride insulating ceramic substrate are respectively formed with an oxygen-free copper layer structure, and the middle layer is made of a high-thermal-conductivity and high-reliability Si3N4 ceramic material layer.

[0014] Preferably, the upper surface of the silicon nitride insulating ceramic substrate is provided with a circuit etching area, and the lower surface of the silicon nitride insulating ceramic substrate is connected with the heat dissipation copper substrate.

[0015] Preferably, the gate electrodes of the lead frame base island and the silicon nitride insulating ceramic substrate are connected by aluminum wires to realize electrical connection.

[0016] Compared with the related art, the lengthened AC optocoupler has the following beneficial effects:

[0017] The lengthened AC optocoupler is composed of an IR lead frame and a PT lead frame, the lead frame is formed by a plurality of frame unit arrays, the frame unit has 9 rows and 24 columns in total, the middle 22 columns of pins are distributed in reverse and staggered, the IR lead frame unit has two base islands and can carry bidirectional LED chips, the IR lead frame and the PT lead frame form a complete AC optocoupler frame, the device can fully utilize the frame space, maximally improve the frame density, and realize the functional requirements of the AC optocoupler. BRIEF DESCRIPTION OF DRAWINGS

[0018] Figure 1 The structure diagram of the lengthened AC optocoupler is shown in the first embodiment of the utility model.

[0019] Figure 2LSOP-4DC optocoupler function schematic diagram;

[0020] Figure 3 LSOP-4AC optocoupler function schematic diagram;

[0021] Figure 4 Old LSOP-4DC optocoupler IR lead frame unit diagram;

[0022] Figure 5 Old LSOP-4DC optocoupler PT lead frame diagram;

[0023] Figure 6 New LSOP-4AC optocoupler IR lead frame;

[0024] Figure 7 New LSOP-4AC optocoupler PT lead frame;

[0025] Figure 8 New LSOP-4AC optocoupler lead frame pin reverse staggered distribution schematic diagram;

[0026] Figure 9 New LSOP-4AC optocoupler IR lead frame unit island symmetric distribution schematic diagram;

[0027] Figure 10 New LSOP-4AC optocoupler PT lead frame island schematic diagram;

[0028] Figure 11 New LSOP-4AC optocoupler IR lead frame island groove schematic diagram;

[0029] Figure 12 New LSOP-4AC optocoupler PT lead frame island groove schematic diagram;

[0030] Figure 13 New LSOP-4AC optocoupler IR lead frame island bearing bidirectional LED chip schematic diagram;

[0031] Figure 14 New LSOP-4AC optocoupler PT lead frame island bearing chip schematic diagram;

[0032] Figure 15 The structure schematic diagram of the second embodiment of the lengthened AC optocoupler is provided.

[0033] In the figure, 1 is a lead frame island, 2 is an island groove, 3 is an integrated circuit chip, 4 is a bonding wire, 5 is a locking glue hole design, 6 is a pin, 7 is a silicon nitride insulating ceramic substrate, 8 is an epoxy plastic sealing shell, and 9 is a heat dissipation copper substrate. DETAILED DESCRIPTION

[0034] The utility model is further described below in combination with the drawings and embodiments.

[0035] First embodiment

[0036] Please see Figure 1 、 Figure 2 、 Figure 3 、 Figure 4 、 Figure 5 、 Figure 6 、 Figure 7 、 Figure 8 、 Figure 9 、 Figure 10 、 Figure 11 、 Figure 12 、 Figure 13 And Figure 14 Wherein, Figure 1 It is a structure schematic view of the first embodiment of the lengthened AC optocoupler provided by the utility model; Figure 2 It is LSOP-4DC optocoupler function principle diagram;

[0037] Figure 3 It is LSOP-4AC optocoupler function principle diagram; Figure 4 It is old LSOP-4DC optocoupler IR lead frame unit diagram; Figure 5 It is old LSOP-4DC optocoupler PT lead frame diagram; Figure 6 It is new LSOP-4AC optocoupler IR lead frame; Figure 7 It is new LSOP-4AC optocoupler PT lead frame; Figure 8 It is new LSOP-4AC optocoupler lead frame pin reverse staggered distribution schematic view; Figure 9 It is new LSOP-4AC optocoupler IR lead frame unit base island symmetric distribution schematic view; Figure 10 It is new LSOP-4AC optocoupler PT lead frame base island schematic view; Figure 11 It is new LSOP-4AC optocoupler IR lead frame base island recess schematic view; Figure 12 It is new LSOP-4AC optocoupler PT lead frame base island recess schematic view; Figure 13 It is new LSOP-4AC optocoupler IR lead frame base island bears bidirectional LED chip schematic view; Figure 14 It is new LSOP-4AC optocoupler PT lead frame base island bears chip schematic view. A lengthened AC optocoupler, comprising: IR lead frame and PT lead frame;

[0038] Lead frame base island 1, two said lead frame base islands 1 are fixedly installed on the two sides of the surface of the IR lead frame respectively

[0039] The base island groove 2 is arranged on the surface of the lead frame base island 1, and the inside of the base island groove 2 is provided with an integrated circuit chip 3; and the two lead frame base islands 1 are provided with a bonding wire 4.

[0040] The lock hinge hole design 5 is arranged on the surface of the IR lead frame, and the other side of the IR lead frame surface is provided with a pin 6.

[0041] The lead frame is formed by a plurality of frame unit arrays, and the frame unit has 9 rows and 24 columns, and the middle 22 columns of pins are reversely and staggeredly distributed, so that the frame space can be fully utilized, and the frame density is maximized.

[0042] The IR lead frame includes two lead frame base islands 1 and two pins 6, the lead frame base islands 1 are symmetrically distributed, and the PT lead frame has only one lead frame base island 1.

[0043] The working principle of the lengthened AC optocoupler is as follows:

[0044] In work, the newly designed LSOP-4AC optocoupler lead frame structure is divided into an IR lead frame and a PT lead frame, the lead frame is formed by a plurality of frame unit arrays, and the frame unit has 9 rows and 24 columns, and the middle 22 columns of pins are reversely and staggeredly distributed, so that the frame space can be fully utilized, and the frame density is maximized.

[0045] The IR lead frame unit includes two lead frame base islands 1 and two pins 6, the lead frame base islands 1 are symmetrically distributed, and the PT lead frame has only one base island.

[0046] Each lead frame base island 1 of the IR lead frame and the PT lead frame has a circular base island groove 2 in the middle for bearing an integrated circuit chip 3, and the two lead frame base islands 1 of the IR lead frame can bear bidirectional LED chips.

[0047] Compared with the related art, the lengthened AC optocoupler has the following beneficial effects:

[0048] The lengthened AC optocoupler is composed of an IR lead frame and a PT lead frame, the lead frame is formed by a plurality of frame unit arrays, and the frame unit has 9 rows and 24 columns, and the middle 22 columns of pins are reversely and staggeredly distributed, the IR lead frame unit has two base islands and can bear bidirectional LED chips, the IR lead frame and the PT lead frame form a complete AC optocoupler frame, the device can fully utilize the frame space, maximizes the frame density, and can realize the functional requirements of the AC optocoupler.

[0049] Second embodiment

[0050] Please refer to Figure 15 , based on the first embodiment of the present application provides a lengthened AC optocoupler, the second embodiment of the present application provides another lengthened AC optocoupler. The second embodiment is only the preferred mode of the first embodiment, the implementation of the second embodiment does not affect the separate implementation of the first embodiment.

[0051] Specifically, the second embodiment of the present application provides a lengthened AC optocoupler, wherein the IR lead frame surface is provided with a silicon nitride insulating ceramic substrate 7, the outer surface of the silicon nitride insulating ceramic substrate 7 is provided with an epoxy plastic sealing shell 8, and the outer surface of the epoxy plastic sealing shell 10 is provided with a heat dissipation copper substrate 9.

[0052] The silicon nitride insulating ceramic substrate 7 adopts a silicon nitride AMB ceramic substrate, and the upper and lower layers of the silicon nitride insulating ceramic substrate 7 are respectively formed with an oxygen-free copper layer structure, and the middle layer is made of a high-thermal-conductivity and high-reliability Si3N4 ceramic material layer.

[0053] The upper surface of the silicon nitride insulating ceramic substrate 7 is provided with a circuit etching area, and the lower surface of the silicon nitride insulating ceramic substrate 7 is connected with the heat dissipation copper substrate 9.

[0054] The lead frame base island 1 and each gate between the silicon nitride insulating ceramic substrate 7 and each gate of the same silicon nitride insulating ceramic substrate 7 are connected by aluminum wires to realize electrical connection.

[0055] The upper and lower copper layer structures are sintered on the middle layer through a silver sintering process, meeting the requirements of high thermal conductivity and high reliability, and the epoxy plastic sealing shell 10 is formed by epoxy plastic sealing injection molding to wrap the silicon nitride insulating ceramic substrate 11.

[0056] The working principle of the lengthened AC optocoupler provided by the utility model is as follows:

[0057] In work, first of all, through the bonding process and the lead frame and the surface of the silicon nitride insulating ceramic substrate 7 are connected, which can effectively improve the maximum fusing current of the lead frame packaging, the copper strip is used as the lead connection, which has greater current-carrying capacity, high stress resistance and strong power cycle resistance, compared with the aluminum wire, the contact area of the copper strip and the lead frame is increased, the thermal resistance and temperature rise of the power device can be greatly reduced, so that lower on-resistance can be obtained, the module heat dissipation capacity is improved, the power loss is reduced, the surface of the lead frame and the silicon nitride insulating ceramic substrate 7 is bonded to the surface of the silicon nitride insulating ceramic substrate 7 through a plurality of copper strip bonding points to realize connection, when being bonded, the pressure and ultrasonic energy act on a larger area, the pressure on the unit area of the lead frame is reduced, and the possibility of damage to the lead frame is reduced.

[0058] Compared with the related art, the lengthened AC optocoupler has the following beneficial effects:

[0059] The lengthened AC optocoupler can effectively reduce the parasitic parameters caused by the linear structure of the traditional aluminum wire or copper wire, improve the thermal conductivity and resistivity, and improve the reliability, and can effectively reduce the warping and pollution of the silicon nitride insulating ceramic substrate 7; compared with the copper wire bonding, the copper band frame is bonded with the pressure and ultrasonic energy acting on a larger area, so that the pressure on the lead frame per unit area is reduced, and the possibility of damage to the lead frame is reduced.

[0060] The above is only an embodiment of the utility model, and does not limit the patent range of the utility model, and any equivalent structure or equivalent process transformation using the utility model specification and drawing contents, or direct or indirect application in other related technical fields, are also included in the patent protection range of the utility model.

Claims

1. An extended AC optocoupler, characterized in that, include: IR leadframe and PT leadframe; Two lead frame base islands are respectively fixedly installed on both sides of the surface of the IR lead frame. The base island groove is disposed on the surface of the lead frame base island, and an integrated circuit chip is disposed inside the base island groove. A bonding wire is disposed between two lead frame base islands. A locking hinge hole design is provided on the surface of the IR lead frame, and a pin is provided on the other side of the surface of the IR lead frame.

2. The extended AC optocoupler according to claim 1, characterized in that, The lead frame is composed of an array of multiple frame units, with a total of 9 rows and 24 columns. The pins in the middle 22 columns are distributed in opposite directions, which can make full use of the frame space and maximize the frame density.

3. The extended AC optocoupler according to claim 1, characterized in that, The IR leadframe includes two leadframe base islands and two pins. The leadframe base islands are symmetrically distributed, while the PT leadframe has only one leadframe base island.

4. The extended AC optocoupler according to claim 1, characterized in that, A silicon nitride insulating ceramic substrate is disposed on one side of the surface of the IR lead frame, an epoxy encapsulation shell is disposed on the outer surface of the silicon nitride insulating ceramic substrate, and a heat dissipation copper substrate is disposed on the outer surface of the epoxy encapsulation shell.

5. An extended AC optocoupler according to claim 4, characterized in that, The silicon nitride insulating ceramic substrate is a silicon nitride AMB ceramic substrate. The upper and lower layers of the silicon nitride insulating ceramic substrate are respectively formed with oxygen-free copper layer structures, and the middle layer is a Si3N4 ceramic material layer with high thermal conductivity and high reliability.

6. The extended AC optocoupler according to claim 4, characterized in that, The upper surface of the silicon nitride insulating ceramic substrate is provided with a circuit etching area, and the lower surface of the silicon nitride insulating ceramic substrate is connected to the heat dissipation copper substrate.

7. An extended AC optocoupler according to claim 4, characterized in that, The lead frame base island and each gate of the silicon nitride insulating ceramic substrate, as well as each gate of the same silicon nitride insulating ceramic substrate, are electrically connected by aluminum wires.

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