Heat dissipation structure and battery management system
By adopting a back-to-back heat dissipation structure in the battery management system, the space on both sides of the circuit board is utilized to increase the volume of the heat sink, thus solving the problem of insufficient space for transistor heat sinks and achieving a more effective heat dissipation effect.
Patent Information
- Application Number
- CN202422945130.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-11-29
- Publication Date
- 2025-11-25
- Estimated Expiration
- 2034-11-29
AI Technical Summary
In the prior art, the limited space of the transistor heat sink in the battery management system results in poor heat dissipation and an inability to effectively reduce the operating temperature of the transistor.
The heat dissipation structure adopts a back-to-back design, with the first transistor and the second transistor located on opposite sides of the circuit board. The first heat sink and the second heat sink extend to opposite sides of the circuit board, making full use of space and increasing the volume of the heat sink to improve heat dissipation efficiency.
By increasing the size of the heat sink, the heat dissipation effect was significantly improved, the problem of transistor overheating was solved, and consumer demand was met.
Smart Images
Figure CN223600085U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to a heat dissipation structure and a battery management system. BACKGROUND
[0002] In the prior art, a plurality of transistors (e.g., MOSFETs) in a battery management system are usually arranged on one side of a circuit board, and a heat sink configured to dissipate heat from the plurality of transistors is arranged on the other side. However, this limits the space available for the heat sink to dissipate heat.
[0003] Specifically, to reduce the operating temperature of the plurality of transistors, the volume of the heat sink needs to be increased. Since the plurality of transistors are arranged on the same side, the plurality of heat sinks can only be increased in size to a limited extent. The design of the prior art cannot further increase the volume of the heat sink, thereby limiting the effectiveness of improving the overheating problem of the transistors in the battery management system.
[0004] Therefore, how to propose a heat dissipation structure and a battery management system that can solve the above problems is one of the problems that the industry urgently wants to invest in research and development resources to solve. SUMMARY
[0005] Therefore, how to propose a heat dissipation structure and a battery management system that can solve the above problems is one of the problems that the industry urgently wants to invest in research and development resources to solve.
[0006] To achieve the above-mentioned purpose, according to an embodiment of the utility model, a heat dissipation structure includes a circuit board, a first transistor, a second transistor, a first heat sink, and a second heat sink. The first transistor is arranged on a first side of the circuit board. The second transistor is arranged on a second side of the circuit board. The first heat sink is connected to the first transistor. The second heat sink is connected to the second transistor. The first heat sink extends to the second side of the circuit board. The second heat sink extends to the first side of the circuit board.
[0007] In one or more embodiments of the utility model, the first heat sink is located below the second transistor, and the second heat sink is located above the first transistor.
[0008] In one or more embodiments of the utility model, the first heat sink includes a first contact portion connected to the first transistor and a first extension portion connected to the first contact portion. The second heat sink includes a second contact portion connected to the second transistor and a second extension portion connected to the second contact portion. The first extension portion is located on the second side of the circuit board, and the second extension portion is located on the first side of the circuit board.
[0009] In one or more embodiments of the utility model, the first contact portion and the second contact portion pass through the circuit board.
[0010] In one or more embodiments of the present application, the first extension is below the second transistor. The second extension is above the first transistor.
[0011] To achieve the above object, according to one embodiment of the present application, a battery management system includes a circuit board, a first transistor, a second transistor, a first heat sink, a second heat sink, a battery, a shunt resistor, and a control unit. The first transistor is disposed on a first side of the circuit board. The second transistor is disposed on a second side of the circuit board. The first heat sink is connected to the first transistor. The second heat sink is connected to the second transistor. The battery is connected to the first transistor and the second transistor. The shunt resistor is connected to the first transistor, the second transistor, and the battery. The control unit is disposed on the circuit board and connected to the first transistor, the second transistor, the battery, and the shunt resistor. The control unit is configured to adjust the first transistor and the second transistor based on a voltage change of the battery. The first heat sink extends to the second side of the circuit board, and the second heat sink extends to the first side of the circuit board.
[0012] In one or more embodiments of the present application, the first heat sink is below the second transistor, and the second heat sink is above the first transistor.
[0013] In one or more embodiments of the present application, the first heat sink includes a first contact connected to the first transistor and a first extension connected to the first contact. The second heat sink includes a second contact connected to the second transistor and a second extension connected to the second contact. The first extension is on the second side of the circuit board, and the second extension is on the first side of the circuit board.
[0014] In one or more embodiments of the present application, the first contact and the second contact pass through the circuit board.
[0015] In one or more embodiments of the present application, the first extension is below the second transistor. The second extension is above the first transistor.
[0016] In summary, in the heat dissipation structure and the battery management system, the first heat sink and the second heat sink are connected to the first transistor and the second transistor respectively, so that the first heat sink and the second heat sink can guide away the waste heat generated by the first transistor and the second transistor. In the heat dissipation structure and the battery management system, the first transistor and the second transistor are located on the first side and the second side of the circuit board respectively, so that the first heat sink and the second heat sink can make full use of the space on both sides of the circuit board. In the heat dissipation structure and the battery management system, the first extension of the first heat sink is located on the second side of the circuit board and below the second transistor, and the second extension of the second heat sink is located on the first side of the circuit board and above the first transistor, so that the volume of the first heat sink and the second heat sink can be greatly increased. Therefore, the heat dissipation structure and the battery management system can effectively increase the volume of the first heat sink and the second heat sink to improve the heat dissipation efficiency, so as to meet the needs of consumers.
[0017] The above is only to illustrate the problems to be solved by the present application, the technical means for solving the problems, and the effects thereof. The specific details of the present application will be described in detail in the following embodiments and related drawings. BRIEF DESCRIPTION OF DRAWINGS
[0018] In order to make the above and other purposes, features, advantages and embodiments of the present application more obvious and easy to understand, the following is a description of the drawings:
[0019] Figure 1 To illustrate the function block diagram of the battery management system according to an embodiment of the present application.
[0020] Figure 2 To illustrate the schematic diagram of the heat dissipation structure according to an embodiment of the present application. DETAILED DESCRIPTION
[0021] In the following, several embodiments of the present application will be disclosed with reference to the drawings. Many practical details will be described in the following description for the purpose of clear illustration. However, it should be understood that these practical details should not be used to limit the present application. That is, in some embodiments of the present application, these practical details are not necessary. In addition, for the purpose of simplifying the drawings, some conventional structures and elements will be shown in a simple schematic manner in the drawings. The same reference numerals will be used to represent the same or similar elements in all the drawings.
[0022] The structure, function and connection relationship between elements of each element included in the battery management system 100 of the present embodiment will be described in detail below.
[0023] Please refer to Figure 1 .Figure 1 is a functional block diagram of a battery management system 100 according to an embodiment of the present application. As shown, in the present embodiment, the battery management system 100 comprises a first transistor 110A, a second transistor 110B, a battery B, a shunt resistor ST, and a control unit CU. The first transistor 110A is connected to the second transistor 110B. The battery B is connected to the first transistor 110A and the second transistor 110B. The shunt resistor ST is connected to the battery B, the first transistor 110A, and the second transistor 110B. The control unit CU is connected to the shunt resistor ST, the battery B, the first transistor 110A, and the second transistor 110B. The control unit CU is configured to adjust the first transistor 110A and the second transistor 110B based on a voltage change of the battery B. Figure 1
[0024] As shown, the battery management system 100 further comprises a positive contact P and a negative contact N. In a usage scenario, the battery management system 100 is configured as a battery pack, and the battery management system 100 can be connected to an electronic device (not shown) through the positive contact P and the negative contact N to activate or actuate the electronic device. Alternatively, in a usage scenario, the battery management system 100 can be connected to a power source (not shown) through the positive contact P and the negative contact N to charge one or more batteries B. Figure 1
[0025] In some embodiments, the number of batteries B can be one. In some embodiments, the number of batteries B can be multiple. However, the present application is not intended to be limited to the number of batteries B.
[0026] In some embodiments, the first transistor 110A and the second transistor 110B can be, for example, a Metal-Oxide-Semiconductor Field-Effect Transistor (MOSFET) or other possible transistors. However, the present application is not intended to be limited to the type of the first transistor 110A and the second transistor 110B.
[0027] In some embodiments, the battery B can be, for example, a lithium battery or other similar batteries. However, the present application is not intended to be limited to the type of the battery B.
[0028] In some embodiments, the shunt resistor ST can be, for example, a metal plate resistor, a metal plate surface mount resistor, a metal plate terminal surface mount resistor, a thick film chip resistor, a metal plate lead type resistor, a metal wire lead type resistor, or other similar resistors. However, the present application is not intended to be limited to the type of the shunt resistor ST.
[0029] In some embodiments, the control unit CU can be, for example, an Analog Front End, a microprocessor (MCU), a combination of an Analog Front End and a microprocessor, or other possible electronic components. However, the present application is not intended to be limited to the type of the control unit CU.
[0030] With the above configuration, the control unit CU can calculate the current according to the measured voltage variation of the battery B. Then, the control unit CU adjusts the first transistor 110A and the second transistor 110B based on the current to achieve the purpose of managing the battery B.
[0031] The structure, function and switching relationship of each element included in the heat dissipation structure DS of the present embodiment will be described in detail below.
[0032] Please refer to Figure 2 . Figure 2 is a schematic view of the heat dissipation structure DS according to an embodiment of the present application. As Figure 2 shown, in the present embodiment, the battery management system 100 further includes a circuit board 105, a first heat sink 120A and a second heat sink 120B. The circuit board 105, the first transistor 110A, the second transistor 110B, the first heat sink 120A and the second heat sink 120B form the heat dissipation structure DS. The first transistor 110A is disposed on the circuit board 105. In detail, the first transistor 110A is disposed on the first side S1 of the circuit board 105. The second transistor 110B is disposed on the circuit board 105. The second transistor 110B is disposed on the second side S2 of the circuit board 105. The first side S1 and the second side S2 are opposite sides of the circuit board 105. In other words, the first transistor 110A and the second transistor 110B are designed in a back to back manner in the heat dissipation structure DS. In some embodiments, the first transistor 110A and the second transistor 110B are staggered with each other in the vertical direction. In some embodiments, the first transistor 110A and the second transistor 110B are staggered with each other in the horizontal direction. The first heat sink 120A is connected to the first transistor 110A. The second heat sink 120B is connected to the second transistor 110B. The first heat sink 120A extends to the second side S2 of the circuit board 105. The second heat sink 120B extends to the first side S1 of the circuit board 105. The first heat sink 120A is located below the second transistor 110B. The second heat sink 120B is located above the first transistor 110A.
[0033] Please continue to refer to Figure 2 . As Figure 2As shown, in this embodiment, the first heat sink 120A includes a first contact portion 122A and a first extension portion 124A. The first contact portion 122A is connected to the first transistor 110A. The first extension portion 124A is connected to the first contact portion 122A. The second heat sink 120B includes a second contact portion 122B and a second extension portion 124B. The second contact portion 122B is connected to the second transistor 110B. The second extension portion 124B is connected to the second contact portion 122B. The first extension portion 124A is located on the second side S2 of the circuit board 105, and the second extension portion 124B is located on the first side S1 of the circuit board 105. Figure 2 As shown, the first contact portion 122A passes through the circuit board 105 and contacts the first transistor 110A. The second contact portion 122B passes through the circuit board 105 and contacts the second transistor 110B. The first extension portion 124A is located below the second transistor 110B, and the second extension portion 124B is located above the first transistor 110A.
[0034] In some embodiments, the extending direction of the first contact portion 122A is different from the extending direction of the first extension portion 124A. In some embodiments, the extending direction of the first contact portion 122A is perpendicular to the extending direction of the first extension portion 124A. For example... Figure 2 As shown, for example, the first contact portion 122A extends in the vertical direction, while the first extension portion 124A extends in the horizontal direction.
[0035] In some embodiments, the extending direction of the second contact portion 122B is different from the extending direction of the second extension portion 124B. In some embodiments, the extending direction of the second contact portion 122B is perpendicular to the extending direction of the second extension portion 124B. For example... Figure 2 As shown, for example, the second contact portion 122B extends in the vertical direction, while the second extension portion 124B extends in the horizontal direction.
[0036] Please continue to refer to this. Figure 2 .like Figure 2 As shown, circuit board 105 has locking holes H. In some embodiments, locking fasteners (not shown) can lock together with the locking holes H, and the first heat sink 120A and the second heat sink 120B contact the locking fasteners. Thus, the first heat sink 120A and the second heat sink 120B are each connected to circuit board 105 via locking fasteners.
[0037] In some embodiments, circuit board 105 may be, for example, a printed circuit board (PCB) or other similar circuit board. However, this invention is not intended to limit the type of circuit board 105.
[0038] In some embodiments, the first heat sink 120A and the second heat sink 120B can be, for example, aluminum extruded fins, forged fins, die-cast fins, metal injection molding (MIM) fins, or other possible heat sinks. However, the present application is not intended to be limited to the types of the first heat sink 120A and the second heat sink 120B.
[0039] In some embodiments, the first extension 124A of the first heat sink 120A extends below the second transistor 110B, such that the second transistor 110B is located between the circuit board 105 and the first extension 124A. In some embodiments, the second extension 124B of the second heat sink 120B extends above the first transistor 110A, such that the first transistor 110A is located between the circuit board 105 and the second extension 124B.
[0040] With the foregoing structural configuration, since the first transistor 110A and the second transistor 110B are of a back-to-back design, the first heat sink 120A and the second heat sink 120B can extend to the second side S2 and the first side S1 of the circuit board 105, respectively, so as to effectively utilize the space around the circuit board 105. In detail, the first contact portion 122A and the second contact portion 122B contact the first transistor 110A and the second transistor 110B, respectively, to conduct away the waste heat, and the first extension 124A and the second extension 124B extend below the second transistor 110B and above the first transistor 110A, respectively, so that the sizes of the first heat sink 120A and the second heat sink 120B can be increased, thereby improving the heat dissipation effect. In this way, the heat dissipation structure DS of the battery management system 100 of the present application indeed effectively improves the heat dissipation efficiency and successfully breaks through the bottleneck that the heat dissipation efficiency cannot be improved under the architecture of multiple transistors. In addition, since the heat dissipation effect is improved, the number of transistors used can also be reduced.
[0041] From the above detailed description of the specific embodiments of the present application, it is obvious that in the heat dissipation structure and the battery management system of the present application, since the first heat sink and the second heat sink are connected to the first transistor and the second transistor respectively, the first heat sink and the second heat sink can conduct away the waste heat generated by the first transistor and the second transistor. In the heat dissipation structure and the battery management system of the present application, since the first transistor and the second transistor are located at the first side and the second side of the circuit board respectively, the first heat sink and the second heat sink can make full use of the space on both sides of the circuit board. In the heat dissipation structure and the battery management system of the present application, since the first extension of the first heat sink is located at the second side of the circuit board and below the second transistor, and the second extension of the second heat sink is located at the first side of the circuit board and above the first transistor, the volume of the first heat sink and the second heat sink can be greatly increased. Therefore, the heat dissipation structure and the battery management system of the present application can effectively increase the volume of the first heat sink and the second heat sink to improve the heat dissipation efficiency, so as to meet the needs of consumers.
[0042] Although the present application has been disclosed with embodiments as above, it is not intended to limit the present application, and any person skilled in the art can make various modifications and decorations without departing from the spirit and scope of the present application, so the protection scope of the present application shall be defined by the appended claims.
[0043]
Symbol Description
[0044] 100: battery management system
[0045] 105: circuit board
[0046] 110A: first transistor
[0047] 110B: second transistor
[0048] 120A: first heat sink
[0049] 120B: second heat sink
[0050] 122A: first contact portion
[0051] 122B: second contact portion
[0052] 124A: first extension
[0053] 124B: second extension
[0054] B: battery
[0055] CU: control unit
[0056] DS: heat dissipation structure
[0057] H: locking hole
[0058] N: negative contact
[0059] P: positive contact
[0060] S1: first side
[0061] S2: second side
[0062] ST: shunt resistance.
Claims
1. A heat dissipating structure, characterized by comprising: A circuit board; a first transistor disposed on a first side of the circuit board; a second transistor disposed on a second side of the circuit board; a first heat sink connected to the first transistor; and a second heat sink connected to the second transistor, wherein the first heat sink extends to the second side of the circuit board and the second heat sink extends to the first side of the circuit board. The first heat sink is below the second transistor and the second heat sink is above the first transistor. The first heat sink includes a first contact connected to the first transistor and a first extension connected to the first contact, and the second heat sink includes a second contact connected to the second transistor and a second extension connected to the second contact, the first extension being on the second side of the circuit board and the second extension being on the first side of the circuit board.
2. The heat dissipating structure according to claim 1, wherein The first and second contacts pass through the circuit board.
3. The heat dissipating structure according to claim 1, wherein The first extension is below the second transistor and the second extension is above the first transistor.
4. The heat dissipating structure according to claim 3, wherein A circuit board; 5. The heat dissipating structure according to claim 3, wherein a first transistor disposed on a first side of the circuit board; 6. A battery management system, characterized by, a second transistor disposed on a second side of the circuit board; a first heat sink connected to the first transistor; a second heat sink connected to the second transistor; a battery connected to the first and second transistors; a shunt resistor connected to the first and second transistors and the battery; and a control unit disposed on the circuit board and connected to the first and second transistors, the battery and the shunt resistor, the control unit configured to adjust the first and second transistors based on a voltage change of the battery, wherein the first heat sink extends to the second side of the circuit board and the second heat sink extends to the first side of the circuit board. The first heat sink is below the second transistor and the second heat sink is above the first transistor. The first heat sink includes a first contact connected to the first transistor and a first extension connected to the first contact, and the second heat sink includes a second contact connected to the second transistor and a second extension connected to the second contact, the first extension being on the second side of the circuit board and the second extension being on the first side of the circuit board. The first and second contacts pass through the circuit board. The first extension is below the second transistor and the second extension is above the first transistor.
7. The battery management system of claim 6, wherein, 8. The battery management system of claim 6, wherein, 9. The battery management system of claim 8, wherein, 10. The battery management system of claim 8, wherein,