A multilayer HDI circuit board

Abstract

The utility model discloses a multilayer HDI circuit board, including mounting plate subassembly, circuit board subassembly and heat abstractor, when using, through the circular through -slot one of being set up on the mounting plate main part and the circular through -slot two of being set up on the HDI circuit board main part, additionally the heat conduction sheet is fixedly connected with and is embedded through on the mounting plate main part and is fixedly connected with the heat pipe on the heat conduction sheet, the one end of heat pipe is set in the circular through -slot one place, through the heat abstractor fixed mounting in the circular through -slot, when using, start heat dissipation fan main part, and the heat of electronic device is transferred to the heat pipe through the heat conduction sheet, and then is taken away heat through the blowing of heat dissipation fan, because the heat abstractor is set between mounting plate subassembly and circuit board subassembly, makes the height influence of heat dissipation mechanism to device whole is little, through the setting heat conduction sheet, heat pipe and heat abstractor can carry out the heat dissipation to some electronic device of the heat output greater.

Description

TECHNICAL FIELD

[0001] The utility model relates to HDI circuit board technical field, concretely relates to a multilayer HDI circuit board. BACKGROUND

[0002] HDI circuit board refers to the double -faced or multilayer circuit board with conventional buried hole, blind hole and via, in order to realize more complex circuit design, and most of HDI circuit board will carry out multilayer board design, thereby realizing interconnection between each circuit layer can satisfy higher requirement circuit design.

[0003] The existing Chinese patent with the authorization announcement number CN217770683U discloses a multilayer HDI circuit board with inner layer interconnection, which comprises an HDI circuit board, a plurality of blind holes are formed in the front upper end and the rear upper end of the HDI circuit board, a reinforcing device is installed at the lower end of the HDI circuit board, a shock-absorbing protection device is installed at the left end and the right end of the HDI circuit board, an installation plate is installed at the left upper end and the right upper end of the shock-absorbing protection device, a heat dissipation device is installed at the middle upper end of the installation plate, and protective side plates are installed at the front end and the rear end of the installation plate. The multilayer HDI circuit board with inner layer interconnection disclosed in the utility model can not only avoid scratches on the HDI circuit board, but also reduce damage to the HDI circuit board caused by vibration, thereby improving the use effect. The heat dissipation device and the reinforcing device not only improve the heat dissipation of the HDI circuit board, but also make the HDI circuit board more resistant to bending.

[0004] The existing technical solution has the following disadvantages: the heat dissipation device is arranged at the middle upper end of the installation plate for heat dissipation, and the overall height of the circuit board structure is high after the heat dissipation device is arranged, which affects the compatibility of the circuit board structure installation and has certain improvement space in practicability. UTILITY MODEL CONTENTS

[0005] The utility model aims to provide a multilayer HDI circuit board to solve the technical problem that the overall height of the circuit board structure is high after the heat dissipation device is arranged in the prior art, which affects the compatibility of the circuit board structure installation and has certain improvement space in practicability.

[0006] The technical problem solved by the utility model can be realized by the following technical solutions:

[0007] A multilayer HDI circuit board comprises:

[0008] The mounting plate assembly comprises a mounting plate body, a circular through slot one is formed on one side of an end face of the mounting plate body, a heat conduction sheet is embedded and fixedly connected on the other side of the end face of the mounting plate body, a heat conduction pipe is arranged on the heat conduction sheet, one end of the heat conduction pipe is fixedly connected with the heat conduction sheet, and the other end of the heat conduction pipe is arranged in the middle of the circular through slot one.

[0009] The circuit board assembly comprises an HDI circuit board body, an electronic device is arranged on the HDI circuit board body, the electronic device is in close contact with the heat conduction sheet, a circular through slot two corresponding to the circular through slot one is formed on the HDI circuit board body, and a heat dissipation assembly is arranged in the circular through slot two.

[0010] As a further scheme of the utility model, mounting screw holes one are formed at corners around the mounting plate body, and mounting screw holes two corresponding to the mounting screw holes one are formed at corners around the HDI circuit board body.

[0011] As a further scheme of the utility model, a bolt one is connected between the mounting plate body and the HDI circuit board body, and the bolt one is threadedly connected with the mounting screw holes one and the mounting screw holes two.

[0012] As a further scheme of the utility model, alignment installation grooves are evenly distributed and formed around the circular through slot two on one side of an end face of the HDI circuit board body, and connecting columns corresponding to the alignment installation grooves are fixedly connected on the other end face of the HDI circuit board body.

[0013] As a further scheme of the utility model, mounting screw holes three are formed from the groove bottoms of the alignment installation grooves to end faces of the connecting columns.

[0014] As a further scheme of the utility model, the heat dissipation assembly comprises an assembly fixing plate, a heat dissipation fan body is fixedly connected to the assembly fixing plate, alignment installation plates corresponding to the alignment installation grooves are evenly distributed around the assembly fixing plate, alignment screw holes corresponding to the mounting screw holes three are formed in the alignment installation plates, the alignment installation plates are sleeved in the alignment installation grooves, a screw rod two is connected between the alignment installation plates and the HDI circuit board body, and the screw rod two is threadedly connected with the mounting screw holes three and the alignment screw holes.

[0015] The utility model has the advantages of the following beneficial effects:

[0016] In use, this invention features a circular through-slot 1 penetrating the mounting plate and a corresponding circular through-slot 2 penetrating the HDI circuit board. A heat-conducting sheet is embedded and fixedly connected to the mounting plate, and a heat-conducting pipe is fixedly connected to the heat-conducting sheet. One end of the heat-conducting pipe is positioned within the circular through-slot. By fixing the heat dissipation assembly to the circular through-slot, and activating the cooling fan during use, the heat from the electronic components is transferred to the heat-conducting pipe via the heat-conducting sheet, and then dissipated by the cooling fan. Because the heat dissipation assembly is positioned between the mounting plate assembly and the circuit board assembly, its impact on the overall height of the device is minimal, ensuring the overall compatibility of the circuit board structure during installation. Furthermore, the heat-conducting sheet, heat-conducting pipe, and heat dissipation assembly can effectively dissipate heat from electronic components that generate significant heat, thus improving the overall applicability of the device. Attached Figure Description

[0017] The present invention will be further described below with reference to the accompanying drawings.

[0018] Figure 1 This is a schematic diagram of the three-dimensional structure of this utility model. Figure One ;

[0019] Figure 2 This is a schematic diagram of the three-dimensional structure of this utility model. Figure Two ;

[0020] Figure 3 This is a schematic diagram of the three-dimensional structure of the circuit board assembly of this utility model. Figure One ;

[0021] Figure 4 This is a schematic diagram of the three-dimensional structure of the circuit board assembly of this utility model. Figure Two ;

[0022] Figure 5 This is a schematic diagram of the three-dimensional structure of the mounting plate assembly of this utility model. Figure One ;

[0023] Figure 6 This is a schematic diagram of the three-dimensional structure of the mounting plate assembly of this utility model. Figure Two ;

[0024] Figure 7 This is a three-dimensional structural diagram of the heat dissipation component of this utility model.

[0025] In the diagram: 1. Mounting plate assembly; 11. Mounting plate body; 12. Mounting threaded hole one; 13. Circular through slot one; 14. Heat-conducting plate; 15. Heat-conducting pipe; 2. Circuit board assembly; 21. HDI circuit board body; 22. Electronic components; 23. Circular through slot two; 24. Connecting post; 25. Mounting threaded hole two; 26. Alignment mounting slot; 27. Mounting threaded hole three; 3. Heat dissipation assembly; 31. Assembly fixing plate; 32. Alignment mounting plate; 33. Alignment threaded hole; 34. Cooling fan body. Detailed Implementation

[0026] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of the present utility model.

[0027] like Figures 1-7 As shown, a multilayer HDI circuit board includes: a mounting plate assembly 1 and a circuit board assembly 2. The mounting plate assembly 1 includes a mounting plate body 11. A circular through-slot 13 is formed on one side of the end face of the mounting plate body 11. A heat-conducting sheet 14 is embedded and fixedly connected to the other side of the end face of the mounting plate body 11. A heat-conducting pipe 15 is provided on the heat-conducting sheet 14. One end of the heat-conducting pipe 15 is fixedly connected to the heat-conducting sheet 14, and the other end of the heat-conducting pipe 15 is located in the middle of the circular through-slot 13. The circuit board assembly 2 includes an HDI circuit board body 21. An electronic device 22 is provided on the HDI circuit board body 21. The electronic device 22 is in close contact with the heat-conducting sheet 14. A circular through-slot 23 corresponding to the circular through-slot 13 is formed on the HDI circuit board body 21. A heat dissipation component 3 is provided in the circular through-slot 23.

[0028] The mounting plate body 11 has a through-hole 12 at each of its four corners. The HDI circuit board body 21 has a through-hole 25 at each of its four corners, corresponding to the through-hole 12. A bolt is connected between the mounting plate body 11 and the HDI circuit board body 21. The bolt is threaded to both the through-hole 12 and the through-hole 25.

[0029] On one side of the HDI circuit board body 21, circular through slots 23 are evenly distributed and aligned with mounting slots 26. On the other side of the HDI circuit board body 21, circular through slots 23 are evenly distributed and fixedly connected with connecting posts 24 corresponding to the mounting slots 26. A mounting threaded hole 27 is provided through the connecting post 24 from the bottom of the mounting slot 26 to the end face of the connecting post 24.

[0030] The heat dissipation assembly 3 comprises an assembly fixing plate 31, the heat dissipation fan main body 34 is fixedly connected on the assembly fixing plate 31, a plurality of alignment installation plates 32 corresponding to the alignment installation grooves 26 are uniformly distributed in the annular shape on the assembly fixing plate 31, the alignment installation plate 32 is provided with a plurality of alignment threaded holes 33 corresponding to the installation threaded holes three 27, the alignment installation plate 32 is sleeved in the alignment installation groove 26, and the screw rod two is connected between the alignment installation plate 32 and the HDI circuit board main body 21; the screw rod two is screwed with the installation threaded holes three 27 and the alignment threaded holes 33 simultaneously.

[0031] In order to facilitate the person skilled in the art to understand the embodiment of the present scheme, the working principle of the present scheme will be briefly described in combination with a specific application scenario:

[0032] In use, the circular through groove one 13 is provided on the installation plate main body 11, and the circular through groove two 23 corresponding to the circular through groove one 13 is provided on the HDI circuit board main body 21; in addition, the heat conduction sheet 14 is embedded and fixedly connected on the installation plate main body 11, and the heat conduction pipe 15 is fixedly connected on the heat conduction sheet 14; one end of the heat conduction pipe is arranged at the circular through groove one 13; the heat dissipation assembly 3 is fixedly installed at the circular through groove two 23; in use, the heat dissipation fan main body 34 is started; the heat of the electronic device 22 is transmitted to the heat conduction pipe 15 through the heat conduction sheet 14, and then the heat is taken away by the blowing of the heat dissipation fan 341; since the heat dissipation assembly 3 is arranged between the installation plate assembly 1 and the circuit board assembly 2, the height of the heat dissipation mechanism has little influence on the whole device, which is beneficial to ensuring the overall compatibility of the circuit board structure during installation; at the same time, the heat dissipation of some electronic devices with large heat generation can be realized by arranging the heat conduction sheet 14, the heat conduction pipe 15 and the heat dissipation assembly 3, which is beneficial to improving the overall applicability of the device.

[0033] The above several embodiments of the present application are described in detail, but the embodiments of the present application are not limited to this, and cannot be considered as limiting the scope of the present application. Any equivalent changes and improvements made within the scope of the present application should still belong to the patent coverage range of the present application.

Claims

1. A multilayer HDI circuit board, characterized by, The application relates to a mounting plate assembly (1) and a circuit board assembly (2). The mounting plate assembly (1) comprises a mounting plate body (11), a circular through groove I (13) is arranged on one side of the end face of the mounting plate body (11), a heat conduction sheet (14) is embedded and fixedly connected on the other side of the end face of the mounting plate body (11), a heat conduction pipe (15) is arranged on the heat conduction sheet (14), one end of the heat conduction pipe (15) is fixedly connected with the heat conduction sheet (14), and the other end of the heat conduction pipe (15) is arranged in the middle of the circular through groove I (13). The circuit board assembly (2) comprises an HDI circuit board body (21), an electronic device (22) is arranged on the HDI circuit board body (21), the electronic device (22) is in close contact with the heat conduction sheet (14), a circular through groove II (23) corresponding to the circular through groove I (13) is arranged on the HDI circuit board body (21), and a heat dissipation assembly (3) is arranged in the circular through groove II (23).

2. The multilayer HDI circuit board of claim 1, wherein, Mounting screw holes I (12) are arranged on the corners of the mounting plate body (11), and mounting screw holes II (25) corresponding to the mounting screw holes I (12) are arranged on the corners of the HDI circuit board body (21).

3. The multilayer HDI circuit board of claim 2, wherein, Bolts I are arranged between the mounting plate body (11) and the HDI circuit board body (21), and the bolts I are in threaded connection with the mounting screw holes I (12) and the mounting screw holes II (25).

4. The multilayer HDI circuit board of claim 1, wherein, Alignment mounting grooves (26) are arranged on the side end face of the HDI circuit board body (21) and surround the circular through groove II (23) and are evenly distributed, and connecting columns (24) corresponding to the alignment mounting grooves (26) are fixedly connected to the other end face of the HDI circuit board body (21) and surround the circular through groove II (23) and are evenly distributed.

5. The multilayer HDI circuit board of claim 4, wherein, Mounting screw holes III (27) are arranged on the end face of the connecting columns (24) from the groove bottoms of the alignment mounting grooves (26).

6. The multilayer HDI circuit board of claim 5, wherein, The heat dissipation assembly (3) comprises an assembly fixing plate (31), a heat dissipation fan body (34) is fixedly connected to the assembly fixing plate (31), alignment mounting plates (32) corresponding to the alignment mounting grooves (26) are evenly distributed on the assembly fixing plate (31), alignment screw holes (33) corresponding to the mounting screw holes III (27) are arranged on the alignment mounting plates (32), the alignment mounting plates (32) are sleeved in the alignment mounting grooves (26), and screws II are arranged between the alignment mounting plates (32) and the HDI circuit board body (21) and are in threaded connection with the mounting screw holes III (27) and the alignment screw holes (33).

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