A reinforcing sheet

Abstract

The utility model discloses a reinforcing sheet relates to reinforcing sheet technical field, including circuit board, the outside of circuit board is provided with reinforcing mechanism, the reinforcing mechanism includes first fixed plate and fixed ring, the surface of fixed ring is opened with connecting groove, the surface fixed connection of first fixed plate has connecting buckle, and connecting buckle is connected with connecting groove and is clamped, the surface of first fixed plate is provided with heat dissipation mechanism, and the heat dissipation mechanism includes heat dissipation scale and heat conducting plate, this reinforcing sheet, through connecting buckle and connecting groove clamping, will circuit board be fixed in the middle of first fixed plate and fixed ring, and the circuit board is reinforced, improves circuit board mechanical strength, through heat conducting plate, the heat of circuit board generates and is given heat dissipation scale, and the scale of heat dissipation scale surface can increase the contact area of heat dissipation scale and air, and then rapidly increases the heat dissipation effect of heat dissipation scale, avoids the circuit board and causes the poor heat dissipation effect of overthick, improves the heat dissipation effect of circuit board.

Description

TECHNICAL FIELD

[0001] The utility model relates to a reinforcing sheet technical field, concretely is a reinforcing sheet. BACKGROUND

[0002] The reinforcing sheet is also called reinforcing plate, which is widely used in FPC flexible circuit board in electronic products. The reinforcing plate mainly solves the flexibility of the flexible circuit board, improves the strength of the plug-in part, facilitates the overall assembly of the product, and the reinforcing plate mainly includes stainless steel reinforcing plate, aluminum foil reinforcing plate, polyester reinforcing plate, polyimide reinforcing plate, glass fiber reinforcing plate, polytetrafluoroethylene reinforcing plate and polycarbonate reinforcing plate.

[0003] The utility model discloses a kind of anti-breaking reinforcing sheets, including reinforcing sheet body, the reinforcing sheet body includes upper split piece and lower split piece on its upper and lower end, and the upper split piece and lower split piece inner end are respectively pressed to form upper pressing groove and lower pressing groove. The reinforcing sheet of the utility model can strengthen the strength and bending resistance of the reinforcing sheet body in use from the inner and outer end of the reinforcing sheet body, to avoid the problem of breaking in use.

[0004] When FPC circuit board is used, in order to improve the strength of FPC circuit board, reinforcing plate will be used. Although the reinforcing sheet in the above patent strengthens the mechanical properties of FPC circuit board, the thickness near FPC circuit board increases, causing poor local heat dissipation. Therefore, we provide a reinforcing sheet to solve the above problems. UTILITY MODEL CONTENTS

[0005] The utility model aims at providing a reinforcing sheet to solve the problems in the prior art.

[0006] To achieve the above object, the utility model provides the following technical scheme: a reinforcing sheet, including circuit board, the outside of the circuit board is provided with reinforcing mechanism, the reinforcing mechanism includes first fixed plate and fixed ring, the surface of the fixed ring is equipped with connecting groove, the surface of the first fixed plate is fixedly connected with connecting buckle, and the connecting buckle is connected with the connecting groove, the surface of the first fixed plate is provided with heat dissipation mechanism, and the heat dissipation mechanism includes heat dissipation scale and heat conduction plate.

[0007] Preferably, the surface of the fixed ring is fixedly connected with a sealing ring, and the sealing ring and the circuit board are in mutual abutment. By the sealing ring, the fixed ring and the circuit board are buffered, and the fixing effect of the fixed ring on the circuit board is improved.

[0008] Preferably, the surface of the first fixed plate is fixedly connected with a mounting plate, and the surface of the first fixed plate is fixedly connected with a sealing ring. By the mounting plate, the device is fixed inside the equipment, and the circuit board is prevented from swinging randomly due to equipment operation.

[0009] Preferably, the surface of the first fixed plate is fixedly connected with a longitudinal reinforcing beam, and the side surface of the longitudinal reinforcing beam is fixedly connected with the sealing ring.

[0010] Preferably, the surface of the longitudinal reinforcing beam is fixedly connected with a transverse reinforcing beam, and the side edge of the transverse reinforcing beam is fixedly connected with the sealing ring.

[0011] Preferably, the surface of the transverse reinforcing beam is fixedly connected with a second fixed plate, and the top end of the sealing ring is fixedly connected with the second fixed plate, and the heat dissipation fin is fixed on the surface of the second fixed plate.

[0012] Preferably, the surface of the heat conduction plate is fixedly connected with a heat conduction column, and the top end of the heat conduction column penetrates through the first fixed plate and the second fixed plate in sequence and is fixedly connected with the heat dissipation fin.

[0013] Preferably, the surface of the heat conduction plate is fixedly connected with a heat conduction column, and the top end of the heat conduction column penetrates through the first fixed plate and the second fixed plate in sequence and is fixedly connected with the heat dissipation fin.

[0014] Compared with the prior art, the utility model has the advantages that:

[0015] 1、 the circuit board is fixed in the first fixed plate and the fixed ring through the clamping of the connecting buckle and the connecting groove, the circuit board is reinforced, the mechanical strength of the circuit board is improved, the heat generated by the circuit board is transmitted to the heat dissipation fin through the heat conduction plate, and the heat dissipation fin is diffused to the environment, so that the poor heat dissipation effect caused by the thick circuit board is avoided, and the heat dissipation effect of the circuit board is improved.

[0016] 2、 the fixed ring and the circuit board are buffered through the sealing ring, the fixing effect of the fixed ring on the circuit board is improved, the device is fixed in the equipment through the mounting plate, the circuit board is prevented from swinging randomly due to equipment operation, the stability of the circuit board is improved, the first fixed plate surface reinforcing device is sealed through the sealing ring, the first fixed plate is longitudinally reinforced through the longitudinal reinforcing beam, the first fixed plate is transversely reinforced through the transverse reinforcing beam, the first fixed plate is cross clamped and reinforced through the longitudinal reinforcing beam and the transverse reinforcing beam, the mechanical strength of the first fixed plate is increased, and the reinforcing effect of the first fixed plate on the circuit board is improved.

[0017] 3、The second fixed plate and the first fixed plate are connected together through the sealing ring, the reinforcing effect on the circuit board is improved, the heat received by the heat conduction plate is quickly transmitted to the heat dissipation scale through the heat conduction column, and the surface of the heat dissipation scale is provided with scales, the contact area of the heat dissipation scale and air can be increased, and then the heat dissipation effect of the heat dissipation scale is quickly increased, the tightness of the heat conduction plate and the circuit board is increased through the heat conduction silica gel, and then the heat generated by the circuit board can be quickly transmitted to the heat conduction plate. BRIEF DESCRIPTION OF DRAWINGS

[0018] Figure 1 It is a structure schematic view of the reinforcing piece of the utility model;

[0019] Figure 2 It is a fixed ring connecting structure schematic view of the reinforcing piece of the utility model;

[0020] Figure 3 It is an internal structure explosion schematic view of the mounting plate of the reinforcing piece of the utility model;

[0021] Figure 4 It is a reinforcing piece of the utility model; Figure 2 It is a structure enlarged schematic view of A place.

[0022] Reference signs in the drawing: 1, circuit board; 2, reinforcing mechanism; 201, first fixed plate; 202, fixed ring; 203, connecting groove; 204, connecting buckle; 205, sealing ring; 206, mounting plate; 207, longitudinal reinforcing beam; 208, transverse reinforcing beam; 209, second fixed plate; 210, sealing ring; 3, heat dissipation mechanism; 301, heat dissipation scale; 302, heat conduction plate; 303, heat conduction silica gel; 304, heat conduction column. DETAILED DESCRIPTION

[0023] The technical scheme in the embodiments of the utility model will be clearly and completely described below in combination with the drawings in the embodiments of the utility model, and apparently, the described embodiments are only part of the embodiments of the utility model, rather than all the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by those skilled in the art without creative labor fall within the protection scope of the utility model.

[0024] As Figure 1 - Figure 4The utility model provides a kind of technical scheme of reinforcing sheet, including circuit board 1, the outside of circuit board 1 is provided with reinforcing mechanism 2, reinforcing mechanism 2 includes first fixed plate 201 and fixed ring 202, the surface of fixed ring 202 is opened with connecting groove 203, the surface of first fixed plate 201 is fixedly connected with connecting buckle 204, and connecting buckle 204 is connected with connecting groove 203, by connecting buckle 204 and connecting groove 203 clamping, circuit board 1 is fixed in first fixed plate 201 and fixed ring 202 between, reinforcing circuit board 1, improve the mechanical strength of circuit board 1.

[0025] The surface of fixed ring 202 is fixedly connected with sealing ring 205, and sealing ring 205 and circuit board 1 are mutually resisted, by sealing ring 205, fixed ring 202 and circuit board 1 are buffered, improve the fixed effect of fixed ring 202 to circuit board 1.

[0026] The surface of first fixed plate 201 is fixedly connected with mounting plate 206, the surface of first fixed plate 201 is fixedly connected with sealing ring 210, by mounting plate 206, device is fixed in equipment interior, avoid because equipment operation causes circuit board 1 swing at will, improve the stability of use of circuit board 1, by sealing ring 210, the reinforcing device on the surface of first fixed plate 201 is sealed.

[0027] The surface of first fixed plate 201 is fixedly connected with longitudinal reinforcing beam 207, and the side surface of longitudinal reinforcing beam 207 is fixedly connected with sealing ring 210, by longitudinal reinforcing beam 207, first fixed plate 201 is longitudinally reinforced.

[0028] The surface of longitudinal reinforcing beam 207 is fixedly connected with transverse reinforcing beam 208, and the side of transverse reinforcing beam 208 is fixedly connected with sealing ring 210, by transverse reinforcing beam 208, first fixed plate 201 is transversely reinforced.

[0029] By longitudinal reinforcing beam 207 and transverse reinforcing beam 208 form cross clamping reinforcement, increase the mechanical strength of use of first fixed plate 201, improve the reinforcing effect of first fixed plate 201 to circuit board 1.

[0030] The surface of transverse reinforcing beam 208 is fixedly connected with second fixed plate 209, and the top of sealing ring 210 is fixedly connected with second fixed plate 209, heat dissipation scale 301 is fixed on the surface of second fixed plate 209, by sealing ring 210, second fixed plate 209 and first fixed plate 201 are connected together, improve the reinforcing effect to circuit board 1.

[0031] The surface of the first fixed plate 201 is provided with a heat dissipation mechanism 3, the heat dissipation mechanism 3 comprises heat dissipation scales 301 and a heat conduction plate 302, heat generated by the circuit board 1 is transmitted to the heat dissipation scales 301 through the heat conduction plate 302, and is diffused to the environment through the heat dissipation scales 301, so that the poor heat dissipation effect caused by the thick circuit board 1 near the circuit board 1 is avoided, and the heat dissipation effect of the circuit board 1 is improved.

[0032] The surface of the heat conduction plate 302 is fixedly connected with heat conduction columns 304, the heat conduction columns 304 are arranged at equal intervals, the top ends of the heat conduction columns 304 sequentially penetrate the first fixed plate 201 and the second fixed plate 209 and are fixedly connected with the heat dissipation scales 301, heat received by the heat conduction plate 302 is quickly transmitted to the heat dissipation scales 301 through the heat conduction columns 304, and the surface of the heat dissipation scales 301 is paved with scales, so that the contact area of the heat dissipation scales 301 and air is increased, and the heat dissipation effect of the heat dissipation scales 301 is quickly increased.

[0033] The surface of the heat conduction plate 302 is fixedly connected with heat conduction silica gel 303, and the bottom surface of the heat conduction silica gel 303 is in contact with the circuit board 1, the contact tightness of the heat conduction plate 302 and the circuit board 1 is increased through the heat conduction silica gel 303, and then heat generated by the circuit board 1 can be quickly transmitted to the heat conduction plate 302.

[0034] The heat conduction silica gel 303 of the circuit board 1 is prior art, and detailed materials and models thereof will not be described in detail.

[0035] In use, the heat conduction silica gel 303 is applied to the heat conduction plate 302 first, then the back surface of the circuit board 1 is in close contact with the heat conduction silica gel 303, then the fixing ring 202 is placed on the front surface of the circuit board 1, the sealing ring 205 is in close contact with the circuit board 1, the circuit board 1 is fixed in the middle of the first fixed plate 201 and the fixing ring 202 through the clamping of the connecting buckle 204 and the connecting groove 203, the circuit board 1 is fixed, the device is fixed in the equipment through the mounting plate 206, after heat is generated by the circuit board 1, the heat is transmitted to the heat conduction plate 302 through the heat conduction silica gel 303, heat received by the heat conduction plate 302 is quickly transmitted to the heat dissipation scales 301 through the heat conduction columns 304, and then is quickly diffused to air through the heat dissipation scales 301, so that the heat dissipation effect of the device is increased.

[0036] It is apparent for a person skilled in the art that the present application is not restricted to the details of the above exemplary embodiments, but that it can be implemented in other concrete forms without departing from the spirit or the essential characteristics of the present application. Therefore, the embodiments should be considered as exemplary only, and not limiting, the scope of the present application being defined by the appended claims rather than the above description, and all changes coming within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference signs in the claims should not be construed as limiting the claims concerned.

Claims

1. A stiffening sheet comprising a circuit board (1), characterized in that: The outer part of the circuit board (1) is provided with a reinforcing mechanism (2), the reinforcing mechanism (2) comprises a first fixed plate (201) and a fixed ring (202), the surface of the fixed ring (202) is provided with a connecting groove (203), the surface of the first fixed plate (201) is fixedly connected with a connecting buckle (204), and the connecting buckle (204) is connected with the connecting groove (203), the surface of the first fixed plate (201) is provided with a heat dissipation mechanism (3), and the heat dissipation mechanism (3) comprises heat dissipation scales (301) and a heat conduction plate (302).

2. A reinforcing patch according to claim 1, characterized in that: The surface of the fixed ring (202) is fixedly connected with a sealing ring (205), and the sealing ring (205) is in contact with the circuit board (1).

3. A reinforcing patch according to claim 1, characterized in that: The surface of the first fixed plate (201) is fixedly connected with a mounting plate (206), and the surface of the first fixed plate (201) is fixedly connected with a sealing ring (210).

4. A reinforcing patch according to claim 3, characterised in that: The surface of the first fixed plate (201) is fixedly connected with a longitudinal reinforcing beam (207), and the side surface of the longitudinal reinforcing beam (207) is fixedly connected with the sealing ring (210).

5. A reinforcing patch according to claim 4, characterised in that: The surface of the longitudinal reinforcing beam (207) is fixedly connected with a transverse reinforcing beam (208), and the side edge of the transverse reinforcing beam (208) is fixedly connected with the sealing ring (210).

6. A reinforcing patch according to claim 5, characterised in that: The surface of the transverse reinforcing beam (208) is fixedly connected with a second fixed plate (209), and the top end of the sealing ring (210) is fixedly connected with the second fixed plate (209), and the heat dissipation scales (301) are fixed on the surface of the second fixed plate (209).

7. A reinforcing patch according to claim 6, characterised in that: The surface of the heat conduction plate (302) is fixedly connected with a heat conduction column (304), and the top end of the heat conduction column (304) penetrates the first fixed plate (201) and the second fixed plate (209) in sequence and is fixedly connected with the heat dissipation scales (301).

8. A reinforcing patch according to claim 1, characterized in that: The surface of the heat conduction plate (302) is fixedly connected with a heat conduction silica gel (303), and the bottom surface of the heat conduction silica gel (303) is in contact with the circuit board (1).

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