Circuit board assembly and energy storage device

Abstract

The utility model relates to the technical field of energy storage equipment, and discloses a circuit board assembly and energy storage equipment, and the circuit board assembly comprises a conductive support, a substrate, a first conductive part and a second conductive part. The conductive support is fixed on the substrate, and the substrate is provided with a first conductive part and a second conductive part. The two ends of the first conductive part are connected with the conductive support and the first conductive part respectively, and the two ends of the second conductive part are connected with the conductive support and the second conductive part respectively. In this way, the manufacturing cost of the circuit board assembly can be reduced.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of energy storage devices, in particular to a circuit board assembly and an energy storage device. BACKGROUND

[0002] In the printed circuit board (PCB) design of an energy storage product, the signal transmission and current transmission between circuit modules mainly rely on the conductive lines attached to the PCB for connection. However, in some cases, due to the limitation of the PCB area, the two points on the circuit board that need to be connected cannot be realized by the wiring design within the limited PCB area. In order to solve this problem, jumper wires or increasing the size of the PCB are usually selected to realize the effective transmission of current. Although these methods can solve the design problem, they will also increase the cost and the size of the product, thereby affecting the market competitiveness and user experience of the product. CONTENT OF THE UTILITY MODEL

[0003] In view of the problems in the background art, the purpose of the present application is to provide a circuit board assembly and an energy storage device, which overcome the above problems or at least partially solve the above problems.

[0004] According to a first aspect of the present application, a circuit board assembly is provided, comprising a conductive support, a substrate, a first conductive member and a second conductive member. The conductive support is fixed to the conductive support, and the substrate is provided with a first conductive part and a second conductive part. The two ends of the first conductive member are connected to the conductive support and the first conductive part, respectively, and the two ends of the second conductive member are connected to the conductive support and the second conductive part, respectively.

[0005] In one or more optional embodiments described above, the substrate is provided with a first via, the first conductive member includes a first connecting column and a first connecting bolt, one end of the first connecting column is connected to the conductive support, the other end of the first connecting column abuts against the surface of the substrate facing the conductive support, and the first connecting bolt is screwed and fixed to the other end of the first connecting column after passing through the first via; and / or the substrate is provided with a second via, the second conductive member includes a second connecting column and a second connecting bolt, one end of the second connecting column is connected to the conductive support, the other end of the second connecting column abuts against the surface of the substrate facing the conductive support, and the second connecting bolt is screwed and fixed to the other end of the second connecting column after passing through the second via.

[0006] In one or more optional embodiments above, the first conductive member includes a first connecting bolt, the first conductive part includes a first conductive layer, a second conductive layer and a third conductive layer, the first conductive layer is disposed at an edge of an aperture of the first via on a surface of the substrate facing away from the conductive support, the second conductive layer is disposed on an inner wall of the first via, the third conductive layer is disposed at an edge of an aperture of the first via on a surface of the substrate facing towards the conductive support, two ends of the second conductive layer are respectively connected to the first conductive layer and the third conductive layer, the first connecting bolt is fixed to the conductive support by a threaded connection after passing through the first via, a nut of the first connecting bolt abuts against the first conductive layer, and the third conductive layer abuts against the surface of the conductive support.

[0007] In one or more optional embodiments above, the second conductive member includes a second connecting bolt, the second conductive part includes a fourth conductive layer, a fifth conductive layer and a sixth conductive layer, the fourth conductive layer is disposed at an edge of an aperture of the second via on a surface of the substrate facing away from the conductive support, the fifth conductive layer is disposed on an inner wall of the second via, the sixth conductive layer is disposed at an edge of an aperture of the second via on a surface of the substrate facing towards the conductive support, two ends of the fifth conductive layer are respectively connected to the fourth conductive layer and the sixth conductive layer, the second connecting bolt is fixed to the conductive support by a threaded connection after passing through the second via, a nut of the second connecting bolt abuts against the fourth conductive layer, and the sixth conductive layer abuts against the surface of the conductive support.

[0008] In one or more optional embodiments above, the conductive support includes a support plate and a support column, the support plate is disposed opposite to the substrate, the support column is connected between the support plate and the substrate, two ends of the first conductive member are respectively connected to the support plate and the first conductive part, and two ends of the second conductive member are respectively connected to the support plate and the second conductive part.

[0009] In one or more optional embodiments above, the support plate has a preset thickness H, the support plate includes a main body part and a protruding part, a connection weak part of the main body part and the protruding part has a preset minimum width size L, a connection part of the first conductive part to the support plate is located at the protruding part, a connection part of the second conductive part to the support plate is located at the main body part, a current carrying capacity of the connection weak part is C1, C1 = H × L, and a preset minimum required current carrying capacity between the connection part of the first conductive part to the support plate and the connection part of the second conductive part to the support plate is C2, C1 ≥ C2.

[0010] In one or more optional embodiments above, the conductive support includes a connecting plate, which is vertically arranged on the surface of the support plate away from the substrate, and an end of the connecting plate away from the support plate is used to fix the circuit board assembly to other equipment.

[0011] In one or more optional embodiments above, the number of the first conductive parts is at least two, the number of the first conductive members is the same as and one-to-one corresponds to the number of the first conductive parts, and / or the number of the second conductive parts is at least two, the number of the second conductive members is the same as and one-to-one corresponds to the number of the second conductive parts.

[0012] According to a second aspect of the present application, a kind of energy storage equipment is provided, including shell, battery pack and the above-mentioned circuit board assembly;The shell is provided with containing cavity, the battery pack is arranged in the containing cavity;The conductive support is fixed to the shell of the battery pack.

[0013] The beneficial effects of the embodiments of the present application are that: the circuit board assembly provided by the embodiments of the present application connects the first conductive part and the second conductive part with the conductive support through the first conductive member and the second conductive member respectively, so as to provide a current transmission path between the first conductive part and the second conductive part by the conductive support, compared with the traditional circuit board assembly using the mode of increasing through-flow copper bar or expanding substrate area, which is conducive to reducing manufacturing cost. BRIEF DESCRIPTION OF DRAWINGS

[0014] In order to more clearly illustrate the technical solutions of the specific embodiments of the present application or the prior art, the drawings needed in the description of the specific embodiments or the prior art will be briefly introduced below. In all the drawings, similar elements or parts are generally identified by similar reference numerals. In the drawings, each element or part is not necessarily drawn according to the actual proportion.

[0015] Figure 1 A perspective view of a circuit board assembly provided by the embodiments of the present application is shown in FIG. 1.

[0016] Figure 2 A schematic view of a substrate of a circuit board assembly provided by the embodiments of the present application is shown in FIG. 2.

[0017] Figure 3 Another schematic view of a substrate of a circuit board assembly provided by the embodiments of the present application is shown in FIG. 3.

[0018] Figure 4 A schematic view of a conductive support of a circuit board assembly provided by the embodiments of the present application is shown in FIG. 4.

[0019] Figure 5 A perspective view of an energy storage equipment provided by the embodiments of the present application is shown in FIG. 5.

[0020] Figure 6A schematic view of a circuit board assembly fixed to a battery pack is provided. DETAILED DESCRIPTION

[0021] For the purpose of facilitating the understanding of the present application, the present application will be described in more detail below in conjunction with the accompanying drawings and specific embodiments. It should be noted that when an element is described as being "fixed to" another element, it can be directly on the other element or one or more intervening elements can be present therebetween. When an element is described as being "connected to" another element, it can be directly connected to the other element or one or more intervening elements can be present therebetween. The terms "vertical", "horizontal", "left", "right", "inner", "outer", and similar expressions used in the present specification are for the purpose of illustration only.

[0022] Unless otherwise defined, all technical and scientific terms used in the present specification are intended to have the same meaning as commonly understood by one of ordinary skill in the art to which the present application belongs. The terms used in the present specification are only for the purpose of describing specific embodiments and are not intended to limit the present application. The term "and / or" used in the present specification includes any and all combinations of one or more of the associated listed items.

[0023] In the description of the present specification, unless otherwise explicitly specified and limited, the terms "connected", "connected", "fixed" should be understood broadly, for example, it can be fixedly connected, or it can be detachably connected, or it can be integrated; it can be mechanically connected, or it can be electrically connected; it can be directly connected, or it can be indirectly connected through an intermediate medium; it can be the internal communication of two elements or the interaction relationship between two elements. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0024] In addition, the technical features involved in different embodiments of the present application described below can be combined with each other as long as there is no conflict.

[0025] Please refer to Figure 1 , the circuit board assembly 100 includes a conductive support 1, a substrate 2, a first conductive member 3 and a second conductive member 4. The substrate 2 is fixed to the conductive support 1, and the conductive support 1 is used to support and fix the substrate 2. The substrate 2 is provided with a first conductive part 21 and a second conductive part 22. The two ends of the first conductive member 3 are respectively connected to the conductive support 1 and the first conductive part 21, and the two ends of the second conductive member 4 are respectively connected to the conductive support 1 and the second conductive part 22. The first conductive part 21 is electrically connected to the second conductive part 22 through the first conductive member 3, the conductive support 1 and the second conductive member 4.

[0026] The circuit board assembly 100 provided by the embodiment of the present application connects the first conductive part 21 and the second conductive part 22 with the conductive support 1 through the first conductive member 3 and the second conductive member 4 respectively, so as to provide a current transmission path between the first conductive part 21 and the second conductive part 22 by the conductive support 1, which is beneficial to reduce the manufacturing cost compared with the traditional circuit board assembly 100 which adopts the way of increasing the through copper bar or expanding the area of the substrate 2.

[0027] In some embodiments, the conductive support 1 comprises a support plate 11 and a support column 12, the substrate 2 is arranged opposite to the support plate 11, the support column 12 is connected between the support plate 11 and the substrate 2, two ends of the first conductive member 3 are connected with the support plate 11 and the first conductive part 21 respectively, and two ends of the second conductive member 4 are connected with the support plate 11 and the second conductive part 22 respectively.

[0028] In some embodiments, one end of the support column 12 is riveted and fixed to the support plate 11, the end of the support column 12 away from the support plate 11 abuts against the surface of the substrate 2 facing the support plate 11, and the circuit board assembly 100 further comprises a third connecting bolt 14, which is screwed and fixed to the end of the support column 12 away from the support plate 11 after penetrating through the substrate 2 in the direction from the substrate 2 to the support plate 11.

[0029] In some embodiments, the conductive support 1 comprises a connecting plate 13, the connecting plate 13 is vertically arranged on the surface of the support plate 11 away from the substrate 2, and the end of the connecting plate 13 away from the support plate 11 is used for fixing the circuit board assembly 100 to other devices.

[0030] In some embodiments, the number of the connecting plates 13 is two, and the two connecting plates 13 are arranged opposite and spaced apart.

[0031] In some embodiments, the conductive support 1 is made of a metal material.

[0032] In some embodiments, the conductive support 1 is a sheet metal part.

[0033] In some embodiments, the circuit board assembly 100 is applied to an electronic device, and the conductive support 1 is arranged in the shell 200 of the electronic device.

[0034] In some embodiments, the conductive support 1 is also used for fixing other devices supporting the electronic device.

[0035] In some embodiments, the conductive support 1 is part of the shell 200 of the electronic device.

[0036] Please refer to Figures 1-3In some embodiments, the substrate 2 is provided with a first through hole 23, the first conductive member 3 comprises a first connecting post 32 and a first connecting bolt 31, one end of the first connecting post 32 is connected with the conductive support 1, the other end of the first connecting post 32 abuts against the surface of the substrate 2 facing the conductive support 1, and the first connecting bolt 31 is screwed and fixed to the other end of the first connecting post 32 after passing through the first through hole 23.

[0037] In some embodiments, the first connecting post 32 is riveted and fixed to the support plate 11.

[0038] In some embodiments, the substrate 2 is provided with a first through hole 23, the first conductive member 3 comprises a first connecting bolt 31, the first conductive part 21 comprises a first conductive layer 211, a second conductive layer (not shown in the figure) and a third conductive layer 212, the first conductive layer 211 is arranged at the edge of the aperture of the first through hole 23 located at the surface of the substrate 2 facing away from the conductive support 1, the second conductive layer is arranged at the inner wall of the first through hole 23, the third conductive layer 212 is arranged at the edge of the aperture of the first through hole 23 located at the surface of the substrate 2 facing the conductive support 1, the two ends of the second conductive layer are respectively connected with the first conductive layer 211 and the third conductive layer 212, the first connecting bolt 31 is fixed to the conductive support 1 by screwing after passing through the first through hole 23, the nut of the first connecting bolt 31 abuts against the first conductive layer 211, and the third conductive layer 212 abuts against the surface of the conductive support 1.

[0039] In some embodiments, the first conductive layer 211 is arranged around the aperture of the first through hole 23, the second conductive layer covers the inner wall of the first through hole 23, and the third conductive layer 212 is arranged around the aperture of the first through hole 23.

[0040] In some embodiments, the surface of the first connecting post 32 facing the substrate 2 abuts against the third conductive layer 212.

[0041] It can be understood that the first conductive member 3 is not limited to the first connecting bolt 31 and the first connecting post 32 described above, and the first conductive part 21 is also not limited to the first conductive layer 211, the second conductive layer and the third conductive layer 212 described above. In other embodiments, the first conductive member 3 is a flexible conductive material, which includes but is not limited to conductive foam, one end of the first conductive member 3 abuts against the third conductive layer 212, the other end of the first conductive member 3 abuts against the surface of the conductive support 1, the substrate 2 is screwed and fixed to the conductive support 1 in the direction of the substrate 2 to the conductive support 1, and the substrate 2 presses the first conductive member 3 against the surface of the conductive support 1. The two ends of the first conductive member 3 are respectively electrically connected with the third conductive layer 212 and the conductive support 1 by abutting contact. In still other embodiments, the first conductive part 21 is a pin arranged on the substrate 2, and the conductive support 1 is provided with a plug hole, and the end of the pin away from the substrate 2 is inserted into and welded to the plug hole.

[0042] In some embodiments, the substrate 2 is provided with a second through hole 24, the second conductive member 4 comprises a second connecting post 42 and a second connecting bolt 41, one end of the second connecting post 42 is connected with the conductive support 1, the other end of the second connecting post 42 abuts against the surface of the substrate 2 facing the conductive support 1, and the second connecting bolt 41 is screwed and fixed to the other end of the second connecting post 42 after passing through the second through hole 24.

[0043] In some embodiments, the substrate 2 is provided with a second through hole 24, the second conductive member 4 comprises a second connecting bolt 41, the second conductive part 22 comprises a fourth conductive layer 221, a fifth conductive layer (not shown in the figure) and a sixth conductive layer 222, the fourth conductive layer 221 is arranged at the edge of the aperture of the second through hole 24 located at the surface of the substrate 2 facing away from the conductive support 1, the fifth conductive layer is arranged at the inner wall of the second through hole 24, the sixth conductive layer 222 is arranged at the edge of the aperture of the second through hole 24 located at the surface of the substrate 2 facing the conductive support 1, both ends of the fifth conductive layer are connected with the fourth conductive layer 221 and the sixth conductive layer 222 respectively, the second connecting bolt 41 is fixed to the conductive support 1 by screwing after passing through the second through hole 24, the nut of the second connecting bolt 41 abuts against the fourth conductive layer 221, and the sixth conductive layer 222 abuts against the surface of the conductive support 1.

[0044] In some embodiments, the fourth conductive layer 221 is arranged around the aperture of the first through hole 23, the fifth conductive layer covers the inner wall of the first through hole 23, and the sixth conductive layer 222 is arranged around the aperture of the first through hole 23.

[0045] In some embodiments, the surface of the second connecting post 42 facing the substrate 2 abuts against the sixth conductive layer 222.

[0046] In some embodiments, the second connecting post 42 is riveted and fixed to the support plate 11.

[0047] It can be understood that the second conductive member 4 is not limited to the second connecting bolt 41 and the second connecting post 42 described above, and the second conductive part 22 is also not limited to the fourth conductive layer 221, the fifth conductive layer and the sixth conductive layer 222 described above. The specific structure and cooperation mode of the second conductive member 4 and the second conductive part 22 can refer to the first conductive member 3 and the first conductive part 21 in the above embodiments, which will not be described one by one here.

[0048] Please refer to Figure 1 and Figure 4In some embodiments, the support plate 11 has a preset thickness H, the support plate 11 comprises a main body part 111 and a protruding part 112, a connection weak part of the main body part 111 and the protruding part 112 has a preset minimum width size L, the first conductive part 21 is connected to the protruding part 112 of the support plate 11, the second conductive part 22 is connected to the main body part 111 of the support plate 11, the current carrying capacity of the connection weak part is C1, C1 = H x L, the preset minimum required current carrying capacity between the connection part of the first conductive part 21 and the support plate 11 and the connection part of the second conductive part 22 and the support plate 11 is C2, C1 ≥ C2. C2 is a minimum threshold of current carrying capacity set according to actual needs. In actual use environment, due to the need of the circuit board assembly 100 to be assembled with other devices in the electronic equipment shell, due to the space limitation in the electronic equipment shell, the area of the main body part 111 of the support plate 11 is insufficient to make the projection of the substrate 2 located in the main body part 111, so the protruding part 112 is needed to be set for the first connecting column 32 to be connected.

[0049] In some embodiments, the value of C2 is obtained by experiment, and the value of C2 is determined according to whether the temperature rise of the support plate 11 is within a preset range when the circuit board assembly 100 is working.

[0050] In some embodiments, the number of the first conductive parts 21 is at least two, the number of the first conductive members 3 is the same as and one-to-one corresponds to the number of the first conductive parts 21, and / or the number of the second conductive parts 22 is at least two, the number of the second conductive members 4 is the same as and one-to-one corresponds to the number of the second conductive parts 22.

[0051] Please refer to Figure 1 , Figure 5 and Figure 6 , based on the same inventive concept, the embodiments of the present application also provide a power storage device 1000, comprising the circuit board assembly 100 in any of the above embodiments.

[0052] In some embodiments, the power storage device 1000 comprises a shell 200 and a battery pack 300. The shell 200 is provided with a containing cavity, the battery pack 300 is arranged in the containing cavity, and the conductive support 1 is fixed to the shell of the battery pack 300.

[0053] In some embodiments, the ends of the two connecting plates 13 away from the support plate 11 are each bent to form a mounting part 131, and the mounting parts 131 of the two connecting plates 13 are each screwed and fixed to the shell of the battery pack 300.

[0054] The above is only an embodiment of the present application, and does not limit the patent scope of the present application, and any equivalent structure or equivalent process transformation using the content of the specification and drawings of the present application, or direct or indirect application in other related technical fields, are also included in the patent protection scope of the present application.

Claims

1. A circuit board assembly, characterized by The circuit board assembly comprises: a conductive support; a substrate fixed to the conductive support, the substrate being provided with a first conductive part and a second conductive part; a first conductive member and a second conductive member, two ends of the first conductive member being connected to the conductive support and the first conductive part respectively, two ends of the second conductive member being connected to the conductive support and the second conductive part respectively.

2. The circuit board assembly according to claim 1, wherein the substrate is provided with a first via, the first conductive member comprises a first connecting column and a first connecting bolt, one end of the first connecting column is connected to the conductive support, the other end of the first connecting column abuts against a surface of the substrate facing the conductive support, and the first connecting bolt is screwed and fixed to the other end of the first connecting column after passing through the first via.

3. The circuit board assembly according to claim 2, wherein the substrate is provided with a second via, the second conductive member comprises a second connecting column and a second connecting bolt, one end of the second connecting column is connected to the conductive support, the other end of the second connecting column abuts against a surface of the substrate facing the conductive support, and the second connecting bolt is screwed and fixed to the other end of the second connecting column after passing through the second via.

4. The circuit board assembly according to claim 3, wherein the first conductive member comprises a first connecting bolt, the first conductive part comprises a first conductive layer, a second conductive layer and a third conductive layer, the first conductive layer is arranged at an edge of an aperture of the first via located at a surface of the substrate facing away from the conductive support, the second conductive layer is arranged at an inner wall of the first via, the third conductive layer is arranged at an edge of an aperture of the first via located at a surface of the substrate facing the conductive support, two ends of the second conductive layer are connected to the first conductive layer and the third conductive layer respectively, the first connecting bolt is fixed to the conductive support by screw connection after passing through the first via, a nut of the first connecting bolt abuts against the first conductive layer, and the third conductive layer abuts against a surface of the conductive support.

5. The circuit board assembly according to claim 4, wherein the second conductive member comprises a second connecting bolt, the second conductive part comprises a fourth conductive layer, a fifth conductive layer and a sixth conductive layer, the fourth conductive layer is arranged at an edge of an aperture of the second via located at a surface of the substrate facing away from the conductive support, the fifth conductive layer is arranged at an inner wall of the second via, the sixth conductive layer is arranged at an edge of an aperture of the second via located at a surface of the substrate facing the conductive support, two ends of the fifth conductive layer are connected to the fourth conductive layer and the sixth conductive layer respectively, the second connecting bolt is fixed to the conductive support by screw connection after passing through the second via, a nut of the second connecting bolt abuts against the fourth conductive layer, and the sixth conductive layer abuts against a surface of the conductive support.

6. The circuit board assembly according to claim 1, wherein The conductive support includes a support plate and a support column, the substrate is arranged opposite to the support plate, the support column is connected between the support plate and the substrate, two ends of the first conductive member are connected to the support plate and the first conductive part respectively, and two ends of the second conductive member are connected to the support plate and the second conductive part respectively.

7. The circuit board assembly of claim 6, wherein, the support plate has a preset thickness H, the support plate includes a main body part and a protruding part, a connection weak part of the main body part and the protruding part has a preset minimum width size L, a connection part of the first conductive part and the support plate is located at the protruding part, a connection part of the second conductive part and the support plate is located at the main body part, a current carrying capacity of the connection weak part is C1, C1=H×L, and a preset minimum required current carrying capacity between the connection part of the first conductive part and the support plate and the connection part of the second conductive part and the support plate is C2, C1≥C2.

8. The circuit board assembly of claim 6, wherein, the conductive support includes a connecting plate, the connecting plate is vertically arranged on a surface of the support plate away from the substrate, and an end of the connecting plate away from the support plate is used for fixing the circuit board assembly to other equipment.

9. The circuit board assembly of any one of claims 1-8, wherein, the number of the first conductive parts is at least two, the number of the first conductive members is the same as and one-to-one corresponds to the number of the first conductive parts, and / or the number of the second conductive parts is at least two, the number of the second conductive members is the same as and one-to-one corresponds to the number of the second conductive parts.

10. An energy storage device, characterized by, The circuit board assembly includes a housing, a battery pack, and the circuit board assembly of any one of claims 1-9; the housing is provided with a containing cavity, the battery pack is arranged in the containing cavity, and the conductive support is fixed to an outer shell of the battery pack.

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