Inverter heat dissipation structure and photovoltaic inverter
By installing a heat sink substrate at the opening of the inverter cavity and installing heat insulation material on its inner side, the problem of poor heat dissipation in the sealed cavity of the inverter is solved, thereby reducing the temperature inside the cavity and protecting the devices.
Patent Information
- Application Number
- CN202423107676.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-16
- Publication Date
- 2025-11-25
- Estimated Expiration
- 2034-12-16
AI Technical Summary
The enclosed cavity structure of existing inverters prevents heat from being effectively dissipated, resulting in excessively high internal temperatures that affect the stability and lifespan of power devices.
A heat sink substrate is used to seal the cavity opening to form a closed cavity, and heat insulation material is placed on the inner side of the substrate. The power device is in direct contact with the substrate to transfer heat, and heat insulation material is placed in other areas of the substrate to reduce heat radiation. Heat dissipation is achieved by combining heat sink fins and air ducts.
It effectively reduces the internal temperature of the sealed cavity, protects power devices, and improves the stability and reliability of the inverter.
Smart Images
Figure CN223600220U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to inverter manufacturing technical field especially relates to a kind of inverter heat dissipation structure and photovoltaic inverter. BACKGROUND
[0002] Inverter is the converter that direct current energy is changed into fixed frequency fixed voltage or frequency modulation voltage-regulated alternating current, inverter needs its long time and stable work when using, but also a large amount of heat energy can be generated, and these heat energy needs to be promptly dissipated.
[0003] At present, the existing inverter cavity is closed, this structure can not get better heat exchange of the heat generated by heat source in the cavity, so that the temperature in the cavity is very high, under such high temperature, it often leads to the device failure of power device in the cavity due to high temperature. SUMMARY
[0004] The utility model discloses at least one of the technical problems existing in the prior art is solved, provide a kind of inverter heat dissipation structure and photovoltaic inverter, can effectively reduce the temperature inside closed cavity.
[0005] First, the utility model embodiment provides a kind of inverter heat dissipation structure, including cavity shell and radiator base plate, wherein:
[0006] The cavity shell is provided with cavity opening;
[0007] The radiator base plate is connected with the cavity shell and seals the cavity opening, to form closed cavity in the inside of the cavity shell, power device is arranged in the closed cavity, the position of the power device corresponds to the cavity opening and is in contact with the radiator base plate;The inner side of the radiator base plate includes first area corresponding to the power device and second area not corresponding to the power device, and the second area is provided with heat insulation material for reducing the heat radiation of the radiator base plate to the closed cavity.
[0008] According to the inverter heat dissipation structure provided by the utility model embodiment, at least has following beneficial effects: by adopting radiator base plate to seal the cavity opening of cavity shell to form closed cavity, the power device inside closed cavity can be better protected, the first area of the inner side of the radiator base plate corresponds to the power device, so that the power device is directly in contact with the first area of the radiator base plate, so that the heat generated by the power device can be directly transmitted to the radiator base plate for heat dissipation, the second area of the inner side of the radiator base plate is provided with heat insulation material, so that the heat radiation of the radiator base plate to the closed cavity can be reduced, so that the heat transmitted to the radiator base plate from the first area by the power device can be avoided and then radiated to the inside of closed cavity from the second area, the temperature inside closed cavity can be effectively reduced.
[0009] The inverter heat dissipation structure according to some embodiments of the present application further comprises a power inductor connected to the outer side of the heat sink substrate, and the contact position of the power inductor and the heat sink substrate is arranged in a staggered manner with the first area.
[0010] The inverter heat dissipation structure according to some embodiments of the present application is characterized in that the heat insulation material is formed on the second area by spraying.
[0011] The inverter heat dissipation structure according to some embodiments of the present application is characterized in that the heat insulation material is arranged on the second area by surface attachment.
[0012] The inverter heat dissipation structure according to some embodiments of the present application further comprises a circuit board arranged in the closed cavity, and the power device is welded to the circuit board.
[0013] The first aspect of the present application further provides an inverter heat dissipation structure comprising a cavity shell, a heat sink substrate and a heat insulation material, wherein:
[0014] The cavity shell is provided with a cavity opening;
[0015] The heat sink substrate is connected to the cavity shell and seals the cavity opening, so as to form a closed cavity inside the cavity shell, the closed cavity is provided with a power device, and the position of the power device corresponds to the cavity opening and is in contact pressure with the heat sink substrate.
[0016] The cavity shell comprises a third area in contact with the heat sink substrate, and the heat insulation material is arranged on the inner side of the cavity shell corresponding to the third area.
[0017] The inverter heat dissipation structure according to the embodiments of the present application has at least the following beneficial effects: the cavity opening of the cavity shell is sealed by the heat sink substrate to form a closed cavity, so as to better protect the power device inside the closed cavity, the position of the power device corresponds to the cavity opening, so as to directly contact and press the heat sink substrate through the cavity opening, directly transfer the heat generated by the power device to the heat sink substrate for heat dissipation, and the inner side of the cavity shell corresponding to the third area is provided with the heat insulation material, so as to reduce the heat transferred by the power device to the heat sink substrate and then radiated from the third area to the inside of the closed cavity, and effectively reduce the temperature inside the closed cavity.
[0018] The inverter heat dissipation structure according to some embodiments of the present application further comprises a power inductor connected to the cavity shell, the cavity shell comprises a fourth area in contact with the power inductor, and the heat insulation material is further arranged on the inner side of the cavity shell corresponding to the fourth area.
[0019] According to the inverter heat dissipation structure provided by some embodiments of the present application, the heat insulation material is formed on the inner side surface of the cavity shell corresponding to the third region by spraying.
[0020] According to the inverter heat dissipation structure provided by some embodiments of the present application, the heat insulation material is formed on the inner side surface of the cavity shell corresponding to the third region by spraying.
[0021] In the second aspect, the present application provides a photovoltaic inverter comprising the inverter heat dissipation structure according to the first aspect.
[0022] Other features and advantages of the present application will be set forth in the following description, and in part will become apparent to those skilled in the art from the description, or can be learned by practice of the present application. The objects and other advantages of the present application can be realized and achieved by the structure particularly pointed out in the description, claims and drawings. BRIEF DESCRIPTION OF DRAWINGS
[0023] The accompanying drawings are used to provide a further understanding of the technical scheme of the present application, and constitute a part of the specification, and are used together with the embodiments of the present application to explain the technical scheme of the present application, and do not constitute a limitation on the technical scheme of the present application.
[0024] The present application will be further described below in combination with the drawings and embodiments;
[0025] Figure 1 is a bottom view of the inverter heat dissipation structure provided by the embodiments of the present application;
[0026] Figure 2 is Figure 1 A-A sectional view of
[0027] Figure 3 is a side view of the inverter heat dissipation structure provided by the embodiments of the present application;
[0028] Figure 4 is a side view of the inverter heat dissipation structure provided by the embodiments of the present application;
[0029] Figure 5 is a structure schematic view of the heat insulation material provided by an embodiment of the present application;
[0030] Figure 6 is a structure schematic view of the heat insulation material provided by another embodiment of the present application;
[0031] Figure 7 is a sectional view of the inverter heat dissipation structure provided by another embodiment of the present application;
[0032] Figure 8 is a chamber temperature schematic diagram of a cavity shell without thermal insulation material;
[0033] Figure 9 is a chamber temperature schematic diagram of a cavity shell of an inverter heat dissipation structure provided by the embodiment of the utility model. DETAILED DESCRIPTION
[0034] This part will describe the specific embodiments of the utility model in detail, the preferred embodiments of the utility model are shown in the drawings, the role of the drawings is to supplement the description of the text part with graphics, so that people can intuitively and visually understand each technical feature and the overall technical scheme of the utility model, but it cannot be understood as the limitation of the protection scope of the utility model.
[0035] In the description of the embodiment of the utility model, the meaning of several is one or more, the meaning of multiple is two or more, greater than, less than, more than, etc. are understood as not including the number, above, below, within, etc. are understood as including the number, "at least one" means one or more, "at least one of the following" and similar expressions mean any combination of these items, including single or multiple items. If there is a description of "first", "second", etc. is only used to distinguish technical features for the purpose, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of indicated technical features or implicitly indicating the sequence of indicated technical features.
[0036] It should be noted that the words such as setting, installation and connection in the embodiment of the utility model should be understood in a broad sense, and the person skilled in the art can reasonably determine the specific meaning of the above words in the embodiment of the utility model according to the specific content of the technical scheme. For example, the term "connection" can be mechanical connection, electrical connection or can communicate with each other; it can be directly connected, or indirectly connected through an intermediate medium.
[0037] It should be noted that the technical features involved in each embodiment of the utility model described below can be combined with each other as long as there is no conflict between them.
[0038] The inverter is a converter that converts direct current power into fixed frequency and fixed voltage or frequency and voltage alternating current. The inverter needs to work for a long time and stably during use, but a large amount of heat energy will be generated at the same time, and these heat energy needs to be dissipated in time. At present, the existing inverter cavity is closed, and this structure will cause the heat generated by the heat source in the cavity to be unable to be exchanged well, so that the temperature in the cavity is very high. Under such high temperature, the power device in the cavity often fails due to high temperature.
[0039] Based on this, the present invention provides an inverter heat dissipation structure and a photovoltaic inverter, which can effectively reduce the temperature inside the sealed cavity.
[0040] The embodiments of this utility model will be further described below with reference to the accompanying drawings.
[0041] Figure 1 This is a bottom schematic diagram of the inverter heat dissipation structure provided in this embodiment of the utility model; Figure 2 yes Figure 1 AA section view; Figure 3 This is a side view of the inverter heat dissipation structure provided in an embodiment of this utility model. (Refer to...) Figures 1 to 3 As shown, the inverter heat dissipation structure provided in the first aspect embodiment of this utility model includes a cavity shell 100 and a heat sink substrate 200, wherein:
[0042] The outer shell 100 of the cavity is provided with a cavity opening, in Figure 2 In the middle, the entire lower side of the cavity shell 100 is set as a cavity opening.
[0043] The heat sink base plate 200 is connected to the cavity housing 100 and seals the cavity opening to form a sealed cavity 300 inside the cavity housing 100. Specifically, in Figure 2 In this process, a heat sink substrate 200 is disposed on the lower side of the cavity housing 100, thereby blocking the cavity opening on the entire lower side of the cavity housing 100. A power device 310, such as a transistor, is disposed inside the sealed cavity 300. The power device 310 is positioned corresponding to the cavity opening and is in contact with the heat sink substrate 200; the inner side of the heat sink substrate 200 includes a first region 201 corresponding to the power device 310 and a second region 202 not corresponding to the power device 310, as shown in the figure. Figure 4 As shown; the second region 202 is provided with a heat insulation material 400 for reducing heat radiation from the heat sink substrate 200 to the sealed cavity 300. A schematic diagram of the structure of the heat insulation material 400 can be found in the diagram. Figure 5 or Figure 6 As shown. It should be noted that the inner side of the heat sink substrate 200 refers to the side of the heat sink substrate 200 facing the sealed cavity 300, and correspondingly, the side of the heat sink substrate 200 away from the sealed cavity 300 is the outer side of the heat sink substrate 200.
[0044] According to the inverter heat dissipation structure provided in the embodiments of the present application, the cavity opening of the cavity shell 100 is closed by the heat sink substrate 200 to form a sealed cavity 300, the power device 310 inside the sealed cavity 300 can be better protected, the first area 201 of the inner side surface of the heat sink substrate 200 corresponds to the power device 310, therefore the power device 310 directly contacts and presses the first area 201 of the heat sink substrate 200, so that the heat generated by the power device 310 can be directly transmitted to the heat sink substrate 200 for heat dissipation, the second area 202 of the inner side surface of the heat sink substrate 200 is provided with the heat insulation material 400, the heat radiation of the heat sink substrate 200 to the sealed cavity 300 can be reduced, so that the heat transmitted from the first area 201 to the heat sink substrate 200 by the power device 310 can not be radiated to the inside of the sealed cavity 300 from the second area 202, and the temperature inside the sealed cavity 300 can be effectively reduced.
[0045] In addition, as shown in FIG. 1, Figures 1 to 3 The outer side surface of the heat sink substrate 200 is also provided with a plurality of heat dissipation fins 210, the plurality of heat dissipation fins 210 are arranged in parallel with each other, a heat dissipation air duct is formed between the two adjacent heat dissipation fins 210, so that the heat dissipation fins 210 can exchange heat with the airflow flowing through the heat dissipation air duct; after the power device 310 inside the sealed cavity 300 generates heat, the heat is transmitted from the first area 201 of the heat sink substrate 200 to the heat sink substrate 200, and then to the heat dissipation fins 210, and finally taken away by the airflow flowing through the heat dissipation air duct, thereby achieving heat dissipation of the inverter.
[0046] As shown in FIG. 1, Figure 1 and Figure 2 In the inverter heat dissipation structure provided in some embodiments of the present application, the power inductor 500 connected to the outer side surface of the heat sink substrate 200 is further included, and the contact position of the power inductor 500 and the heat sink substrate 200 is arranged in a staggered manner with the first area 201.
[0047] It can be understood that the power inductor 500 needs to be configured in some inverters, and the power inductor 500 also has a large amount of heat, therefore the power inductor 500 is connected to the outer side surface of the heat sink substrate 200, the heat generated by the power inductor 500 can be transmitted to the heat sink substrate 200, and the heat can be taken away by the airflow flowing through the heat dissipation fins 210 of the heat sink substrate 200 to achieve heat dissipation, and the contact position of the power inductor 500 and the heat sink substrate 200 is arranged in a staggered manner with the first area 201, that is, the contact position of the power inductor 500 and the heat sink substrate 200 corresponds to the second area 202 of the heat sink substrate 200, and the position is also correspondingly provided with the heat insulation material 400, so that the heat transmitted from the power inductor 500 to the heat sink substrate 200 can not be radiated to the inside of the sealed cavity 300.
[0048] In the inverter heat dissipation structure provided in some embodiments of the utility model, the heat insulation material 400 is formed on the second area 202 by spraying.
[0049] In the embodiment, the heat insulation material 400 formed on the second area 202 by spraying is integrated with the heat sink substrate 200, and has better adhesion. It can be understood that, before spraying, a sticker can be attached to the first area 201 of the heat sink substrate 200, and the sticker on the first area 201 is torn off after spraying, so that the heat insulation material 400 is prevented from existing on the first area 201, and the heat transfer of the power device 310 to the heat sink substrate 200 is prevented.
[0050] In the inverter heat dissipation structure provided in some embodiments of the utility model, the heat insulation material 400 is formed on the second area 202 by spraying.
[0051] In the embodiment, the heat insulation material 400 formed on the second area 202 by spraying can be cut according to the shape of the second area 202 and then attached to the second area 202, and has the advantages of flexible attachment and easy adjustment.
[0052] In the inverter heat dissipation structure provided in some embodiments of the utility model, the heat insulation material 400 is formed on the second area 202 by spraying.
[0053] It can be understood that the photovoltaic inverter is mainly composed of switching elements such as transistors, and the switching elements are repeatedly turned on / off in a regular manner to convert the direct current input into alternating current output. Usually, a plurality of transistors are arranged in a photovoltaic inverter, and different functional modules are formed by the plurality of transistors, so as to realize the functions of power conversion and energy transmission. The plurality of transistors can be welded on the circuit board and installed in the photovoltaic inverter through the circuit board.
[0054] Referring to Figure 7 , the first aspect embodiment of the utility model further provides an inverter heat dissipation structure, comprising a cavity shell 100, a heat sink substrate 200 and a heat insulation material 400, wherein:
[0055] The cavity shell 100 is provided with a cavity opening; specifically, as Figure 7 shown, the cavity shell 100 can include a first shell 110 and a second shell 120, and the cavity opening can be formed on the second shell 120, and the cavity opening can be formed with a plurality of openings.
[0056] The heat sink substrate 200 is connected with the cavity shell 100 and seals the cavity opening, so as to form a closed cavity 300 in the inside of the cavity shell 100, and specifically, in Figure 7In the embodiment, the heat sink substrate 200 is fixed on the second shell 120. The power device 310 is arranged inside the sealed cavity 300, and the position of the power device 310 corresponds to the cavity opening and is in contact with the heat sink substrate 200.
[0057] The second shell 120 in the cavity shell 100 comprises a third region in contact with the heat sink substrate 200, and the heat insulation material 400 is arranged on the inner side of the second shell 120 in the cavity shell 100 corresponding to the third region. The structure diagram of the heat insulation material 400 can be referred to Figure 5 Or Figure 6 It should be noted that the inner side of the second shell 120 refers to the side of the second shell 120 facing the sealed cavity 300, and accordingly, the side of the second shell 120 away from the sealed cavity 300 is the outer side of the second shell 120.
[0058] According to the inverter heat dissipation structure provided in the embodiment of the utility model, the cavity opening of the cavity shell 100 is sealed by the heat sink substrate 200 to form the sealed cavity 300, which can better protect the power device 310 inside the sealed cavity 300. The position of the power device 310 corresponds to the cavity opening, so that the power device 310 can be directly in contact with the heat sink substrate 200 through the cavity opening. The heat generated by the power device 310 is directly transmitted to the heat sink substrate 200 for heat dissipation. The inner side of the cavity shell 100 corresponding to the third region is provided with the heat insulation material 400, so that the heat generated by the power device 310 can be reduced after being transmitted to the heat sink substrate 200 and then radiated to the inside of the sealed cavity 300 from the third region, thereby effectively reducing the temperature inside the sealed cavity 300.
[0059] Referring to Figure 7 In the inverter heat dissipation structure provided in some embodiments of the utility model, the power inductor 500 connected with the cavity shell 100 is further included. The second shell 120 in the cavity shell 100 comprises a fourth region in contact with the power inductor 500, and the heat insulation material 400 is further arranged on the inner side of the second shell 120 in the cavity shell 100 corresponding to the fourth region.
[0060] In the embodiment, the heat insulation material 400 is also arranged on the inner side corresponding to the contact position of the power inductor 500 and the second shell 120, so that the heat generated by the power inductor 500 can be prevented from being radiated to the inside of the sealed cavity 300.
[0061] In the inverter heat dissipation structure provided in some embodiments of the utility model, the heat insulation material 400 is formed on the inner side of the second shell 120 in the cavity shell 100 corresponding to the third region by spraying.
[0062] In the embodiment, the heat insulation material 400 formed on the second shell 120 by spraying can form an integrated structure with the second shell 120, and has better adhesion.
[0063] In the inverter heat dissipation structure provided in some embodiments of the utility model, the heat insulation material 400 is arranged on the inner side surface of the second shell 120 corresponding to the third region in the cavity shell 100 by surface attachment.
[0064] In the embodiment, the heat insulation material 400 arranged on the second shell 120 by surface attachment can be cut according to the required shape and then attached to the inner side surface of the second shell 120, which has the advantages of flexible attachment and easy adjustment.
[0065] In addition, the second aspect embodiment of the utility model provides a photovoltaic inverter comprising the inverter heat dissipation structure of the above first aspect embodiment.
[0066] According to the photovoltaic inverter provided in the embodiment of the utility model, the cavity opening of the cavity shell 100 is closed by the heat sink substrate 200 to form the sealed cavity 300, which can provide better protection for the power device 310 inside the sealed cavity 300. The first region 201 of the inner side surface of the heat sink substrate 200 corresponds to the power device 310, so that the power device 310 is directly pressed against the first region 201 of the heat sink substrate 200, thereby directly transferring the heat generated by the power device 310 to the heat sink substrate 200 for heat dissipation. The second region 202 of the inner side surface of the heat sink substrate 200 is provided with the heat insulation material 400, which can reduce the heat radiation of the heat sink substrate 200 to the sealed cavity 300, thereby avoiding the heat transferred from the first region 201 of the power device 310 to the heat sink substrate 200 and then radiated from the second region 202 to the inside of the sealed cavity 300, which can effectively reduce the temperature inside the sealed cavity 300. Alternatively, the cavity opening of the cavity shell 100 is closed by the heat sink substrate 200 to form the sealed cavity 300, which can provide better protection for the power device 310 inside the sealed cavity 300. The position of the power device 310 corresponds to the cavity opening, so that the power device 310 can be directly pressed against the heat sink substrate 200 through the cavity opening, thereby directly transferring the heat generated by the power device 310 to the heat sink substrate 200 for heat dissipation. The inner side surface of the cavity shell 100 corresponding to the third region is provided with the heat insulation material 400, thereby reducing the heat transferred from the power device 310 to the heat sink substrate 200 and then radiated from the third region to the inside of the sealed cavity 300, which can effectively reduce the temperature inside the sealed cavity 300.
[0067] Figure 8 is a schematic diagram of the temperature of the cavity of the cavity shell without the heat insulation material; Figure 9It is the cavity temperature schematic diagram of the cavity shell of the inverter heat dissipation structure provided by the embodiment of the utility model. Figure 8 And Figure 9 It can be known that the heat insulation material 400 is arranged in the mode provided by the embodiment of the utility model, the temperature inside the closed cavity 300 can be reduced by 3.5 degrees Celsius, and the mode has good effect.
[0068] The above combines the drawings to make detailed description to the embodiment of the utility model, but the utility model is not limited to the above embodiment, within the knowledge range possessed by the ordinary skill in the art, various changes can be made without departing from the purpose of the utility model.
Claims
1. An inverter heat dissipation structure, characterized by comprising: The application relates to an inverter heat dissipation structure. The application relates to an inverter heat dissipation structure. The application relates to an inverter heat dissipation structure.
2. The inverter heat dissipation structure according to claim 1, characterized by, The application relates to an inverter heat dissipation structure.
3. The inverter heat dissipation structure according to claim 1, characterized by, The application relates to an inverter heat dissipation structure.
4. The inverter heat dissipation structure according to claim 1, characterized by, The application relates to an inverter heat dissipation structure.
5. The inverter heat dissipation structure according to claim 1, wherein The application relates to an inverter heat dissipation structure.
6. An inverter heat dissipation structure, characterized by comprising: The application relates to an inverter heat dissipation structure. The application relates to an inverter heat dissipation structure. The application relates to an inverter heat dissipation structure. The application relates to an inverter heat dissipation structure.
7. The inverter heat dissipation structure according to claim 6, characterized by, The application relates to an inverter heat dissipation structure.
8. The inverter heat dissipation structure according to claim 6, characterized by, The application relates to an inverter heat dissipation structure.
9. The inverter heat dissipation structure of claim 6, wherein, The application relates to an inverter heat dissipation structure.
10. A photovoltaic inverter, characterized by The application relates to an inverter heat dissipation structure. The application relates to an inverter heat dissipation structure. The application relates to an inverter heat dissipation structure. The application relates to an inverter heat dissipation structure. The application relates to an inverter heat dissipation structure. The application relates to an inverter heat dissipation structure. The application relates to an inverter heat dissipation structure. The application relates to an inverter heat dissipation structure. The application relates to an inverter heat dissipation structure. The application relates to an inverter heat dissipation structure. The application relates to an inverter heat dissipation structure. The application relates to an inverter heat dissipation structure. The application relates to an inverter heat dissipation structure. The application relates to an inverter heat dissipation structure. The application relates to an inverter heat dissipation structure. The application relates to an inverter heat dissipation structure. The application relates to an inverter heat dissipation structure. The application relates to an inverter heat dissipation structure. The application relates to an inverter heat dissipation structure. The application relates to an inverter heat dissipation structure. The application relates to an inverter heat dissipation structure. The application relates to an inverter heat dissipation structure. The application relates to an inverter heat dissipation structure. The application relates to an inverter heat dissipation structure. The application relates to an inverter heat dissipation structure. The application relates to an inverter heat dissipation structure. The application relates to an inverter heat dissipation structure. The application relates to an inverter heat dissipation structure. The application relates to an inverter heat dissipation structure. The application relates to an inverter heat dissipation structure. The application relates to an inverter heat dissipation structure. The application relates to an inverter heat dissipation structure. The application relates to an inverter heat dissipation structure. The application relates to an inverter heat dissipation structure. The application relates to an inverter heat dissipation structure. The application relates to an inverter heat dissipation structure. The application relates to an inverter heat dissipation structure. The application relates to an inverter heat dissipation structure. The application relates to an inverter heat dissipation structure. The application relates to an inverter heat dissipation structure. The application relates to an inverter heat dissipation structure. The application relates to an inverter heat dissipation structure. The application relates to an inverter heat dissipation structure. The application relates to an inverter heat dissipation structure. The application relates to an inverter heat dissipation structure. The application relates to an inverter heat dissipation structure. The application relates to an inverter heat dissipation structure. The application relates to an inverter heat dissipation structure. The application relates to an inverter heat dissipation structure. The application relates to an inverter heat dissipation structure. The application relates to an inverter heat dissipation structure. The application relates to an inverter heat dissipation structure. The application relates to an inverter heat dissipation structure. The application relates to an inverter heat dissipation structure. The application relates to an inverter heat dissipation structure. The application relates to an inverter heat dissipation structure. The application relates to an inverter heat dissipation structure. The application relates to an inverter heat dissipation structure. The application relates to an inverter heat dissipation structure. The application relates to an inverter heat dissipation structure. The application relates to an inverter heat dissipation structure. The application relates to an inverter heat dissipation structure. The application relates to an inverter heat dissipation structure. The application relates to an inverter heat dissipation structure. The application relates to an inverter heat dissipation structure. The application relates to an inverter heat dissipation structure. The application relates to an inverter heat dissipation structure. The application relates to an inverter heat dissipation structure. The application relates to an inverter heat dissipation structure. The application relates to an inverter heat dissipation structure. The application relates to an inverter heat dissipation structure. The application relates to an inverter heat dissipation structure. The application relates to an inverter heat dissipation structure. The application relates to an inverter heat dissipation structure. The application relates to an inverter heat dissipation structure. The application relates to an inverter heat dissipation structure. The application relates to an inverter heat dissipation structure. The application relates to an inverter heat dissipation structure. The application relates to an inverter heat dissipation structure. The application relates to an inverter heat dissipation structure. The application relates to an inverter heat dissipation structure. The application relates to an inverter heat dissipation structure. The application relates to an inverter heat dissipation structure. The application relates to an inverter heat dissipation structure. The application relates to an inverter heat dissipation structure. The application relates to an inverter heat dissipation structure. The application relates to an inverter heat dissipation structure. The application relates to an inverter heat dissipation structure. The application relates to an inverter heat dissipation structure. The application relates to an inverter heat dissipation structure. The application relates to an inverter heat dissipation structure. The application relates to an inverter heat dissipation structure. The application relates to an inverter heat dissipation structure. The application relates to an inverter heat dissipation structure. The application relates to an inverter heat dissipation structure. The application relates to an inverter heat dissipation structure. The application relates to an inverter heat dissipation structure. The application relates to an inverter heat dissipation structure. The application relates to an inverter heat dissipation structure. The application relates to an inverter heat dissipation structure. The application relates to an inverter heat dissipation structure. The application relates to an inverter heat dissipation structure. The application relates to an inverter heat dissipation structure. The application relates to an inverter heat dissipation structure. The application relates to an inverter heat dissipation structure. The application relates to an inverter heat dissipation structure. The application relates to an inverter heat dissipation structure. The application relates to an inverter heat dissipation structure. The application relates to an inverter heat dissipation structure. The application relates to an inverter heat dissipation structure. The application relates to an inverter heat dissipation structure. The application relates to an inverter heat dissipation structure. The application relates to an inverter heat dissipation structure. The application relates to an inverter heat dissipation structure. The application relates to an inverter heat dissipation structure. The application relates to an inverter heat dissipation structure. The application relates to an inverter heat dissipation structure. The application relates to an inverter heat dissipation structure. The application relates to an inverter heat dissipation structure. The application relates to an inverter heat dissipation structure. The application relates to an inverter heat dissipation structure. The application relates to an inverter heat dissipation structure. The application relates to an inverter heat dissipation structure. The application relates to an inverter heat dissipation structure. The application relates to an inverter heat dissipation structure. The application relates to an inverter heat dissipation structure. The application relates to an inverter heat dissipation structure. The application relates to an inverter heat dissipation structure. The application relates to an inverter heat dissipation structure. The application relates to an inverter heat dissipation structure. The application relates to an inverter heat dissipation structure. The application relates to an inverter heat dissipation structure. The application relates to an inverter heat dissipation structure. The application relates to an inverter heat dissipation structure. The application relates to an inverter heat dissipation structure. The application relates to an inverter heat dissipation structure. The application relates to an inverter heat dissipation structure. The application relates to an inverter heat dissipation structure. The application relates to an inverter heat dissipation structure. The application relates to an inverter heat dissipation structure. The application relates to an inverter heat dissipation structure. The application relates to an inverter heat dissipation structure. The application relates to an inverter heat dissipation structure. The application relates to an inverter heat dissipation structure. The application relates to an inverter heat dissipation structure. The application relates to an inverter heat dissipation structure. The application relates to an inverter heat dissipation structure. The application relates to an inverter heat dissipation structure. The application relates to an inverter heat dissipation structure. The application relates to an inverter heat dissipation structure. The application relates to an inverter heat dissipation structure. The application relates to an inverter heat dissipation structure. The application relates to an inverter heat dissipation structure. The application relates to an inverter heat dissipation structure. The application relates to an inverter heat dissipation structure. The application relates to an inverter heat dissipation structure. The application relates to an inverter heat