Device for improving residue of high-viscosity negative glue and uniform glue silk

Abstract

The utility model relates to the technical field of manufacturing of power semiconductors, and discloses a device for improving high-viscosity negative glue spin-coating glue silk residues, a stainless steel spin-coating cavity is provided with a sucker motor connecting shaft, the bottom of the shaft is connected with a sucker motor for providing rotation, and a rotary sucker is arranged at the top of the shaft. An electric lifter is mounted on the outer side of the cavity, an output end is connected with an overturning seat, a double-layer cover is mounted on the seat, and a glue dripping pipeline is mounted on the cover and penetrates through the cover to extend downwards. And through the optimized glue uniformizing design, glue thread residues on the back surface and the edge of the wafer are effectively reduced, so that the problem that the wafer is scrapped due to wafer breaking, wafer cracking and the like in the subsequent photoetching process is reduced. And the residual glue threads at the edge of the wafer are reduced, so that the damage to the photolithography mask caused by the residual glue threads is reduced, and the service life of the photolithography mask is prolonged. By reducing the rejection rate of the wafer and the damage of the photolithography mask, a more reasonable process scheme is provided for photoetching and glue uniformizing processes of a table board, a lead and the like of a high-voltage and high-power chip, so that the overall process yield is improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to power semiconductor manufacturing technical field, concretely is a kind of high viscosity negative glue uniformity glue silk residual device for improvement. BACKGROUND

[0002] At present, with the continuous progress and maturity of domestic high-power device technology, the market demand of high-voltage high-power chip is increasing year by year, and the pace of import substitution is also gradually accelerated. The core manufacturing link of the product depends on advanced process technology of large size and deep mesa, which usually requires the width and depth of the mesa to exceed 100um. In the deeper mesa process, the time required for wafer etching increases significantly, and low viscosity photoresist is not up to the task because it cannot withstand long-term strong acid corrosion. Therefore, for mesa processes above 100um, photoresist with higher resistance and thicker layer thickness must be used to match the complex photoetching process, such as the widely used 450 and 500 type negative photoresist on the market.

[0003] These high-end photoresists not only significantly enhance the etching performance, but also greatly improve the viscosity of the photoresist. However, the increase in viscosity also brings new challenges - the generation of glue silk during high-speed glue uniformity rotation. If there is glue silk left on the back or edge of the wafer, it will cause serious problems such as wafer cracking, damage, and corner defects during the subsequent contact exposure process, and even damage the photoetching plate, resulting in economic losses.

[0004] With the continuous expansion of the application field of high-voltage high-power devices, from traditional industrial control to new energy, automotive electronics, solar inverter, high-voltage power grid and other emerging fields, deep groove photoetching and lead photoetching process as the key link in high-voltage device manufacturing, its process requirements are becoming more and more stringent. In these processes, if there is residual glue or glue silk on the back and edge of the wafer, it will directly lead to an increase in the breakage rate, thereby significantly increasing production costs. Therefore, the existing equipment scheme is difficult to meet the current process requirements, and needs to be upgraded and optimized.

[0005] Therefore, based on the above technical problems, it is necessary for technicians in the field to develop a high-viscosity negative glue uniformity glue silk residual device. UTILITY MODEL CONTENT

[0006] The utility model aims to provide a kind of high-viscosity negative glue uniformity glue silk residual device for improvement, to solve the problems raised in the above background art.

[0007] To achieve the above purpose, the utility model provides the following technical scheme:

[0008] The utility model provides a kind of to improve high viscosity negative glue uniformity glue silk residual device technical scheme, including stainless steel uniformity glue chamber, suction cup motor connecting shaft is installed in the stainless steel uniformity glue chamber, suction cup motor connecting shaft bottom is connected with suction cup motor, for providing rotary drive, suction cup motor connecting shaft top end is installed with rotary suction cup, stainless steel uniformity glue chamber adjacent outside is installed with electric hoist, electric hoist output end is connected with turnover seat, double-layer cover is installed on the turnover seat, glue dripping pipeline is installed on the double-layer cover, glue dripping pipeline penetrates double-layer cover and extends downward.

[0009] As a preferred technical scheme, the double-layer cover is composed of lower cover and upper cover, the lower cover is provided with a hollow area, the upper cover is installed above the hollow area, and the upper cover and the lower cover are connected by four columns.

[0010] As a preferred technical scheme, a vacuum passage is arranged in the middle of the suction cup motor connecting shaft, the vacuum holes on the rotary suction cup are connected with the vacuum passage, and the vacuum passage is connected with a vacuum device to provide vacuum for the suction cup.

[0011] As a preferred technical scheme, the distance between the rotary suction cup and the bottom of the chamber is 110 mm, the diameter of the stainless steel uniformity glue chamber is 200 mm, and the depth is 150 mm.

[0012] As a preferred technical scheme, the diameter of the lower cover is 200 mm, and the diameter of the upper cover is 100 mm.

[0013] As a preferred technical scheme, the height of the column is 2-3 cm.

[0014] Compared with the prior art, the utility model has the advantages that:

[0015] The utility model discloses a kind of to improve high viscosity negative glue uniformity glue silk residual device, by optimizing the uniformity glue design, effectively reduce the glue silk residual of wafer back and edge, to reduce the problem that wafer is scrapped in subsequent photolithography process, broken piece, crack piece etc.

[0016] The utility model reduces the glue silk residual of wafer edge, and then reduces the photolithography plate damage caused by glue silk residual, prolongs the service life of photolithography plate. By reducing the wafer scrap rate and the damage of photolithography plate, a more reasonable process scheme is provided for high-voltage high-power chip mesa, lead etc. photolithography uniformity glue process, so as to improve the overall process yield.

[0017] The optimized device reduces the loss of wafers and photoetching plates, reduces production cost, and has a positive impact on the economic benefits of the production line. The device is not only suitable for the uniform coating process of high-viscosity negative photoresist, but also suitable for the uniform coating process of conventional viscosity photoresist, and has good versatility and flexibility. The design of the hollow top cover enables the operator to conveniently observe the wafer uniform coating process, and facilitates real-time monitoring and adjustment of process parameters.

[0018] In summary, the device solves the problem of glue filament in the uniform coating process of high-viscosity negative photoresist, improves the yield and efficiency of the photoetching process, reduces production cost, and has significant industrial application value. BRIEF DESCRIPTION OF DRAWINGS

[0019] Figure 1 It is a whole structure schematic view of a device for improving high-viscosity negative photoresist uniform coating glue filament residue;

[0020] Figure 2 It is a use state structure schematic view of a device for improving high-viscosity negative photoresist uniform coating glue filament residue.

[0021] In the figure, 1 is a stainless steel uniform coating chamber; 2 is a chuck motor connecting shaft; 3 is a rotating chuck; 4 is an electric lifter; 5 is a turnover seat; 6 is a lower cover; 7 is a hollow area; 8 is an upper cover; and 9 is a glue dropping pipeline. DETAILED DESCRIPTION

[0022] The features and exemplary embodiments of each aspect of the present application will be described in detail below. In order to make the purpose, technical scheme and advantages of the present application more clear and apparent, the present application will be further described in detail below with reference to the drawings and specific embodiments. For those skilled in the art, the present application can be implemented without some of these specific details. The following description of the embodiments is only to provide a better understanding of the present application by showing examples of the present application.

[0023] As shown in Figure 1 , Figure 2 The present application provides a device for improving high-viscosity negative photoresist uniform coating glue filament residue, which comprises a stainless steel uniform coating chamber 1, a chuck motor connecting shaft 2 is installed in the stainless steel uniform coating chamber, a chuck motor is connected to the bottom of the chuck motor connecting shaft for providing rotary drive, a rotating chuck 3 is installed at the top end of the chuck motor connecting shaft, an electric lifter 4 is installed adjacent to the outside of the stainless steel uniform coating chamber, a turnover seat 5 is connected to the output end of the electric lifter, a double-layer cover 6 is installed on the turnover seat, a glue dropping pipeline 9 is installed on the double-layer cover and extends downward through the double-layer cover.

[0024] The double-layer cover 6 is composed of a lower cover 7 and an upper cover 8, the lower cover 7 is provided with a hollow area 7, and the upper cover 8 is arranged above the hollow area 7.

[0025] The vacuum channel is connected with a vacuum device (not shown) to provide vacuum for the suction disc.

[0026] The distance between the rotating suction disc 3 and the bottom of the cavity is 110 mm, and the diameter of the stainless steel glue uniformizing cavity 1 is 200 mm and the depth is 150 mm.

[0027] The diameter of the lower cover 7 is 200 mm, and the diameter of the upper cover 8 is 100 mm.

[0028] According to the above scheme, in the implementation, during use, the wafer is placed on the rotating suction disc 3, and then the turnover seat 5 and the double-layer cover are turned over by the electric lifter 4 to be tightly attached to the stainless steel glue uniformizing cavity 1, during the glue uniformizing process, the rotating suction disc 3 is rotated under the drive of the suction disc motor, vacuum adsorption force is generated through the vacuum channel and the vacuum holes on the suction disc, and the wafer is ensured to be stable during the glue uniformizing process.

[0029] After the glue uniformizing is completed, the electric lifter 4 turns over the turnover seat 5 and the double-layer cover to be opened, and the wafer is taken out for subsequent photoetching process.

[0030] The glue uniformizing device of the utility model realizes effective control of wafer back and edge glue silk residue, improves photoetching process yield and efficiency, reduces production cost at the same time, and has remarkable industrial application value.

[0031] The working principle and use process of the utility model are as follows: after the components of the scheme are assembled in sequence, the components are sequentially operated according to actual requirements, and all working steps can be realized.

[0032] The above merely describes a preferred specific implementation manner of the utility model, but the protection scope of the utility model is not limited to this, any skilled person in the art can make equivalent replacement or change according to the technical scheme and the utility model concept of the utility model within the technical range disclosed by the utility model, and all of them should be covered in the protection scope of the utility model.

[0033] In the description of the utility model, it is understood that the orientation or positional relationship indicated by the terms "coaxial", "bottom", "one end", "top", "middle", "the other end", "upper", "one side", "top", "inner", "front", "central", "both ends" and the like is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the utility model and simplifying the description, and does not indicate or imply that the devices or elements indicated must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the utility model.

[0034] In the utility model, unless otherwise explicitly specified and limited, the terms "mounting", "setting", "connecting", "fixing", "screw connection" and the like should be understood broadly, for example, can be fixed connection, can also be detachable connection, or be integrated; can be mechanical connection, can also be electrical connection; can be directly connected, can also be indirectly connected through an intermediate medium, can be the communication inside two elements or the interaction relationship of two elements, unless otherwise explicitly limited, the above terms in the utility model can be understood according to the specific meaning in the specific circumstances by the ordinary skilled in the art.

[0035] According to the above embodiments of the utility model, these embodiments do not describe all the details, and the utility model is not limited to the specific embodiments. Obviously, according to the above description, many modifications and changes can be made. The embodiments are selected and specifically described in the specification in order to better explain the principles and practical application of the utility model, so that the skilled in the art can well utilize the utility model and the modified use based on the utility model. Any modification, equivalent replacement, improvement and the like made within the spirit and principles of the utility model should be included in the protection scope of the utility model.

Claims

1. A device for improving the residue of adhesive fibers in high-viscosity negative adhesive, characterized in that, include: A stainless steel uniform adhesive chamber (1) is provided with a suction cup motor connecting shaft (2) installed inside the stainless steel uniform adhesive chamber (1). A suction cup motor is connected to the bottom of the suction cup motor connecting shaft (2) to provide rotation drive. A rotating suction cup (3) is installed at the top of the suction cup motor connecting shaft (2). An electric lifter (4) is installed on the adjacent outer side of the stainless steel uniform adhesive chamber (1). A flipping seat (5) is connected to the output end of the electric lifter (4). A double cover is installed on the flipping seat (5). A dripping pipe (9) is installed on the double cover. The dripping pipe (9) passes through the double cover and extends downward.

2. The device for improving the residue of adhesive fibers in high-viscosity negative adhesive as described in claim 1, characterized in that: The double-layer cover consists of a lower cover (6) and an upper cover (8). The lower cover (6) has a through-hole area (7), and the upper cover (8) is installed above the through-hole area (7). The upper cover (8) and the lower cover (6) are connected by four sets of pillars.

3. The device for improving the residue of adhesive fibers in high-viscosity negative adhesive as described in claim 1, characterized in that: A vacuum channel is provided in the middle of the suction cup motor connecting shaft (2), and the vacuum hole on the rotating suction cup (3) is connected to the vacuum channel. The vacuum channel is connected to a vacuum device to provide a vacuum for the suction cup.

4. The device for improving the residue of adhesive fibers in high-viscosity negative adhesive as described in claim 3, characterized in that: The distance between the rotating suction cup (3) and the bottom of the cavity is 110mm, and the stainless steel uniform adhesive chamber (1) has a diameter of 200mm and a depth of 150mm.

5. The device for improving the residue of adhesive fibers in high-viscosity negative adhesive as described in claim 2, characterized in that: The lower cover (6) has a diameter of 200 mm, and the upper cover (8) has a diameter of 100 mm.

6. The device for improving the residue of adhesive fibers in high-viscosity negative adhesive as described in claim 2, characterized in that: The height of the column is 2-3cm.

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