Plasma cleaning device for PCB (Printed Circuit Board)

Abstract

The utility model provides a plasma cleaning device for a PCB (Printed Circuit Board). The conveying assembly and the transverse moving assembly are both arranged on the rack, the transverse moving assembly is located above the conveying assembly, the longitudinal moving assembly is installed at the moving end of the transverse moving assembly, the vertical moving assembly is installed at the moving end of the longitudinal moving assembly, and the plasma spraying part is installed at the moving end of the longitudinal moving assembly. The first PCB conveying part and the second PCB conveying part are both arranged on the rack, and a PCB conveying area is jointly formed between the first PCB conveying part and the second PCB conveying part. And the spraying end of the plasma spraying piece is arranged towards the PCB transmission area. The first lifting part is arranged on the first PCB conveying part, the second lifting part is arranged on the second PCB conveying part, and the lifting end of the first lifting part and the lifting end of the second lifting part are jointly used for supporting a PCB located in the PCB conveying area so as to adjust the distance between the spraying end of the plasma spraying part and the PCB.

Description

TECHNICAL FIELD

[0001] The present disclosure relates to the field of PCB board production and processing, in particular to a PCB board plasma cleaning device. BACKGROUND

[0002] Electronic product PCB board has a very wide range of uses in electronic products. As a carrier of electronic components, it can provide stable electrical connections and good signal transmission to ensure the normal operation of electronic products. Stable electrical connections and good signal transmission cannot be achieved without the surface cleanliness of the PCB board. After SMT surface technology processing, the surface of the PCB board may have particle impurities. In order to improve the surface cleanliness of the PCB board, the existing plasma cleaning machine generally has an XYZ three-axis moving mechanism to drive the plasma nozzle to clean the PCB board comprehensively. For example, the prior art includes CN220738842U-Plasma cleaning equipment and CN213436084U-Plasma spray gun driving device and plasma cleaning machine.

[0003] The Z-axis movement of the existing plasma cleaning machine controls the vertical height of the plasma nozzle. For thick PCB board cleaning requirements, the vertical height of the plasma nozzle can be adjusted by Z-axis movement to achieve the best cleaning height of the thick PCB board.

[0004] The movement structure of the Z-axis moving mechanism is limited in position, that is, there is a minimum height difference between the movement structure of the Z-axis moving mechanism and the PCB board on the conveying belt, so that the plasma nozzle has a minimum height difference from the PCB board on the conveying belt. However, the best cleaning height of the ultra-thin PCB board is lower than the above-mentioned minimum height difference, so that the plasma cleaning machine cannot meet the requirement of the best cleaning height of the ultra-thin PCB board, resulting in poor cleaning effect of the plasma cleaning machine on the ultra-thin PCB board, and reducing the adaptability of the plasma cleaning machine. CONTENT OF THE INVENTION

[0005] The purpose of the present disclosure is to overcome the shortcomings of the prior art and provide a PCB board plasma cleaning device that can adapt to different thickness PCB boards while ensuring the best cleaning effect of the PCB board.

[0006] The purpose of the present disclosure is achieved by the following technical solutions:

[0007] The utility model provides a kind of plasma cleaning device for PCB, including frame, transmission component, plasma spray piece, transverse movement component, longitudinal movement component and vertical movement component, the transmission component and the transverse movement component are arranged on the frame, the transverse movement component is located above the transmission component, the longitudinal movement component is installed on the moving end of the transverse movement component, the vertical movement component is installed on the moving end of the longitudinal movement component, the plasma spray piece is installed on the moving end of the longitudinal movement component;

[0008] The transmission component includes a first PCB plate transmission member and a second PCB plate transmission member, both of which are arranged on the frame, and a PCB plate transmission area is formed between the first PCB plate transmission member and the second PCB plate transmission member.

[0009] The spray end of the plasma spray piece is arranged towards the PCB plate transmission area.

[0010] The plasma cleaning device further includes a lifting assembly, which includes a first lifting member and a second lifting member. The first lifting member is arranged on the first PCB plate transmission member, and the second lifting member is arranged on the second PCB plate transmission member. The lifting end of the first lifting member and the lifting end of the second lifting member are used together to support the PCB plate in the PCB plate transmission area, so as to adjust the distance between the spray end of the plasma spray piece and the PCB plate.

[0011] In one embodiment, the first PCB plate transmission member includes a first transmission baffle, a first transmission drive member, and a first belt transmission member. The first transmission baffle is arranged on the frame, the first transmission drive member is installed on the first transmission baffle, and the first belt transmission member is sleeved on the output rotating wheel of the first transmission drive member.

[0012] The second PCB plate transmission member includes a second transmission baffle, a second transmission drive member, and a second belt transmission member. The second transmission baffle is arranged on the frame, the second transmission drive member is installed on the second transmission baffle, and the second belt transmission member is sleeved on the output rotating wheel of the second transmission drive member. The first belt transmission member and the second belt transmission member form the PCB plate transmission area together.

[0013] In one of the embodiments, the first lifting member comprises a first lifting driving member, a first cam member, a first lifting block and a first lifting top plate, the first lifting driving member is arranged on the frame, the first lifting block is provided with a first cam groove, the first lifting top plate is installed on the first lifting block, and an eccentric rotating shaft of the first lifting driving member is fixedly connected with one end of the first cam member, and the other end of the first cam member is arranged in the first cam groove.

[0014] The second lifting member comprises a second lifting driving member, a second cam member, a second lifting block and a second lifting top plate, the second lifting driving member is arranged on the frame, the second lifting block is provided with a second cam groove, the second lifting top plate is installed on the second lifting block, and an eccentric rotating shaft of the second lifting driving member is fixedly connected with one end of the second cam member, and the other end of the second cam member is arranged in the second cam groove.

[0015] In one of the embodiments, the first lifting member further comprises a first sliding rail member, a second sliding rail member and a plurality of first spring limiting members, the first sliding rail member and the second sliding rail member are both installed on the first transmission baffle, one end of each of the plurality of first spring limiting members is fixed on the first transmission baffle, the other end of each of the plurality of first spring limiting members is fixed on the first lifting block, and the first lifting block is in sliding connection with the first sliding rail member and the second sliding rail member respectively.

[0016] In one of the embodiments, the second lifting member further comprises a third sliding rail member, a fourth sliding rail member and a plurality of second spring limiting members, the third sliding rail member and the fourth sliding rail member are both installed on the second transmission baffle, one end of each of the plurality of second spring limiting members is fixed on the second transmission baffle, the other end of each of the plurality of second spring limiting members is fixed on the second lifting block, and the second lifting block is in sliding connection with the third sliding rail member and the fourth sliding rail member respectively.

[0017] In one of the embodiments, the lateral moving assembly comprises a first lateral fixing frame, a second lateral fixing frame, a lateral driving member, a first lateral moving block, a second lateral moving block, a fifth sliding rail member and a sixth sliding rail member, the first lateral fixing frame and the second lateral fixing frame are both mounted in the rack, the lateral driving member is mounted on the first lateral fixing frame, the first lateral moving block is threadedly connected with a screw rod transmission shaft of the lateral driving member, the fifth sliding rail member is mounted on the first lateral fixing frame, the sixth sliding rail member is mounted on the second lateral fixing frame, the first lateral moving block and the second lateral moving block are both connected with the longitudinal moving assembly, the first lateral moving block and the second lateral moving block are both located above the PCB board conveying area, the first lateral moving block is slidably connected with the fifth sliding rail member, and the second lateral moving block is slidably connected with the sixth sliding rail member.

[0018] In one of the embodiments, the longitudinal moving assembly comprises a longitudinal fixing frame, a longitudinal driving member, a longitudinal moving block and a seventh sliding rail member, the longitudinal fixing frame is connected with the first lateral moving block and the second lateral moving block respectively, the longitudinal driving member is mounted on the longitudinal fixing frame, the longitudinal moving block is threadedly connected with a screw rod transmission shaft of the longitudinal driving member, the longitudinal moving block is connected with the vertical moving assembly, and the seventh sliding rail member is mounted on the longitudinal fixing frame, the longitudinal moving block is slidably connected with the seventh sliding rail member.

[0019] In one of the embodiments, the vertical moving assembly comprises a vertical fixing frame, a vertical driving member, a vertical moving block and an eighth sliding rail member, the vertical fixing frame is connected with the longitudinal moving block, the vertical driving member is mounted on the vertical fixing frame, the vertical moving block is threadedly connected with a screw rod transmission shaft of the vertical driving member, the plasma spraying member is mounted on the vertical moving block, the eighth sliding rail member is mounted on the vertical fixing frame, and the vertical moving block is slidably connected with the eighth sliding rail member.

[0020] In one of the embodiments, the rack is provided with a board inlet and a board outlet.

[0021] The plasma cleaning device further comprises an upper code reading assembly and a lower code reading assembly, the upper code reading assembly is arranged in the rack, and the upper code reading assembly is arranged adjacent to one side of the board inlet; the lower code reading assembly is arranged outside the rack, and the lower code reading assembly is arranged adjacent to the other side of the board inlet; the upper code reading assembly comprises a first mounting frame, a first horizontal moving drive, a first horizontal moving block and an upper code reader; the first mounting frame is mounted on the first horizontal fixing frame; the first horizontal moving drive is mounted on the first mounting frame; the first horizontal moving block is threadedly connected with a screw rod transmission shaft of the first horizontal moving drive; and the upper code reader is mounted on the first horizontal moving block; the lower code reading assembly comprises a second mounting frame, a second horizontal moving drive, a second horizontal moving block and a lower code reader; the second mounting frame is mounted on the rack; the second horizontal moving drive is mounted on the second mounting frame; the second horizontal moving block is threadedly connected with a screw rod transmission shaft of the second horizontal moving drive; and the lower code reader is mounted on the second horizontal moving block.

[0022] In one of the embodiments, the plasma cleaning device further comprises a width adjusting assembly, the width adjusting assembly comprises a width adjusting drive, a first transmission screw rod and a second transmission screw rod; the width adjusting drive is arranged in the rack; one end of the first transmission screw rod and one end of the second transmission screw rod are connected with a power output end of the width adjusting drive; the other end of the first transmission screw rod and the other end of the second transmission screw rod are fixedly connected with the second transmission baffle; the first transmission baffle is threadedly connected with the first transmission screw rod and the second transmission screw rod respectively, so as to adjust the distance between the first transmission baffle and the second transmission baffle through the width adjusting drive.

[0023] In one of the embodiments, the lifting assembly further comprises a first limiting baffle and a second limiting baffle; the first limiting baffle is mounted on the first transmission baffle; the second limiting baffle is mounted on the second transmission baffle; and the first limiting baffle and the second limiting baffle are located above the PCB board transmission area.

[0024] Compared with the prior art, the present disclosure has at least the following advantages:

[0025] 1. By arranging the first PCB board transmission member and the second PCB board transmission member, and forming the PCB board transmission area between the first PCB board transmission member and the second PCB board transmission member, the first PCB board transmission member and the second PCB board transmission member are used to jointly transmit the PCB board, and then the driving horizontal moving assembly, the vertical moving assembly and the vertical moving assembly are used to drive the plasma spraying member to move in the rack, so that the plasma spraying member can comprehensively clean the PCB board in the PCB board transmission area, and the PCB board has good cleaning effect.

[0026] 2. To address the cleaning requirements of PCBs of varying thicknesses, the distance between the plasma spray component and the PCB in the PCB transfer area can be adjusted using the vertical moving component. This allows the plasma to clean the PCB at the optimal cleaning height, achieving the best cleaning effect for PCBs of different thicknesses. Furthermore, there is a minimum height difference between the vertical moving component and the PCB in the PCB transfer area. The optimal cleaning height for ultra-thin PCBs is lower than this minimum height difference. By incorporating a first lifting component and a second lifting component, the PCB in the PCB transfer area is lifted, shortening the distance between the plasma spray component and the PCB in the PCB transfer area. This reduces the minimum height difference between the vertical moving component and the PCB in the PCB transfer area, matching the optimal cleaning height for ultra-thin PCBs and achieving the best cleaning effect. This also improves the cleaning adaptability of the plasma cleaning device. Attached Figure Description

[0027] To more clearly illustrate the technical solutions of the embodiments of this disclosure, the accompanying drawings used in the embodiments will be briefly described below. It should be understood that the following drawings only show some embodiments of this disclosure and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0028] Figure 1 This is a schematic diagram of the structure of a plasma cleaning device for PCB boards in one embodiment;

[0029] Figure 2 for Figure 1 A schematic diagram of the plasma cleaning device for the PCB board shown from another perspective.

[0030] Figure 3 for Figure 1 A partial structural schematic diagram of the plasma cleaning device used for the PCB board is shown.

[0031] Figure 4 for Figure 3 A schematic diagram of the plasma cleaning device for the PCB board shown from another perspective.

[0032] Figure 5 for Figure 3 A partial structural schematic diagram of the plasma cleaning device used for the PCB board is shown.

[0033] Figure 6 for Figure 3 A partial structural schematic diagram of the plasma cleaning device used for the PCB board is shown.

[0034] Figure 7 for Figure 6 A schematic diagram of the plasma cleaning device for the PCB board shown from another perspective.

[0035] Figure 8 for Figure 7 A partial structural schematic diagram of the plasma cleaning device used for the PCB board is shown.

[0036] Figure 9 for Figure 5 A partial structural schematic diagram of the plasma cleaning device used for the PCB board is shown.

[0037] Figure 10 for Figure 9 A schematic diagram of the plasma cleaning device for the PCB board shown from another perspective.

[0038] Figure 11 for Figure 9 A partial structural schematic diagram of the plasma cleaning device used for the PCB board is shown.

[0039] Figure 12 for Figure 10 A partial structural diagram of the plasma cleaning device used for the PCB board is shown. Detailed Implementation

[0040] To facilitate understanding of this disclosure, a more complete description will be given below with reference to the accompanying drawings, which illustrate preferred embodiments of the present disclosure. However, this disclosure can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided to provide a more thorough and complete understanding of the disclosure.

[0041] It should be noted that when an element is referred to as being "fixed to" another element, it can be directly attached to the other element or there may be an intervening element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or there may be an intervening element. The terms "vertical," "horizontal," "left," "right," and similar expressions used herein are for illustrative purposes only and do not represent the only possible implementation.

[0042] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure belongs. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of this disclosure. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0043] The present disclosure provides a kind of PCB board plasma cleaning device comprising rack, transmission assembly, plasma spray piece, transverse movement assembly, longitudinal movement assembly and vertical movement assembly, transmission assembly and transverse movement assembly are arranged on rack, transverse movement assembly is located in the upper of transmission assembly, longitudinal movement assembly is installed on the mobile end of transverse movement assembly, vertical movement assembly is installed on the mobile end of longitudinal movement assembly, plasma spray piece is installed on the mobile end of longitudinal movement assembly.Transmission assembly includes first PCB board transmission piece and second PCB board transmission piece, first PCB board transmission piece and second PCB board transmission piece are arranged on rack, first PCB board transmission piece and second PCB board transmission piece are formed with PCB board transmission area between it together.Plasma spray piece spray end is towards PCB board transmission area setting.Plasma cleaning device further includes lifting assembly, lifting assembly includes first lifting piece and second lifting piece, first lifting piece is set on first PCB board transmission piece, second lifting piece is set on second PCB board transmission piece, the lifting end of first lifting piece and the lifting end of second lifting piece are used to support PCB board in PCB board transmission area, to adjust the distance between plasma spray piece spray end and PCB board.

[0044] Please refer to Figures 1 to 12 , in order to better understand the PCB board plasma cleaning device 10 of the present disclosure, the following further explains the PCB board plasma cleaning device 10:

[0045] The plasma cleaning device 10 for PCB board in an embodiment comprises a rack 100, a conveying assembly 200, a plasma spraying part 300, a transverse moving assembly 400, a longitudinal moving assembly 500 and a vertical moving assembly 600, the conveying assembly 200 and the transverse moving assembly 400 are arranged on the rack 100, the transverse moving assembly 400 is above the conveying assembly 200, the longitudinal moving assembly 500 is installed on the moving end of the transverse moving assembly 400, the vertical moving assembly 600 is installed on the moving end of the longitudinal moving assembly 500, and the plasma spraying part is installed on the moving end of the longitudinal moving assembly 500. The conveying assembly 200 comprises a first PCB board conveying part 210 and a second PCB board conveying part 220, the first PCB board conveying part 210 and the second PCB board conveying part 220 are arranged on the rack 100, and the first PCB board conveying part 210 and the second PCB board conveying part 220 jointly form a PCB board conveying area 202. The spraying end of the plasma spraying part 300 is arranged towards the PCB board conveying area 202. The plasma cleaning device 10 further comprises a lifting assembly 700, the lifting assembly 700 comprises a first lifting part 710 and a second lifting part 720, the first lifting part 710 is arranged on the first PCB board conveying part 210, the second lifting part 720 is arranged on the second PCB board conveying part 220, and the lifting end of the first lifting part 710 and the lifting end of the second lifting part 720 jointly support the PCB board in the PCB board conveying area 202 to adjust the distance between the spraying end of the plasma spraying part 300 and the PCB board.

[0046] In the embodiment, the first PCB board conveying part 210 and the second PCB board conveying part 220 are arranged, and the first PCB board conveying part 210 and the second PCB board conveying part 220 jointly form the PCB board conveying area 202, that is, the first PCB board conveying part 210 and the second PCB board conveying part 220 jointly convey the PCB board, then the plasma spraying part 300 is driven by the transverse moving assembly 400, the longitudinal moving assembly 500 and the vertical moving assembly 600 to move in the rack 100, so that the plasma spraying part 300 can clean the PCB board in the PCB board conveying area 202 comprehensively, and the PCB board has better cleaning effect.

[0047] Further, the distance between the plasma spraying member 300 and the PCBs in the PCB conveying area 202 can be adjusted by the vertical moving assembly 600 according to the cleaning requirements of PCBs with different thicknesses, so that the plasma can clean the PCBs at the optimal cleaning height, and the PCBs with different thicknesses can obtain the optimal cleaning effect. Further, the vertical moving assembly 600 and the PCBs in the PCB conveying area 202 have a minimum height difference, and the optimal cleaning height of the ultra-thin PCBs is lower than the minimum height difference. By providing the first lifting member 710 and the second lifting member 720, and lifting the PCBs in the PCB conveying area 202 by the first lifting member 710 and the second lifting member 720, the distance between the plasma spraying member 300 and the PCBs in the PCB conveying area 202 is shortened, that is, the value of the minimum height difference between the vertical moving assembly 600 and the PCBs in the PCB conveying area 202 is shortened, so as to match the optimal cleaning height of the ultra-thin PCBs, and the ultra-thin PCBs can obtain the optimal cleaning effect, and the cleaning adaptability of the plasma cleaning device 10 is improved.

[0048] It should be noted that by driving the horizontal moving assembly 400 to drive the longitudinal moving assembly 500 to move horizontally, and then driving the longitudinal moving assembly 500 to drive the vertical moving assembly 600 to move longitudinally, and then driving the vertical moving assembly 600 to drive the plasma spraying member 300 to move vertically, the plasma spraying member 300 can clean the PCBs in the PCB conveying area 202 comprehensively, and the PCBs can obtain the optimal cleaning effect.

[0049] As Figure 3 , Figure 9 and Figure 10As shown, in one of the embodiments, the first PCB plate conveying member 210 comprises a first conveying baffle 2110, a first conveying driving member 2120 and a first belt conveying member 2130, the first conveying baffle 2110 is arranged on the rack 100, the first conveying driving member 2120 is installed on the first conveying baffle 2110, and the first belt conveying member 2130 is sleeved on the output rotating wheel of the first conveying driving member 2120. The second PCB plate conveying member 220 comprises a second conveying baffle 2210, a second conveying driving member 2220 and a second belt conveying member 2230, the second conveying baffle 2210 is arranged on the rack 100, the second conveying driving member 2220 is installed on the second conveying baffle 2210, and the second belt conveying member 2230 is sleeved on the output rotating wheel of the second conveying driving member 2220, and the first belt conveying member 2130 and the second belt conveying member 2230 jointly form a PCB plate conveying area 202. It can be understood that the first conveying driving member 2120 and the second conveying driving member 2220 are driven at the same time, the first belt conveying member 2130 and the second belt conveying member 2230 are driven to rotate, the PCB plate can be moved in the PCB plate conveying area 202, and the conveying function of the PCB plate is realized.

[0050] As Figure 3 , Figures 9 to 12As shown, in one of the embodiments, the first lifting member 710 comprises a first lifting driving member 7110, a first cam member 7120, a first lifting block 7130 and a first lifting top plate 7140, the first lifting driving member 7110 is arranged on the frame 100, the first lifting block 7130 is provided with a first cam groove 7132, the first lifting top plate 7140 is installed on the first lifting block 7130, the eccentric rotating shaft of the first lifting driving member 7110 is fixedly connected with one end of the first cam member 7120, and the other end of the first cam member 7120 is arranged in the first cam groove 7132. The second lifting member 720 comprises a second lifting driving member 7210, a second cam member 7220, a second lifting block 7230 and a second lifting top plate 7240, the second lifting driving member 7210 is arranged on the frame 100, the second lifting block 7230 is provided with a second cam groove 7232, the second lifting top plate 7240 is installed on the second lifting block 7230, the eccentric rotating shaft of the second lifting driving member 7210 is fixedly connected with one end of the second cam member 7220, and the other end of the second cam member 7220 is arranged in the second cam groove 7232. It should be noted that, by driving the eccentric rotating shaft of the first lifting driving member 7110 to rotate, the first cam member 7120 is rotated in the first cam groove 7132 to lift or lower the first lifting block 7130, and drive the first lifting top plate 7140 to rise upward or fall downward, at the same time, by driving the eccentric rotating shaft of the second lifting driving member 7210 to rotate, the second cam member 7220 is rotated in the second cam groove 7232 to lift or lower the second lifting block 7230, and drive the second lifting top plate 7240 to rise upward or fall downward, so that the first lifting top plate 7140 and the second lifting top plate 7240 jointly lift the PCB in the PCB conveying area 202, thereby reducing the minimum height difference value between the plasma spraying member 300 and the PCB in the PCB conveying area 202, matching the optimal cleaning height of the ultra-thin PCB, and effectively improving the adaptability of the plasma cleaning device 10.

[0051] It should be noted that, the first lifting top plate 7140 and the second lifting top plate 7240 need to be lifted upward at the same time to lift the PCB in the PCB conveying area 202, to ensure the stability of the PCB when being lifted.

[0052] As Figure 3 , Figures 9 to 12As shown in the drawings, in one embodiment, the first lifting member 710 further comprises a first sliding rail member 7150, a second sliding rail member 7160, and a plurality of first spring limiting members 7170. The first sliding rail member 7150 and the second sliding rail member 7160 are both mounted on the first transmission baffle 2110. One end of each of the plurality of first spring limiting members 7170 is fixed on the first transmission baffle 2110, and the other end of each of the plurality of first spring limiting members 7170 is fixed on the first lifting block 7130. The first lifting block 7130 is in sliding connection with the first sliding rail member 7150 and the second sliding rail member 7160, respectively. It can be understood that when the first lifting block 7130 is lifted upward, the first spring limiting members 7170 are pressed, and at the same time, the first spring limiting members 7170 play a limiting role, so that the first lifting block 7130 slides on the first sliding rail member 7150 and the second sliding rail member 7160. The first sliding rail member 7150 and the second sliding rail member 7160 make the first lifting block 7130 slide more stably.

[0053] As shown in the drawings, Figure 3 , Figures 9 to 12 As shown in the drawings, in one embodiment, the second lifting member 720 further comprises a third sliding rail member 7250, a fourth sliding rail member 7260, and a plurality of second spring limiting members 7270. The third sliding rail member 7250 and the fourth sliding rail member 7260 are both mounted on the second transmission baffle 2210. One end of each of the plurality of second spring limiting members 7270 is fixed on the second transmission baffle 2210, and the other end of each of the plurality of second spring limiting members 7270 is fixed on the second lifting block 7230. The second lifting block 7230 is in sliding connection with the third sliding rail member 7250 and the fourth sliding rail member 7260, respectively. It can be understood that when the second lifting block 7230 is lifted upward, the second spring limiting members 7270 are pressed, and at the same time, the second spring limiting members 7270 play a limiting role, so that the second lifting block 7230 slides on the third sliding rail member 7250 and the fourth sliding rail member 7260. The third sliding rail member 7250 and the fourth sliding rail member 7260 make the first lifting block 7130 slide more stably.

[0054] As shown in the drawings, Figure 3 and Figure 6As shown in the drawings, in one embodiment, the lateral moving assembly 400 includes a first lateral fixing frame 410, a second lateral fixing frame 420, a lateral driving member 430, a first lateral moving block 440, a second lateral moving block 450, a fifth sliding rail member 460, and a sixth sliding rail member 470. The first lateral fixing frame 410 and the second lateral fixing frame 420 are both mounted in the rack 100. The lateral driving member 430 is mounted on the first lateral fixing frame 410. The first lateral moving block 440 is threadedly connected with a screw transmission shaft of the lateral driving member 430. The fifth sliding rail member 460 is mounted on the first lateral fixing frame 410. The sixth sliding rail member 470 is mounted on the second lateral fixing frame 420. The first lateral moving block 440 and the second lateral moving block 450 are both connected with the longitudinal moving assembly 500. The first lateral moving block 440 and the second lateral moving block 450 are both located above the PCB board conveying area 202. The first lateral moving block 440 is slidably connected with the fifth sliding rail member 460. The second lateral moving block 450 is slidably connected with the sixth sliding rail member 470. It can be understood that the output of the driving lateral driving member 430 drives the first lateral moving block 440 to slide on the fifth sliding rail member 460. The longitudinal moving assembly 500 is connected with the first lateral moving block 440 and the second lateral moving block 450 respectively to simultaneously drive the second lateral moving block 450 to slide on the sixth sliding rail member 470, thereby ensuring the stability of the longitudinal moving assembly 500 during lateral movement and realizing the lateral movement of the plasma spraying member 300.

[0055] It should be noted that, in the embodiment, the number of the fifth sliding rail members 460 is two.

[0056] As shown in the drawings, Figure 3 , Figure 6 and Figure 7 , in one embodiment, the longitudinal moving assembly 500 includes a longitudinal fixing frame 510, a longitudinal driving member 520, a longitudinal moving block 530, and a seventh sliding rail member 540. The longitudinal fixing frame 510 is connected with the first lateral moving block 440 and the second lateral moving block 450 respectively. The longitudinal driving member 520 is mounted on the longitudinal fixing frame 510. The longitudinal moving block 530 is threadedly connected with a screw transmission shaft of the longitudinal driving member 520. The longitudinal moving block 530 is connected with the vertical moving assembly 600. The seventh sliding rail member 540 is mounted on the longitudinal fixing frame 510. The longitudinal moving block 530 is slidably connected with the seventh sliding rail member 540. It can be understood that the output of the driving longitudinal driving member 520 drives the longitudinal moving block 530 to slide on the seventh sliding rail member 540, thereby ensuring the stability of the vertical moving assembly 600 during longitudinal movement and realizing the longitudinal movement of the plasma spraying member 300.

[0057] It should be noted that, in the embodiment, the number of the seventh sliding rail members 540 is two.

[0058] AsFigure 3 , Figure 6 , Figure 7 and Figure 8 As shown, in one embodiment, the vertical moving assembly 600 includes a vertical fixing frame 610, a vertical driving member 620, a vertical moving block 630, and an eighth slide rail 640. The vertical fixing frame 610 is connected to the vertical moving block 530. The vertical driving member 620 is mounted on the vertical fixing frame 610. The vertical moving block 630 is threadedly connected to the lead screw drive shaft of the vertical driving member 620. The plasma spraying member 300 is mounted on the vertical moving block 630. The eighth slide rail 640 is mounted on the vertical fixing frame 610, and the vertical moving block 630 and the eighth slide rail 640 are slidably connected. It can be understood that driving the vertical driving member 620 outputs output, causing the vertical moving block 630 to slide on the eighth slide rail 640, ensuring the stability of the plasma spraying member 300 when moving in the vertical direction, and realizing the vertical movement of the plasma spraying member 300.

[0059] It should be noted that in this embodiment, there are two eighth slide rail components 640.

[0060] like Figure 1 , Figure 2 and Figure 4As shown, in one of the embodiments, the rack 100 is provided with a plate inlet 102 and a plate outlet 104. The plasma cleaning device 10 further comprises an upper code reading assembly 800 and a lower code reading assembly 900. The upper code reading assembly 800 is arranged in the rack 100 and is arranged adjacent to one side of the plate inlet 102. The lower code reading assembly 900 is arranged outside the rack 100 and is arranged adjacent to the other side of the plate inlet 102. The upper code reading assembly 800 comprises a first mounting frame 810, a first horizontal moving driving member 820, a first horizontal moving block 830 and an upper code reader 840. The first mounting frame 810 is mounted on the first horizontal fixing frame 410. The first horizontal moving driving member 820 is mounted on the first mounting frame 810. The first horizontal moving block 830 is threadedly connected with a screw transmission shaft of the first horizontal moving driving member 820. The upper code reader 840 is mounted on the first horizontal moving block 830. The lower code reading assembly 900 comprises a second mounting frame 910, a second horizontal moving driving member 920, a second horizontal moving block 930 and a lower code reader 940. The second mounting frame 910 is mounted on the rack 100. The second horizontal moving driving member 920 is mounted on the second mounting frame 910. The second horizontal moving block 930 is threadedly connected with a screw transmission shaft of the second horizontal moving driving member 920. The lower code reader 940 is mounted on the second horizontal moving block 930. It can be understood that, by arranging the upper code reader 840 and the lower code reader 940, the code reading requirement of the PCB board with different two-dimensional code position designs can be met. Further, by driving the first horizontal moving driving member 820 and the second horizontal moving driving member 920 to output, the first horizontal moving block 830 and the second horizontal moving block 930 are moved horizontally, so that the upper code reader 840 and the lower code reader 940 can meet the code reading requirement of the PCB board with different two-dimensional code position designs, and the adaptability of the plasma cleaning device 10 is further improved.

[0061] As Figure 3 and Figure 5As shown, in one of the embodiments, the plasma cleaning device 10 further comprises a width adjusting assembly 1000, the width adjusting assembly 1000 comprises a width adjusting drive 1010, a first transmission screw rod 1020 and a second transmission screw rod 1030, the width adjusting drive 1010 is arranged in the rack 100, one end of the first transmission screw rod 1020 and one end of the second transmission screw rod 1030 are connected with the power output end of the width adjusting drive 1010, the other end of the first transmission screw rod 1020 and the other end of the second transmission screw rod 1030 are fixedly connected with the second transmission baffle 2210, the first transmission baffle 2110 is threadedly connected with the first transmission screw rod 1020 and the second transmission screw rod 1030 respectively, so as to adjust the distance between the first transmission baffle 2110 and the second transmission baffle 2210 through the width adjusting drive 1010. It can be understood that by driving the width adjusting drive 1010 to output, the first transmission screw rod 1020 and the second transmission screw rod 1030 are driven to rotate, so as to adjust the distance between the first transmission baffle 2110 and the second transmission baffle 2210, that is, adjust the width of the PCB board transmission area 202, so as to adapt to PCB boards of different widths, thereby improving the adaptability of the plasma cleaning device 10.

[0062] As shown in Figure 3 , Figure 9 and Figure 10 As shown, in one of the embodiments, the lifting assembly 700 further comprises a first limiting baffle 730 and a second limiting baffle 740, the first limiting baffle 730 is installed on the first transmission baffle 2110, the second limiting baffle 740 is installed on the second transmission baffle 2210, and the first limiting baffle 730 and the second limiting baffle 740 are located above the PCB board transmission area 202. It can be understood that when the first lifting top plate 7140 and the second lifting top plate 7240 are lifted, the PCB board needs to be limited, and the first limiting baffle 730 and the second limiting baffle 740 are used to limit and clamp the PCB board, so that the PCB board does not shake during cleaning, and the best cleaning effect is ensured.

[0063] Compared with the prior art, the present disclosure has at least the following advantages:

[0064] 1. By arranging the first PCB board transmission member and the second PCB board transmission member, and forming the PCB board transmission area between the first PCB board transmission member and the second PCB board transmission member, that is, by the first PCB board transmission member and the second PCB board transmission member, the PCB board is transmitted, and then the horizontal moving assembly, the vertical moving assembly and the vertical moving assembly are driven to move the plasma spraying member in the rack, so that the plasma spraying member can clean the PCB board in the PCB board transmission area, and the PCB board has good cleaning effect.

[0065] 2. To address the cleaning requirements of PCBs of varying thicknesses, the distance between the plasma spray component and the PCB in the PCB transfer area can be adjusted using the vertical moving component. This allows the plasma to clean the PCB at the optimal cleaning height, achieving the best cleaning effect for PCBs of different thicknesses. Furthermore, there is a minimum height difference between the vertical moving component and the PCB in the PCB transfer area. The optimal cleaning height for ultra-thin PCBs is lower than this minimum height difference. By incorporating a first lifting component and a second lifting component, the PCB in the PCB transfer area is lifted, shortening the distance between the plasma spray component and the PCB in the PCB transfer area. This reduces the minimum height difference between the vertical moving component and the PCB in the PCB transfer area, matching the optimal cleaning height for ultra-thin PCBs and achieving the best cleaning effect. This also improves the cleaning adaptability of the plasma cleaning device.

[0066] The embodiments described above are merely illustrative of several implementations of this disclosure, and while the descriptions are specific and detailed, they should not be construed as limiting the scope of the disclosed patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this disclosure, and these all fall within the protection scope of this disclosure. Therefore, the protection scope of this patent should be determined by the appended claims.

Claims

1. A plasma cleaning device for PCB board, comprising a frame, a transmission assembly, a plasma spraying element, a transverse moving assembly, a longitudinal moving assembly and a vertical moving assembly, the transmission assembly and the transverse moving assembly are arranged on the frame, the transverse moving assembly is above the transmission assembly, the longitudinal moving assembly is installed on the moving end of the transverse moving assembly, the vertical moving assembly is installed on the moving end of the longitudinal moving assembly, and the plasma spraying element is installed on the moving end of the longitudinal moving assembly, characterized in that, the transmission assembly comprises a first PCB board transmission element and a second PCB board transmission element, the first PCB board transmission element and the second PCB board transmission element are arranged on the frame, and the first PCB board transmission element and the second PCB board transmission element jointly form a PCB board transmission area therebetween; the spraying end of the plasma spraying element is arranged towards the PCB board transmission area; the plasma cleaning device further comprises a lifting assembly, the lifting assembly comprises a first lifting element and a second lifting element, the first lifting element is arranged on the first PCB board transmission element, the second lifting element is arranged on the second PCB board transmission element, and the lifting end of the first lifting element and the lifting end of the second lifting element jointly support the PCB board in the PCB board transmission area to adjust the distance between the spraying end of the plasma spraying element and the PCB board.

2. The plasma cleaning apparatus for PCB board according to claim 1, wherein, the first PCB board transmission element comprises a first transmission baffle, a first transmission driving element and a first belt transmission element, the first transmission baffle is arranged on the frame, the first transmission driving element is installed on the first transmission baffle, and the first belt transmission element is sleeved on the output rotating wheel of the first transmission driving element; the second PCB board transmission element comprises a second transmission baffle, a second transmission driving element and a second belt transmission element, the second transmission baffle is arranged on the frame, the second transmission driving element is installed on the second transmission baffle, and the second belt transmission element is sleeved on the output rotating wheel of the second transmission driving element, and the first belt transmission element and the second belt transmission element jointly form the PCB board transmission area therebetween.

3. The plasma cleaning apparatus for PCB board according to claim 2, wherein, the first lifting element comprises a first lifting driving element, a first cam element, a first lifting block and a first lifting top plate, the first lifting driving element is arranged on the frame, the first lifting block is provided with a first cam groove, the first lifting top plate is installed on the first lifting block, the eccentric rotating shaft of the first lifting driving element is fixedly connected with one end of the first cam element, and the other end of the first cam element is arranged in the first cam groove; the second lifting element comprises a second lifting driving element, a second cam element, a second lifting block and a second lifting top plate, the second lifting driving element is arranged on the frame, the second lifting block is provided with a second cam groove, the second lifting top plate is installed on the second lifting block, the eccentric rotating shaft of the second lifting driving element is fixedly connected with one end of the second cam element, and the other end of the second cam element is arranged in the second cam groove.

4. The plasma cleaning apparatus for PCB board according to claim 3, wherein The first lifting piece further comprises a first sliding rail piece, a second sliding rail piece and a plurality of first spring limiting pieces, the first sliding rail piece and the second sliding rail piece are both mounted on the first transmission baffle, one end of the plurality of first spring limiting pieces is fixed on the first transmission baffle, the other end of the plurality of first spring limiting pieces is fixed on the first lifting block, and the first lifting block is in sliding connection with the first sliding rail piece and the second sliding rail piece respectively.

5. The plasma cleaning apparatus for PCB board as claimed in claim 3, wherein, The second lifting piece further comprises a third sliding rail piece, a fourth sliding rail piece and a plurality of second spring limiting pieces, the third sliding rail piece and the fourth sliding rail piece are both mounted on the second transmission baffle, one end of the plurality of second spring limiting pieces is fixed on the second transmission baffle, the other end of the plurality of second spring limiting pieces is fixed on the second lifting block, and the second lifting block is in sliding connection with the third sliding rail piece and the fourth sliding rail piece respectively.

6. The plasma cleaning apparatus for PCB board as claimed in claim 1 wherein, The lateral movement assembly comprises a first lateral fixing frame, a second lateral fixing frame, a lateral driving piece, a first lateral moving block, a second lateral moving block, a fifth sliding rail piece and a sixth sliding rail piece, the first lateral fixing frame and the second lateral fixing frame are both mounted in the rack, the lateral driving piece is mounted on the first lateral fixing frame, the first lateral moving block is in threaded connection with a screw transmission shaft of the lateral driving piece, the fifth sliding rail piece is mounted on the first lateral fixing frame, the sixth sliding rail piece is mounted on the second lateral fixing frame, the first lateral moving block and the second lateral moving block are both connected with the longitudinal movement assembly, the first lateral moving block and the second lateral moving block are both located above the PCB board transmission area, the first lateral moving block is in sliding connection with the fifth sliding rail piece, and the second lateral moving block is in sliding connection with the sixth sliding rail piece.

7. The plasma cleaning apparatus for PCB board as claimed in claim 6 wherein, The longitudinal movement assembly comprises a longitudinal fixing frame, a longitudinal driving piece, a longitudinal moving block and a seventh sliding rail piece, the longitudinal fixing frame is connected with the first lateral moving block and the second lateral moving block respectively, the longitudinal driving piece is mounted on the longitudinal fixing frame, the longitudinal moving block is in threaded connection with a screw transmission shaft of the longitudinal driving piece, the longitudinal moving block is connected with the vertical movement assembly, and the seventh sliding rail piece is mounted on the longitudinal fixing frame.

8. The plasma cleaning apparatus for PCB board as claimed in claim 7, wherein, The vertical movement assembly comprises a vertical fixing frame, a vertical driving piece, a vertical moving block and an eighth sliding rail piece, the vertical fixing frame is connected with the longitudinal moving block, the vertical driving piece is mounted on the vertical fixing frame, the vertical moving block is in threaded connection with a screw transmission shaft of the vertical driving piece, the plasma spraying piece is mounted on the vertical moving block, the eighth sliding rail piece is mounted on the vertical fixing frame, and the vertical moving block is in sliding connection with the eighth sliding rail piece.

9. The plasma cleaning apparatus for PCB board as claimed in claim 6 wherein, The rack is provided with a board inlet and a board outlet. The plasma cleaning device further comprises an upper code reading assembly and a lower code reading assembly, the upper code reading assembly is arranged in the rack, and the upper code reading assembly is arranged adjacent to one side of the board inlet; the lower code reading assembly is arranged outside the rack, and the lower code reading assembly is arranged adjacent to the other side of the board inlet; the upper code reading assembly comprises a first mounting frame, a first horizontal movement driving member, a first horizontal movement block and an upper code reader; the first mounting frame is mounted on the first horizontal fixing frame; the first horizontal movement driving member is mounted on the first mounting frame; the first horizontal movement block is threadedly connected with a screw rod transmission shaft of the first horizontal movement driving member; and the upper code reader is mounted on the first horizontal movement block; the lower code reading assembly comprises a second mounting frame, a second horizontal movement driving member, a second horizontal movement block and a lower code reader; the second mounting frame is mounted on the rack; the second horizontal movement driving member is mounted on the second mounting frame; the second horizontal movement block is threadedly connected with a screw rod transmission shaft of the second horizontal movement driving member; and the lower code reader is mounted on the second horizontal movement block.

10. The plasma cleaning apparatus for PCB board as claimed in claim 3 wherein, The plasma cleaning device further comprises a width adjusting assembly, the width adjusting assembly comprises a width adjusting driving member, a first transmission screw rod and a second transmission screw rod; the width adjusting driving member is arranged in the rack; one end of the first transmission screw rod and one end of the second transmission screw rod are connected with a power output end of the width adjusting driving member; the other end of the first transmission screw rod and the other end of the second transmission screw rod are fixedly connected with the second transmission baffle; the first transmission baffle is threadedly connected with the first transmission screw rod and the second transmission screw rod respectively, so as to adjust the distance between the first transmission baffle and the second transmission baffle through the width adjusting driving member; and / or, The lifting assembly further comprises a first limiting baffle and a second limiting baffle, the first limiting baffle is mounted on the first transmission baffle, and the second limiting baffle is mounted on the second transmission baffle; the first limiting baffle and the second limiting baffle are located above the PCB board transmission area.

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