Semiconductor cleaning device and semiconductor production equipment

Abstract

The utility model relates to a semiconductor cleaning device and semiconductor production equipment, the semiconductor cleaning device is used for blowing and cleaning an electrostatic chuck (10), and the semiconductor cleaning device comprises a support assembly (1) and a mounting platform (101) connected to the upper portion of the electrostatic chuck (10); the air injection assembly (2) is connected to the support assembly (1), the air injection assembly (2) and the electrostatic chuck (10) are arranged at intervals in the first direction (z), the air injection assembly (2) and the electrostatic chuck (10) can move relatively, the air injection assembly (2) is provided with at least one air injection opening, the air injection opening faces the electrostatic chuck (10), and the air injection assembly (2) is connected to the support assembly (1). The air injection assembly (2) is configured to selectively inject air to the electrostatic chuck (10).

Description

TECHNICAL FIELD

[0001] The present disclosure relates to the technical field of semiconductor production, and in particular, to a semiconductor cleaning device and a semiconductor production equipment. BACKGROUND

[0002] During the production and use of the semiconductor production equipment, the particles and other impurities in the cavity fall on the electrostatic chuck, which will cause abnormal adsorption of the electrostatic chuck and machine downtime.

[0003] Currently, when the electrostatic chuck has abnormal adsorption of the semiconductor wafer, it is necessary to open the semiconductor cavity and use a clean cloth, isopropyl alcohol or anhydrous ethanol and other cleaning agents to clean the electrostatic chuck. After cleaning, a Bare Wafer Cycle Test needs to be performed. The entire process takes at least 30 minutes. Manual wiping of the machine is time-consuming and labor-intensive. The cleaning process is complex and the cleaning efficiency is low. CONTENT OF THE UTILITY MODEL

[0004] Embodiments of the present disclosure provide a semiconductor cleaning device and a semiconductor production equipment, which can improve the cleaning efficiency of the electrostatic chuck.

[0005] According to a first aspect of the present disclosure, a semiconductor cleaning device is provided for purging and cleaning an electrostatic chuck. The semiconductor cleaning device comprises:

[0006] a support assembly connected to a mounting platform above the electrostatic chuck; and

[0007] a gas jet assembly connected to the support assembly, the gas jet assembly being spaced apart from the electrostatic chuck along a first direction, the gas jet assembly and the electrostatic chuck being relatively movable, the gas jet assembly being provided with at least one gas jet opening facing the electrostatic chuck, the gas jet assembly being configured to selectively jet gas to the electrostatic chuck.

[0008] In some embodiments, the electrostatic chuck is rotatable about a central axis thereof, the central axis extending along the first direction.

[0009] In some embodiments, the gas jet assembly comprises at least one gas jet pipe extending along a second direction intersecting the first direction, the gas jet pipe being provided with a plurality of gas jet openings spaced apart along the second direction.

[0010] In some embodiments, the length of the gas jet pipe is greater than or equal to the radius of the electrostatic chuck.

[0011] In some embodiments, the gas jet openings are located at the bottom of the gas jet pipe along the first direction.

[0012] In some embodiments, the gas jet assembly further comprises an air inlet section protruding from the gas jet pipe, the air inlet section being configured to connect to a compressed air source.

[0013] In some embodiments, the air jet assembly is lower than the mounting platform along a first direction, the mounting platform comprises a mounting slot, the mounting slot comprises a first end and a second end oppositely and spacedly arranged along a third direction, the first end is away from the electrostatic chuck, the second end is close to the electrostatic chuck, the third direction intersects the first direction, and the support assembly comprises:

[0014] a first support, a main body portion of the first support extends along the third direction, and the first support is connected between the first end and the air jet assembly.

[0015] In some embodiments, the support assembly further comprises:

[0016] a second support connected between the second end and the air jet assembly, and a length of the second support is less than a length of the first support.

[0017] According to a second aspect of the present disclosure, a semiconductor production equipment is provided, comprising:

[0018] the semiconductor cleaning device of the above-mentioned embodiments; a cavity, the cavity is provided with an electrostatic chuck and an air jet assembly; and

[0019] a fan assembly provided in the cavity, the fan assembly is configured to collect the debris blown away from the electrostatic chuck to the bottom of the cavity and discharge.

[0020] In some embodiments, a plurality of vacuum hole groups are provided on the electrostatic chuck, each vacuum hole group comprises a plurality of vacuum holes spacedly arranged along a radial direction of the electrostatic chuck, and the plurality of vacuum hole groups are spacedly arranged along a circumferential direction of the electrostatic chuck.

[0021] Based on the above technical solutions, the semiconductor cleaning device of the embodiments of the present disclosure has a simple and reliable structure, the air jet assembly is connected to the mounting platform through the support assembly, in the case of needing to clean the electrostatic chuck, manual wiping is not needed to open the cavity, the air jet assembly blows gas to the electrostatic chuck, and the particles and other debris clogging on the surface of the electrostatic chuck or the vacuum holes are removed, so that the electrostatic chuck returns to normal operation, the time for abnormal treatment can be greatly shortened, the cleaning efficiency of the electrostatic chuck is improved, and the labor and time costs are saved. BRIEF DESCRIPTION OF DRAWINGS

[0022] The accompanying drawings, which are included to provide a further understanding of the present disclosure and constitute a part of this application, illustrate certain illustrative embodiments of the present disclosure and are used to explain the present disclosure, but do not limit the present disclosure. In the drawings:

[0023] Figure 1 FIG. 1 is a structural schematic diagram of some embodiments of a semiconductor production equipment of the present disclosure.

[0024] Figure 2A schematic diagram showing the principle of some embodiments of the semiconductor cleaning device of the present disclosure.

[0025] Figure 3 A schematic diagram showing the comparison of the number of particles in the cavity before and after the purge action performed by the gas jet assembly of the present disclosure.

[0026] Explanation of reference signs

[0027] 1, support assembly; 11, first support; 12, second support; 2, gas jet assembly; 21, gas jet pipe; 22, gas inlet section; 10, electrostatic chuck; 100, vacuum hole; 101, mounting platform; 102, mounting groove; 111, first fastener; 112, second fastener; 20, cavity; z, first direction; x, second direction; y, third direction. DETAILED DESCRIPTION

[0028] Various exemplary embodiments of the present disclosure will now be described in detail with reference to the accompanying drawings. The description of the exemplary embodiments is merely illustrative in nature and is in no way intended to limit the disclosure, its application or uses, except as described by the appended claims. The present disclosure can be implemented in numerous different forms, as is desired for specific applications. These embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the disclosure to those skilled in the art. It should be noted that the relative arrangement of components and steps, the components of materials, numerical expressions, and numerical values set forth in these embodiments are to be interpreted as merely exemplary, rather than a limitation unless specifically stated otherwise.

[0029] The terms "first", "second", and similar terms used in the present disclosure do not denote any order, quantity, or importance, but are used to distinguish different parts. The terms "comprise", "include" or "contain" and similar terms mean that the elements before the term encompass the elements listed after the term, and do not exclude the possibility of also encompassing other elements. "Up", "down", "left", "right", and the like are used only to indicate relative positional relationships, and when the absolute position of the described object changes, the relative positional relationship can also change accordingly.

[0030] In the present disclosure, when it is described that a specific device is located between a first device and a second device, there can be an intervening device between the specific device and the first device or the second device, or there can be no intervening device. When it is described that a specific device is connected to other devices, the specific device can be directly connected to the other devices without an intervening device, or can not be directly connected to the other devices with an intervening device.

[0031] All terms used in the present disclosure, including technical or scientific terms, have the same meanings as those understood by a person having ordinary knowledge in the art to which the present disclosure belongs, unless otherwise specifically defined. It should also be understood that terms defined in commonly used dictionaries should be interpreted as having a meaning that is consistent with their meaning in the context of the relevant art and should not be interpreted in an idealized or overly formal sense, unless expressly so defined herein.

[0032] Techniques, methods, and apparatus known to those of ordinary skill in the relevant art can not be discussed in detail, but should be considered as part of the specification where appropriate.

[0033] Based on the above embodiments of the present disclosure, the technical features of one embodiment can be beneficially combined with one or more other embodiments without explicit negation or conflict.

[0034] First, the present disclosure provides a semiconductor cleaning device, such as Figure 1 and Figure 2 for purging and cleaning an electrostatic chuck 10, the semiconductor cleaning device comprises:

[0035] a bracket assembly 1 connected to a mounting platform 101 above the electrostatic chuck 10; and

[0036] a gas jet assembly 2 connected to the bracket assembly 1, the gas jet assembly 2 is spaced apart from the electrostatic chuck 10 along a first direction z, the gas jet assembly 2 and the electrostatic chuck 10 are relatively movable, the gas jet assembly 2 is provided with at least one gas jet port, the gas jet port faces the electrostatic chuck 10, and the gas jet assembly 2 is configured to selectively spray gas to the electrostatic chuck 10.

[0037] Specifically, during the production and use of the semiconductor production equipment, particles in the machine cavity fall onto the vacuum hole 100, which can block or partially block the vacuum hole 100, and further cause abnormal vacuum adsorption of the electrostatic chuck 10, resulting in machine downtime, such as failure to adsorb wafers. By providing the gas jet assembly 2 to selectively spray gas to the electrostatic chuck 10, the particles blocking the vacuum hole 100 can be suspended and removed, allowing the electrostatic chuck 10 to resume normal operation, achieving efficient cleaning of the electrostatic chuck, and the cleaning time can be shortened to within 5 minutes.

[0038] Specifically, the first direction z can be a height direction. The gas jet assembly 2 and the electrostatic chuck 10 are relatively movable, which can be that the gas jet assembly 2 is movable and the electrostatic chuck 10 is fixed, or that the gas jet assembly 2 is fixed and the electrostatic chuck 10 is movable, or that both the gas jet assembly 2 and the electrostatic chuck 10 are movable.

[0039] Optionally, the jetting assembly 2 can be movable, which can be translational or rotational relative to the mounting platform 101, or the position of the jetting assembly 2 can be fixed relative to the mounting platform 101, and the mounting platform 101 can drive the jetting assembly 2 to move or rotate during the movement or rotation.

[0040] For example, the mounting platform 101 is part of a semiconductor production device or machine, the position of the mounting platform 101 is fixed, the jetting assembly 2 is installed on the mounting platform 101 through the support assembly 1, and the position of the jetting assembly 2 is fixed after installation. The electrostatic chuck 10 can rotate around the central axis to achieve jet cleaning of the entire surface of the electrostatic chuck 10. The electrostatic chuck 10 is provided with a vacuum hole 100, and the electrostatic chuck 10 is used to adsorb and move semiconductor devices such as wafers. The jetting body of the jetting assembly 2 is located in the chamber of the machine, and the jetting assembly 2 is located directly above the electrostatic chuck 10 during jetting.

[0041] Optionally, the jetting assembly 2 can include a jet pipe such as a air knife, which can extend from a position close to the center of the electrostatic chuck to a position close to the edge of the electrostatic chuck to achieve jet cleaning of the entire surface of the electrostatic chuck 10. Optionally, the lowest point of the jetting assembly 2 and the working position of the electrostatic chuck 10 are spaced apart by a predetermined height margin in the first direction z, for example, 4-5 mm, so as to avoid causing hardware interference.

[0042] Optionally, the electrostatic chuck 10 can perform other translational movements in addition to rotation relative to the mounting platform 101 to achieve jet cleaning of a certain required area of the electrostatic chuck 10. Optionally, the specific jetting position of the electrostatic chuck 10 can be set through R, Y, and Z, and the specific position of the blowing can be automatically adjusted. After blowing, it automatically returns to the original position to achieve targeted cleaning of the electrostatic chuck 10. R is the rotation angle of the electrostatic chuck 10, Y is the left and right position of the electrostatic chuck 10, and Z is the height position of the electrostatic chuck 10.

[0043] Optionally, the gas used for cleaning can be compressed dry air (CDA) or the like. Optionally, the jetting assembly 2 can be controlled by an operator to blow and clean at any time, or can be controlled by a timer to blow and clean periodically to avoid electrostatic chuck 10 adsorption abnormalities in the entire semiconductor production process, thereby improving the production efficiency of the entire semiconductor production process.

[0044] The semiconductor cleaning device of the embodiment has simple and reliable structure, the air jet assembly 2 is connected to the mounting platform 101 through the support assembly 1, in the case of needing to clean the electrostatic chuck 10, without opening the cavity for manual wiping, the air jet assembly 2 sprays gas to the electrostatic chuck 10, removes the blocked particles and other sundries on the surface of the electrostatic chuck 10 or the vacuum hole 100, and restores the normal operation of the electrostatic chuck 10, which can greatly shorten the abnormal processing time, improve the cleaning efficiency of the electrostatic chuck, and save labor and time cost.

[0045] In some embodiments, the electrostatic chuck 10 is rotatable about a central axis thereof, the central axis extending along the first direction x.

[0046] The electrostatic chuck 10 of the embodiment is rotatable about a central axis thereof, which can realize the spraying coverage of the air jet assembly 2 to the entire surface of the electrostatic chuck 10; without setting a driving part for driving the air jet assembly 2 or the mounting platform 101 to rotate, the production cost of the semiconductor cleaning device can be reduced.

[0047] In some embodiments, as shown in Figure 1 The air jet assembly 2 includes at least one air jet pipe 21, the air jet pipe 21 extends along the second direction x, the second direction x is perpendicular to the first direction z, and a plurality of air jet ports are arranged on the air jet pipe 21 and are arranged at intervals along the second direction x.

[0048] Specifically, the air jet pipe 21 is arranged between the mounting platform 101 and the electrostatic chuck 10 along the first direction x, and the air jet pipe 21 is located directly above the electrostatic chuck 10. The air jet ports are arranged on the side facing the electrostatic chuck 10, and the gas sprayed by the air jet ports makes the particles float towards a side of the electrostatic chuck 10. Optionally, the air jet assembly 2 can include a plurality of air jet pipes 21, for example, two air jet pipes 21 are symmetrically arranged on both sides of the center of the electrostatic chuck 10, etc. Optionally, the air jet ports can be arranged on the pipe wall of the air jet pipe 21, or the air jet ports can be arranged protruding from the pipe wall under the premise of avoiding interference.

[0049] The air jet pipe 21 of the embodiment is provided with a plurality of air jet ports distributed at intervals along the length direction thereof, which can expand the coverage area of the gas spraying, so that the air jet assembly 2 more comprehensively covers the surface of the electrostatic chuck 10, and the cleaning efficiency is improved.

[0050] In some embodiments, the length of the air jet pipe 21 is greater than or equal to the radius of the electrostatic chuck 10.

[0051] The length of the air jet pipe 21 of the embodiment is greater than or equal to the radius of the electrostatic chuck 10, which can ensure that the plurality of air jet ports on the air jet pipe 21 can cover the entire surface of the electrostatic chuck 10 when the electrostatic chuck 10 rotates, thereby realizing more comprehensive and thorough cleaning effect and further improving the cleaning efficiency.

[0052] In some embodiments, the air outlet is located at the bottom of the air jet pipe 21 along the first direction z.

[0053] Specifically, the air outlet is located at the side of the air jet pipe 21 facing the electrostatic chuck 10, and the air outlet is located at the minimum distance between any point on the air jet pipe 21 and the plane where the electrostatic chuck 10 is located.

[0054] The air outlet of this embodiment is arranged at the side of the air jet pipe 21 facing the electrostatic chuck 10 and is located on the radial direction of the air jet pipe 21 along the first direction z, so that the gas blown by the air outlet can directly face the particles blocked in the vacuum hole 100, thereby improving the cleaning effect of the semiconductor cleaning device.

[0055] In some embodiments, as shown in Figure 1 The air inlet section 22 of this embodiment is responsible for guiding compressed air to the air jet pipe 21, and then spraying it onto the electrostatic chuck 10. The air inlet section 22 protrudes from the air jet pipe 21, which can facilitate the connection of the compressed air source to the air inlet section 22 through a plastic hose, ensuring stable gas supply.

[0056] In some embodiments, the semiconductor cleaning device further comprises:

[0057] The controller is configured to control at least one of the start timing of the air jet assembly 2, the air jet duration of the air jet assembly 2, and the resting time of the air jet assembly 2.

[0058] Specifically, the air jet assembly 2 is provided with a resting time, which can allow the particles and other impurities in the suspended state to be collected to the bottom of the cavity by the fan, thereby avoiding the contamination of the wafer by the suspended particles in the cavity. Alternatively, the start timing, air jet duration, and resting time of the air jet assembly 2 can be controlled by the operator or by a timing function. To ensure production safety, the timing blowing can only be enabled when there is no wafer being measured on the machine.

[0059] Alternatively, the controller can set different automatic blowing modes such as continuous blowing mode or intermittent blowing mode, for example, the first half of the time adopts intermittent blowing mode, and the second half of the time adopts continuous blowing mode. Alternatively, the controller can use a timer, an integrated circuit chip, or a single-chip microcomputer, etc.

[0060] The controller can realize the timing cleaning of the electrostatic chuck 10 by controlling the start timing of the air jet assembly 2, the air jet duration of the air jet assembly 2, and the resting time of the air jet assembly 2, and can accurately control the operating state of the air jet assembly 2, thereby improving the cleaning effect and avoiding excessive blowing of particles floating in the cavity.

[0061] The controller can realize the timing cleaning of the electrostatic chuck 10 by controlling the start timing of the air jet assembly 2, the air jet duration of the air jet assembly 2, and the resting time of the air jet assembly 2, and can accurately control the operating state of the air jet assembly 2, thereby improving the cleaning effect and avoiding excessive blowing of particles floating in the cavity.

[0062] In some embodiments, as shown in Figure 1 The jet assembly 2 is below the mounting platform 101 along the first direction z, the mounting platform 101 comprises a mounting slot 102, the mounting slot 102 comprises a first end and a second end which are opposite and spaced along a third direction y, the first end is away from the electrostatic chuck 10, the second end is close to the electrostatic chuck 10, and the third direction y is perpendicular to the first direction z. The bracket assembly 1 comprises:

[0063] The first bracket 11, the main body of the first bracket 11 extends along the third direction y, and the first bracket 11 is connected between the first end and the jet assembly 2; and / or

[0064] The second bracket 12 is connected between the second end and the jet assembly 2, and the length of the second bracket 12 is less than the length of the first bracket 11.

[0065] Specifically, the first bracket 11 and the second bracket 12 can each comprise a stepped portion or an inclined connecting plate to reduce the mounting height of the jet pipe 21, so that the jet pipe 21 is located between the mounting platform 101 and the electrostatic chuck 10. The mounting slot 102 extends through the mounting platform 101 along the first direction x, and after the bracket assembly 1 is mounted at both ends of the mounting slot 102, the mounting platform is sealed by a cover plate to make the cavity 20 of the semiconductor production equipment airtight. The length of the second bracket 12 is less than the length of the first bracket 11, so that the jet assembly 2 is located directly above the electrostatic chuck 10.

[0066] The first bracket 11 and the mounting slot 102 are fixed by the first fastener 111, the second bracket 12 and the mounting slot 102 are fixed by the first fastener 111, and the first fastener 111 can be a screw or the like; the first bracket 11 and the jet pipe 21 are fixed by the second fastener 112, the second bracket 12 and the jet pipe 21 are fixed by the second fastener 112, and the second fastener 112 can be a top screw matched with a snap ring, and the jet pipe 21 passes through the snap ring.

[0067] Optionally, the intake section 22 extends along the first direction z and passes through the mounting platform 101, which can improve the positional stability of the jet pipe 21, and further improve the cleaning effect of the semiconductor cleaning device.

[0068] This embodiment can stably support the jet assembly 2 through the cooperation of the first bracket 11 and the second bracket 12, so that the jet pipe 21 can be stably positioned above the electrostatic chuck 10 to realize effective blowing and cleaning of the electrostatic chuck 10 by the jet assembly 2.

[0069] Secondly, the present disclosure also proposes a semiconductor production equipment, as shown in Figure 1 comprising the semiconductor cleaning device of the above-mentioned embodiments.

[0070] Specifically, after the semiconductor cleaning device is installed to the semiconductor production equipment, the marathon wafer test is continuously performed before the first use to determine whether the pollution is found. The semiconductor production equipment of the present disclosure performs more than 100 marathon wafer tests, and no pollution or abnormality occurs.

[0071] The semiconductor production equipment of this embodiment, when the electrostatic chuck 10 needs to be cleaned, does not need to be opened for manual wiping. The gas blowing assembly 2 blows gas to the electrostatic chuck 10 to remove the blocked particles and other impurities on the vacuum hole 100. The time for abnormality treatment is short, and the cleaning efficiency of the electrostatic chuck is high. By shortening the processing time of the electrostatic chuck adsorption abnormality, the production efficiency of the whole semiconductor production process can be improved.

[0072] In some embodiments, as shown in Figure 1 The semiconductor production equipment further comprises:

[0073] The cavity 20 is provided with the electrostatic chuck 10 and the gas blowing assembly 2; and

[0074] The fan assembly is arranged in the cavity 20, and the fan assembly is configured to collect the impurities blown away from the electrostatic chuck 10 to the bottom of the cavity 20 and discharge them.

[0075] Specifically, the gas blowing assembly 2 blows the particles on the electrostatic chuck 10 into the cavity 20, and then blows the particles to the bottom of the cavity 20 by the fan assembly in the cavity 20 and discharges them by the exhaust fan, which can ensure the cleanliness of the cavity 20, so that the electrostatic chuck can be cleaned at any time or regularly without polluting the cavity 20. Optionally, the fan assembly can include a fan filter unit (FFU) or the like.

[0076] Specifically, during the test, 10 times of die cycle tests are performed respectively 5 minutes before and after the purging action of the semiconductor cleaning device, and the test results are as shown in Figure 3 As shown in the table, the number of particles in the cavity 20 is not found to be obviously abnormal, and the data before and after purging is stable, which proves that the purging action of the gas blowing assembly 2 will not bring additional particles and other impurities to the cavity 20.

[0077] The semiconductor production equipment of this embodiment, the fan assembly in the cavity 20 can ensure that the impurities generated during the blowing cleaning process will not re-attach to the semiconductor wafer or other equipment components, thereby improving the cleanliness and product quality of the whole semiconductor production process; the fan assembly helps to maintain the clean environment in the cavity 20, simplifies the impurity treatment process after cleaning, shortens the standing time after blowing cleaning, and further improves the production efficiency.

[0078] In some embodiments, as shown in Figure 2As shown, the electrostatic chuck 10 is provided with a plurality of vacuum hole groups, each of which includes a plurality of vacuum holes 100 arranged along the radial direction of the electrostatic chuck 10, and the plurality of vacuum hole groups are arranged along the circumferential direction of the electrostatic chuck 10.

[0079] The above describes in detail a semiconductor cleaning device and a semiconductor production equipment provided by the present disclosure. The principles and implementation manners of the present disclosure are described by using specific examples in this paper, and the above example description is only used to help understand the method and core idea of the present disclosure. It should be pointed out that, for those skilled in the art, without departing from the principles of the present disclosure, the present disclosure can be improved and modified in several ways, and these improvements and modifications also fall within the protection scope of the claims of the present disclosure.

Claims

1. A semiconductor cleaning apparatus characterized by comprising: A semiconductor cleaning device for purging cleaning of an electrostatic chuck (10) includes: a bracket assembly (1) connected to a mounting platform (101) above the electrostatic chuck (10); and a gas jet assembly (2) connected to the bracket assembly (1), the gas jet assembly (2) being spaced apart from the electrostatic chuck (10) along a first direction (z), the gas jet assembly (2) and the electrostatic chuck (10) being relatively movable, the gas jet assembly (2) being provided with at least one gas jet port facing the electrostatic chuck (10), the gas jet assembly (2) being configured to selectively jet gas toward the electrostatic chuck (10); the gas jet assembly (2) includes at least one gas jet pipe (21) extending along a second direction (x) intersecting the first direction (z), the gas jet pipe (21) being provided with a plurality of gas jet ports spaced apart along the second direction (x); the gas jet assembly (2) further includes an air inlet section (22) protruding from the gas jet pipe (21), the air inlet section (22) being configured to connect to a compressed air source.

2. The semiconductor cleaning apparatus according to claim 1, wherein The electrostatic chuck (10) is rotatable about a central axis thereof extending along the first direction (z).

3. The semiconductor cleaning apparatus according to claim 1, wherein The length of the gas jet pipe (21) is greater than or equal to the radius of the electrostatic chuck (10).

4. The semiconductor cleaning apparatus according to claim 1, wherein The gas jet ports are located at the bottom of the gas jet pipe (21) along the first direction (z).

5. The semiconductor cleaning apparatus according to any one of claims 1 to 4, characterized by The gas jet assembly (2) is lower than the mounting platform (101) along the first direction (z), the mounting platform (101) includes a mounting slot (102) including a first end and a second end spaced apart along a third direction (y), the first end being away from the electrostatic chuck (10), the second end being close to the electrostatic chuck (10), the third direction (y) intersecting the first direction (z), the bracket assembly (1) includes: a first bracket (11) having a main body portion extending along the third direction (y), the first bracket (11) being connected between the first end and the gas jet assembly (2).

6. The semiconductor cleaning apparatus according to claim 5, wherein The bracket assembly (1) further includes: a second bracket (12) connected between the second end and the gas jet assembly (2), the second bracket (12) having a length smaller than that of the first bracket (11) so that the gas jet assembly (2) is located above the electrostatic chuck (10).

7. A semiconductor production apparatus characterized by comprising: The semiconductor cleaning device includes: the semiconductor cleaning device according to any one of claims 1-6; a cavity (20) in which the electrostatic chuck (10) and the gas jet assembly (2) are located; and a fan assembly provided in the cavity (20), the fan assembly being configured to collect debris blown away from the electrostatic chuck (10) to the bottom of the cavity (20) and discharge the debris. ​ 8. The semiconductor production apparatus according to Claim 7, characterized by The electrostatic chuck (10) is provided with a plurality of vacuum hole groups, each of which comprises a plurality of vacuum holes (100) arranged along the radial direction of the electrostatic chuck (10), and the vacuum hole groups are arranged along the circumferential direction of the electrostatic chuck (10).

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