Discharging mechanism of silicon wafer scribing machine

Abstract

The utility model relates to the technical field of scribing machines, and provides a blanking mechanism of a silicon wafer scribing machine, which comprises a bottom plate, a supporting column fixedly mounted at the center of the outer surface of the top of the bottom plate, a connecting shaft mounted on a top bearing of the supporting column, a gear I fixedly sleeved on the outer surface of the connecting shaft, and a connecting plate, the connecting plate is fixedly mounted at the top of the connecting shaft, electric push rods are fixedly mounted on the two sides of the top of the connecting plate, and the output ends of the two electric push rods penetrate through the connecting plate; the discharging mechanism is connected with the scribing machine through the bottom plate, the cutting table is located at the tops of the scribing machine and the bottom plate, a second driving motor is started to drive the cutting table through a connecting rod to move the cut silicon wafer to the outer surface of the bottom plate, and then an electric push rod is started to drive a suction cup to adsorb the cut silicon wafer. And the vacuum pump extracts air in the suction cup through the connecting pipe and the telescopic hose, so that the silicon wafer is better adsorbed by the suction cup.

Description

TECHNICAL FIELD

[0001] The utility model relates to wafer scriber technical field especially relates to a silicon wafer scriber unloading mechanism. BACKGROUND

[0002] The silicon wafer scriber is a kind of equipment for the accurate cutting of silicon wafer in semiconductor manufacturing process.This kind of equipment is usually used to divide large-size silicon wafer into multiple small-size chips for further processing and packaging.

[0003] After the cutting of silicon wafer, it is mostly taken off from cutting table by manual, and the efficiency of manual unloading is low, which reduces work efficiency, and the silicon wafer is easily scratched, so there is certain safety hazard, and the cut silicon wafer is pushed by push rod for unloading, which is easy to cause abrasion or knock of silicon wafer, so that the silicon wafer is damaged, and the use effect is reduced. UTILITY MODEL CONTENT

[0004] The utility model discloses a silicon wafer scriber unloading mechanism, which can solve the problems of low efficiency of manual unloading, reduced work efficiency, easy scratching of silicon wafer, certain safety hazard, abrasion or knock of silicon wafer, damage of silicon wafer and reduced use effect after the cutting of silicon wafer.

[0005] In order to achieve the above-mentioned purpose, the utility model adopts the following technical scheme: a silicon wafer scriber unloading mechanism, comprising: a bottom plate, a support column is fixedly installed at the center of the top outer surface of the bottom plate, a connecting shaft is rotatably installed at the top of the support column, a gear one is fixedly installed on the outer surface of the connecting shaft, and further comprising:

[0006] A connecting plate is fixedly installed at the top of the connecting shaft, and an electric push rod is fixedly installed at the top of the connecting plate on both sides; the output end of the two electric push rods penetrates the connecting plate;

[0007] Two mounting blocks are fixedly installed at the output end of the two electric push rods, and a suction cup is fixedly installed at the bottom of the two mounting blocks.

[0008] Preferably, a vacuum pump is fixedly installed at the center of the top outer surface of the connecting plate, connecting pipes are fixedly installed on both sides of the vacuum pump, and the other end of the two connecting pipes penetrates the connecting plate.

[0009] The technical effect of the above-mentioned further scheme is that the vacuum pump extracts the air inside the suction cup through the connecting pipe and the flexible hose.

[0010] Preferably, a flexible hose is fixedly installed at one end of the two connecting pipes, and the other end of the two flexible hoses is fixedly connected to the outer surface of the suction cup.

[0011] The technical effect of the further scheme is that the telescopic hose can be retracted and adjusted along with the electric push rod, and air can be better extracted.

[0012] Preferably, a ring-shaped groove is formed at the center of the top outer surface of the bottom plate, and support rods are fixedly installed on both sides of the connecting plate, and the other ends of the plurality of support rods are movably embedded in the ring-shaped groove.

[0013] The technical effect of the further scheme is that the support rods can improve the stability of the connecting plate and rotate in the ring-shaped groove.

[0014] Preferably, a driving motor one is fixedly installed on one side of the bottom plate close to the support column, an output end of the driving motor one is fixedly installed with a gear two, and the gear two is engaged with the gear one.

[0015] The technical effect of the further scheme is that the driving motor one can drive the gear two to rotate, and the gear one engaged with the gear two is driven to rotate.

[0016] Preferably, a placing groove is formed at the center of one side of the bottom plate, and a fixed plate is fixedly installed on the other side of the bottom plate away from the placing groove.

[0017] The technical effect of the further scheme is that the cut silicon wafer is moved to the collecting box in the placing groove by the suction cup.

[0018] Preferably, a driving motor two is fixedly installed on the top of the fixed plate, and a plurality of connecting rods are fixedly installed on the output end of the driving motor two.

[0019] The technical effect of the further scheme is that the fixed plate facilitates the installation of the driving motor two, and the connecting rods and the cutting table are driven to rotate by the driving motor two.

[0020] Preferably, a cutting table is fixedly installed on one end of each of the plurality of connecting rods, and the plurality of cutting tables are located on the top outer surface of the bottom plate.

[0021] The technical effect of the further scheme is that the plurality of cutting tables are alternately moved to the outer surface of the bottom plate, the suction cup is facilitated to adsorb the material, and the material efficiency is better improved.

[0022] Compared with the prior art, the advantages and positive effects of the utility model lie in that,

[0023] 1. The utility model discloses a bottom plate is connected with the wafering machine to the blanking mechanism, makes the cutting table be located at the top of wafering machine and bottom plate, opens drive motor no. 2 and is driven cutting table with cutting silicon wafer moves to the outer surface of bottom plate, then opens electric push rod and drives the suction cup to cut the silicon wafer and carries out adsorption, the vacuum pump is extracted with the air in the suction cup inside through the connecting pipe and flexible hose, makes the suction cup better adsorbs the silicon wafer.

[0024] 2. The utility model discloses opening drive motor no. 1 drives gear no. 2 rotation, gear no. 2 drives the gear no. 1 rotation of intermeshing, gear no. 1 fixedly covers the outside surface of connecting shaft, can therefore drive connecting axle rotation in support column, drives the connecting plate to carry out alternation to two suction cups, and the suction cup that adsorbed silicon wafer moves to the above of placing groove, and electric push rod drives the suction cup and places the silicon wafer in the inside of storage box, and the vacuum pump exhaust makes the suction cup no longer adsorbs the silicon wafer, to realize the blanking, improve the blanking efficiency, also reduce the wear and tear of silicon wafer, and the outer surface of connecting plate is fixedly installed with a plurality of support rods, and a plurality of support rods can improve the stability of connecting plate, better carry out the blanking of silicon wafer, and the other end of support rod is movably embedded in the inside of annular groove, can rotate along with connecting plate in the inside of annular groove. DRAWINGS

[0025] Figure 1 The utility model proposes a structure schematic diagram of silicon wafer wafering machine blanking mechanism;

[0026] Figure 2 The utility model proposes a partial side view structure schematic diagram of silicon wafer wafering machine blanking mechanism;

[0027] Figure 3 The utility model proposes a partial sectional structure schematic diagram of silicon wafer wafering machine blanking mechanism;

[0028] Figure 4 The utility model proposes a silicon wafer wafering machine blanking mechanism Figure 2 The utility model proposes a structure schematic diagram of silicon wafer wafering machine blanking mechanism;

[0029] Legend:

[0030] 1, bottom plate;101, support column;102, connecting axle;103, gear no. 1;104, drive motor no. 1;105, gear no. 2;106, connecting plate;107, vacuum pump;108, connecting pipe;109, electric push rod;110, mounting block;111, suction cup;112, placing groove;113, annular groove;114, support rod;115, drive motor no. 2;116, connecting rod;117, cutting table;118, fixed plate;119, flexible hose. Specific implementation

[0031] To better understand the above-mentioned objectives, features, and advantages of this utility model, the present utility model will be further described below with reference to the accompanying drawings and embodiments. It should be noted that, unless otherwise specified, the embodiments and features described in these embodiments can be combined with each other.

[0032] Many specific details are set forth in the following description in order to provide a full understanding of the present invention. However, the present invention may also be implemented in other ways different from those described herein. Therefore, the present invention is not limited to the specific embodiments disclosed in the following specification.

[0033] Example 1, such as Figures 1-4 As shown, this utility model provides a silicon wafer dicing machine unloading mechanism, including: a base plate 1, a support column 101 fixedly installed at the center of the top outer surface of the base plate 1, a connecting shaft 102 mounted on the top bearing of the support column 101, and a gear 103 fixedly sleeved on the outer surface of the connecting shaft 102; it also includes: a connecting plate 106 fixedly installed on the top of the connecting shaft 102, and electric push rods 109 fixedly installed on both sides of the top of the connecting plate 106, with the output ends of both electric push rods 109 penetrating the connecting plate 106; two... Mounting blocks 110 are fixedly installed at the output ends of two electric push rods 109, and suction cups 111 are fixedly installed at the bottom of each of the two mounting blocks 110. A vacuum pump 107 is fixedly installed at the center of the top outer surface of the connecting plate 106, and connecting pipes 108 are fixedly installed on both sides of the vacuum pump 107. The other ends of the two connecting pipes 108 penetrate the connecting plate 106. A telescopic hose 119 is fixedly installed at one end of each of the two connecting pipes 108, and the other ends of the two telescopic hoses 119 are fixedly connected to the outer surface of the suction cups 111.

[0034] In this embodiment, the feeding mechanism is connected to the dicing machine via the base plate 1, so that the cutting table 117 is located on top of the dicing machine and the base plate 1. The drive motor 115 is turned on and drives the cutting table 117 to move the cut silicon wafer to the outer surface of the base plate 1 via the connecting rod 116. Then, the electric push rod 109 is turned on to drive the suction cup 111 to adsorb the cut silicon wafer. The vacuum pump 107 extracts the air inside the suction cup 111 through the connecting pipe 108 and the telescopic hose 119, so that the suction cup 111 can better adsorb the silicon wafer.

[0035] Example 2, as Figures 1-4As shown, the center of the top outer surface of the bottom plate 1 is provided with an annular groove 113, both sides of the connecting plate 106 are fixedly installed with support rods 114, the other end of the plurality of support rods 114 is movably embedded in the inside of the annular groove 113; the side of the bottom plate 1 near the support column 101 is fixedly installed with a driving motor one 104, the output end of the driving motor one 104 is fixedly installed with a gear two 105, the gear two 105 is engaged with the gear one 103; the center of one side of the bottom plate 1 is provided with a placing groove 112, the other side of the bottom plate 1 away from the placing groove 112 is fixedly installed with a fixed plate 118; the top of the fixed plate 118 is fixedly installed with a driving motor two 115, the output end of the driving motor two 115 is fixedly installed with a plurality of connecting rods 116; one end of the plurality of connecting rods 116 is fixedly installed with a cutting table 117, the plurality of cutting tables 117 are located on the top outer surface of the bottom plate 1.

[0036] In this embodiment, the driving motor one 104 is started to drive the gear two 105 to rotate, the gear two 105 drives the engaged gear one 103 to rotate, the gear one 103 is fixedly sleeved on the outer surface of the connecting shaft 102, so that the connecting shaft 102 can be driven to rotate in the support column 101, the connecting plate 106 is driven to alternate two suction cups 111, the suction cup 111 with the silicon wafer is moved to the upper side of the placing groove 112, the electric push rod 109 drives the suction cup 111 to place the silicon wafer in the storage box, the vacuum pump 107 exhausts to make the suction cup 111 no longer adsorb the silicon wafer, so as to realize the discharging, improve the discharging efficiency, also reduce the abrasion of the silicon wafer, the outer surface of the connecting plate 106 is fixedly installed with a plurality of support rods 114, the plurality of support rods 114 can improve the stability of the connecting plate 106, better discharge the silicon wafer, the other end of the support rod 114 is movably embedded in the inside of the annular groove 113, which can rotate with the connecting plate 106 in the inside of the annular groove 113.

[0037] Working principle: in use, through the bottom plate 1 is connected with the blanking mechanism and the scriber, make cutting table 117 located in the scriber and the top of bottom plate 1, open drive motor two 115 through connecting rod 116 drive cutting table 117 will be cut after the silicon wafer moves to the outer surface of bottom plate 1, then open electric push rod 109 drive suction cup 111 after cutting the silicon wafer is adsorbed, vacuum pump 107 through the connecting pipe 108 and flexible hose 119 will be the air inside suction cup 111 extraction, make suction cup 111 better adsorbed silicon wafer, open drive motor one 104 drive gear two 105 rotation, gear two 105 drive meshing gear one 103 rotation, gear one 103 fixedly arranged on the outer surface of connecting shaft 102, therefore can drive connecting shaft 102 rotates in support column 101 inside, drive connecting plate 106 to two suction cup 111 alternately, suction cup 111 with silicon wafer is adsorbed moves to the above of placing groove 112, electric push rod 109 drive suction cup 111 will be placed in the storage box inside the silicon wafer, vacuum pump 107 exhaust makes suction cup 111 no longer adsorbed silicon wafer, so as to realize the blanking, improve the blanking efficiency, also reduce the wear of silicon wafer, the outer surface of connecting plate 106 is fixedly installed with a plurality of support rods 114, a plurality of support rods 114 can improve the stability of connecting plate 106, better blanking of silicon wafer, the other end of support rod 114 is movably embedded in the inside of annular groove 113, can rotate with connecting plate 106 in the inside of annular groove 113.

[0038] The above is only the preferred embodiment of the present application, not other forms of the present application limit, any skilled in the art of technical personnel may use the above disclosed technical content to change or modification as equivalent variation of equivalent embodiments applied to other fields, but any simple modification, equivalent change and modification of the above embodiments, which does not deviate from the technical scheme of the present application, according to the technical essence of the present application, still belongs to the protection scope of the present application technical scheme.

Claims

1. A silicon wafer dicing saw unloading mechanism comprising: The bottom plate (1), the center of the top outer surface of the bottom plate (1) is fixedly installed with a support column (101), the top of the support column (101) is bearing-mounted with a connecting shaft (102), the outer surface of the connecting shaft (102) is fixedly sleeved with a gear one (103), characterized in that, further comprising: The connecting plate (106) is fixedly installed on the top of the connecting shaft (102), and the top of the connecting plate (106) is fixedly installed with an electric push rod (109) on both sides, and the output ends of the two electric push rods (109) penetrate the connecting plate (106); Two mounting blocks (110) are fixedly installed on the output ends of the two electric push rods (109), and the bottom of the two mounting blocks (110) is fixedly installed with a suction cup (111).

2. The wafer dicing machine blanking mechanism of claim 1, wherein: The top outer surface of the connecting plate (106) is fixedly installed with a vacuum pump (107) at the center, and the two sides of the vacuum pump (107) are fixedly installed with a connecting pipe (108), and the other ends of the two connecting pipes (108) penetrate the connecting plate (106).

3. The wafer saw dicing machine unloading mechanism of claim 2, wherein: One end of the two connecting pipes (108) is fixedly installed with a flexible hose (119), and the other end of the two flexible hoses (119) is fixedly connected to the outer surface of the suction cup (111).

4. The wafer sawing machine blanking mechanism according to claim 1, wherein: The top outer surface of the bottom plate (1) is provided with an annular groove (113) at the center, and the two sides of the connecting plate (106) are fixedly installed with a support rod (114), and the other ends of the plurality of support rods (114) are movably embedded in the inside of the annular groove (113).

5. The wafer sawing machine blanking mechanism according to claim 1, wherein: The side of the bottom plate (1) close to the support column (101) is fixedly installed with a driving motor one (104), the output end of the driving motor one (104) is fixedly installed with a gear two (105), and the gear two (105) is engaged with the gear one (103).

6. The wafer saw dicing machine unloading mechanism of claim 1, wherein: The center of one side of the bottom plate (1) is provided with a placing groove (112), and the other side of the bottom plate (1) away from the placing groove (112) is fixedly installed with a fixed plate (118).

7. The wafer saw dicing machine unloading mechanism of claim 6, wherein: The top of the fixed plate (118) is fixedly installed with a driving motor two (115), and the output end of the driving motor two (115) is fixedly installed with a plurality of connecting rods (116).

8. The wafer saw dicing machine unloading mechanism of claim 7, wherein: One end of the plurality of connecting rods (116) is fixedly installed with a cutting table (117), and the plurality of cutting tables (117) are located on the top outer surface of the bottom plate (1).

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