Electroplating hanger

Abstract

The embodiment of the utility model discloses an electroplating hanger. The electroplating hanging tool comprises a hanging tool main body and an electroplating part, wherein the hanging tool main body is provided with a clamping area for placing a to-be-processed workpiece; the cover plate assembly is configured to be in sealing fit with the hanging tool main body in a negative pressure forming mode; the cover plate assembly comprises a cover plate and a compression part, and an elastic part is arranged between the compression part and the cover plate; when the cover plate assembly is attached to the hanging tool body in a sealed mode, the cover plate acts on the compression component through the elastic piece to press the wafer in the clamping area. According to the embodiment of the invention, the technical problem of how to improve the production quality and production efficiency of wafers is solved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of semiconductor wafer electroplating processing, and particularly to an electroplating hanger. BACKGROUND

[0002] In the production of semiconductor wafers, an electroplating hanger is used to immerse the wafer in a chemical agent for electroplating treatment.

[0003] In the prior art, the electroplating hanger fixes the wafer in the middle by two panels, and the two panels are generally fixedly connected by screws. After a period of use, the screws are prone to loosening, and the sealing performance is problematic, causing liquid leakage. In addition, during the fixing process, uneven force of the tightened screws also easily leads to poor sealing performance or wafer cracking, resulting in poor wafer electroplating effect and affecting product quality. Meanwhile, the existing electroplating hanger has limitations on the size of the clamped wafer, and generally, one electroplating hanger can only adapt to loading one size of wafer, leading to low production efficiency and high cost, and failing to effectively meet the production needs. CONTENT OF THE INVENTION

[0004] The present application aims to at least solve one of the technical problems existing in the prior art. To this end, the present application provides an electroplating hanger to solve the technical problem of how to improve the production quality and production efficiency of wafers.

[0005] The present application provides an electroplating hanger, comprising:

[0006] A hanger body provided with a clamping area for placing a workpiece to be processed;

[0007] A cover plate assembly configured to be sealed and fitted with the hanger body by forming negative pressure; the cover plate assembly comprises a cover plate and a compression component, and an elastic member is arranged between the cover plate and the compression component;

[0008] When the cover plate assembly is sealed and fitted with the hanger body, the cover plate compresses the wafer in the clamping area by the compression component through the action of the elastic member.

[0009] In one embodiment of the above-mentioned electroplating hanger,

[0010] The compression component is slidingly installed on the cover plate towards the clamping area, and the compression component has a certain gap with the cover plate under the elastic force of the elastic member, and the movement distance of the compression component relative to the cover plate is less than or equal to the gap.

[0011] In one embodiment of the above-mentioned electroplating hanger,

[0012] In the moving direction of the compression component, the first part of the elastic member is embedded in the compression component, and the second part of the compression component exposed when the elastic force of the elastic member is fully released contacts the cover plate, and the gap is less than or equal to the length of the second part.

[0013] In one embodiment of the electroplating fixture described above,

[0014] The elastic member is arranged on the compression component around the center of the compression component.

[0015] In one embodiment of the electroplating fixture described above,

[0016] The elastic member has at least two and is evenly arranged around the circumference of the center of the compression component.

[0017] In one embodiment of the electroplating fixture described above,

[0018] The compression component is slidingly installed on the cover plate by at least one limiting member;

[0019] The at least one limiting member is correspondingly arranged at the center position of the compression component, or

[0020] The limiting member has at least two and is evenly arranged around the circumference of the center of the compression component.

[0021] In one embodiment of the electroplating fixture described above,

[0022] The fixture body is provided with a first sealing ring arranged along the periphery of the clamping area; the cover plate is provided with at least one second sealing ring, and a negative pressure area is formed between the first sealing ring and the at least one second sealing ring to make the cover plate assembly and the fixture body seal and fit.

[0023] In one embodiment of the electroplating fixture described above,

[0024] In the clamping area, a third sealing ring is arranged along the edge of the clamping area, and a conductive sheet is attached to the third sealing ring; one end of the first sealing ring extends to press against the third sealing ring and a part of the conductive sheet, and the other part of the conductive sheet is attached to the wafer compressed by the compression component.

[0025] In one embodiment of the electroplating fixture described above,

[0026] The second sealing ring has at least two, at least one of the at least two second sealing rings is arranged along the periphery of the compression component, and at least another of the at least two second sealing rings is arranged along the edge of the cover plate.

[0027] In one embodiment of the electroplating fixture described above,

[0028] The fixture body is provided with a positioning pin, and the cover plate is provided with a slot matched with the positioning pin; the positioning pin and the slot are matched before the cover plate assembly is attached to the fixture body to position the cover plate assembly and the fixture body.

[0029] In one embodiment of the electroplating fixture described above,

[0030] The fixture body is provided with an air extraction hole.

[0031] The above one or more embodiments of the present application have at least one or more of the following beneficial effects:

[0032] In the implementation of the technical solutions of the present application, the fixture body and the cover plate assembly are attached and sealed by forming a negative pressure, and the negative pressure suction promotes the cover plate to compress the wafer through the elastic member acting on the compression component. In the process of compressing the wafer, the elastic deformation of the elastic member between the cover plate and the compression component realizes the close and stable attachment of the wafer and the conductive component of the fixture body, effectively ensures the effect of electroplating, and improves the production quality. Moreover, the elastic effect of the elastic member can compensate the position of the compression component, avoiding the loosening problem between the cover plate and the fixture body due to long-term use of the electroplating fixture. In addition, the uniform stress and good sealing effect between the cover plate and the fixture body are achieved by forming a negative pressure. The combination of the negative pressure forming mode and the elastic structure of the cover plate assembly not only ensures the smooth electroplating of the wafer, but also prevents the leakage of the chemical solution, thereby improving the production quality of the wafer. Furthermore, the compression component under the elastic effect of the elastic member can load wafers of different sizes, reducing production cost and improving production efficiency without replacing the matched fixture during the production process.

[0033] Additional aspects and advantages of the present application will be in part apparent and in part pointed out hereinafter. BRIEF DESCRIPTION OF DRAWINGS

[0034] The disclosure of the present application will become more apparent from the following description in conjunction with the accompanying drawings. It will be readily understood to those skilled in the art that the drawings are merely intended to illustrate the present application and are not intended to limit the scope of protection of the present application. In addition, similar numbers in the figures represent similar components, wherein:

[0035] Figure 1 is a schematic diagram of the fixture body and the cover plate assembly of the electroplating fixture according to one embodiment of the present application (the inner side view of the cover plate assembly relative to the fixture body);

[0036] Figure 2Figure 1 is a schematic diagram of a structure of a plating rack according to an embodiment of the present application, which is a schematic diagram of a structure of a rack body and a cover plate assembly of the plating rack according to an embodiment of the present application, which is a schematic diagram of an inner side view of the rack body relative to the cover plate assembly of the plating rack according to an embodiment of the present application;

[0037] Figure 3 Figure 2 is a schematic diagram of a structure of a plating rack according to an embodiment of the present application, which is a schematic diagram of a structure of a rack body and a cover plate assembly of the plating rack according to an embodiment of the present application, which is a schematic diagram of a structure of the rack body and the cover plate assembly of the plating rack according to an embodiment of the present application after being attached;

[0038] Figure 4 Figure 3 is a schematic diagram of a relationship structure of a cover plate, a compression component and an elastic member according to an embodiment of the present application;

[0039] Figure 5 Figure 4 is a sectional view along the direction of C-C of Figure 3; Figure 3

[0040] Figure 6 Figure 5 is an enlarged view of an A area in Figure 4; Figure 5

[0041] Figure 7 Figure 6 is a schematic diagram of an elastic member installation structure according to an embodiment of the present application;

[0042] Figure 8 Figure 7 is a schematic diagram of an elastic member installation structure according to another embodiment of the present application;

[0043] Figure 9 Figure 8 is a schematic diagram of a structure of a rack body according to an embodiment of the present application;

[0044] Figure 10 Figure 9 is a schematic diagram of a structure of a cover plate assembly according to an embodiment of the present application.

[0045] Legend of reference signs:

[0046] 100, rack body; 101, clamping area; 102, first sealing ring; 103, third sealing ring; 104, conductive sheet; 105, locking flange; 106, positioning pin; 107, air extraction hole; 108, air extraction channel; 109, air pipe joint mounting hole; 1011, flat plate; 1012, opening;

[0047] 200, cover plate assembly; 201, cover plate; 202, compression component; 203, elastic member; 204, limiting member; 2041, limiting end; 205, second sealing ring; 206, insertion slot;

[0048] 300, wafer. DETAILED DESCRIPTION

[0049] Some embodiments of the present application will be described below with reference to the accompanying drawings. It should be understood by those skilled in the art that these embodiments are only used to explain the technical principles of the present application, and are not intended to limit the protection scope of the present application.

[0050] ​​As described in the background, the existing electroplating hanger two panels are fixed by screws, long time use, easy to loose and leak, affect product quality, and can not meet the different size wafer use, can not meet the production efficiency demand, based on this, the present application proposes a kind of electroplating hanger to solve the above problems.

[0051] Refer to the attached Figures 1-3 In one or more embodiments, the electroplating hanger of the present application comprises: a hanger body 100, provided with a clamping area 101 for placing the workpiece to be processed;A cover plate assembly 200 is configured to be sealed and fitted with the hanger body 100 by forming a negative pressure;The cover plate assembly 200 includes a cover plate 201 and a compression component 202, and a spring (not shown in the figure) is arranged between the compression component 202 and the cover plate 201;When the cover plate assembly 200 is sealed and fitted with the hanger body 100, the cover plate 201 compresses the wafer on the clamping area 101 by the spring acting on the compression component 202. Figures 1-3

[0052] Specifically, in the present application, with reference to Figure 1 The hanger body 100 includes a flat plate 1011, and the flat plate 1011 is provided with an opening 1012, and the clamping area 101 is arranged around the opening 1012, and the clamping area 101 is used to place the wafer, and when the cover plate assembly 200 is sealed and fitted with the hanger body 100, the compression component 202 of the cover plate assembly 200 is pressed towards the opening 1012 direction on the clamping area 101, wherein the opening 1012 is used to expose the wafer to realize electroplating.

[0053] In one possible implementation, the clamping area 101 includes a bearing plate arranged integrally with the flat plate 1011, the bearing plate is arranged around the opening 1012, and in the direction towards the cover plate assembly 200, the surface of the bearing plate is relatively lower than the surface of the flat plate 1011, and the flat plate 1011 forms an area that can be used to carry and limit the position of the wafer, the shape and size of the bearing plate and the opening 1012 can be set according to the shape and size of the wafer, the size of the bearing plate needs to be greater than or equal to the wafer, and the size of the opening 1012 needs to be smaller than the size of the wafer, so as to realize the bearing of the wafer, in this example, the opening 1012 is circular, the bearing plate is annular around the opening 1012, and the outer diameter of the bearing plate is equal to or slightly larger than the radius of the wafer, and the radius of the opening 1012 is smaller than the radius of the wafer;The compression component 202 can also be set according to the shape and size of the clamping area 101, in this example, the compression component 202 can be a disc with a radius equal to or slightly larger than the wafer, and the disc moves towards the opening 1012 direction under the action of the spring to press the wafer on the bearing plate in the clamping area 101.

[0054] ​It should be understood that the figures in the present application only show one structure state of the clamping area 101, the opening 1012 and the compression component 202, and are not a limitation on the shape, size and number of the clamping area 101, the opening 1012 and the compression component 202. In actual use, the shape, size and number of the clamping area 101, the opening 1012 and the compression component 202 can be adaptively set according to the shape, size or radius of the wafer and the production quantity.

[0055] The electroplating hanger of the embodiment of the present application is sealed and attached between the hanger body 100 and the cover plate assembly 200 by forming a negative pressure. The negative pressure suction promotes the cover plate 201 to compress the wafer by the compression component 202 through the action of the elastic member. In the process of compressing the wafer, the elastic deformation of the elastic member between the cover plate 201 and the compression component 202 realizes the close and stable attachment of the wafer and the conductive component of the hanger body 100, effectively guarantees the electroplating effect and improves the production quality. Moreover, the elastic action of the elastic member can compensate the position of the compression component 202, avoiding the loosening problem between the cover plate 201 and the hanger body 100 due to long-time use of the electroplating hanger. Meanwhile, the forming of the negative pressure makes the stress between the cover plate 201 and the hanger body 100 uniform and the sealing effect good. The combination of the forming of the negative pressure and the elastic structure of the cover plate assembly 200 can not only guarantee the smooth electroplating of the wafer, but also prevent the leakage of the chemical solution, improving the production quality of the wafer. Further, the compression component 202 can load wafers of different sizes under the elastic action of the elastic member, reducing the production cost, without the need to replace the matched hanger in the production process, and improving the production efficiency.

[0056] In one embodiment, referring to Figures 1-3 The compression component 202 is slidably installed on the cover plate 201 towards the clamping area 101, i.e. the compression component 202 is in a movable state relative to the cover plate 201, so that there is a certain gap between the two to adapt to the loading of wafers of different sizes. Meanwhile, referring to Figure 3 When the hanger body 100 and the cover plate assembly 200 are in a sealed and attached state, the clamping force of the cover plate 201 to the elastic member towards the clamping area 101 makes the compression component 202 compress the wafer without displacement under the elastic action of the elastic member. Meanwhile, in order for the elastic member to have an effect on the compression component 202 during use, the compression component 202 does not deviate from the action range of the elastic member, realizing the compression of the wafer. When the hanger body 100 and the cover plate assembly 200 are not in use, referring to Figure 4The simplified schematic diagram of the cover plate 201, compression component 202, and elastic element 203 shown illustrates that the relative sliding distance between the compression component 202 and the cover plate 201 must be within the elastic force range of the elastic element 203. In other words, even when the fixture body 100 and the cover plate assembly 200 are not clamping the wafer, and the elastic element 203 is under minimal force (fully released), the compression component 202 must still be in contact with or within the effective range of the elastic element 203. Therefore, it is necessary to ensure that, in the fully released state (in the direction of movement of the compression component 202), both ends of the compression component 202 are respectively... The maximum distance that the compression component 202 can move relative to the cover plate 201 under elastic action can be called the compression gap or compensation gap. That is, the distance between the compression component 202 and the opposite surface of the cover plate 201 when the elastic force of the elastic element 203 is fully released is the gap D. Therefore, the movement distance of the compression component 202 relative to the cover plate 201 needs to be less than or equal to the gap D. That is, the movement distance of the compression component 202 is within the range of the gap D so that the compression component 202 can press the wafer under the action of the elastic element 203.

[0057] In one possible implementation, refer to Figures 3-6 In the moving direction of the compression component 202, the first part of the elastic element 203 is embedded in the compression component 202, and when the elastic force of the elastic element 203 is fully released, the second part of the compression component 202 is exposed and contacts the cover plate 201, with a gap D less than or equal to the length of the second part. Specifically, Figure 5 for Figure 3 A cross-sectional view along the CC direction. Figure 6 for Figure 5 The enlarged view of area A shows that, in order to improve the sealing between the cover plate assembly 200 and the fixture body 100 and prevent leakage, and to ensure that the compression component 202 can effectively and stably press the wafer 300, the distance between the compression component 202 and the cover plate 201 should not be too long. Therefore, the elastic element 203 is partially embedded in the compression component 202. This can effectively fix the elastic element 203 while ensuring that there is a certain gap D between the compression component 202 and the cover plate 201, and that the gap D does not affect the overall sealing between the cover plate assembly 200 and the fixture body 100. For example, when the elastic force of the elastic element 203 is fully released, the length of the second part of the compression component 202 exposed is 1.5 mm, the gap D can be less than or equal to 1.5 mm, and the moving distance of the compression component 202 relative to the cover plate 201 is less than or equal to 1.5 mm. Within this moving range, wafers 300 of different sizes can be pressed into the clamping area 101. It should be understood that the diagrams are only schematic representations of the relevant structural settings and relationships, and do not limit the specific shape and size of the compression component 202, the elastic element 203, and the cover plate 201.

[0058] In one possible implementation, refer toFigure 7 The elastic member 203 is arranged on the compression component 202 around the center of the compression component 202, and specifically, the elastic member 203 can be at least one silica gel tube or sealing ring arranged around the center of the compression component 202. Arranging the elastic member 203 around the center of the compression component 202 can make the elastic force received by the entire compression component 202 uniform, and can achieve uniform compression of the wafer.

[0059] In one possible implementation, referring to Figure 8 The elastic member 203 has at least two and is arranged uniformly in a circumferential direction around the center of the compression component 202, and specifically, the elastic member 203 can be a segmented silica gel tube or rubber pad or other structure with the same specification and certain elasticity, which is arranged uniformly on the compression component 202. The distributed arrangement can ensure that the elastic force received by the compression component 202 is uniform, and can flexibly use materials and save costs.

[0060] In one possible implementation, referring to Figures 1-6 The compression component 202 is slidingly installed on the cover plate 201 by at least one limiting member 204, and the limiting member 204 is used to install the compression component 202 on the cover plate 201. Specifically, as shown in Figure 6 One end of the limiting member 204 is fixedly installed on the cover plate 201, and the other end of the limiting member 204 has a limiting end 2041 extending in a direction perpendicular to the moving direction of the compression component 202. The compression component 202 is sleeved on the limiting member 204 between the cover plate 201 and the limiting end 2041, so that the compression component 202 can move between the cover plate 201 and the limiting end 2041. Specifically, the limiting member 204 can be a T-shaped limiting sleeve, and the fixed end of the T-shaped limiting sleeve is fixed on the cover plate 201 through the compression component 202, thereby achieving sliding installation of the compression component 202. Further, for the position setting of the limiting member 204, one limiting member 204 can be arranged at the center position of the compression component 202, or multiple limiting members 204 can be arranged. Referring to the position setting of Figure 3 The limiting members 204 are arranged uniformly in a circumferential direction around the center of the compression component 202, which effectively improves the moving stability of the compression component 202. It should be understood that the number and shape of the limiting members 204 shown in the figure are not limited, and in actual use, the specific setting can be made according to the installation requirements.

[0061] In one embodiment, referring to Figures 1-3 , Figure 5 , Figure 6 , Figure 9 and Figure 10The first sealing ring 102 is arranged on the hanger body 100 and is arranged along the periphery of the clamping area 101. The cover plate assembly 200 is arranged with at least one second sealing ring 205. A negative pressure is formed between the first sealing ring 102 and the at least one second sealing ring 205, so that the cover plate assembly 200 is tightly attached to the hanger body 100, and the compression component 202 is pressed against the wafer 300.

[0062] In one possible implementation, as shown in Figure 6 and Figure 9 , the third sealing ring 103 is arranged along the edge of the clamping area 101, and the conductive sheet 104 is attached to the third sealing ring 103. One end of the first sealing ring 102 extends to press against a part of the third sealing ring 103 and the conductive sheet 104. The other part of the conductive sheet 104 and the third sealing ring 103 is attached to the wafer 300 pressed by the compression component 202. Specifically, the first sealing ring 102 has two sealing contact surfaces. One sealing contact surface is directed towards the cover plate 201 to form a negative pressure area with the second sealing ring 205. The other sealing contact surface is used to press the third sealing ring 103 and the conductive sheet 104 in the clamping area 101. In this application, the first sealing ring 102 can be a T-shaped silica gel sealing ring, which is fixed on the hanger body 100 by the locking flange 105. The third sealing ring 103 and the conductive sheet 104 are arranged around the center of the clamping area 101. The locking flange 105 is installed on the sealing contact surface for attaching to the cover plate 201 and is uniformly spaced to ensure the firmness of the sealing ring. During installation, the third sealing ring 103 is clamped in the clamping area 101, the conductive sheet 104 is attached to the third sealing ring 103, the first sealing ring 102 is tightly installed at the periphery of the clamping area 101 and one end abuts and presses the third sealing ring 103 and the conductive sheet 104, and finally the locking flange 105 is tightly fixed on the hanger body 100. The arrangement of the third sealing ring 103 and the first sealing ring 102 ensures that the wafer 300 can be tightly attached to the conductive sheet 104, improves the sealing performance in the clamping area 101, ensures the smooth electroplating of the wafer 300, further prevents the leakage of the chemical solution, and improves the electroplating quality.

[0063] In one possible implementation, referring to Figure 3 and Figure 10 , the second sealing ring 205 has at least two. At least one of the at least two second sealing rings 205 is arranged along the periphery of the compression component 202, and at least one of the at least two second sealing rings 205 is arranged along the edge of the cover plate 201. The inner and outer multiple second sealing rings 205 can improve the sealing performance and provide more areas that can form negative pressure. More negative pressure areas can improve the attachment durability and prevent the cover plate assembly 200 from loosening from the hanger body 100.

[0064] In one embodiment, as shown in Figures 1-3 The positioning pin 106 is arranged on the hanger body 100, and the cover plate 201 is provided with a slot 206 corresponding to the positioning pin 106. The positioning pin 106 and the slot 206 are matched before the cover plate assembly 200 and the hanger body 100 are attached, so as to position the cover plate assembly 200 and the hanger body 100. In this application, the hanger body 100 and the cover plate assembly 200 are pressed by forming a negative pressure. In order to ensure accurate pressing of the wafer, the cover plate assembly 200 and the hanger body 100 are accurately positioned and attached by the positioning pin 106 and the slot 206 before the negative pressure is formed. Specifically, the positioning pin 106 can be arranged in multiple and symmetrical positions on the hanger body 100, which facilitates positioning. The specific number and position can be set according to the use requirement, and the number and position of the slot 206 and the positioning pin 106 are one-to-one matched.

[0065] In one embodiment, as shown in Figures 1-3 The hanger body 100 is provided with an air extraction hole 107 for extracting air between the cover plate assembly 200 and the hanger body 100 to form a negative pressure. The air extraction hole 107 can be connected to an air extraction device to extract air in the area between the cover plate assembly 200 and the hanger body 100, so as to form a negative pressure. In order to facilitate connection, the hanger body 100 is provided with an air extraction channel 108 communicating with the air extraction hole 107. One end of the air extraction channel 108 communicates with the air extraction hole 107, and the other end is connected to the air pipe joint mounting hole 109 arranged on the hanger body 100. The air extraction device is connected to the air pipe joint mounting hole 109 to perform the air extraction action. The arrangement of the air extraction channel 108 and the air pipe joint mounting hole 109 facilitates the connection of the air extraction device, and the air extraction hole 107 does not need to be directly connected to the air extraction device, which reduces the possibility of contact between the area between the cover plate assembly 200 and the hanger body 100 and the outside, and improves the sealing performance after the negative pressure is formed. It should be understood that the position and number of the air extraction hole 107, the air extraction channel 108 and the air pipe joint mounting hole 109 are arranged according to the position of the air extraction device for convenient connection. The position and number are not limited in the figure. Further, in this application, in order to improve the sealing performance and the durability of the attachment between the hanger body 100 and the cover plate assembly 200, the negative pressure is formed between the hanger body 100 and the cover plate assembly 200 until a vacuum state is reached. That is, the air extraction device is connected to the hanger body 100 and the cover plate assembly 200 through the air extraction hole 107 to extract air until the area between the hanger body 100 and the cover plate assembly 200 is in a vacuum state, so as to achieve a more close attachment.

[0066] Based on the above embodiment, referring to Figures 1-10An optional working process of the electroplating fixture of the embodiment is as follows: firstly, the wafer 300 is placed in the clamping area 101, and the cover plate 201 is matched and positioned with the fixture main body 100 through the positioning pin 106 and the slot 206; after positioning, the air pipe connector mounting hole 109 is connected with the air extraction device, the area between the first sealing ring 102 and the second sealing ring 205 is extracted through the air extraction hole 107 to form a negative pressure in the area until a vacuum state, so that the cover plate assembly 200 is sealed and fitted with the fixture main body 100; when the fitting is complete, the compression component 202 is pressed against the wafer 300 under the elastic force of the elastic member 203, so that the wafer 300 is tightly fitted with the conductive sheet 104 and the third sealing ring 103; after the wafer 300 is tightly fitted, the air extraction device can stop air extraction, and the electroplating fixture can be placed in the electroplating equipment for electroplating; after electroplating is completed, the fixture main body 100 and the cover plate assembly 200 can be separated by reversing the inflation between the fixture main body 100 and the cover plate assembly 200 or making them consistent with the external air pressure. The electroplating fixture of the application can not only ensure the smooth electroplating of the wafer 300, but also prevent the leakage of the liquid medicine. In addition, the gap between the cover plate 201 and the compression component 202 and the elastic member 203 can enable the electroplating fixture to load wafers of different sizes, meet different production needs, and improve production efficiency.

[0067] In the description of the present specification, the description of the terms "one embodiment", "some embodiments", "an example", "a specific example", or "some examples" and the like means that the specific features, structures, materials or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present application. In the present specification, the illustrative description of the above terms does not necessarily mean the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0068] In addition, the terms "first", "second" are only for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined with "first", "second" can explicitly or implicitly include at least one of the features. In the description of the present application, the meaning of "a plurality of" is at least two, for example, two, three, etc., unless otherwise specifically limited.

[0069] Although the embodiments of the present application have been shown and described above, it can be understood that the above embodiments are exemplary and cannot be understood as limiting the present application, and those skilled in the art can make changes, modifications, replacements and variations to the above embodiments within the scope of the present application.

Claims

1. An electroplating rack characterized by, The utility model relates to a wafer holder and a wafer holder assembly, comprising: a holder body provided with a clamping area for placing a workpiece to be processed; a cover plate assembly configured to be sealed and fitted with the holder body by forming a negative pressure; the cover plate assembly comprises a cover plate and a compression component, and an elastic member is arranged between the cover plate and the compression component; when the cover plate assembly is sealed and fitted with the holder body, the cover plate presses a wafer in the clamping area by the compression component under the action of the elastic member.

2. The electroplating rack of claim 1, wherein, The compression component is slidingly installed on the cover plate towards the clamping area, and the compression component has a certain gap with the cover plate under the action of the elastic force of the elastic member; the movement distance of the compression component relative to the cover plate is less than or equal to the gap.

3. The electroplating rack of claim 2, wherein, In the movement direction of the compression component, a first part of the elastic member is embedded in the compression component, and a second part of the compression component exposed when the elastic force of the elastic member is completely released contacts the cover plate; the gap is less than or equal to the length of the second part.

4. The electroplating rack of claim 2, wherein, The elastic member is arranged on the compression component around the center of the compression component.

5. The electroplating rack of claim 4, wherein, The elastic member has at least two and is uniformly arranged around the center of the compression component in the circumferential direction.

6. The electroplating rack of claim 2, wherein, The compression component is slidingly installed on the cover plate by at least one limiting member; the at least one limiting member is correspondingly arranged at the center position of the compression component, or the limiting member has at least two and is uniformly arranged around the center of the compression component in the circumferential direction.

7. The electroplating rack of any one of claims 1-6, wherein, A first sealing ring is arranged on the holder body and arranged along the periphery of the clamping area; at least one second sealing ring is arranged on the cover plate, and a negative pressure area is formed between the first sealing ring and the at least one second sealing ring to seal and fit the cover plate assembly with the holder body.

8. The electroplating rack of claim 7, wherein, In the clamping area, a third sealing ring is arranged along the edge of the clamping area, and a conductive sheet is fitted on the third sealing ring; one end of the first sealing ring extends to press the third sealing ring and a part of the conductive sheet, and the other part of the conductive sheet is fitted on the wafer pressed by the compression component.

9. The electroplating rack of claim 7, wherein, The second sealing ring has at least two, at least one of the at least two second sealing rings is arranged along the periphery of the compression component, and at least one of the at least two second sealing rings is arranged along the edge of the cover plate.

10. The electroplating rack of claim 1, wherein, A positioning pin is arranged on the holder body, and a slot corresponding to the positioning pin is arranged on the cover plate; the positioning pin and the slot are matched before the cover plate assembly and the holder body are fitted to position the cover plate assembly and the holder body.

11. The electroplating rack of claim 1, wherein, An air extraction hole is arranged on the holder body.

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