Insoluble anode structure of horizontal pulse plating line

Abstract

The utility model discloses an insoluble anode structure of a horizontal pulse plating line. The horizontal pulse plating line comprises a pulse rectifier, an anode and a cathode, the anode is electrically connected to an anode of the pulse rectifier, the cathode is electrically connected to a cathode of the pulse rectifier, the anode is the insoluble anode, and the insoluble anode comprises an electroplating anode and a protective anode; the anode and the cathode are arranged in parallel and are parallel to the ground; the electroplating anode and the protective anode are not in contact with each other and are independently and electrically connected to the positive electrode of the pulse rectifier; a one-way circuit control system is arranged between the electroplating anode and the anode of the pulse rectifier; the protective anode is arranged to protect the electroplating anode when pulse electroplating reverse current is conducted, the one-way circuit control system is arranged, the effect that only forward current passes through the electroplating anode is achieved, electroplating of the electroplating anode under the forward current condition is enhanced, the service life of the insoluble anode is prolonged, and the machining precision and efficiency of products are improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to the design processing field of electroplating device especially relates to a kind of insoluble anode structure of horizontal pulse electroplating line. BACKGROUND

[0002] With the rapid development of microelectronic technology, printed circuit board (PCB) appears high-precision deep hole design, that is, the proportion of circuit board thickness and hole diameter is larger, and the processing technology of conventional vertical electroplating line equipment (that is, the circuit board of cathode is perpendicular to the ground during electroplating process) is difficult to meet the high-quality, high-reliability manufacturing technical requirements of high thickness-diameter ratio hole, and it is easy to produce hole without copper problem.

[0003] Therefore, horizontal electroplating line equipment appears, that is, the cathode circuit board is parallel to the ground during electroplating process, and the horizontal electroplating line has more refined processing technology, more reliable product quality, more sufficient exchange of medicine, more stable electroplating process, so that the current control is more stable, and large-scale processing can be realized.

[0004] For horizontal electroplating, the traditional way still uses copper ball as anode, which is easy to produce anode mud and other problems, resulting in reduced processing accuracy, high maintenance cost, and decomposition and consumption of macromolecular compounds such as gloss agent in solution and other problems.

[0005] Therefore, the use of strong inert conductive material as insoluble anode appears, and copper oxide powder or copper sulfate solution is used to provide the required copper ions during electroplating, which improves the electroplating precision, and for horizontal electroplating line equipment, the use of insoluble anode technology also appears; However, the insoluble anode is equivalent to anode electrolysis of water during electroplating process, producing oxygen, which can oxidize important additives such as gloss agent, causing it to decompose quickly, affecting the gloss of electroplating, and producing more organic pollutants, affecting the quality of electroplating.

[0006] In addition, pulse electroplating is a kind of electroplating using pulse power instead of direct current, and the continuously formed forward and reverse alternating current in the pulse process prevents the current in the deep hole of the cathode circuit board from being distributed in the shape of waist drum during electroplating (using direct current), thereby preventing the current distribution in the deep hole from gradually decreasing from the hole edge to the hole center, causing a large amount of electroplated copper to deposit on the surface and the hole edge, and the phenomenon that it is difficult to electroplate copper in the hole, thereby improving the ability and quality of deep hole electroplating.

[0007] However, the continuously formed forward and reverse alternating current of pulse electroplating is more likely to impact the insoluble anode, causing the service life of the insoluble anode to decrease.

[0008] Based on the above background technology and problems, for the insoluble anode of pulse electroplating type horizontal electroplating line, an insoluble anode structure with protection function is provided. Utility model content

[0009] The utility model aims at solving the problem that insoluble anode of horizontal pulse plating line of prior art adopts pulse type electroplating, insoluble anode is easy to be impacted in the electroplating process, and the service life is affected, provide a kind of insoluble anode structure of horizontal pulse plating line, the horizontal pulse plating line includes pulse rectifier, anode, cathode, the anode is electrically connected to the positive pole of the pulse rectifier, the cathode is electrically connected to the cathode of the pulse rectifier;The anode and the cathode are mutually parallel arrangement, and mutually parallel with ground are arranged;The anode is insoluble anode, and the insoluble anode includes electroplating anode and protective anode;The electroplating anode and the protective anode do not contact each other and are electrically connected to the positive pole of the pulse rectifier respectively;Single circuit control system is arranged between the electroplating anode and the positive pole of the pulse rectifier.

[0010] Further, the single circuit control system is a diode system or a triode system or a MOS tube system or an IGBT system or an analog circuit system or a digital circuit system.

[0011] Further, the insoluble anode is provided with an anode diaphragm, and the anode diaphragm is a selective permeation membrane.

[0012] Further, the selective permeation membrane is a cation exchange membrane, and the cation exchange membrane is a sulfonic acid-based cation exchange membrane or a phosphoric acid-based cation exchange membrane.

[0013] Further, the insulating film is made of PE, PC, PP, PI, PVC, PET, PTFE, PMMA, ABS, ETFE, TPX, silica gel, epoxy resin, acrylic acid, ceramic or nano-ceramic composite epoxy resin.

[0014] Further, the insoluble anode comprises the following structural features: the anode diaphragm is arranged between the electroplating anode and the cathode; or, the anode diaphragm wraps the electroplating anode; or, the anode diaphragm wraps the insoluble anode.

[0015] Further, the insoluble anode comprises the following structural features: the insulating film is arranged between the electroplating anode and the cathode; or, the protective anode, the insulating diaphragm and the electroplating anode are sequentially superimposed to form an integrated superimposed anode.

[0016] Optionally, the insoluble anode is provided with an insulating frame; the electroplating anode and the protective anode are fixed on the insulating frame in parallel with each other.

[0017] Optionally, an anode diaphragm is arranged between the electroplating anode and the cathode, the anode diaphragm is a selective permeation membrane; the selective permeation membrane is a cation exchange membrane, the cation exchange membrane is a sulfonic acid cation exchange membrane or a phosphoric acid cation exchange membrane; the anode diaphragm is arranged between the electroplating anode and the protective anode; or, the anode diaphragm wraps the insoluble anode (or wraps the electroplating anode and the protective anode).

[0018] Optionally, an insulating film is arranged between the electroplating anode and the protective anode; the material of the insulating film is PE, PC, PP, PI, PVC, PET, PTFE, PMMA, ABS, ETFE, TPX, silica gel, epoxy resin, acrylic acid, ceramic or nano-ceramic composite epoxy resin; the insulating film is parallel to the electroplating anode and is fixed on the insulating frame.

[0019] The technical scheme of the utility model provides the insoluble anode of the horizontal electroplating line of the pulse type electroplating, provides the adoption of the division of the anode into the electroplating anode and the protective anode, utilizes the protective anode to play the protection effect to the electroplating anode when the pulse electroplating switches for the reverse current (the anode is replaced for the cathode, and the cathode is replaced for the anode), prevents the phenomenon that the electroplating anode produces surface hydrogen evolution corrosion, is plated on the metal (copper), and sets up the unidirectional circuit control system, makes the electroplating anode only be able to pass through the positive current that the pulse rectifier issues, and cannot pass through the reverse current, enhances the electroplating of the electroplating anode only under the positive current condition, enhances the protection effect of the protective anode under the reverse current condition.

[0020] Further setting the anode diaphragm, can pass through the water molecule, ion and electron, block the macromolecular component, play the role of blocking the insoluble anode and the gloss agent etc. macromolecular component, and the oxygen generated by the anode and the oxidation reaction of the gloss agent etc. are blocked, improve the electroplating flatness, further set the insulating film or the insulating frame, can make the insoluble anode formed by the electroplating anode and the protective anode realize the high-precision layout in smaller space. BRIEF DESCRIPTION OF DRAWINGS

[0021] In order to more clearly illustrate the technical scheme in the embodiments of the utility model or the prior art, the drawings needed to be used in the following embodiment or prior art description will be briefly introduced, and obviously, the drawings in the following description are only some embodiments of the utility model, and for those skilled in the art, other drawings can be obtained according to the structure shown in these drawings without creating labor.

[0022] Figure 1 It is the anode and cathode distribution structure schematic view of the horizontal electroplating line of the pulse type insoluble anode of the embodiment;

[0023] Figure 2 A schematic diagram of insoluble anode structure for a first horizontal pulse plating line of the present embodiment;

[0024] Figure 3 A schematic diagram of insoluble anode structure for a second horizontal pulse plating line of the present embodiment;

[0025] Figure 4 A schematic diagram of insoluble anode structure for a third horizontal pulse plating line of the present embodiment;

[0026] Figure 5 A schematic diagram of insoluble anode structure for a fourth horizontal pulse plating line of the present embodiment;

[0027] Figure 6 A schematic diagram of insoluble anode structure for a fifth horizontal pulse plating line of the present embodiment;

[0028] Figure 7 A schematic diagram of insoluble anode structure for a sixth horizontal pulse plating line of the present embodiment;

[0029] Figure 8 A schematic diagram of insoluble anode structure for a seventh horizontal pulse plating line of the present embodiment;

[0030] Figure 9 A schematic diagram of insoluble anode structure for an eighth horizontal pulse plating line of the present embodiment;

[0031] Figure 10 A schematic diagram of insoluble anode structure for a ninth horizontal pulse plating line of the present embodiment;

[0032] Figure 11 A schematic diagram of insoluble anode structure for a tenth horizontal pulse plating line of the present embodiment.

[0033] BRIEF DESCRIPTION OF DRAWINGS

[0034]

[0035] The implementation, functional features and advantages of the present utility model will be further described with reference to the accompanying drawings in conjunction with embodiments. DETAILED DESCRIPTION

[0036] The technical solutions in the embodiments of the present utility model will be apparently and completely described in conjunction with the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are only part of the embodiments of the present utility model, rather than all the embodiments. Based on the embodiments in the present utility model, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the present utility model.

[0037] It should be noted that all directional indications (such as up, down, left, right, front, back, etc.) in the embodiments of the present application are only used to explain the relative position relationship, movement condition, etc. between components in a certain specific posture (as shown in the drawings), and if the specific posture changes, the directional indications will also change accordingly.

[0038] In addition, the description such as "first", "second" and the like in the present application is only for the purpose of description, and cannot be understood as indicating or implying the relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features limited by "first", "second" can be explicitly or implicitly included at least one of the features. In the description of the present application, the meaning of "multiple" is at least two, such as two, three, etc., unless otherwise specifically limited.

[0039] Please refer to Figure 1 , Figure 1 The anode and cathode distribution structure of the horizontal plating line of the pulse type insoluble anode of the present embodiment is shown in the figure.

[0040] The horizontal plating line 10 of the pulse type insoluble anode is provided with an upper anode 110A above the cathode 120 and a lower anode 110B below the cathode 120, and the upper anode 110A, the cathode 120 and the lower anode 110B are all parallel to the ground.

[0041] Please refer to Figure 2 , Figure 2 The insoluble anode structure of the first horizontal pulse plating line of the present embodiment is shown in the figure.

[0042] The insoluble anode structure of the horizontal pulse plating line provided by the present embodiment, the horizontal pulse plating line includes a pulse rectifier 20, an anode 110, and a cathode 120, the anode 110 is electrically connected to the positive electrode of the pulse rectifier 20, and the cathode 120 is electrically connected to the negative electrode of the pulse rectifier 20; the anode 110 and the cathode 120 are arranged parallel to each other and are both arranged parallel to the ground; the anode 110 is an insoluble anode, and the insoluble anode includes an electroplating anode 1110 and a protective anode 1120; the electroplating anode 1110 and the protective anode 1120 do not contact each other and are independently electrically connected to the positive electrode of the pulse rectifier 20; a unidirectional circuit control system 1130 is arranged between the electroplating anode 1110 and the positive electrode of the pulse rectifier 20.

[0043] In the embodiment, the anode 110 and the cathode 120 are parallel to the ground, and in the horizontal plating line installation process, the plating solution needs to be parallel to the horizontal plane due to the existence of the plating tank and the plating solution in the device, so the anode 110 and the cathode 120 of the embodiment are parallel to the horizontal plane, which is a necessary feature of horizontal plating; on this basis, the plating anode 1110 and the protective anode 1120 are arranged, and the plating anode 1110 and the protective anode 1120 can both play an electrolysis role when the pulse current is conducted in the positive direction, and when the pulse current is conducted in the reverse direction, the protective anode 1120 plays a role of replacing the plating anode 1110 as the cathode 120 in the reverse transient switching, and plays a protective effect.

[0044] However, since both are electrically connected to the positive pole of the pulse rectifier 20, simply adding the protective anode 1120 has limited protective effect on the plating anode 1110, therefore, the unidirectional circuit control system 1130 is arranged, that is, the unidirectional circuit control system 1130 is arranged to enable the pulse positive current to be smoothly conducted to the plating anode 1110 after being emitted from the positive pole of the pulse rectifier 20, and the pulse reverse current cannot be transmitted back through the plating anode 1110 but can only be transmitted back from the protective anode 1120 after being emitted from the negative pole of the pulse rectifier 20, so as to form protection for the plating anode from the current conduction.

[0045] It should be noted that since the protective anode 1120 is used as the cathode 120 when the pulse current is in the reverse current, the surface is easy to be plated with metal (copper), since the plating is formed in the environment of the plating solution to form a current loop to form the plating process, and the protective anode 1120 is generally made of valve metal materials such as titanium, and the valve metal does not conduct electricity as the anode in the plating solution, so the current unidirectional control system is arranged to enable the pulse plating to emit positive current when working, and the current can only be transmitted from the plating anode 1110, so that the metal (copper) attached to the surface of the protective anode 1120 can be automatically ablated, and the phenomenon of surface metal (copper) deposition does not occur, thereby playing the roles of automatic ablation, automatic cleaning, and no need for separate cleaning.

[0046] The protective anode 1120 can be a solid plate structure or a mesh structure, and the mesh structure is more conducive to the flow of plating solution.

[0047] In the embodiment, the unidirectional circuit control system 1130 is a diode system or a triode system or a MOS tube system or an IGBT system or an analog circuit system or a digital circuit system.

[0048] The current unidirectional control system is a system capable of controlling and realizing unidirectional conduction of current, i.e., a system capable of realizing the effect of unidirectional conduction of current, which can be used in the present embodiment; preferably, a diode is used and a corresponding circuit is configured for use as the current unidirectional control system.

[0049] Further, to improve the reliability of unidirectional current, in addition to the above-mentioned unidirectional circuit control system 1130 that can be arranged between the electroplating anode 1110 and the positive electrode of the pulse rectifier 20, a unidirectional circuit control system 1130 can also be arranged between the protective anode 1120 and the positive electrode of the pulse rectifier 20, and the electroplating anode 1110 and the protective anode 1120 can be electrically connected, and a unidirectional circuit control system 1130 can be arranged between the circuits electrically connected in series; further, a plurality of parallel electrically connected circuits can also be arranged, and a unidirectional circuit control system 1130 can be arranged on each circuit to prevent problems caused by a single failure.

[0050] Please refer to Figure 3 and Figure 4 , Figure 3 is a schematic diagram of the insoluble anode structure of the second horizontal pulse electroplating line of the present embodiment; Figure 4 is a schematic diagram of the insoluble anode structure of the third horizontal pulse electroplating line of the present embodiment.

[0051] In the present embodiment, the insoluble anode is provided with an anode diaphragm 3030, and the anode diaphragm 3030 is a selective permeation membrane; and / or, the insoluble anode is provided with an insulating film 40.

[0052] Further, the selective permeation membrane is a cation exchange membrane, and the cation exchange membrane is a sulfonic acid-based cation exchange membrane or a phosphoric acid-based cation exchange membrane.

[0053] Further, the material of the insulating film 40 is PE, PC, PP, PI, PVC, PET, PTFE, PMMA, ABS, ETFE, TPX, silica gel, epoxy resin, acrylic acid, ceramic, or nano-ceramic composite epoxy resin.

[0054] In the present embodiment, the insoluble anode comprises the following structural features: the anode diaphragm 30 is arranged between the electroplating anode 1110 and the cathode 120; or, the anode diaphragm 30 wraps the electroplating anode 1110; or, the anode diaphragm 30 wraps the insoluble anode.

[0055] Since the insoluble anode electrolyzes water to produce oxygen during the electroplating process, which causes oxidation of additives such as brightener, and the oxygen also affects the electroplating process of the workpiece to be plated, a selective permeable membrane is arranged between the electroplatable anode 1110 and the cathode 120 to block the additives such as brightener to the side of the electroplating solution tank body and to block the oxygen to the side of the insoluble anode (oxygen can be automatically discharged), which can effectively improve the stability and quality effect of the electroplating process.

[0056] The anode diaphragm 30 must be arranged between the cathode 120 and the electroplatable anode 1110, and the protective anode 1120 can be arranged at any position in the electroplating solution in the electroplating tank body.

[0057] The selective permeable membrane can be selected from PP film, PET film, PTFE film, PE film, PVC film or PC film; the material is resistant to electroplating environment and does not react with electroplating solution, and can be effectively applied in the solution environment of the electroplating cylinder.

[0058] The thickness of the selective permeable membrane is 120 microns to 800 microns, preferably 170 microns, 220 microns or 300 microns to 600 microns; the selective permeable membrane can be selected from a cation exchange membrane; which is more conducive to the effect of passing electrons and not passing macromolecular compounds such as brightener, and has the advantages of good chemical stability and thermal stability, low voltage drop, high electrical conductivity, high mechanical strength, etc., and can be used in harsh conditions such as strong acid, strong base, strong oxidizing agent medium and high temperature.

[0059] The anode diaphragm 30 wraps the electroplatable anode 1110 or the insoluble anode, which can better form a closed isolation state for the anode, preventing the problem of not being isolated by the anode diaphragm 30 due to the flow and splashing of the solution.

[0060] Please refer to Figures 5 to 9 , Figure 5 is a schematic diagram of an insoluble anode structure of a fourth horizontal pulse electroplating line of the embodiment; Figure 6 is a schematic diagram of an insoluble anode structure of a fifth horizontal pulse electroplating line of the embodiment; Figure 7 is a schematic diagram of an insoluble anode structure of a sixth horizontal pulse electroplating line of the embodiment; Figure 8 is a schematic diagram of an insoluble anode structure of a seventh horizontal pulse electroplating line of the embodiment; Figure 9 is a schematic diagram of an insoluble anode structure of an eighth horizontal pulse electroplating line of the embodiment.

[0061] In the embodiment, the insoluble anode includes the following structural features: the insulating film 40 is arranged between the electroplatable anode 1110 and the cathode 120; or, the protective anode 1120, the insulating diaphragm and the electroplatable anode 1110 are sequentially superimposed to form a whole superimposed anode.

[0062] Due to the limited space of the horizontal plating line, the distance between the electroplating anode 1110 and the protective anode 1120 is short, and the insulating film 40 is mainly used to isolate the electroplating anode 1110 and the protective anode 1120, so that they can work independently. The insulating film 40 can also be a mesh film, which is beneficial to the circulation of the electroplating solution in the electroplating tank. Preferably, the protective anode 1120, the insulating diaphragm, and the electroplating anode 1110 can be stacked at one time to form a whole anode, which is more conducive to saving space. It should be noted that in the whole anode, the size of the insulating film 40 on one side is greater than or equal to the size of the electroplating anode 1110 and the protective anode 1120.

[0063] For the stacking of the whole anode, adhesion, hot pressing, riveting, and clamping can be used.

[0064] Please refer to Figures 10 to 11 , Figure 10 Figure 9 is a schematic diagram of an insoluble anode structure of a ninth horizontal pulse plating line according to the present embodiment. Figure 11 Figure 10 is a schematic diagram of an insoluble anode structure of a tenth horizontal pulse plating line according to the present embodiment.

[0065] In the present embodiment, the insoluble anode is provided with an insulating frame 50, and the electroplating anode 1110 and the protective anode 1120 are fixed on the insulating frame 50 in parallel with each other.

[0066] In one embodiment, an anode diaphragm 30 is arranged between the electroplating anode 1110 and the cathode 120, the anode diaphragm 30 is a selective permeation film, and the selective permeation film is a cation exchange film. The selective permeation film is a cation exchange film, and the cation exchange film is a sulfonic acid-based cation exchange film or a phosphoric acid-based cation exchange film. The anode diaphragm 30 is arranged between the electroplating anode 1110 and the protective anode 1120, or the anode diaphragm 30 wraps the insoluble anode, or the electroplating anode 1110 and the protective anode 1120.

[0067] Since the electroplating anode 1110 and the protective anode 1120 are both materials with strong rigidity, they can be arranged on the insulating frame 50 to be fixed away from each other. Similarly, an anode diaphragm 30 can also be arranged between the electroplating anode 1110 and the cathode 120.

[0068] In one embodiment, an insulating film 40 is arranged between the electroplating anode 1110 and the protective anode 1120. The material of the insulating film 40 is PE, PC, PP, PI, PVC, PET, PTFE, PMMA, ABS, ETFE, TPX, silicone, epoxy resin, acrylic acid, ceramic, or nano-ceramic composite epoxy resin. The insulating film 40 is parallel to the electroplating anode 1110 and is fixed on the insulating frame 50.

[0069] In the same way, the whole structure can be fixed by using the insulating frame 50.

Claims

1. A horizontal pulse electroplating line insoluble anode structure, the horizontal pulse electroplating line comprising a pulse rectifier, an anode, a cathode, the anode being electrically connected to the positive pole of the pulse rectifier, the cathode being electrically connected to the negative pole of the pulse rectifier, characterized in that, the anode and the cathode are arranged parallel to each other and parallel to the ground; the anode is an insoluble anode, the insoluble anode comprising an electroplating anode and a protective anode; the electroplating anode and the protective anode are not in contact with each other and are independently electrically connected to the positive pole of the pulse rectifier respectively; a unidirectional circuit control system is arranged between the electroplating anode and the positive pole of the pulse rectifier.

2. An insoluble anode structure for a horizontal pulse plating line as claimed in claim 1, characterized in that The unidirectional circuit control system is a diode system or a triode system or a MOS tube system or an IGBT system or an analog circuit system or a digital circuit system. 3.The horizontal pulse electroplating line insoluble anode structure of claim 1, characterized in that, the insoluble anode is provided with an anode diaphragm, the anode diaphragm being a selective permeation membrane; and / or, the insoluble anode is provided with an insulating film. 4.The horizontal pulse electroplating line insoluble anode structure of claim 3, characterized in that, the selective permeation membrane is a cation exchange membrane, the cation exchange membrane being a sulfonic acid cation exchange membrane or a phosphoric acid cation exchange membrane. 5.The horizontal pulse electroplating line insoluble anode structure of claim 3, characterized in that, the material of the insulating film is PE, PC, PP, PI, PVC, PET, PTFE, PMMA, ABS, ETFE, TPX, silica gel, epoxy resin, acrylic acid, ceramic or nano-ceramic composite epoxy resin. 6.The horizontal pulse electroplating line insoluble anode structure of claim 3, characterized in that, the insoluble anode comprises the following structural features: the anode diaphragm is arranged between the electroplating anode and the cathode; or, the anode diaphragm wraps the electroplating anode; or, the anode diaphragm wraps the insoluble anode. 7.The horizontal pulse electroplating line insoluble anode structure of claim 3 or 6, characterized in that, the insulating film is arranged between the electroplating anode and the cathode; or, the protective anode, the insulating film and the electroplating anode are sequentially superimposed to form an integrated superimposed anode. 8.The horizontal pulse electroplating line insoluble anode structure of claim 1, characterized in that, the insoluble anode is provided with an insulating frame; the electroplating anode and the protective anode are fixed on the insulating frame in parallel to each other. 9.The horizontal pulse electroplating line insoluble anode structure of claim 8, characterized in that, an anode diaphragm is arranged between the electroplating anode and the cathode, the anode diaphragm being a selective permeation membrane; the selective permeation membrane is a cation exchange membrane, the cation exchange membrane being a sulfonic acid cation exchange membrane or a phosphoric acid cation exchange membrane. The anode diaphragm is arranged between the electroplating anode and the protective anode, and the anode diaphragm wraps the insoluble anode or the anode diaphragm wraps the electroplating anode and the protective anode.

10. The insoluble anode structure of a horizontal pulse electroplating line according to claim 8 or 9, characterized in that, an insulation film is arranged between the electroplating anode and the protective anode.

10. The insoluble anode structure of a horizontal pulse electroplating line according to claim 8 or 9, characterized in that, an insulation film is arranged between the electroplating anode and the protective anode.

10. The insoluble anode structure of a horizontal pulse electroplating line according to claim 8 or 9, characterized in that, an insulation film is arranged between the electroplating anode and the protective anode.

10. The insoluble anode structure of a horizontal pulse electroplating line according to claim 8 or 9, characterized in that, an insulation film is arranged between the electroplating anode and the protective anode.

10. The insoluble anode structure of a horizontal pulse electroplating line according to claim 8 or 9, characterized in that, an insulation film is arranged between the electroplating anode and the protective anode.

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