Small quartz wafer frequency chip corrosion equipment
By combining filtration extraction and rotating components, the problem of uneven etching solution concentration is solved, achieving uniform distribution of the etching solution within the etching chamber and ensuring the etching uniformity and consistency of the finished product for small quartz wafer frequency wafers.
Patent Information
- Application Number
- CN202423302594.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-31
- Publication Date
- 2025-11-28
- Estimated Expiration
- 2034-12-31
AI Technical Summary
During the etching process of small quartz wafer frequency wafers, uneven concentration of the etching solution leads to uneven etching degree in different parts of the same batch of quartz wafers, resulting in poor consistency of finished products.
The system combines a filtration extraction component and a rotating component. The filtered corrosion solution enters the rotating tube, which is driven by a servo motor to rotate, forming a dynamic circulation that ensures the corrosion solution is evenly distributed within the corrosion chamber.
It effectively reduces the difference in etching solution concentration, ensures that the etching degree of each part of each wafer is consistent, and improves the consistency of finished products.
Smart Images

Figure CN223607439U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to small quartz wafer frequency piece corrosion technical field especially, relates to a small quartz wafer frequency piece corrosion equipment. BACKGROUND
[0002] Small quartz wafer frequency piece is an important element widely used in electronic field, adopts quartz crystal material, and is the micro piece element made through fine processing, is used to accurately control the oscillation frequency in electronic circuit, and needs to carry out corrosion treatment to small quartz wafer frequency piece in the processing of small quartz wafer frequency piece, through corrosion treatment, can accurately and uniformly etch the extremely thin layer of material on wafer surface, thereby subtly change wafer thickness, and in the processing of small quartz wafer frequency piece, it is inevitable that certain damage is left on the surface of small quartz wafer frequency piece, and the damage layer on the surface of small quartz wafer frequency piece can be treated through corrosion.
[0003] Small quartz wafer frequency piece is usually fixed through clamp, small quartz wafer frequency piece is placed into the inside of corrosion box through clamp, and small quartz wafer frequency piece is corroded through the corrosion liquid in the corrosion box, and the corrosion liquid is frequently circulated through circulating mechanism, so that the corrosion liquid circulates in the corrosion box, and the corrosion liquid concentration is uniform.
[0004] But in the use process, since the position of the liquid material inlet of the circulating structure is fixed, the corrosion liquid concentration is easy to appear difference in the area close to the liquid material inlet and the area far from these parts, it is difficult to guarantee that the corrosion liquid is absolutely uniformly distributed in the corrosion chamber, the corrosion degree of each part of the same batch of quartz wafer is uneven, and the consistency of finished product is poor, based on the above problems, the present application provides a small quartz wafer frequency piece corrosion equipment. UTILITY MODEL CONTENTS
[0005] In view of the defects of the prior art, the utility model provides a small quartz wafer frequency piece corrosion equipment to solve the problems in the background art.
[0006] In order to realize the above purpose, the utility model adopts the following technical scheme:
[0007] The utility model provides a small quartz wafer frequency piece etching equipment, including the installation base, the top fixedly installed etching box of installation base, the top of installation base is provided with lifting assembly, the inside of installation base is provided with mounting frame through lifting assembly, the surface of mounting frame is provided with placing assembly, the inside of installation base is provided with quartz wafer frequency piece body through placing assembly, the top of installation base is provided with filter type extraction assembly, the top of installation base is provided with liquid outlet pipe through filter type extraction assembly, the liquid outlet end of liquid outlet pipe is provided with rotating assembly, the liquid outlet end of liquid outlet pipe is provided with rotating pipe through rotating assembly, the top of installation base is provided with drive assembly.
[0008] Preferably, the lifting assembly includes a hydraulic push rod fixedly installed on the top of the installation base, the output end of the hydraulic push rod is fixedly provided with a moving plate, the surface of the moving plate is fixedly provided with a sealing cover plate, the bottom of the sealing cover plate is fixedly provided with a connecting column, and the mounting frame is fixedly installed at the bottom end of the connecting column.
[0009] Preferably, the placing assembly includes a U-shaped plate fixedly installed on the surface of the mounting frame, the inside of the U-shaped plate is fixedly provided with a mounting cylinder, the surface of the mounting cylinder is fixedly provided with a triangular plate, and the quartz wafer frequency piece body is lapped with the triangular plate.
[0010] Preferably, the filter type extraction assembly includes a filter box fixedly installed on the top of the installation base, the liquid outlet pipe is fixedly installed on the left side of the filter box, the inside of the filter box is fixedly provided with a filter screen, the top of the filter screen is fixedly provided with a connecting frame, the top of the connecting frame is fixedly provided with a conveying pump, the liquid outlet end of the conveying pump penetrates through the connecting frame and extends to the inside of the filter box, the liquid inlet end of the conveying pump is fixedly provided with a liquid inlet pipe, and the liquid inlet end of the liquid inlet pipe penetrates through the etching box and extends to the inside of the etching box.
[0011] Preferably, the rotating assembly includes a mounting pipe fixedly installed on the liquid outlet end of the liquid outlet pipe, the bottom end of the mounting pipe is fixedly provided with a sealing shell, the inside of the sealing shell is fixedly provided with a sealing bearing, the outer ring of the sealing bearing is connected with the sealing shell, the inner ring of the sealing bearing is fixedly provided with a connecting pipe, and the connecting pipe is fixedly installed on the liquid outlet end of the rotating pipe.
[0012] Preferably, the drive assembly includes a servo motor fixedly installed on the top of the installation base, the output end of the servo motor is fixedly provided with a drive gear, the surface of the drive gear is engagedly provided with a connecting gear, and the connecting gear is fixedly installed on the surface of the rotating pipe.
[0013] Preferably, the rear side of the etching box is fixedly provided with a liquid discharge pipe, and the liquid discharge pipe is fixedly provided with a control valve.
[0014] Compared with the prior art, the small quartz wafer frequency piece etching equipment has the advantages that the etching liquid is extracted from the etching box through the filtering type extraction assembly, the filtered etching liquid enters the inside of the rotating pipe located in the middle of the etching box through the liquid outlet pipe and the rotating assembly, and is discharged to the inside of the etching box, meanwhile, the driving assembly drives the rotating pipe to rotate, the etching liquid forms dynamic circulation in the etching box, so that the etching liquid in different areas has sufficient opportunity to mix, thereby reducing the concentration difference, and avoiding that the etching degree of each part of the same batch of quartz wafers close to the liquid inlet and far away from the liquid inlet is uneven, so that the finished product remains consistency. BRIEF DESCRIPTION OF DRAWINGS
[0015] Figure 1 It is a structure of the utility model;
[0016] Figure 2 It is a longitudinal section view of the structure of the utility model;
[0017] Figure 3 It is a local structure view of the utility model;
[0018] Figure 4 It is a structure view of the placing assembly of the utility model;
[0019] Figure 5 It is Figure 2 the structure enlarged view of A.
[0020] In the drawing: 1, mounting base; 2, etching box; 3, hydraulic push rod; 4, moving plate; 5, sealing cover plate; 6, connecting column; 7, mounting frame; 8, U-shaped plate; 9, mounting cylinder; 10, triangular plate; 11, quartz wafer frequency piece body; 12, filter box; 13, filter screen; 14, connecting frame; 15, conveying pump; 16, liquid inlet pipe; 17, liquid outlet pipe; 18, mounting pipe; 19, sealing shell; 20, sealing bearing; 21, connecting pipe; 22, rotating pipe; 23, servo motor; 24, driving gear; 25, connecting gear. DETAILED DESCRIPTION
[0021] The technical solutions in the embodiments of the utility model will be clearly and completely described below with reference to the drawings in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by those skilled in the art without creative labor fall within the protection scope of the utility model.
[0022] Refer to Figures 1-5The utility model provides a small quartz wafer frequency piece etching equipment, including installation base 1, etching box 2 is fixedly arranged on the top of installation base 1, and the top of installation base 1 is provided with lifting assembly, and the inside of installation base 1 is provided with mounting bracket 7 through lifting assembly, and the surface of mounting bracket 7 is provided with placing assembly, and the inside of installation base 1 is provided with quartz wafer frequency piece body 11 through placing assembly, and the top of installation base 1 is provided with filter type extraction assembly, and the top of installation base 1 is provided with liquid outlet pipe 17 through filter type extraction assembly, and the liquid outlet end of liquid outlet pipe 17 is provided with rotating assembly, and the liquid outlet end of liquid outlet pipe 17 is provided with rotating pipe 22 through rotating assembly, and filter type extraction assembly includes filter box 12 fixedly installed on the top of installation base 1, and liquid outlet pipe 17 is fixedly installed on the left side of filter box 12, and the inside of filter box 12 is fixedly provided with filter screen 13, and the top of filter screen 13 is fixedly provided with connecting frame 14, and the top of connecting frame 14 is fixedly provided with conveying pump 15, and the liquid outlet end of conveying pump 15 penetrates connecting frame 14 and extends to the inside of filter box 12, and the liquid inlet end of conveying pump 15 is fixedly provided with liquid inlet pipe 16, and the liquid inlet end of liquid inlet pipe 16 penetrates etching box 2 and extends to the inside of etching box 2, and conveying pump 15 draws etching liquid into filter box 12 through liquid inlet pipe 16, and etching liquid is filtered through filter screen 13, and the filtered etching liquid is discharged through liquid outlet pipe 17, and enters the inside of rotating pipe 22 through rotating assembly, and is discharged to the inside of etching box 2 through the liquid outlet hole on rotating pipe 22, so that the etching liquid can be circulated, the etching liquid concentration in different positions in etching box 2 remains consistent, and the impurity particles generated during etching can be removed, avoiding that the impurity particles are attached to the wafer surface and affect the etching quality, and the top of installation base 1 is provided with driving assembly, and driving assembly includes servo motor 23 fixedly installed on the top of installation base 1, and the output end of servo motor 23 is fixedly provided with driving gear 24, and driving gear 24 is engaged with connecting gear 25 on the surface, and connecting gear 25 is fixedly installed on the surface of rotating pipe 22, and servo motor 23 drives connecting gear 25 to rotate through driving gear 24, and rotating pipe 22 rotates liquid outlet through connecting gear 25, so that the etching liquid concentration in etching box 2 is more uniform, and the uniform etching liquid concentration can guarantee that each wafer part receives nearly uniform etching degree, when different etching liquid needs to be switched, rotating pipe 22 rotates liquid outlet in the middle of etching box 2, so that the etching liquid has dynamic mixing characteristics, the new etching liquid can be rapidly and uniformly spread in the chamber, so that the pre-debugging time is reduced, and the etching degree of the same batch of quartz wafers near the liquid inlet and far from the liquid inlet is not uniform, so that the finished product remains consistent.
[0023] Specifically, the lifting assembly includes a hydraulic push rod 3 fixedly installed on the top of the mounting base 1, the output end of the hydraulic push rod 3 is fixedly provided with a moving plate 4, the surface of the moving plate 4 is fixedly provided with a sealing cover plate 5, the bottom of the sealing cover plate 5 is fixedly provided with a connecting column 6, and a mounting frame 7 is fixedly installed at the bottom end of the connecting column 6. The placing assembly includes a U-shaped plate 8 fixedly installed on the surface of the mounting frame 7, the U-shaped plate 8 is fixedly provided with an installation cylinder 9 in the inside, the surface of the installation cylinder 9 is fixedly provided with a triangular plate 10, and the quartz crystal frequency chip body 11 is overlapped with the triangular plate 10. The quartz crystal frequency chip body 11 is placed in the inside of the triangular plate 10 and the bottom of the quartz crystal frequency chip body 11 is in contact with the lower side wall of the U-shaped plate 8. When the quartz crystal frequency chip body 11 is placed, the output end is driven to move downward by the hydraulic push rod 3, the sealing cover plate 5 is driven to move downward by the moving plate 4, the sealing cover plate 5 drives the mounting frame 7 to move downward through the connecting column 6, so that the quartz crystal frequency chip body 11 enters the inside of the corrosion tank 2, and the quartz crystal frequency chip body 11 is corroded by the corrosion liquid in the corrosion tank 2, so that the quartz crystal frequency chip body 11 is placed in the corrosion tank 2, and the quartz crystal frequency chip body 11 corroded is taken out from the corrosion tank 2.
[0024] Specifically, the rotating assembly includes a mounting pipe 18 fixedly installed on the liquid outlet end of the liquid outlet pipe 17, the bottom end of the mounting pipe 18 is fixedly provided with a sealing shell 19, the sealing shell 19 is fixedly provided with a sealing bearing 20 in the inside, the outer ring of the sealing bearing 20 is connected with the sealing shell 19, the inner ring of the sealing bearing 20 is fixedly provided with a connecting pipe 21, and the connecting pipe 21 is fixedly installed on the liquid outlet end of a rotating pipe 22. When the rotating pipe 22 rotates, the rotating pipe 22 drives the connecting pipe 21 to rotate in the sealing shell 19 through the sealing bearing 20, and the sealing shell 19 and the mounting pipe 18 rotate, so that the rotating pipe 22 rotates to discharge liquid.
[0025] Specifically, the rear side of the corrosion tank 2 is fixedly provided with a liquid discharge pipe, and a control valve is fixedly arranged on the liquid discharge pipe. The corrosion liquid in the corrosion tank 2 is discharged through the liquid discharge pipe, and the corrosion liquid is replaced.
[0026] The small quartz crystal frequency chip corrosion equipment is connected with 220V mains, and the main control unit can be a conventional known device such as a computer.
[0027] In use: when the quartz wafer frequency piece body 11 is subjected to etching treatment, the delivery pump 15 draws the etching liquid in the etching box 2 through the liquid inlet pipe 16, so that the etching liquid enters the inside of the filter box 12 through the liquid outlet end thereof, the etching liquid in the filter box 12 is filtered through the filter screen 13, the filtered etching liquid enters the inside of the mounting pipe 18 through the liquid outlet pipe 17, and enters the inside of the connecting pipe 21 through the mounting pipe 18, enters the inside of the rotating pipe 22 through the connecting pipe 21, and is discharged through the liquid outlet holes on the surface of the rotating pipe 22, and then the servo motor 23 drives the output end to rotate the driving gear 24, the connecting gear 25 meshed with the driving gear 24 is driven to rotate through the driving gear 24, and the rotating pipe 22 is driven to rotate through the connecting gear 25, so that the rotating pipe 22 rotates while discharging the etching liquid.
[0028] It should be noted that, in this document, relational terms such as first and second and the like can be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises", "comprising", or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but can include other elements not expressly listed or inherent to such process, method, article, or apparatus.
[0029] Although the embodiments of the present application have been shown and described, it is to be understood that for the purpose of the present application, the embodiments change, modify, replace, and vary in many ways without departing from the principles and spirit of the present application, and the scope of the present application is defined by the appended claims and their equivalents.
Claims
1. A small quartz crystal wafer frequency piece etching apparatus comprising a mounting base (1), characterized in that, The mounting base (1) is fixedly provided with an etching box (2) on top. The mounting base (1) is provided with a lifting component on top. The mounting base (1) is provided with a mounting frame (7) inside through the lifting component. The mounting frame (7) is provided with a placement component on its surface. The mounting base (1) is provided with a quartz crystal frequency chip body (11) inside through the placement component. The mounting base (1) is provided with a filter extraction component on top. The mounting base (1) is provided with a liquid outlet pipe (17) on top through the filter extraction component. The liquid outlet pipe (17) is provided with a rotating component at its liquid outlet end. The liquid outlet pipe (17) is provided with a rotating tube (22) at its liquid outlet end through the rotating component. The mounting base (1) is provided with a driving component on top.
2. A small quartz crystal wafer frequency piece etching apparatus according to claim 1, wherein, The lifting assembly includes a hydraulic push rod (3) fixedly installed on the top of the mounting base (1), a movable plate (4) fixedly installed at the output end of the hydraulic push rod (3), a sealing cover plate (5) fixedly installed on the surface of the movable plate (4), a connecting column (6) fixedly installed at the bottom of the sealing cover plate (5), and the mounting bracket (7) fixedly installed at the bottom end of the connecting column (6).
3. The apparatus according to claim 1, wherein The placement assembly includes a U-shaped plate (8) fixedly installed on the surface of the mounting frame (7), a mounting cylinder (9) fixedly installed inside the U-shaped plate (8), a triangular plate (10) fixedly installed on the surface of the mounting cylinder (9), and the quartz crystal frequency chip body (11) overlaps with the triangular plate (10).
4. The apparatus according to claim 1, wherein The filtration extraction assembly includes a filter box (12) fixedly installed on the top of the mounting base (1), an outlet pipe (17) fixedly installed on the left side of the filter box (12), a filter screen (13) fixedly installed inside the filter box (12), a connecting frame (14) fixedly installed on the top of the filter screen (13), a delivery pump (15) fixedly installed on the top of the connecting frame (14), the outlet end of the delivery pump (15) passes through the connecting frame (14) and extends into the interior of the filter box (12), the inlet end of the delivery pump (15) is fixedly installed with an inlet pipe (16), the inlet end of the inlet pipe (16) passes through the corrosion chamber (2) and extends into the interior of the corrosion chamber (2).
5. The apparatus according to claim 1, wherein The rotating assembly includes an installation tube (18) fixedly installed at the liquid outlet end of the liquid outlet tube (17). A sealing shell (19) is fixedly provided at the bottom end of the installation tube (18). A sealing bearing (20) is fixedly provided inside the sealing shell (19). The outer ring of the sealing bearing (20) is connected to the sealing shell (19). A connecting tube (21) is fixedly provided on the inner ring of the sealing bearing (20). The connecting tube (21) is fixedly installed at the liquid outlet end of the rotating tube (22).
6. The apparatus according to claim 1, wherein The drive assembly includes a servo motor (23) fixedly mounted on the top of the mounting base (1), a drive gear (24) fixedly mounted on the output end of the servo motor (23), a connecting gear (25) meshing on the surface of the drive gear (24), and the connecting gear (25) fixedly mounted on the surface of the rotating tube (22).
7. The apparatus according to claim 1, wherein The corrosion box (2) is fixedly provided with a drain pipe on the rear side, and the drain pipe is fixedly provided with a control valve.