Refrigeration and heat dissipation device
By installing a heat sink and a fan on the heat-dissipating surface of the thermoelectric cooler, combined with a dust filter design, the problem of poor heat dissipation on the heat-dissipating surface of the thermoelectric cooler is solved, achieving a more efficient heat dissipation effect.
Patent Information
- Application Number
- CN202423124576.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-18
- Publication Date
- 2025-11-28
- Estimated Expiration
- 2034-12-18
AI Technical Summary
Poor heat dissipation from the heat-dissipating surface of the thermoelectric cooler leads to poor overall heat dissipation.
A cooling and heat dissipation device was designed, including a fixed shell, a heat sink, a fan, an insulation shell, and a dust filter. The fan rotates rapidly to blow the heat from the heat sink and the inside of the fixed shell out through the heat dissipation vents. A dust filter is installed at the heat dissipation vents to prevent dust from entering and improve heat dissipation efficiency.
It effectively improves the heat dissipation effect of the heat-dissipating surface of the semiconductor refrigeration chip, enhances the overall heat dissipation performance of the heat dissipation device, and prevents dust from affecting the heat dissipation efficiency.
Smart Images
Figure CN223610388U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to a heat dissipation device technical field, specifically is a refrigeration heat dissipation device. BACKGROUND
[0002] Semiconductor refrigeration piece, also called thermoelectric refrigeration piece, is a kind of heat pump. Its advantage is that there is no sliding part, is applied to some space limited, reliability requirement high, no refrigerant pollution's occasion, utilizes the peltier effect of semiconductor material, when direct current passes through the electric couple of series connection of two different semiconductor materials, can respectively absorb heat and emit heat at the two ends of electric couple, can realize the purpose of refrigeration, it is a kind of negative heat resistance refrigeration technology, its characteristics are no moving part, and reliability is also higher.
[0003] In prior art, when semiconductor refrigeration piece is used to cool and dissipate heat to small device, since one side of semiconductor is refrigeration, and the other side is heat release, small device is dissipated heat by refrigeration side, but since the heat release side of semiconductor refrigeration piece is not good at dissipating heat, thus the heat dissipation effect of semiconductor refrigeration piece is not good. UTILITY MODEL CONTENT
[0004] Therefore, the utility model aims at providing a refrigeration heat dissipation device to solve the technical problem that the heat release side of semiconductor refrigeration piece is not good at dissipating heat, resulting in the heat dissipation effect of overall semiconductor refrigeration piece being not good.
[0005] To achieve the above-mentioned purpose, the utility model provides the following technical scheme: a refrigeration heat dissipation device, which comprises a fixed shell and a semiconductor refrigeration block, one side of the inside of the fixed shell is fixedly connected with a heat dissipation block, and the heat dissipation block is located between the fixed shell and the semiconductor refrigeration block, one side of the outside of the fixed shell is fixedly connected with a fan, one side of the semiconductor refrigeration block is fixedly connected with a heat preservation shell, and the outer wall of the semiconductor refrigeration block is fixedly connected with an insulating shell.
[0006] By adopting the above technical scheme, the device needing heat dissipation can be fastened together with the heat preservation shell by bolts when the utility model is used, so that the device needing heat dissipation contacts the refrigeration side of the semiconductor refrigeration block through the placing cavity to achieve the heat dissipation effect, the heat dissipation block is installed on the heat release side of the semiconductor refrigeration block, a plurality of heat dissipation plates on one side of the heat dissipation block can quickly release heat, then the fan is installed on one side of the fixed shell, after being electrified, the fan rotates quickly to blow air into the inside of the fixed shell, so that the heat on the heat dissipation plates and the heat accumulated in the inside of the fixed shell can be blown out from the heat dissipation opening on the outer wall of the fixed shell by air force, thereby realizing the cooling effect of the heat release side of the semiconductor refrigeration block. Through the above structure, the technical problem that the heat release side of the semiconductor refrigeration piece is not good at dissipating heat, resulting in the heat dissipation effect of overall semiconductor refrigeration piece being not good can be solved.
[0007] Further, a plurality of groups of heat dissipation openings are arranged at both ends of the fixed shell, and each group of heat dissipation openings is designed to be inclined, and a dustproof net is fixedly connected to the outside of each group of heat dissipation openings, so as to prevent dust from entering the inside of the fixed shell.
[0008] By adopting the above technical scheme, the fan can blow out the heat on the heat dissipation plate and the heat accumulated in the fixed shell through the heat dissipation openings on the outer wall of the fixed shell by air force, and the dustproof net installed at the heat dissipation openings can prevent dust from entering the inside of the fixed shell, thereby preventing the dust from affecting the heat dissipation efficiency.
[0009] Further, a plurality of groups of air holes are arranged at one end of the fan, the fixed shell is connected to the outside through the air holes, and a plurality of groups of heat dissipation fins are arranged on the outer wall of the heat dissipation block, so as to accelerate the heat dissipation of the semiconductor refrigeration block.
[0010] By adopting the above technical scheme, after being powered on, the fan rotates rapidly to suck air from the outside and blow air into the inside of the fixed shell, and the heat dissipation plate on the outer wall of the heat dissipation block is opposite to the fan, so that the fan can blow out the heat on the heat dissipation plate and the heat accumulated in the fixed shell through the heat dissipation openings on the outer wall of the fixed shell by air force, thereby achieving the effect of cooling the heat release surface of the semiconductor refrigeration block.
[0011] Further, a placing cavity is arranged in the heat preservation shell, and the semiconductor refrigeration block is connected to the equipment needing to be cooled through the placing cavity.
[0012] By adopting the above technical scheme, the equipment needing to be cooled can be fastened to the heat preservation shell through bolts, so that the equipment needing to be cooled is in contact with the cooling side of the semiconductor refrigeration block through the placing cavity in the heat preservation shell, thereby achieving the effect of heat dissipation.
[0013] In summary, the utility model mainly has the following beneficial effects: when the equipment needing to be cooled is fastened to the heat preservation shell through bolts, the equipment needing to be cooled is in contact with the cooling side of the semiconductor refrigeration block through the placing cavity, thereby achieving the effect of heat dissipation, the heat release side of the semiconductor refrigeration block is provided with the heat dissipation block, a plurality of groups of heat dissipation plates on one side of the heat dissipation block can rapidly release heat, and the fan is arranged on one side of the fixed shell, so that the fan rotates rapidly to blow air into the inside of the fixed shell after being powered on, the heat on the heat dissipation plate and the heat accumulated in the fixed shell can be blown out through the heat dissipation openings on the outer wall of the fixed shell by air force, thereby achieving the effect of cooling the heat release surface of the semiconductor refrigeration block. BRIEF DESCRIPTION OF DRAWINGS
[0014] Figure 1 It is the overall structure schematic view of the utility model;
[0015] Figure 2 It is the sectional view of the utility model;
[0016] Figure 3 It is the exploded view of the utility model overall structure;
[0017] Figure 4 It is the structure schematic view of the dust screen of the utility model.
[0018] In the figure: 1, fixed shell;2, semiconductor refrigeration block;3, heat dissipation block;4, fan;5, heat preservation shell;6, insulating shell;7, heat dissipation port;8, dust screen;9, placing cavity;10, air hole. DETAILED DESCRIPTION
[0019] The technical solutions in the embodiments of the utility model will be clearly and completely described below with reference to the drawings in the embodiments of the utility model. The embodiments described below with reference to the drawings are exemplary and are used only for explaining the utility model, and cannot be understood as limiting the utility model.
[0020] The embodiments will be described below according to the overall structure of the utility model.
[0021] A kind of refrigeration heat dissipation device, as shown in Figures 1-4 It includes fixed shell 1 and semiconductor refrigeration block 2, and one side of fixed shell 1 inside is fixedly connected with heat dissipation block 3, and heat dissipation block 3 is located between fixed shell 1 and semiconductor refrigeration block 2, and one side of semiconductor refrigeration block 2 is installed with heat dissipation block 3, can quickly absorb the heat released by semiconductor refrigeration block 2, and the heat can be quickly released by the multiple groups of heat dissipation plates on one side of heat dissipation block 3, so that heat is accumulated in the inside of fixed shell 1;
[0022] In the example, one side of fixed shell 1 outside is fixedly connected with fan 4, and fan 4 is installed on one side of fixed shell 1, after being electrified, fan 4 quickly rotates, can extract air from outside, and blows air to the inside of fixed shell 1, and the position of heat dissipation plate on the outer wall of heat dissipation block 3 is opposite to fan 4, so fan 4 can blow the heat on heat dissipation plate together with the heat accumulated in the inside of fixed shell 1 through wind force from the heat dissipation port 7 on the outer wall of fixed shell 1, so as to realize the cooling effect of the heat releasing surface of semiconductor refrigeration block 2;
[0023] In the example, the semiconductor refrigeration block 2 is fixedly connected with the heat preservation shell 5 on one side, the semiconductor refrigeration block 2 is fixedly connected with the insulating shell 6 on the outer wall, and the semiconductor refrigeration block 2 is installed inside the insulating shell 6, wherein the side of the semiconductor refrigeration block 2 for refrigeration is installed with the heat preservation shell 5, and the device needing heat dissipation can be fastened with the heat preservation shell 5 through bolts, so that the device needing heat dissipation is in contact with the side of the semiconductor refrigeration block 2 for refrigeration through the placement cavity 9 inside the heat preservation shell 5, so as to achieve the effect of heat dissipation.
[0024] Please refer to Figure 1 、 Figure 2 、 Figure 3 and Figure 4 , a plurality of heat dissipation openings 7 are formed at both ends of the fixed shell 1, and each group of heat dissipation openings 7 is designed to be inclined, and each group of heat dissipation openings 7 is fixedly connected with a dust screen 8 outside, the dust screen 8 blocks dust from entering the inside of the fixed shell 1, the fan 4 can blow the heat on the heat dissipation plate and the heat accumulated inside the fixed shell 1 out of the heat dissipation openings 7 on the outer wall of the fixed shell 1 through the wind force, and the dust screen 8 installed at the heat dissipation openings 7 blocks the dust from the outside from entering the inside of the fixed shell 1, preventing the dust from affecting the heat dissipation efficiency.
[0025] Please refer to Figure 2 and Figure 3 , a plurality of air holes 10 are formed at one end of the fan 4, and the fixed shell 1 is connected with the outside through the air holes 10. A plurality of heat dissipation fins are arranged on the outer wall of the heat dissipation block 3, and the heat dissipation fins of the heat dissipation block 3 accelerate the heat dissipation of the semiconductor refrigeration block 2. After being powered on, the fan 4 rotates quickly, can extract air from the outside, and blows air into the inside of the fixed shell 1, and the position of the heat dissipation plate on the outer wall of the heat dissipation block 3 is opposite to the fan 4, so that the fan 4 can blow the heat on the heat dissipation plate and the heat accumulated inside the fixed shell 1 out of the heat dissipation openings 7 on the outer wall of the fixed shell 1 through the wind force, thereby realizing the effect of cooling the heat dissipation surface of the semiconductor refrigeration block 2.
[0026] Please refer to Figure 1 、 Figure 2 and Figure 3 , the placement cavity 9 is formed in the heat preservation shell 5, and the semiconductor refrigeration block 2 is connected with the equipment needing cooling through the placement cavity 9, wherein the side of the semiconductor refrigeration block 2 for refrigeration is installed with the heat preservation shell 5, and the device needing heat dissipation can be fastened with the heat preservation shell 5 through bolts, so that the device needing heat dissipation is in contact with the side of the semiconductor refrigeration block 2 for refrigeration through the placement cavity 9 inside the heat preservation shell 5, so as to achieve the effect of heat dissipation.
[0027] The working principle of the utility model is: when using, after the power is turned on, because the semiconductor refrigeration block 2 is installed inside the insulating shell 6, one side of the semiconductor refrigeration block 2 is installed with the heat preservation shell 5, and the device needing heat dissipation can be fastened together with the heat preservation shell 5 through bolts, so that the device needing heat dissipation contacts with one side of the semiconductor refrigeration block 2 through the placing cavity 9 inside the heat preservation shell 5, so as to achieve the effect of heat dissipation.
[0028] And one side of the semiconductor refrigeration block 2 is installed with the heat dissipation block 3, the heat released by the semiconductor refrigeration block 2 can be quickly absorbed, and the heat can be quickly released through the multiple groups of heat dissipation plates on one side of the heat dissipation block 3, so that the heat is accumulated inside the fixed shell 1.
[0029] Then the fan 4 is installed on one side of the fixed shell 1, after being powered on, the fan 4 rotates quickly, air can be extracted from the outside, and the fixed shell 1 is blown, and the position of the heat dissipation plate on the outer wall of the heat dissipation block 3 is opposite to the fan 4, so that the fan 4 can blow the heat on the heat dissipation plate together with the heat accumulated inside the fixed shell 1 through the heat dissipation port 7 on the outer wall of the fixed shell 1, so as to realize the effect of cooling the heat releasing surface of the semiconductor refrigeration block 2.
[0030] And multiple groups of air holes 10 are arranged on one side of the fan 4, so that the fan 4 can extract air while preventing dust from entering the fixed shell 1, and the dust screen 8 is installed at the heat dissipation port 7 on both sides of the fixed shell 1, so that the dust in the outside can also be prevented from entering the fixed shell 1, preventing the dust from affecting the heat dissipation efficiency.
[0031] Through the above structure, the technical problem that one side of the semiconductor refrigeration sheet 2 is not good at heat dissipation, resulting in poor heat dissipation effect of the whole semiconductor refrigeration sheet 2 can be solved.
[0032] Although the embodiments of the utility model have been shown and described, the specific embodiments are only an explanation of the utility model, and are not a limitation of the utility model, and the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable way, and the person skilled in the art can make modifications, replacements and changes without creative contribution after reading the specification without departing from the principles and purposes of the utility model, but as long as it is within the scope of the claims of the utility model, it is protected by the patent law.
Claims
1. A refrigeration heat sink device comprising a fixed case (1) and a semiconductor refrigeration block (2), characterized in that: The fixed shell (1) is fixedly connected with a heat dissipation block (3) on one side, and the heat dissipation block (3) is located between the fixed shell (1) and the semiconductor refrigeration block (2), the fixed shell (1) is fixedly connected with a fan (4) on the other side, the semiconductor refrigeration block (2) is fixedly connected with a heat preservation shell (5) on one side, and the semiconductor refrigeration block (2) is fixedly connected with an insulating shell (6) on the outer wall.
2. The refrigeration heat sink of claim 1, wherein: A plurality of groups of heat dissipation openings (7) are formed in the fixed shell (1), and each group of heat dissipation openings (7) is designed to be inclined.
3. The refrigeration heat sink of claim 2, wherein: Each group of heat dissipation openings (7) is fixedly connected with a dust screen (8) on the outside, and the dust screen (8) blocks dust from entering the inside of the fixed shell (1).
4. The refrigeration heat sink of claim 1, wherein: The fan (4) is provided with a plurality of groups of air holes (10) on one end, and the fixed shell (1) is connected with the outside through the air holes (10).
5. The refrigeration heat sink of claim 1, wherein: The heat preservation shell (5) is provided with a placing cavity (9) in the inside, and the semiconductor refrigeration block (2) is connected with the equipment to be cooled through the placing cavity (9).
6. The refrigeration heat sink of claim 1, wherein: The heat dissipation block (3) is provided with a plurality of groups of heat dissipation fins on the outer wall, and the heat dissipation fins of the heat dissipation block (3) accelerate the heat dissipation of the semiconductor refrigeration block (2).