Flow dividing assembly and air conditioner indoor unit
By setting a capillary structure on the inner wall of the connector hole, the problem of low welding strength between the connector and the branch pipe was solved, achieving high-strength welding, reducing production costs, and ensuring the stability and efficiency of welding.
Patent Information
- Application Number
- CN202423034337.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-09
- Publication Date
- 2025-11-28
- Estimated Expiration
- 2034-12-09
AI Technical Summary
The welding strength between the splitter and the branch pipe in the splitter assembly is low, and existing technologies may increase material costs or cause welding instability.
A capillary structure is set on the inner wall of the connector hole of the distributor to provide capillary force to improve the fluidity of the solder, allowing the solder to penetrate between the branch pipe and the distributor, thereby enhancing the welding strength. The production difficulty is also reduced by adjusting the size and distribution of the capillary structure.
This improved the welding strength between the distributor and the branch pipe, avoided increasing material costs, reduced production difficulty, and ensured the stability and reliability of the welding.
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Figure CN223610409U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The present application relates to the technical field of household appliances, and in particular to a shunt assembly and an indoor unit of an air conditioner. BACKGROUND
[0002] The heat exchange efficiency of an air conditioner indoor heat exchanger is related to the flow rate and pressure drop of refrigerant. Within a certain range, the faster the refrigerant flow rate, the smaller the pressure drop, and the better the heat exchange effect. When the air conditioner indoor unit is working, in order to improve the heat exchange efficiency of the indoor heat exchanger and reduce the flow rate and pressure loss, the refrigerant of the indoor heat exchanger is usually divided into multiple branches for heat exchange.
[0003] In order to uniformly distribute the refrigerant, the air conditioner indoor unit further includes a shunt assembly connected between the indoor heat exchanger and the refrigerant pipeline. The shunt of the shunt assembly is connected with multiple branch pipes, and the multiple branch pipes are used to shunt the refrigerant.
[0004] However, the shunt of the shunt assembly and the branch pipe are usually made of different materials. When the two are welded, the oxides and oxide films generated by the welding of the materials will affect the fluidity of the solder, making it difficult for the solder to penetrate between the connecting holes of the shunt and the branch pipe, and the welding strength of the shunt and the branch pipe is low. UTILITY MODEL CONTENT
[0005] The embodiments of the present application disclose a shunt assembly and an indoor unit of an air conditioner, which can improve the fluidity of the solder when the shunt assembly is welded, so that the solder can penetrate between the first connecting holes and the branch pipes, and the welding strength of the shunt and the branch pipe is high.
[0006] To achieve the above-mentioned purpose, on the one hand, the present application discloses a shunt assembly, comprising:
[0007] a shunt;
[0008] a main pipe connected to the shunt;
[0009] a plurality of branch pipes connected to the shunt to communicate with the main pipe;
[0010] The shunt is provided with a plurality of first connecting holes and a second connecting hole, the second connecting hole communicates with the plurality of first connecting holes, the plurality of branch pipes are welded to the shunt, and the plurality of branch pipes respectively communicate with the plurality of first connecting holes, and the main pipe is welded to the shunt and communicates with the second connecting hole;
[0011] Among them, the inner wall surface of each first connecting hole is provided with a first capillary structure, and the first capillary structure is used to provide capillary force to make the solder penetrate between the first capillary structure and the branch pipe when the branch pipe and the shunt are welded.
[0012] By setting the first capillary structure on the inner wall surface of the first connecting hole, the capillary force provided by the first capillary structure can improve the flowability of the solder when the branch pipe is welded with the flow distributor, so that the solder can penetrate between the first capillary structure and the branch pipe, thereby improving the welding strength of the branch pipe and the flow distributor. Moreover, during welding, the composition and amount of the solder and flux do not need to be adjusted, and the situation of increasing material cost can be avoided.
[0013] On the other hand, the application discloses a flow distribution assembly, comprising:
[0014] a flow distributor;
[0015] a main pipe connected to the flow distributor;
[0016] a plurality of branch pipes connected to the flow distributor and in communication with the main pipe;
[0017] The flow distributor is provided with a plurality of first connecting holes and a second connecting hole in communication with the plurality of first connecting holes. The plurality of branch pipes are welded to the flow distributor and in communication with the plurality of first connecting holes. The main pipe is welded to the flow distributor and in communication with the second connecting hole.
[0018] The inner wall surface of each first connecting hole is provided with a first capillary structure, and the first capillary structure is filled with solder between the first capillary structure and the branch pipe.
[0019] By setting the first capillary structure on the inner wall surface of the first connecting hole, the capillary force provided by the first capillary structure can improve the flowability of the solder when the branch pipe is welded with the flow distributor, so that the solder can penetrate between the first capillary structure and the branch pipe, thereby improving the welding strength of the branch pipe and the flow distributor. Moreover, during welding, the composition and amount of the solder and flux do not need to be adjusted, and the situation of increasing material cost can be avoided.
[0020] In some embodiments of the application, the first capillary structure is configured as a plurality of first recesses, which are distributed on the inner wall surface of the first connecting hole along the circumference of the first connecting hole.
[0021] By distributing the first recesses on the inner wall surface of the first connecting hole, the capillary force provided by the first recesses can make the solder penetrate and fill into the first recesses when the branch pipe is welded with the flow distributor, so that the branch pipe and the flow distributor have higher welding strength. Moreover, the solder is distributed more uniformly in the circumferential direction of the first connecting hole, and the situation of stress concentration leading to welding failure of the branch pipe and the flow distributor can be avoided.
[0022] In some embodiments of the present application, the first recess has a recess depth h1, h1≥0.1 mm; h1≤0.3 mm.
[0023] The recess depth h1 of the first recess is h1≥0.1 mm, which can reduce the processing difficulty of the first recess and the overall production difficulty of the flow distribution assembly while meeting the capillary force requirement. The recess depth h1 of the first recess is h1≤0.3 mm, which can provide a larger capillary force to make the solder have a larger flowability, a higher permeability, and be able to penetrate between the first capillary structure and the branch pipe, thereby increasing the welding strength of the branch pipe and the flow distributor.
[0024] In some embodiments of the present application, the first recess has a width d1 along the circumferential direction of the first connecting hole, d1≥0.1 mm; d1≤0.3 mm.
[0025] The width d1 of the first recess is d1≥0.1 mm, which can reduce the processing difficulty of the first recess and the overall production difficulty of the flow distribution assembly while meeting the capillary force requirement. The width d1 of the first recess is d1≤0.3 mm, which can provide a larger capillary force to make the solder have a larger flowability, a higher permeability, and be able to penetrate between the first capillary structure and the branch pipe, thereby increasing the welding strength of the branch pipe and the flow distributor.
[0026] In some embodiments of the present application, the interval distance between two adjacent first recesses is L1, L1≥1 mm; L1≤5 mm.
[0027] The interval distance L1 between two adjacent first recesses is L1≥1 mm, which can reduce the processing difficulty of the first recess and the overall production difficulty of the flow distribution assembly while meeting the capillary force requirement. The interval distance L1 between two adjacent first recesses is L1≤5 mm, which can provide a larger capillary force by the plurality of first recesses to make the solder have a larger flowability, a higher permeability, and be able to penetrate between the first capillary structure and the branch pipe, thereby increasing the welding strength of the branch pipe and the flow distributor.
[0028] In some embodiments of the present application, the inner wall surface of the second connecting hole is provided with a second capillary structure, which is used to provide a capillary force to make the solder penetrate between the second capillary structure and the main pipe when the main pipe and the flow distributor are welded.
[0029] Alternatively, the second capillary structure and the main pipe are filled with solder.
[0030] By arranging the second capillary structure on the inner wall surface of the second connecting hole, the capillary force provided by the second capillary structure can improve the flowability of the solder when the main pipe and the flow divider are welded, so that the solder can penetrate between the second capillary structure and the main pipe, thereby improving the welding strength of the main pipe and the flow divider. Moreover, the composition and amount of the solder and the flux do not need to be adjusted during welding, and the situation of increasing material cost can be avoided. When the second capillary structure and the main pipe are filled with solder, that is, the solder can penetrate and fill between the second capillary structure and the main pipe during welding of the main pipe and the flow divider, the welding strength of the main pipe and the flow divider is improved. Moreover, the composition and amount of the solder and the flux do not need to be adjusted during welding, and the situation of increasing material cost can be avoided.
[0031] In some embodiments of the present application, the second capillary structure is configured as a plurality of second recesses, and the plurality of second recesses are distributed on the inner wall surface of the second connecting hole along a circumference of the second connecting hole.
[0032] By distributing the second recesses on the inner wall surface of the second connecting hole, the capillary force provided by the second recesses can make the solder penetrate and fill into the second recesses during welding of the main pipe and the flow divider, so that the main pipe and the flow divider have higher welding strength. Moreover, the solder is uniformly distributed in the circumferential direction of the second connecting hole, and the situation of stress concentration that leads to welding failure of the main pipe and the flow divider can be avoided.
[0033] In some embodiments of the present application, the recess depth of the second recess is h2, h2≥0.1 mm; and h2≤0.3 mm.
[0034] By setting the recess depth h2 of the second recess as h2≥0.1 mm, the processing difficulty of the second recess is lower under the premise of meeting the demand of capillary force, and the overall production difficulty of the flow divider assembly can be reduced. By setting the recess depth h2 of the second recess as h2≤0.3 mm, the capillary force is larger, which is sufficient to make the solder have larger flowability, the solder has higher penetrability, the solder can penetrate between the second capillary structure and the main pipe, and the welding strength of the main pipe and the flow divider is higher.
[0035] In some embodiments of the present application, the width of the second recess along the circumferential direction of the second connecting hole is d2, d2≥0.1 mm; and d2≤0.3 mm.
[0036] The width d2 of the second recess is d2≥0.1mm, which is lower in processing difficulty and can reduce the overall production difficulty of the flow distribution assembly under the premise of meeting the capillary force requirement. When the width d2 of the second recess is d2≤0.3mm, the capillary force is larger, which is sufficient to make the solder have larger fluidity, the solder has higher permeability, and the solder can penetrate between the second capillary structure and the main pipe, so that the welding strength of the main pipe and the flow distributor is higher.
[0037] In some embodiments of the present application, the spacing distance between two adjacent second recesses is L2, L2≥1mm; and L2≤5mm.
[0038] When the spacing distance L2 between two adjacent second recesses is L2≥1mm, the processing difficulty of the second recess is lower and the overall production difficulty of the flow distribution assembly can be reduced under the premise of meeting the capillary force requirement. When the spacing distance L2 between two adjacent second recesses is L2≤5mm, the capillary force provided by the plurality of second recesses as a whole is larger, which is sufficient to make the solder have larger fluidity, the solder has higher permeability, and the solder can penetrate between the second capillary structure and the main pipe, so that the welding strength of the main pipe and the flow distributor is higher.
[0039] In another aspect, the present application discloses an air conditioner indoor unit, comprising:
[0040] A shell forms an inner cavity.
[0041] A fan is arranged in the inner cavity.
[0042] A flow distribution assembly is arranged in the inner cavity.
[0043] The flow distribution assembly comprises:
[0044] A refrigerant pipeline;
[0045] A heat exchanger is arranged in the inner cavity.
[0046] A flow distribution assembly is arranged in the inner cavity, and one end of the main pipe away from the flow distributor is connected to the refrigerant pipeline, and one end of each branch pipe away from the flow distributor is connected to the heat exchanger.
[0047] The flow distribution assembly is the flow distribution assembly of the above-mentioned aspect or another aspect.
[0048] The air conditioner indoor unit disclosed in another aspect has all the beneficial effects of the flow distribution assembly of the above-mentioned aspect or another aspect, which will not be repeated here.
[0049] Compared with the prior art, the present application has at least the following beneficial effects:
[0050] In the embodiment of the present application, the first capillary structure is arranged on the inner wall surface of the first connecting hole, and the capillary force provided by the first capillary structure is used to improve the flowability of the solder when the branch pipe is welded with the flow divider, so that the solder can penetrate between the first capillary structure and the branch pipe, thereby improving the welding strength of the branch pipe and the flow divider. Moreover, during welding, the composition and amount of the solder and the flux do not need to be adjusted, and the situation of increasing material cost can be avoided. BRIEF DESCRIPTION OF DRAWINGS
[0051] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed in the embodiments will be briefly introduced as follows. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative effort on the basis of these drawings.
[0052] Figure 1 is a structural schematic diagram of an indoor unit of an air conditioner provided by an embodiment of the present application;
[0053] Figure 2 is a structural schematic diagram of a flow dividing assembly provided by an embodiment of the present application;
[0054] Figure 3 is an exploded structural schematic diagram of a flow dividing assembly provided by an embodiment of the present application;
[0055] Figure 4 is an exploded structural schematic diagram of a flow dividing assembly provided by an embodiment of the present application from another perspective;
[0056] Figure 5 is a sectional structural schematic diagram of a flow divider provided by an embodiment of the present application;
[0057] Figure 6 is a structural schematic diagram of a flow divider provided by an embodiment of the present application;
[0058] Figure 7 is Figure 6 is an enlarged structural schematic diagram of I in FIG. 1;
[0059] Figure 8 is Figure 7 is an enlarged structural schematic diagram of II in FIG. 1;
[0060] Figure 9 is a structural schematic diagram of a flow divider provided by an embodiment of the present application from another perspective;
[0061] Figure 10 is Figure 9 is an enlarged structural schematic diagram of III in FIG. 1;
[0062] Figure 11Fig. 1 is a structural schematic diagram of a shunt assembly provided by an embodiment of the present application.
[0063] Main reference sign explanation
[0064] 100, shunt assembly;
[0065] 10, shunt; 10a, first connecting hole; 10b, second connecting hole;
[0066] 101, first capillary structure; 101a, first recess; 102, second capillary structure; 102a, second recess;
[0067] 20, branch pipe;
[0068] 30, main pipe;
[0069] 1000, air conditioner indoor unit;
[0070] 200, shell;
[0071] 300, refrigerant pipeline;
[0072] 400, heat exchanger. DETAILED DESCRIPTION
[0073] The technical solutions in the embodiments of the present application will be described clearly and completely below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only some of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative work fall within the scope of protection of the present application.
[0074] In the present application, the terms "upper", "lower", "left", "right", "front", "back", "top", "bottom", "inner", "outer", "middle", "vertical", "horizontal", "lateral", "longitudinal", and the like indicate the orientation or positional relationship shown in the drawings. These terms are mainly used to better describe the present application and its embodiments, and are not used to limit the indicated devices, elements or components to have a specific orientation, or to be constructed and operated in a specific orientation.
[0075] In addition, in addition to indicating the orientation or positional relationship, the above-mentioned part of the terms can also be used to indicate other meanings, for example, the term "upper" can also be used to indicate a certain dependent relationship or connection relationship in some cases. Those of ordinary skill in the art can understand the specific meaning of these terms in the present application according to the specific situation.
[0076] In addition, the terms "mounting", "arrangement", "provided with", "connected", "linked" should be interpreted broadly. For example, it can be fixed connection, detachable connection, or integral structure; it can be mechanical connection, or electrical connection; it can be directly connected, or indirectly connected through an intermediate medium, or internal communication between two devices, elements or components. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.
[0077] In addition, the terms "first", "second" and the like are mainly used to distinguish different devices, elements or components (the specific type and structure can be the same or different), and are not intended to indicate or imply the relative importance and quantity of the indicated devices, elements or components. Unless otherwise stated, the meaning of "multiple" is two or more.
[0078] Before explaining the technical solutions of the present application, the inventive concept of the present application will be explained.
[0079] Figure 1 is a structural schematic diagram of an air conditioner indoor unit 1000 provided by an embodiment of the present application. Figure 2 is a structural schematic diagram of a flow splitting assembly 100 provided by an embodiment of the present application. As shown in Figure 1 and Figure 2 The flow splitting assembly 100 is a device installed in the shell 200 of the air conditioner indoor unit 1000, used to split the refrigerant when the air conditioner indoor unit 1000 is running.
[0080] Figure 3 is an exploded structural schematic diagram of a flow splitting assembly 100 provided by an embodiment of the present application.
[0081] Generally, as shown in Figure 2 and Figure 3 The flow splitter 10 and the branch pipe 20 of the flow splitting assembly 100 are connected by welding. When welding, the branch pipe 20 partially extends into the first connecting hole 10a of the flow splitter 10, and the solder is mainly formed at the connecting position of the branch pipe 20 and the end surface of the flow splitter 10, while the solder further penetrates between the branch pipe 20 and the inner wall surface of the first connecting hole 10a.
[0082] However, due to the different requirements of strength and thermal conductivity of the flow splitter 10 and the branch pipe 20, the materials made are also different, the flow splitter 10 is generally made of brass, while the branch pipe 20 is made of red copper. In this way, when the flow splitter 10 and the branch pipe 20 are welded, it belongs to dissimilar material welding, and the oxides and oxide films generated during welding will affect the fluidity of the solder, making it difficult for the solder to penetrate between the connecting hole of the flow splitter 10 and the branch pipe 20, and the welding strength of the flow splitter 10 and the branch pipe 20 is low.
[0083] Therefore, in the related art, there are mainly two ways to solve the above problems when welding.
[0084] One is to use a solder with a high silver content for welding, for example, a solder with a silver content of 5%-15%. However, this way has a high material cost.
[0085] The second is to add a large amount of flux when welding. However, this way also has the problem of high material cost, and the residue of the flux can easily cause the shunt 10 to be corroded and cause leakage.
[0086] In summary, the shunt assembly 100 in the related art has the problem that when welding, it is difficult to simultaneously consider the welding strength and material cost of the shunt 10 and the branch pipe 20. Based on this, the present application provides a shunt assembly 100 and an air conditioner indoor unit 1000 to solve the above problems.
[0087] The technical solutions in some embodiments of the present application will be described clearly and completely below in combination with the drawings in some embodiments of the present application. Obviously, the described embodiments are only some of the embodiments of the present application, not all. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative labor fall within the scope of protection of the present application.
[0088] The shunt assembly 100 provided by the embodiments of the present application can have various implementation forms, for example, it can be applied to air conditioner outdoor units, refrigerators, etc., and the present embodiment does not specifically limit this. Figure 1 One application of the shunt assembly 100 provided by the embodiments of the present application is applied to an air conditioner indoor unit 1000.
[0089] In some embodiments, as shown in Figure 2 The shunt assembly 100 includes a shunt 10. The material of the shunt 10 can include brass, and the shunt 10 has a channel inside to realize the communication between the pipelines.
[0090] In some embodiments, the shunt assembly 100 includes a main pipe 30 connected to the shunt 10.
[0091] In some embodiments, the shunt assembly 100 includes a plurality of branch pipes 20 connected to the shunt 10 to communicate with the main pipe 30.
[0092] The shunt 10 connects the branch pipes 20 and the main pipe 30, so that the main pipe 30 communicates with the plurality of branch pipes 20, realizing shunting.
[0093] In some embodiments, as shown in Figure 2 and Figure 3As shown, the distributor 10 is provided with a plurality of first connection holes 10a, and a plurality of branch pipes 20 are welded to the distributor 10, and the plurality of branch pipes 20 are respectively connected to the plurality of first connection holes 10a.
[0094] The branch pipe 20 is welded to the distributor 10 to achieve a secure connection. Furthermore, the branch pipe 20 is connected to the first connection hole 10a, thereby enabling flow diversion.
[0095] The first connecting hole 10a can be a countersunk hole or a through hole, and this embodiment does not specifically limit it.
[0096] In some embodiments, combined with Figure 4 and Figure 5 As shown, the distributor 10 is provided with a second connection hole 10b, which is connected to a plurality of first connection holes 10a. The main pipe 30 is welded to the distributor 10 and is connected to the second connection hole 10b.
[0097] The main pipe 30 is welded to the distributor 10 to achieve a secure connection. Furthermore, the main pipe 30 communicates with the second connection hole 10b, thereby enabling flow diversion.
[0098] The second connecting hole 10b can be a countersunk hole or a through hole, and this embodiment does not specifically limit it.
[0099] In some embodiments, such as Figure 6 and Figure 7 As shown, the inner wall surface of each first connecting hole 10a is provided with a first capillary structure 101. The first capillary structure 101 is used to provide capillary force when each branch pipe 20 is welded to the distributor 10 so that the solder penetrates between the first capillary structure 101 and the branch pipe 20.
[0100] By providing a first capillary structure 101 on the inner wall of the first connecting hole 10a, the capillary force provided by the first capillary structure 101 improves the fluidity of the solder when welding the branch pipe 20 to the distributor 10. This allows the solder to penetrate between the first capillary structure 101 and the branch pipe 20, thereby increasing the welding strength between the branch pipe 20 and the distributor 10. Furthermore, during welding, there is no need to adjust the composition or amount of solder and flux, thus avoiding increased material costs.
[0101] In some embodiments, the inner wall surface of each first connecting hole 10a is provided with a first capillary structure 101, and the space between the first capillary structure 101 and the branch pipe 20 is filled with solder.
[0102] By avoiding setting the first capillary structure 101 in the inner of the first connecting hole 10a, and filling the solder between the first capillary structure 101 and the branch pipe 20, that is, when the branch pipe 20 and the flow divider 10 are welded, the solder can penetrate and fill between the first capillary structure 101 and the branch pipe 20, and the welding strength of the branch pipe 20 and the flow divider 10 is improved. And when welding, there is no need to adjust the composition and amount of solder and flux, and the situation of increasing material cost can be avoided.
[0103] In some embodiments, in combination with Figure 8 As shown, the first capillary structure 101 is configured as a plurality of first recesses 101a, and the plurality of first recesses 101a are distributed along the inner wall surface of the first connecting hole 10a.
[0104] By distributing the first recesses 101a along the inner wall surface of the first connecting hole 10a, the capillary force provided by the first recesses 101a can make the solder penetrate and fill into the first recesses 101a when the branch pipe 20 and the flow divider 10 are welded, so that the branch pipe 20 and the flow divider 10 have higher welding strength. And the solder is distributed more uniformly in the circumferential direction of the first connecting hole 10a, which can avoid the situation of stress concentration leading to welding failure of the branch pipe 20 and the flow divider 10.
[0105] The size of each part of the first recess 101a (including width, depth, cross-sectional area, etc.) is negatively correlated with the size of the capillary force. The larger the size, the smaller the capillary force, and vice versa.
[0106] In some embodiments, the recess depth of the first recess 101a is h1, and h1≥0.1mm.
[0107] If the recess depth h1 of the first recess 101a is less than 0.1mm, the recess depth of the first recess 101a is small, and the processing difficulty of the first recess 101a is high, which will increase the overall production difficulty of the flow distribution assembly 100. Therefore, the recess depth h1 of the first recess 101a can be h1≥0.1mm, which can reduce the processing difficulty of the first recess 101a under the premise of meeting the capillary force requirement, and can reduce the overall production difficulty of the flow distribution assembly 100.
[0108] In some embodiments, the recess depth of the first recess 101a is h1, and h1≤0.3mm.
[0109] If the recess depth h1 of the first recessed part 101a is greater than 0.3 mm, the recess depth of the first recessed part 101a is large, the capillary force is small, which is insufficient to make the solder obtain large fluidity, the solder has low permeability, and the solder is difficult to penetrate between the first capillary structure 101 and the branch pipe 20, and the welding strength of the branch pipe 20 and the flow divider 10 is low. Therefore, the recess depth h1 of the first recessed part 101a can be h1≤0.3 mm, the capillary force is large, which is sufficient to make the solder obtain large fluidity, the solder has high permeability, the solder can penetrate between the first capillary structure 101 and the branch pipe 20, and the welding strength of the branch pipe 20 and the flow divider 10 is high.
[0110] Therefore, the recess depth h1 of the first recessed part 101a can be 0.1 mm, 0.15 mm, 0.2 mm, 0.25 mm, 0.3 mm, etc., which is not limited in the embodiment.
[0111] In some embodiments, the width of the first recessed part 101a along the circumferential direction of the first connecting hole 10a is d1, and d1≥0.1 mm.
[0112] If the width d1 of the first recessed part 101a is less than 0.1 mm, the width of the first recessed part 101a is small, and the processing difficulty of the first recessed part 101a is high, which will increase the overall production difficulty of the flow distribution assembly 100. Therefore, the width d1 of the first recessed part 101a can be d1≥0.1 mm, which is low in processing difficulty of the first recessed part 101a under the premise of meeting the capillary force requirement, and can reduce the overall production difficulty of the flow distribution assembly 100.
[0113] In some embodiments, the width of the first recessed part 101a along the circumferential direction of the first connecting hole 10a is d1, and d1≤0.3 mm.
[0114] If the width d1 of the first recessed part 101a is greater than 0.3 mm, the width of the first recessed part 101a is large, the capillary force is small, which is insufficient to make the solder obtain large fluidity, the solder has low permeability, and the solder is difficult to penetrate between the first capillary structure 101 and the branch pipe 20, and the welding strength of the branch pipe 20 and the flow divider 10 is low. Therefore, the width d1 of the first recessed part 101a can be d1≤0.3 mm, the capillary force is large, which is sufficient to make the solder obtain large fluidity, the solder has high permeability, the solder can penetrate between the first capillary structure 101 and the branch pipe 20, and the welding strength of the branch pipe 20 and the flow divider 10 is high.
[0115] Therefore, the width d1 of the first recessed part 101a can be 0.1 mm, 0.15 mm, 0.2 mm, 0.25 mm, 0.3 mm, etc., which is not limited in the embodiment.
[0116] In some embodiments, the distance between two adjacent first recesses 101a is L1, where L1 ≥ 1 mm.
[0117] If the distance L1 between two adjacent first recesses 101a is less than 1 mm, then with a fixed diameter of the first connecting hole 10a, the number of first recesses 101a distributed around the first connecting hole 10a will be large, the first recesses 101a will be dense, and the processing difficulty of the first recesses 101a will be high, which will increase the overall production difficulty of the diversion component 100. Therefore, the distance L1 between two adjacent first recesses 101a can be L1 ≥ 1 mm. Under the premise of meeting the capillary force requirements, the processing difficulty of the first recesses 101a is lower, which can reduce the overall production difficulty of the diversion component 100.
[0118] In some embodiments, the distance between two adjacent first recesses 101a is L1, where L1 ≤ 5 mm.
[0119] If the distance L1 between two adjacent first recesses 101a is greater than 5 mm, then with a fixed aperture of the first connecting hole 10a, the number of first recesses 101a distributed around the first connecting hole 10a is small, the first recesses 101a are sparse, and the capillary force provided by the multiple first recesses 101a as a whole is small, insufficient to allow the solder to achieve greater fluidity, resulting in low solder penetration. The solder is difficult to penetrate between the first capillary structure 101 and the branch pipe 20, leading to low welding strength between the branch pipe 20 and the distributor 10. Therefore, the distance L1 between two adjacent first recesses 101a can be L1 ≤ 5 mm. The capillary force provided by the multiple first recesses 101a as a whole is larger, sufficient to allow the solder to achieve greater fluidity, resulting in higher solder penetration. The solder can penetrate between the first capillary structure 101 and the branch pipe 20, leading to higher welding strength between the branch pipe 20 and the distributor 10.
[0120] Therefore, the distance L1 between two adjacent first recesses 101a can be 1mm, 1.5mm, 2mm, 2.5mm, 3mm, 3.5mm, 4mm, 4.5mm, 5mm, etc., and this embodiment does not make a specific limitation on this.
[0121] In some embodiments, such as Figure 9 and Figure 10 As shown, the inner wall surface of the second connecting hole 10b is provided with a second capillary structure 102. The second capillary structure 102 is used to provide capillary force to allow the solder to penetrate between the second capillary structure 102 and the main pipe 30 when the main pipe 30 is welded to the distributor 10.
[0122] By arranging the second capillary structure 102 on the inner wall surface of the second connecting hole 10b, the capillary force provided by the second capillary structure 102 can improve the flowability of the solder when the main pipe 30 is welded with the flow divider 10, so that the solder can penetrate between the second capillary structure 102 and the main pipe 30, thereby improving the welding strength of the main pipe 30 and the flow divider 10. Moreover, the composition and amount of the solder and flux do not need to be adjusted during welding, and the situation of increasing material cost can be avoided.
[0123] In some embodiments, the inner wall surface of the second connecting hole 10b is provided with the second capillary structure 102, and the second capillary structure 102 is filled with solder between the second capillary structure 102 and the main pipe 30.
[0124] By arranging the second capillary structure 102 on the inner wall surface of the second connecting hole 10b, and filling the solder between the second capillary structure 102 and the main pipe 30, that is, when the main pipe 30 is welded with the flow divider 10, the solder can penetrate and fill between the second capillary structure 102 and the main pipe 30, thereby improving the welding strength of the main pipe 30 and the flow divider 10. Moreover, the composition and amount of the solder and flux do not need to be adjusted during welding, and the situation of increasing material cost can be avoided.
[0125] In some embodiments, the second capillary structure 102 is configured as a plurality of second recesses 102a, and the plurality of second recesses 102a are arranged on the inner wall surface of the second connecting hole 10b at intervals along the circumference of the second connecting hole 10b.
[0126] By arranging the second recesses 102a on the inner wall surface of the second connecting hole 10b at intervals, the capillary force provided by the second recesses 102a can make the solder penetrate and fill into the second recesses 102a when the main pipe 30 is welded with the flow divider 10, so that the main pipe 30 and the flow divider 10 have higher welding strength. Moreover, the solder is uniformly distributed in the circumferential direction of the second connecting hole 10b, and the situation of stress concentration leading to welding failure of the main pipe 30 and the flow divider 10 can be avoided.
[0127] The size of each part of the second recess 102a (including width, depth, cross-sectional area, etc.) is negatively correlated with the size of the capillary force, that is, the larger the size, the smaller the capillary force, and vice versa.
[0128] In some embodiments, the recess depth of the second recess 102a is h2, and h2≥0.1mm.
[0129] If the recess depth h2 of the second recessed portion 102a is less than 0.1 mm, the recess depth of the second recessed portion 102a is small, and the processing difficulty of the second recessed portion 102a is high, which will increase the overall production difficulty of the flow distribution assembly 100. Therefore, the recess depth h2 of the second recessed portion 102a can be h2≥0.1 mm, and under the premise of meeting the capillary force requirement, the processing difficulty of the second recessed portion 102a is low, which can reduce the overall production difficulty of the flow distribution assembly 100.
[0130] In some embodiments, the recess depth of the second recessed portion 102a is h2, and h2≤0.3 mm.
[0131] If the recess depth h2 of the second recessed portion 102a is greater than 0.3 mm, the recess depth of the second recessed portion 102a is large, the capillary force is small, which is not enough to make the solder have large fluidity, the permeability of the solder is low, and the solder is difficult to penetrate between the second capillary structure 102 and the main pipe 30. The welding strength of the main pipe 30 and the flow distributor 10 is low. Therefore, the recess depth h2 of the second recessed portion 102a can be h2≤0.3 mm, the capillary force is large, which is enough to make the solder have large fluidity, the permeability of the solder is high, the solder can penetrate between the second capillary structure 102 and the main pipe 30, and the welding strength of the main pipe 30 and the flow distributor 10 is high.
[0132] Therefore, the recess depth h2 of the second recessed portion 102a can be 0.1 mm, 0.15 mm, 0.2 mm, 0.25 mm, 0.3 mm, etc., which is not limited in the embodiment.
[0133] In some embodiments, the width of the second recessed portion 102a along the circumferential direction of the second connecting hole 10b is d2, and d2≥0.1 mm.
[0134] If the width d2 of the second recessed portion 102a is less than 0.1 mm, the width of the second recessed portion 102a is small, and the processing difficulty of the second recessed portion 102a is high, which will increase the overall production difficulty of the flow distribution assembly 100. Therefore, the width d2 of the second recessed portion 102a can be d2≥0.1 mm, and under the premise of meeting the capillary force requirement, the processing difficulty of the second recessed portion 102a is low, which can reduce the overall production difficulty of the flow distribution assembly 100.
[0135] In some embodiments, the width of the second recessed portion 102a along the circumferential direction of the second connecting hole 10b is d2, and d2≤0.3 mm.
[0136] If the width d2 of the second recess 102a is greater than 0.3 mm, the capillary force is small, which is insufficient to make the solder have greater fluidity, the solder has low permeability, and the solder is difficult to penetrate between the second capillary structure 102 and the main pipe 30, so that the welding strength of the main pipe 30 and the flow distributor 10 is low. Therefore, the width d2 of the second recess 102a can be d2≤0.3 mm, the capillary force is large, which is sufficient to make the solder have greater fluidity, the solder has high permeability, and the solder can penetrate between the second capillary structure 102 and the main pipe 30, so that the welding strength of the main pipe 30 and the flow distributor 10 is high.
[0137] Therefore, the width d2 of the second recess 102a can be 0.1 mm, 0.15 mm, 0.2 mm, 0.25 mm, 0.3 mm, etc., which is not limited in the embodiment.
[0138] In some embodiments, the interval distance between two adjacent second recesses 102a is L2, and L2≥1 mm.
[0139] If the interval distance L2 between two adjacent second recesses 102a is less than 1 mm, under the condition that the hole diameter of the second connecting hole 10b is constant, the number of second recesses 102a distributed around the second connecting hole 10b is large, the second recesses 102a are dense, and the processing difficulty of the second recesses 102a is high, which will increase the overall production difficulty of the flow distribution assembly 100. Therefore, the interval distance L2 between two adjacent second recesses 102a can be L2≥1 mm, which is low in processing difficulty of the second recess 102a under the premise of meeting the capillary force requirement, and can reduce the overall production difficulty of the flow distribution assembly 100.
[0140] In some embodiments, the interval distance between two adjacent second recesses 102a is L2, and L2≤5 mm.
[0141] If the interval distance L2 between two adjacent second recesses 102a is greater than 5 mm, under the condition that the hole diameter of the second connecting hole 10b is constant, the number of second recesses 102a distributed around the second connecting hole 10b is small, the second recesses 102a are sparse, and the capillary force provided by the plurality of second recesses 102a as a whole is small, which is insufficient to make the solder have greater fluidity, the solder has low permeability, and the solder is difficult to penetrate between the second capillary structure 102 and the main pipe 30, so that the welding strength of the main pipe 30 and the flow distributor 10 is low. Therefore, the interval distance L2 between two adjacent second recesses 102a can be L2≤5 mm, the capillary force provided by the plurality of second recesses 102a as a whole is large, which is sufficient to make the solder have greater fluidity, the solder has high permeability, and the solder can penetrate between the second capillary structure 102 and the main pipe 30, so that the welding strength of the main pipe 30 and the flow distributor 10 is high.
[0142] Therefore, the interval distance L2 of two adjacent second recesses 102a can be 1 mm, 1.5 mm, 2 mm, 2.5 mm, 3 mm, 3.5 mm, 4 mm, 4.5 mm, 5 mm, etc., which is not limited in the embodiment.
[0143] The embodiment of the present application further provides an air conditioner indoor unit 1000. In some embodiments, as shown in FIG. 1, the air conditioner indoor unit 1000 comprises a shell 200, and the shell 200 forms an inner cavity.
[0144] The shape of the inner cavity can be cylindrical or cuboid, etc. Of course, the inner cavity can be other possible shapes, which are not limited in the embodiment.
[0145] In some embodiments, the air conditioner indoor unit 1000 comprises a fan, and the fan is arranged in the inner cavity.
[0146] By arranging the fan in the inner cavity, the fan can quickly blow the air after heat exchange in the inner cavity to the indoor where the air conditioner indoor unit 1000 is located, and the cooling effect of the air conditioner indoor unit 1000 is better.
[0147] In some embodiments, as shown in FIG. 1, Figure 11 The shunt assembly comprises a refrigerant pipeline 300, and the refrigerant pipeline 300 is arranged in the inner cavity.
[0148] By arranging the refrigerant pipeline 300 in the inner cavity, the refrigerant pipeline 300 can input the refrigerant to realize heat exchange with the air, and discharge the refrigerant after heat exchange with the air. That is, the condensing pipeline comprises an input pipeline and an output pipeline, which are respectively used for inputting and discharging the refrigerant.
[0149] In some embodiments, the refrigerant pipeline 300 is connected to the heat exchanger 400 through the shunt assembly 100. The main pipe 30 of the shunt assembly 100 is connected to the refrigerant pipeline 300, and the branch pipe 20 is connected to the shunt 10.
[0150] When the condensing pipeline is the input pipeline, the refrigerant is input to the main pipe 30 through the refrigerant pipeline 300, and the refrigerant is distributed through the shunt 10 and the plurality of branch pipes 20 to be transported to the heat exchanger 400. When the air flows through the heat exchanger 400, the air exchanges heat with the refrigerant through the heat exchanger 400, so as to change the temperature of the air.
[0151] The structure of the shunt assembly 100 can be the same as that of any one of the shunt assemblies 100 in the above embodiments, and can bring the same or similar beneficial effects. For details, refer to the description of the shunt assembly 100 in the above embodiments, which will not be repeated here.
[0152] The above has carried on the detailed introduction to the split flow assembly and the indoor unit of the air conditioner disclosed in the examples of the application, the principles and implementation modes of the application are described by using the examples, the above example description is only used to help understand the split flow assembly and the indoor unit of the air conditioner and the core idea thereof; meanwhile, for the general technical personnel in the art, according to the idea of the application, the specific implementation mode and the application range will be changed, and the above is not understood as the limitation of the application.
Claims
1. A flow splitting assembly, characterized by, The application relates to a manifold assembly. The manifold assembly comprises: a manifold; a main pipe connected to the manifold; a plurality of branch pipes connected to the manifold to communicate with the main pipe; the manifold is provided with a plurality of first connecting holes and a second connecting hole communicating with the first connecting holes, the branch pipes are welded to the manifold and communicate with the first connecting holes respectively, and the main pipe is welded to the manifold and communicates with the second connecting hole; 2. A flow splitting assembly, characterized by wherein the inner wall surface of each first connecting hole is provided with a first capillary structure for providing capillary force to make solder penetrate between the first capillary structure and the branch pipe when the branch pipe is welded to the manifold. The application relates to a manifold assembly. The manifold assembly comprises: a manifold; a main pipe connected to the manifold; a plurality of branch pipes connected to the manifold to communicate with the main pipe; 3. The flow splitting assembly of claim 1 or 2, wherein, the manifold is provided with a plurality of first connecting holes and a second connecting hole communicating with the first connecting holes, the branch pipes are welded to the manifold and communicate with the first connecting holes respectively, and the main pipe is welded to the manifold and communicates with the second connecting hole; 4. The flow splitting assembly of claim 3, wherein, wherein the inner wall surface of each first connecting hole is provided with a first capillary structure for providing capillary force to make solder penetrate between the first capillary structure and the branch pipe when the branch pipe is welded to the manifold.
5. The flow splitting assembly of claim 3, wherein, The first capillary structure is configured as a plurality of first recesses which are distributed on the inner wall surface of the first connecting hole along the circumference of the first connecting hole.
6. The flow splitting assembly of claim 3, wherein, The recess depth of the first recess is h1, h1>=0.1mm; h1<=0.3mm.
7. The flow splitting assembly of claim 1 or 2, wherein, The width of the first recess along the circumferential direction of the first connecting hole is d1, d1>=0.1mm; d1<=0.3mm. The interval distance of two adjacent first recesses is L1, L1>=1mm; L1<=5mm.
8. The flow splitting assembly of claim 7, wherein, The inner wall surface of the second connecting hole is provided with a second capillary structure for providing capillary force to make solder penetrate between the second capillary structure and the main pipe when the main pipe is welded to the manifold.
9. The flow splitting assembly of claim 8, wherein, Alternatively, the second capillary structure is filled with solder between the second capillary structure and the main pipe.
10. The flow splitting assembly of claim 8, wherein, The second capillary structure is configured as a plurality of second recesses which are distributed on the inner wall surface of the second connecting hole along the circumference of the second connecting hole.
11. The flow splitting assembly of claim 8, wherein, The recess depth of the second recess is h2, h2>=0.1mm; h2<=0.3mm.
12. An air conditioner indoor unit characterized by comprising: The width of the second recess along the circumferential direction of the second connecting hole is d2, d2>=0.1mm; d2<=0.3mm. The interval distance of two adjacent second recesses is L2, L2>=1mm; L2<=5mm. The application relates to a manifold assembly. The manifold assembly comprises: an outer shell forming an inner cavity; a fan arranged in the inner cavity; a manifold assembly arranged in the inner cavity; the manifold assembly comprises: a refrigerant pipeline; a heat exchanger arranged in the inner cavity; A flow distribution assembly is arranged in the inner cavity, and one end of the main pipe away from the flow distributor is connected to the refrigerant pipeline, and one end of each branch pipe away from the flow distributor is connected to the heat exchanger. The flow distribution assembly is the flow distribution assembly according to any one of claims 1 to 11.