Magnetic angle sensor

Abstract

The utility model provides a magnetic angle sensor, which relates to the technical field of magnetic angle sensor manufacture and comprises a magnet, a sub-PCB (printed circuit board) and a main PCB which are arranged from top to bottom in the vertical direction. The sub-PCB is welded on the main PCB, a chip is mounted on the sub-PCB, and a gap is formed between the chip and the magnet. The beneficial effects of the utility model are that the replaceable sub-PCB is arranged on the main PCB, so that when the magnetic field intensity sensed by the chip does not meet the requirement due to the replacement of the magnet or the chip in the later period, or the factors such as the structural manufacturing tolerance, the distance between the magnetic angle chip and the magnet is adjusted by adjusting the manufacturing thickness of the sub-PCB; the magnetic field intensity sensed by the chip can meet the requirement, the whole main PCB does not need to be replaced, and the material cost can be saved.

Description

TECHNICAL FIELD

[0001] The utility model relates to magnetic angle sensor manufacturing technical field especially relates to a kind of magnetic angle sensors. BACKGROUND

[0002] Magnetic angle sensor is a kind of sensor using magnetic principle to detect angle position, usually magnetic angle chip is used to induct the magnetic field direction of permanent magnet to determine the angle position of sensor, this sensor has high precision and stability, non-contact measurement, good anti-interference ability and other advantages and is widely applied, such as position sensor on automobile chassis, sensor for feedbacking the position of rotating shaft in car light etc.

[0003] In the application of magnetic angle sensor, magnetic angle chip and magnet cooperate with each other, and magnetic angle sensor chip has requirements to minimum or maximum magnetic field intensity, if below or exceed the required magnetic field intensity of chip, it will have bad influence on the performance parameters such as linearity of whole sensor, so it is important to meet the required magnetic field intensity of magnetic angle chip in the early stage of magnetic angle sensor design, and when using PCBA+Magnet method to design magnetic angle sensor, the distance between chip and magnet surface is basically controlled by structure design, to meet the required magnetic field of chip;

[0004] But in actual production and use process, we sometimes also encounter the condition that the magnetic intensity sensed by angle magnetic sensor chip is weak or strong, such as the magnetic field of magnet is reduced under high temperature environment, or the dimensional error of sensor structure manufacturing causes the distance between chip and magnet to increase or decrease, or magnet or chip is replaced in later period to reduce cost etc.;At this time, if limited by structure and magnet size and material etc. factor, we can not meet the required magnetic field intensity of angle magnetic sensor chip by adjusting structure design and replacing magnet etc. way. UTILITY MODEL CONTENTS

[0005] In view of the problems in prior art, the utility model provides a kind of magnetic angle sensor, including magnet, sub-PCB board and main PCB board arranged from top to bottom according to vertical direction;

[0006] The sub-PCB board is welded on the main PCB board, the chip is attached on the sub-PCB board, and the gap is between the chip and the magnet.

[0007] Preferably, the sub-PCB board is made of FR4 material.

[0008] Preferably, the main PCB board is made of FR4 material.

[0009] Preferably, the sub-PCB board is welded on the solder pad of the main PCB board.

[0010] Preferably, the sub-PCB is welded on the main PCB by pin.

[0011] Preferably, the thickness of the sub-PCB is 0.8-2mm.

[0012] Preferably, the chip is a magnetic angle chip.

[0013] The above technical solution has the following advantages or beneficial effects:

[0014] By setting the replaceable sub-PCB on the main PCB, when the magnetic field intensity sensed by the chip does not meet the requirements due to the replacement of the magnet or the chip, or the structural manufacturing tolerance, etc., the spacing between the magnetic angle chip and the magnet is adjusted by adjusting the manufacturing thickness of the sub-PCB, so that the magnetic field intensity sensed by the chip meets the requirements, without replacing the whole main PCB, which can save material cost. BRIEF DESCRIPTION OF DRAWINGS

[0015] Figure 1 In a preferred embodiment of the present application, a structural schematic diagram of a magnetic angle sensor is provided. DETAILED DESCRIPTION

[0016] The present application will be described in detail below with reference to the drawings and specific embodiments. The present application is not limited to this embodiment, and other embodiments can also fall within the scope of the present application as long as they comply with the main idea of the present application.

[0017] In a preferred embodiment of the present application, based on the above problems existing in the prior art, a magnetic angle sensor is provided, which comprises a magnet 1, a sub-PCB 2 and a main PCB 3 arranged in a vertical direction from top to bottom.

[0018] The sub-PCB 2 is welded on the main PCB 3, and the chip 4 is attached on the sub-PCB 2, and there is a gap between the chip 4 and the magnet 1.

[0019] Specifically, in the present embodiment, by setting the replaceable sub-PCB 2 on the main PCB 3, when the magnetic field intensity sensed by the chip does not meet the requirements due to the replacement of the magnet 1 or the chip 4, or the structural manufacturing tolerance, etc., since the main PCB 3 integrates a plurality of other electronic circuits which are not convenient to replace and have a large replacement cost, the spacing D2 between the magnetic angle chip 4 and the magnet 1 is adjusted by adjusting the manufacturing thickness D1 of the sub-PCB 2, so that the magnetic field intensity sensed by the chip 4 meets the requirements, without replacing the whole main PCB 3, which can save material cost.

[0020] In the preferred embodiment of the present application, the sub-PCB 2 is made of FR4 material, and the main PCB 3 is also made of FR4 material. The thickness of the sub-PCB is 0.8mm-2mm.

[0021] Specifically, in the present embodiment, the FR4 material has significant advantages in the electronic manufacturing industry, such as good electrical insulation, flame retardant level reaching UL94 V-0 standard, easy to drill, cut, bend and other processing operations, and the manufacturing cost of FR-4 material is relatively low compared to other high-performance materials. Therefore, in the present embodiment, the sub-PCB 2 and the main PCB 3 are made of FR4 material, and the thickness of the sub-PCB 2 can also be 0.8-2mm.

[0022] In the preferred embodiment of the present application, the sub-PCB 2 is welded to the solder pad of the main PCB 3.

[0023] In the preferred embodiment of the present application, the sub-PCB 2 is welded to the solder pad of the main PCB 3.

[0024] Specifically, the sub-PCB 2 can be welded to the main PCB 3 in the form of solder pad or pin, and the welding method can be selected, which has a wider application range and flexible options when replacing the sub-PCB 2.

[0025] In the preferred embodiment of the present application, the chip 4 is a magnetic angle chip.

[0026] The above is only the preferred embodiment of the present application, and does not limit the implementation and protection scope of the present application. For those skilled in the art, it should be realized that any equivalent replacement and obvious changes made according to the present application and drawings should be included in the protection scope of the present application.

Claims

1. A magnetic angle sensor, characterized in that The magnet, the sub-PCB plate and the main PCB plate are arranged from top to bottom in a vertical direction; The sub-PCB plate is welded on the main PCB plate, and the chip is attached on the sub-PCB plate, and a gap is formed between the chip and the magnet.

2. The magnetic angle sensor according to claim 1, characterized in that The sub-PCB plate is made of FR4 material.

3. The magnetic angle sensor of claim 1, wherein, The main PCB plate is made of FR4 material.

4. The magnetic angle sensor of claim 1, wherein, The sub-PCB plate is welded on the solder pad of the main PCB plate.

5. The magnetic angle sensor of claim 1, wherein, The sub-PCB plate is welded on the main PCB plate through the pin.

6. The magnetic angle sensor of claim 1, wherein, The thickness of the sub-PCB plate is 0.8mm-2mm.

7. The magnetic angle sensor of claim 1, wherein, The chip is a magnetic angle chip.

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