MEMS (Micro Electro Mechanical System) test socket device

Abstract

The utility model discloses an MEMS test seat device, which comprises an upper cover, a base and a PCB (printed circuit board), the base and a communication plug connector are fixed on the PCB, when the upper cover and the base are matched for use, a sealing cavity is formed in the upper cover and the base, an air inlet and an air outlet are arranged in the sealing cavity, and the air inlet and the air outlet are communicated with the communication plug connector. The air inlet and the air outlet are communicated with an air inlet device and an air outlet device respectively, a detection area is further arranged in the sealing cavity, an aging module is arranged in the detection area, and a product to be detected is placed on the aging module. According to the utility model, the special gas circuit is arranged in the MEMS test seat device, so that the test requirement on gas pressure or specific gas can be met, and meanwhile, the aging module is arranged in the detection area, so that the temperature test on the MEMS sensor is realized, the test verification requirements of various MEMS sensors are met, and the fixing cost of laboratory equipment is reduced.

Description

TECHNICAL FIELD

[0001] The utility model relates to the field of semiconductor manufacturing, in particular to a MEMS test seat device. BACKGROUND

[0002] MEMS (Micro Electro Mechanical System) sensor is a kind of micro device that converts physical quantity (such as temperature, pressure, acceleration, etc.) into electrical signal, is widely used in environmental monitoring, industrial automation, automotive electronics and various high-tech fields, and the stability and accuracy of its performance directly affect the reliability and functionality of the whole system. The performance of MEMS chip is evaluated by final test (MEMS FT) of MEMS sensor, to ensure that the sensor can maintain stable performance during the whole service life of the device, and meet the use demand of various industries. The existing aging seat test device generally only corresponds to one type of MEMS sensor test verification, such as MEMS pressure sensor and MEMS temperature sensor product test, different test equipment is often needed, which cannot meet the test verification demand of different types of MEMS sensors of the same equipment.

[0003] Therefore, a MEMS sensor test seat device is needed, which can be compatible with the air pressure or special gas test and temperature test verification of the product to be tested, and meet the test verification demand of different types of MEMS sensors of the same equipment. UTILITY MODEL CONTENT

[0004] The utility model provides a MEMS test seat device to solve all or part of the above prior art problems.

[0005] In order to realize the above-mentioned purpose, the utility model provides a kind of MEMS test seat device, including upper cover, base and PCB board, the base and communication plug-in piece are fixed on the PCB board, the upper cover and the base are used in cooperation, the upper cover and the base inside form a sealed cavity, air inlet and air outlet are provided in the sealed cavity, the air inlet and the air outlet are respectively communicated with air inlet device and air outlet device, detection area is further provided in the sealed cavity, aging module is provided in the detection area, and the aging module is placed with the product to be measured.Product aging seat test device of prior art is generally only corresponding to one type MEMS sensor test verification, when MEMS pressure sensor and MEMS temperature sensor finished product are tested, different test equipment is often needed, cannot satisfy the different types of MEMS sensor test verification demand of same one setting, the utility model is connected with external gas by setting special gas path structure in MEMS test seat device, can satisfy the test demand of the air pressure or specific gas of MEMS sensor, while setting aging module in detection area, and the MEMS sensor chip to be measured is placed on aging module, and electrical connection is carried out with PCB board by probe below aging module, the temperature test of MEMS sensor is realized, so as to compatible multiple MEMS sensor test verification demand, and laboratory equipment fixed cost is reduced.

[0006] Air inlet channel and air outlet channel are provided on the upper cover, the air inlet device and the air outlet device are provided on the side of the base, and the air inlet and the air outlet are communicated with the air inlet device and the air outlet device through the air inlet channel and the air outlet channel.

[0007] Sealing ring is provided on the base, the sealing ring is in contact with the upper cover, and the sealing cavity is formed in the upper cover and the base.The sealing ring maintains the airtightness of the sealed cavity of the MEMS test seat device, thereby completing the air pressure test of the MEMS sensor or the test verification of special gases such as oxygen and carbon dioxide.

[0008] Sealing rings are provided at the interfaces of the air inlet device and the air outlet device, and the sealing rings are in contact with the openings of the air inlet channel and the air outlet channel.The air inlet device and the air outlet device on the base are connected with the air inlet pipe and the air outlet pipe on the upper cover through the interfaces, and sealing rings are provided at the interfaces to ensure the airtightness of the entire sealed cavity and prevent gas leakage from causing unstable air pressure or gas pollution.

[0009] The detection area comprises a connecting plate and a fixing plate arranged on the connecting plate, the connecting plate is located at the bottom of the base, the connecting plate is fixedly connected with the fixing plate, the fixing plate is fixedly connected with the base, and the aging module is located at the middle of the fixing plate. Further, the fixing plate and the connecting plate are positioned and fixed by a plurality of positioning pins and fixing shafts, so that for different packaging forms of the device to be tested, the aging test can be realized by replacing the fixing plate and the connecting plate, and the versatility of the MEMS test seat device is increased.

[0010] The aging module comprises a temperature detection assembly and a temperature control module, and the temperature control module is a heating module or a diode refrigeration module. According to the test requirement, the temperature control module can be a heating module or a diode refrigeration module, and the temperature detection assembly is used for detecting and feeding back the temperature of the contact center of the product to be tested, so as to realize the temperature performance test of the MEMS sensor in the heating temperature test mode or the low temperature test mode.

[0011] A heating electrode is arranged on the connecting plate, one end of a Pin needle group is connected with the temperature detection assembly and the temperature control module, and the other end penetrates through the fixing plate and the connecting plate and is connected with the PCB plate. Heat is conducted to the product to be tested by the PIN needle to realize the temperature test of the MEMS test seat.

[0012] A pressing device is arranged in the middle of the upper cover, the pressing device comprises a limiting plate and a pressing core arranged on the limiting plate, the pressing core comprises a plurality of column structures perpendicular to the direction of the limiting plate, and a gap is arranged between adjacent two column structures. The pressing core is arranged as a plurality of column structures, and a gap is arranged between the column structures to reserve a vertical channel for a chip sensing hole on the product to be tested, so that pressure or gas can smoothly reach the sensing area of the product to be tested, and the pressure or gas test of the product to be tested is completed.

[0013] A circular baffle is arranged outside the pressing core, a control assembly is further arranged on the upper cover, the control assembly controls the up-down movement of the circular baffle, and a circular clamping groove matched with the shape of the circular baffle is arranged on the fixing plate. When the product to be tested is tested for temperature, the circular baffle is controlled to move downward into the circular clamping groove by the control assembly, a smaller sealed chamber is realized within the range of the circular clamping groove, concentrated heating or cooling of the product to be tested is realized, and the influence of the heating or cooling rate on the test result is reduced; when the product to be tested is tested for pressure or special gas, a gap is left between the circular baffle and the circular clamping groove by the control assembly, and the gas passing is not affected.

[0014] One end of the upper cover is rotationally connected with one end of the base, the other end of the upper cover is provided with a buckling piece, and a buckling plate corresponding to the buckling piece is arranged on one side of the base.

[0015] Compared with the prior art, the utility model discloses the beneficial effects are: the utility model discloses a special gas path structure is connected with external gas in the MEMS test seat device, can satisfy the test demand of the air pressure or specific gas of MEMS sensor, is placed in the aging module on the MEMS sensor chip of detection area setting, and the probe below aging module is electrically connected with PCB board, realizes the temperature test of MEMS sensor, thereby compatible multiple MEMS sensor test verification demand, has reduced laboratory equipment fixed cost. BRIEF DESCRIPTION OF DRAWINGS

[0016] Figure 1 It is a gas path structure schematic view of the MEMS test seat device provided by the utility model embodiment 1;

[0017] Figure 2 It is the front view of the MEMS test seat device provided by the utility model embodiment 1;

[0018] Figure 3 It is the side view of the MEMS test seat device in embodiment 1;

[0019] Figure 4 It is the top view of the MEMS test seat device in embodiment 1;

[0020] Figure 5 And Figure 6 It is the structure schematic view of the detection area in embodiment 1;

[0021] BRIEF DESCRIPTION OF DRAWINGS

[0022] 1, upper cover;11, compression device;111, limit board;113, circular baffle;A, gas inlet;B, gas outlet;C, sealed cavity;E, the interface of gas inlet device and gas outlet device;F, the opening of gas inlet channel and gas outlet channel;12, gas inlet pipeline;13, gas outlet pipeline;2, base;21, gas inlet device;22, gas outlet device;23, sealing ring;3, PCB board;4, communication plug connector;5, detection area;51, connecting plate;511, heating electrode;512, positioning pin;513, fixed shaft;52, fixed plate;521, circular clamping groove;6, aging module;7, product to be tested;8, Pin needle group;9, buckling piece;91, pivot;92, tip;10, buckling plate. DETAILED DESCRIPTION

[0023] The preferred embodiments of the utility model are described in detail below in combination with the drawings, so that the advantages and features of the utility model can be more easily understood by the person skilled in the art, and the protection scope of the utility model is more clearly and explicitly defined.

[0024] Embodiment 1

[0025] This embodiment provides a MEMS test fixture including an upper cover 1, a base 2, and a PCB board 3. The base 2 and a communication connector 4 are fixed on the PCB board 3. When the upper cover 1 and the base 2 are used together, a sealed cavity C is formed inside the upper cover 1 and the base 2. Figures 1 to 4 As shown, the sealed cavity C is provided with an air inlet A and an air outlet B. The upper cover 1 is provided with an air inlet channel 12 and an air outlet channel 13. The air inlet A and the air outlet B are respectively connected to the air inlet device 21 and the air outlet device 22 on the base through the air inlet channel 12 and the air outlet channel 13. The sealed cavity C is also provided with a detection area 5. The detection area 5 is provided with an aging module 6. The product to be tested 7 is placed on the aging module 6.

[0026] The base 2 is fixed to the PCB board 3 through positioning holes. Embedded wires are set on the PCB board 3. The communication connector 4 is a circuit communication port and is an adapter for communication between the MEMS test socket functional module and the ribbon cable. It adopts a fixed interface terminal structure, which increases the reliability, versatility and ease of operation of the adapter, avoids manual wire soldering, and reduces the workload.

[0027] In this embodiment, as Figures 2 to 3 As shown, one end of the upper cover 1 of the MEMS test fixture is rotatably connected to one end of the base 2. The other end of the upper cover 1 is provided with a fastening member 9, and a buckle plate 10 is provided on one side of the base 2 corresponding to the fastening member 9. The fastening member 9 has a through hole in the middle, and the rotating shaft 91 is horizontally disposed in the through hole. Both ends of the rotating shaft 91 are connected to the upper cover 1. The fastening member 9 has a pointed tip 92 facing the inside of the upper cover 1 at the end near the base 2. When the MEMS test fixture is closed, the pointed tip 92 abuts against the bottom of the buckle plate 10.

[0028] like Figure 4 As shown, a sealing ring 23 is provided on the base 2. The sealing ring 23 contacts the upper cover 1 and forms the sealing cavity C inside the upper cover 1 and the base 2. An air inlet channel 21 and an air outlet channel 22 are provided on the upper cover 1. An air inlet device 21 and an air outlet device 22 are provided on the base. One end of the air inlet pipe 12 and the air outlet pipe 13 connects to the air inlet A and the air outlet B inside the sealing cavity C, and the other end connects to the air inlet device 21 and the air outlet device 22. A sealing ring 23 is also provided at the interface E of the air inlet pipe 12 and the air outlet pipe 13. When performing air pressure or special gas tests, such as... Figure 1As shown, gas enters the detection area 5 within the sealed cavity C from the inlet A through the inlet channel 12 of the inlet device 21, and returns to the outlet device 22 from the outlet B along the outlet channel 13. A sealing ring 23 is provided to maintain the airtightness of the MEMS test fixture, preventing gas leakage that could cause pressure instability or contamination, thereby completing the pressure test of the MEMS sensor, or the testing and verification of special gases such as oxygen and carbon dioxide.

[0029] like Figure 5 As shown, the detection area 5 on the base 2 includes a connecting plate 51 and a fixing plate 52. The connecting plate 51 is located at the bottom of the base 2. In this embodiment, the connecting plate 51 and the fixing plate 52 are respectively provided with multiple positioning holes and fixing holes. The connecting plate 51 and the fixing plate 52 are fixedly connected by positioning pins 512 and fixing shafts 513. The connecting plate 51 and the fixing plate 52 are movable modules. For devices under test with different packaging forms, aging tests can be performed by replacing the fixing plate and the connecting plate, increasing the versatility of the MEMS test fixture. The fixing plate 52 is fixedly connected to the base 2 by studs.

[0030] like Figure 6 As shown, the aging module includes a temperature detection component and a temperature control module (not shown in the figure). The temperature control module is a heating module. A heating electrode 511 is provided on the connecting plate 51. One end of the pin group 8 is connected to the temperature detection component and the heating module, and the other end passes through the fixing plate 52 and the connecting plate 51 and is connected to the PCB board 3. During heating, heat is conducted to the product under test through the pins. The temperature detection component detects and provides feedback on the temperature of the contact center of the product under test, realizing the heating temperature test mode of the MEMS test socket. The heating module can also be replaced with a diode cooling module according to the test requirements, thereby realizing the temperature performance test of the MEMS sensor in the low temperature test mode. In this embodiment, the temperature detection component is a PT1000 thermistor, and its circuit loop is embedded in the PCB board and connected to the temperature controller through a designated RS232 port.

[0031] A pressing device 11 is provided in the middle of the upper cover 1. The pressing device 11 includes a limiting plate 111 and a pressing core disposed on the limiting plate 111. The pressing core includes multiple columnar structures perpendicular to the limiting plate, with gaps between adjacent columnar structures. The pressing core is configured as multiple columnar structures with gaps between them to reserve vertical channels for the chip sensing holes on the product under test, allowing pressure or gas to smoothly reach the sensing area of ​​the product under test and complete the pressure or gas test of the product under test.

[0032] A circular baffle 113 is arranged outside the pressing core, and a control assembly (not shown in the figure) is further arranged on the upper cover 1, which controls the up and down movement of the circular baffle 113, and a circular clamping groove 521 is arranged on the fixed plate 52 and is matched with the shape of the circular baffle 113. When the product to be tested is subjected to temperature test, the circular baffle is controlled to move downward into the circular clamping groove by the control assembly, a smaller sealed chamber is realized within the range of the circular clamping groove, the concentrated heating or cooling of the product to be tested is realized, and the influence of the heating or cooling rate on the test result is reduced; when the product to be tested is subjected to pressure or special gas test, a gap is left between the circular baffle and the circular clamping groove by the control assembly, and the gas passing is not affected.

[0033] The above is only the embodiment of the present application, and does not limit the patent range of the present application, and any equivalent structure or equivalent process transformation, or direct or indirect application in other related technical fields by using the content of the present application specification and drawings, are also included in the patent protection range of the present application.

Claims

1. A MEMS test socket apparatus, characterized by, The utility model relates to an aging test device, including upper cover (1), base (2) and PCB board (3), the PCB board (3) is fixed with base (2) and communication plug -in spare (4), when the upper cover (1) and base (2) cooperate and use, the upper cover (1) and base (2) inside form a sealed cavity C, the sealed cavity C is provided with air inlet A and air outlet B, air inlet A and air outlet B are connected with air inlet device (21) and air outlet device (22) respectively, the sealed cavity C is also provided with detection area (5), detection area (5) is provided with aging module (6), and aging module (6) places product (7) to be measured.

2. The MEMS test socket device of claim 1, wherein: The upper cover (1) is provided with air inlet channel (12) and air outlet channel (13), and the air inlet device (21) and the air outlet device (22) are arranged on the side of the base (2). The air inlet A and the air outlet B are communicated with the air inlet device (21) and the air outlet device (22) through the air inlet channel (12) and the air outlet channel (13) respectively.

3. The MEMS test socket device of claim 1, wherein: The base (2) is provided with a sealing ring (23), which is in contact with the upper cover (1) and forms the sealed cavity C inside the upper cover (1) and the base (2).

4. The MEMS test socket device of claim 2, wherein: The interface E of the air inlet device (21) and the air outlet device (22) is provided with a sealing ring (23), which is in contact with the opening F of the air inlet channel (12) and the air outlet channel (13) respectively.

5. The MEMS test socket device of claim 1, wherein: The detection area (5) includes a connecting plate (51) and a fixing plate (52) arranged on the connecting plate (51). The connecting plate (51) is located at the bottom of the base (2). The connecting plate (51) is fixedly connected with the fixing plate (52). The fixing plate (52) is fixedly connected with the base (2). The aging module (6) is located in the middle of the fixing plate (52).

6. The MEMS test socket device of claim 5, wherein: The aging module (6) includes a temperature detection assembly and a temperature control module, which is a heating module or a diode refrigeration module.

7. The MEMS test socket apparatus of claim 6, wherein: The connecting plate (51) is provided with a heating electrode (511). One end of the Pin needle group (8) is connected with the aging module (6), and the other end penetrates through the fixing plate (52) and the connecting plate (51) and is connected with the PCB board (3).

8. The MEMS test socket apparatus of claim 7, wherein: The middle of the upper cover (1) is provided with a pressing device (11). The pressing device (11) includes a limiting plate (111) and a pressing core arranged on the limiting plate (111). The pressing core includes a plurality of column structures perpendicular to the limiting plate. Adjacent two column structures are provided with a gap.

9. The MEMS test socket apparatus of claim 8, wherein: A circular baffle (113) is arranged outside the pressing core. The upper cover (1) is also provided with a control assembly, which controls the up and down movement of the circular baffle (113). The fixing plate (52) is provided with a circular clamping groove (521) matched with the shape of the circular baffle (113).

10. The MEMS test socket device of claim 1, wherein: One end of the upper cover (1) is rotatably connected with one end of the base (2), and the other end of the upper cover (1) is provided with a buckling member (9), and a buckling plate (10) is arranged on one side of the base (2) corresponding to the buckling member (9).

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