A sealing property detection device for a chip package
By designing a combination of the testing chamber body, sleeve, cylinder, and piston head, the problems of low detection accuracy and poor stability of traditional chip packaging sealing testing devices are solved, achieving efficient and stable sealing testing and automated collection.
Patent Information
- Application Number
- CN202520277819.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-02-20
- Publication Date
- 2025-11-28
- Estimated Expiration
- 2035-02-20
AI Technical Summary
Traditional chip packaging sealing testing devices suffer from low testing accuracy, unstable testing environment, low collection efficiency, and are prone to damaging chips, resulting in poor device operational stability.
A device comprising a detection chamber body, a sleeve, a cylinder, and a piston head was designed. The negative pressure environment is controlled by the movement of the piston head, and the collection mechanism enables automated chip collection. A buffer mechanism ensures detection stability and a smooth process.
It improves detection accuracy, reduces external interference, achieves automated collection, avoids chip damage, and enhances the continuity of the detection process and the stability of the device.
Smart Images
Figure CN223611028U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to chip package detection equipment technical field especially relates to a chip package is with leakproofness detection device. BACKGROUND
[0002] In the chip production process, the purpose of chip packaging is to protect the precision circuit inside the chip from the influence of external environment such as moisture, dust, oxygen and the like, and the leakproofness detection device is used to detect whether the packaged chip meets the sealing requirement. It judges whether the chip packaging exists leakage by simulating various environmental pressure conditions, ensures that the chip can stably and reliably run in actual use, and protects the performance and service life of the chip.
[0003] The traditional chip packaging leakproofness detection device is single in the way of generating negative pressure in the detection link, often cannot accurately control the change of negative pressure, leads to that the detection result is not accurate enough. Moreover, it is difficult to maintain a stable detection environment in the detection process, is easily interfered by external factors, causes that the detection result deviation is larger. When collecting the detected chip, the traditional device usually lacks efficient collection mechanism, needs manual collection, and the efficiency is low, and the chip is also easily damaged in the collection process. In addition, the synergy between the parts of the traditional device is poor, lacks buffering and stable design, makes the device operation stability be poor, influences the overall detection efficiency and quality. UTILITY MODEL CONTENT
[0004] The utility model aims at providing a chip package is with leakproofness detection device to solve the problem that the traditional detection device is low in detection precision, the detection environment is unstable, the collection efficiency is low and the chip is easily damaged and the device operation stability is poor.
[0005] The utility model realizes by the following technical scheme:
[0006] A chip package is with leakproofness detection device, including detection chamber body, one side of the detection chamber body is equipped with the sleeve that communicates with the inside of the detection chamber body, the sleeve is connected with the pneumatic cylinder away from the detection chamber body side, the outer end of the pneumatic cylinder's piston rod is equipped with the piston head that matches the sleeve, when the piston head moves in the sleeve and is away from the direction of the chip, let the inside of the detection chamber body produce negative pressure, still including collection mechanism, when the leakproofness of chip is detected, the collection mechanism pushes out the chip that has been tested from the inside of the detection chamber body.
[0007] Preferably, the sleeve is provided with an opening, the collecting mechanism comprises a connecting rod provided on the piston rod and penetrating through the opening, one end of the connecting rod is connected to the piston rod, the other end of the connecting rod is connected with a sealing plate, the detection chamber body is provided with a first opening, the sealing plate is provided with a second opening matched with the first opening; when the detection is completed, the chip is pushed to fall from the first opening and the second opening during the reset of the piston head.
[0008] Preferably, the sealing plate is further provided with a buffer mechanism, the buffer mechanism comprises a stopper provided on the sealing plate, the sealing plate is divided into a first plate and a second plate, and the first plate and the second plate are connected by a second spring.
[0009] Preferably, the axis of the connecting rod is perpendicular to the axis of the sealing plate.
[0010] Preferably, the inner wall of the opening and the connecting rod are provided with a first spring connecting the connecting rod and the inner wall of the opening.
[0011] Preferably, the end of the piston head away from the piston rod is provided with a push rod.
[0012] Preferably, the connection between the detection chamber body and the sleeve is smoothly transitioned.
[0013] Preferably, the bottom of the detection chamber body is provided with a base, and the base is provided with a through hole matched with the second opening.
[0014] Compared with the prior art, the utility model has the following advantages and beneficial effects: the cooperation of the detection chamber body, the sleeve, the cylinder and the piston head of the utility model controls the generation of negative pressure, and the detection precision is greatly improved, and the interference of external factors is reduced by the moving distance and speed of the piston head. The design of the connecting rod, the sealing plate and the opening of the detection chamber body in the collecting mechanism realizes automatic collection of the chip, avoids damage to the chip caused by manual operation, and improves the collection efficiency. The buffer mechanism on the sealing plate limits the movement during detection, ensures the sealing property of the detection chamber, pushes the sealing plate after detection is completed, and makes the openings coincide to facilitate the falling of the chip, so that the detection and collection process is smooth. In addition, the base supports the device and provides a moving channel for the sealing plate, and the overall stability is enhanced. BRIEF DESCRIPTION OF DRAWINGS
[0015] The drawings described herein are used to provide further understanding of the embodiments of the utility model and constitute a part of the application, and do not constitute the limitation to the embodiments of the utility model. In the drawings:
[0016] Figure 1 It is the whole structure schematic diagram of the utility model;
[0017] Figure 2 For Figure 1 A enlarged view of the place of the utility model;
[0018] Figure 3 The structure diagram of the sealing plate of the utility model.
[0019] The represented by the reference signs are:
[0020] 10, detection chamber body, 11, first opening,
[0021] 20, sleeve, 201, first spring, 21, opening, 22, connecting rod, 23, sealing plate, 231, third opening, 232, second spring, 233, stop block,
[0022] 30, cylinder, 31, piston rod, 32, piston head, 321, second opening, 33, push rod,
[0023] 40, base, 41, perforation,
[0024] 50, chip. Specific embodiments
[0025] In order to make the purpose, technical scheme and advantages of the embodiments of the utility model clearer, the technical scheme of the embodiments of the utility model will be clearly and completely described below in combination with the drawings of the embodiments of the utility model. The "first", "second" and similar words used in the utility model do not represent any order, quantity or importance, but are only used to distinguish different components. "Include" or "contain" and similar words mean that the elements or objects before the word cover the elements or objects listed after the word and their equivalents, without excluding other elements or objects.
[0026] Embodiment 1:
[0027] As Figures 1 to 3 shown, the embodiment provides a kind of sealing detection device for chip packaging, including detection chamber body 10, the side of detection chamber body 10 is equipped with with the inside of detection chamber body 10 intercommunication sleeve 20, sleeve 20 is connected with cylinder 30 away from the side of detection chamber body 10, the outer end of piston rod 31 of cylinder 30 is equipped with with piston head 32 matching sleeve 20;Piston head 32 moves in the sleeve 20 in the direction of moving away from chip 50, let detection chamber body 10 inside produce negative pressure;It also includes collection mechanism, when the sealing of chip 50 is detected, collection mechanism is pushed out from detection chamber body 10 after chip 50 has been tested.
[0028] In the chip 50 packaging production, the traditional sealing detection device has the problems of low detection precision, low collection efficiency, easy damage to the chip 50, and poor device running stability. The scheme aims to solve these problems to improve the quality and efficiency of the chip 50 packaging sealing detection. The detection chamber body 10 provides space for chip 50 detection, the sleeve 20 connects the detection chamber body 10 and the cylinder 30, and the piston head 32 is installed at the outer end of the piston rod 31 and matched with the sleeve 20. The collection mechanism is used to push out the tested chip 50 after detection.
[0029] When working, the chip 50 is placed in the detection chamber body 10. The cylinder 30 is started, the piston rod 31 drives the piston head 32 to move in the sleeve 20 away from the chip 50, so that a negative pressure is generated in the detection chamber body 10, simulating the low pressure environment that the chip 50 faces in actual use, and judging the sealing of the chip 50 packaging by detecting whether the chip 50 leaks gas in this negative pressure environment, effectively solving the problems of low detection precision and unstable detection environment of the traditional detection device. When the detection is completed, the collection mechanism starts to work, pushing the tested chip 50 out of the detection chamber body 10, realizing automatic collection, improving the collection efficiency, and avoiding damage to the chip 50 caused by manual operation. This design makes the whole detection process efficient and stable, effectively ensuring the smooth progress of the chip 50 packaging sealing detection.
[0030] In this embodiment, the sleeve 20 is provided with an opening 21, and the collection mechanism includes a connecting rod 22 provided on the piston rod 31 and passing through the opening 21. One end of the connecting rod 22 is connected to the piston rod 31, and the other end of the connecting rod 22 is connected with a sealing plate 23. The detection chamber body 10 is provided with a first opening 11, and the sealing plate 23 is provided with a second opening 321 matched with the first opening 11. When the detection is completed, the piston head 32 is reset, pushing the chip 50 to fall from the first opening 11 and the second opening 321.
[0031] The sleeve 20 is provided with an opening 21, and the connecting rod 22 on the piston rod 31 passes through the opening 21. One end of the connecting rod 22 is connected to the piston rod 31, and the other end of the connecting rod 22 is connected to the sealing plate 23. The detection chamber body 10 is provided with a first opening 11, and the sealing plate 23 is provided with a second opening 321. When the piston head 32 is reset at the end of detection, the chip 50 is pushed to fall through the first opening 11 and the second opening 321 in turn, and the collection is completed. This structure realizes automatic collection of the chip 50, avoids manual contact with the chip 50, reduces the risk of damage to the chip 50, and improves the coherence of the detection process.
[0032] In this embodiment, the sealing plate 23 is also provided with a buffer mechanism, and the buffer mechanism includes a stop block 233 provided on the sealing plate 23. The sealing plate 23 is divided into a first plate and a second plate, and a second spring 232 is arranged between the first plate and the second plate to connect the first plate and the second plate.
[0033] When detecting, the stopper 233 and the second spring 232 limit the movement of the first plate to prevent the gas in the detection chamber from escaping; when the piston head 32 resets, the second spring 232 pushes the first plate to move, so that the first opening 11 coincides with the second opening 321, facilitating the falling of the chip 50. This buffering mechanism ensures the sealing during detection and facilitates the transfer of the chip 50 during collection.
[0034] In this embodiment, the axis of the connecting rod 22 is perpendicular to the axis of the sealing plate 23. When the connecting rod 22 moves with the piston rod 31, it can stably drive the sealing plate 23 to move vertically, ensuring that the second opening 321 on the sealing plate 23 accurately corresponds to the first opening 11 of the detection chamber body 10.
[0035] In this embodiment, the inner wall of the opening 21 and the connecting rod 22 are provided with a first spring 201 connecting the connecting rod 22 and the inner wall of the opening 21. During the movement of the piston head 32 driving the connecting rod 22, the first spring 201 plays a buffering and resetting role. When the piston head 32 moves quickly, the first spring 201 can buffer the impact force received by the connecting rod 22, avoiding damage due to excessive force; at the same time, when the piston head 32 resets, it helps the connecting rod 22 to quickly return to its original position, ensuring stable operation of the device.
[0036] In this embodiment, the end of the piston head 32 away from the piston rod 31 is provided with a push rod 33. When the piston head 32 resets to push the chip 50 after detection, the push rod 33 can apply force to ensure that the chip 50 falls smoothly through the first opening 11 and the second opening 321, improving the success rate of collection.
[0037] The length of the push rod 33 should be determined according to the depth of the detection chamber body 10 and the size of the chip 50, to ensure that it can effectively fix the chip 50 during detection and accurately apply force when pushing the chip 50. The diameter of the push rod 33 also needs to consider its strength and the force on the chip 50. Too thin may not provide enough pushing force, and too thick may cause excessive pressure on the chip 50 when fixing the chip 50. Its shape can also be diversified, such as using an arc design for the head, which can better fit the surface of the chip 50, avoid damaging the chip 50, and at the same time enhance the fixing and pushing effect.
[0038] The working process is as follows: first, the chip 50 is placed in the detection chamber body 10, the air cylinder 30 is started, the piston rod 31 drives the piston head 32 to move in the sleeve 20 away from the chip 50, so that the negative pressure is generated in the inside of the detection chamber body 10, the low pressure environment used by the chip 50 is simulated, and the detection of the sealing property of the chip 50 is performed. During the detection process, the stop block 233 and the second spring 232 of the buffer mechanism limit the first plate movement of the sealing plate 23, and prevent the detection chamber gas from escaping. After the detection is completed, the piston head 32 is reset, at this time, the second spring 232 pushes the first plate to move, so that the second opening 321 on the sealing plate 23 coincides with the first opening 11 of the detection chamber body 10, the push rod 33 at the end of the piston head 32 accurately applies force to push the chip 50, and the chip 50 sequentially passes through the first opening 11 and the second opening 321 and falls into a designated collection position through the through hole 41 of the base 40, so that the detection and collection process is completed. During the process, the first spring 201 buffers the impact force of the connecting rod 22 and assists the reset of the connecting rod 22, and the smooth transition connection ensures smooth movement of the piston head 32.
[0039] Embodiment 2
[0040] In this embodiment, the connection between the detection chamber body 10 and the sleeve 20 is smoothly transitioned. When the piston head 32 moves in the sleeve 20, the frictional resistance generated due to uneven connection can be reduced, the piston head 32 moves more smoothly, the stability of the negative pressure generation is ensured, and the service life of the piston head 32 and the sleeve 20 is prolonged.
[0041] In this embodiment, the bottom of the detection chamber body 10 is provided with the base 40, and the through hole 41 matched with the second opening 321 is arranged on the base 40. The base 40 supports the entire device and ensures smooth operation of the device. After the chip 50 falls through the first and second openings, the chip 50 can fall into a designated collection position through the through hole 41 of the base 40, and the complete collection process of the chip 50 is realized.
[0042] In actual application scenarios, the sealing property detection device for the chip 50 improves the detection accuracy through the controlled negative pressure generation mechanism. The automatic collection mechanism avoids manual contact with the chip 50, reduces the risk of damage to the chip 50, improves the collection efficiency and the coherence of the detection process. The buffer mechanism ensures the sealing property during detection and assists the smooth transfer of the chip 50 during collection. The reasonable connection and layout among the components, such as the vertical arrangement of the connecting rod 22 and the sealing plate 23, the buffer reset function of the first spring 201, the accurate force application of the push rod 33 and the smooth transition connection, improve the stability and reliability of the device operation and prolong the service life.
[0043] The above examples are only used to illustrate the technical solutions of the present disclosure, rather than limit them; although the present disclosure has been described in detail with reference to the foregoing examples, those of ordinary skill in the art should understand that they can still modify the technical solutions recorded in the foregoing examples, or make equivalent replacements for part of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the present disclosure.
Claims
1. A kind of chip package sealing detection device, comprising detection chamber body (10), characterized by, One side of the detection chamber body (10) is provided with sleeve (20) which is communicated with the inside of the detection chamber body (10), the sleeve (20) is connected with air cylinder (30) away from the detection chamber body (10), the outer end of the piston rod (31) of the air cylinder (30) is provided with piston head (32) matched with the sleeve (20);When the piston head (32) moves in the sleeve (20) and moves away from the chip (50), negative pressure is generated in the inside of the detection chamber body (10); It further includes collection mechanism, when the sealing of chip (50) is detected, the collection mechanism pushes the tested chip (50) out from the detection chamber body (10).
2. The device for detecting the sealing property of a chip package according to claim 1, wherein Openings (21) are provided on the sleeve (20), the collection mechanism includes connecting rod (22) provided on the piston rod (31) and passing through the opening (21), one end of the connecting rod (22) is connected to the piston rod (31), the other end of the connecting rod (22) is connected with sealing plate (23), first opening (11) is provided on the detection chamber body (10), second opening (321) matched with the first opening (11) is provided on the sealing plate (23);When the detection is completed, the piston head (32) is reset, and the chip (50) is pushed to fall from the first opening (11) and the second opening (321).
3. The device for detecting the sealing property of a chip package according to claim 2, wherein Buffer mechanism is further provided on the sealing plate (23), the buffer mechanism includes stop block (233) provided on the sealing plate (23), the sealing plate (23) is divided into first plate and second plate, second spring (232) is provided between the first plate and the second plate and connected with the first plate and the second plate.
4. The device for detecting the sealing property of a chip package according to claim 3, wherein The axis of the connecting rod (22) and the axis of the sealing plate (23) are perpendicular to each other.
5. The device for detecting the sealing property of a chip package according to claim 4, wherein First spring (201) is provided between the inner wall of the opening (21) and the connecting rod (22) and connected with the connecting rod (22) and the inner wall of the opening (21).
6. The device for detecting the sealing property of a chip package according to claim 5, wherein The end of the piston head (32) away from the piston rod (31) is provided with push rod (33).
7. The device for detecting the sealing property of a chip package according to claim 6, wherein The connection between the detection chamber body (10) and the sleeve (20) is smoothly transitioned.
8. The device for detecting the sealing property of a chip package according to claim 7, wherein The bottom of the detection chamber body (10) is provided with base (40), the base (40) is provided with perforation (41) matched with the second opening (321).