Chip package leak test fixture

By optimizing the structure of the chip packaging sealing test fixture, simultaneous testing of multiple chips and simplified operation were achieved, solving the problem of low testing efficiency in existing technologies and improving testing efficiency.

CN223611029UActive Publication Date: 2025-11-28ZHONGKE TONGDE MICROELECTRONICS TECHNOLOGY (DATONG) CO LTD
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Patent Information

Application Number
CN202520280411.4
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2025-02-20
Publication Date
2025-11-28
Estimated Expiration
2035-02-20

AI Technical Summary

Technical Problem

Existing chip packaging sealing test fixtures have a limited number of chips that can be tested at one time, and the chips are difficult to remove, which affects testing efficiency.

Method used

A chip packaging sealing test fixture was designed, which includes a test gas release device, a gas extraction detection device, an upper mold, a lower mold, and a fixture frame. The upper mold and the lower mold are synchronously slidable through a drive mechanism, which increases the number of sealing cavities and optimizes the chip support structure, simplifying the chip placement and removal process.

Benefits of technology

It improves the efficiency of chip sealing testing, enables the simultaneous testing of more chips, and simplifies chip placement and removal operations, saving time.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model belongs to chip packaging technical field discloses a kind of chip packaging sealing property test fixture, and the side of jig frame is equipped with driving mechanism;At least two sealing cavities are provided in the middle of lower mould and / or upper end of other side, and the bottom surface of sealing cavity is provided with through hole, and the chip support column matched with lower mould sealing cooperation is inserted in through hole, and the lower end of chip support column is connected to jig frame;The outside above sealing cavity is provided with sealing groove, and the lower end of upper mould is provided with sealing plug matched with sealing groove;Test gas release device is communicated with all sealing cavities by gas outlet pipeline, and suction detection device is communicated with the middle portion below the lower end of sealing plug by suction pipeline.The utility model places chip and takes chip conveniently;Driving mechanism can control lower mould and upper mould to be close to each other, to reduce the time of mould movement, reduce operation time, improve test efficiency.
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Description

TECHNICAL FIELD

[0001] The utility model belongs to chip packaging technical field, concretely relates to a chip packaging sealing property test fixture. BACKGROUND

[0002] At present, in order to achieve waterproof, dustproof or air leakage prevention effect, the sealing property test needs to be carried out, generally, test instrument is used to inflate and pressure maintain inside the chip, the way that gas leaks from the measured device is detected, and then the sealing property of the device is judged. The existing, such as Chinese patent announcement number: CN215492255U, the present application relates to a kind of chip packaging sealing property test fixture, it includes fixture frame, the upper surface of fixture frame is provided with lower mould, the upper surface of lower mould is provided with sealed cavity, test gas release device is arranged in the side wall of lower mould, the upper surface of fixture frame is fixed with support plate symmetrically, the top of two support plates is provided with sealed power box, the side wall of sealed power box is provided with lifting motor symmetrically, the output end of two lifting motors is provided with rotating rod, two rotating rods are fixed with two first bevel gears, the upper surface of lower mould is provided with a plurality of lifting screws rotationally, the top of a plurality of lifting screws is fixed with second bevel gear, a plurality of lifting screws are provided with upper mould, the upper surface in upper mould is provided with suction detection device, the lower surface of upper mould is provided with first sealing ring mechanism and second sealing ring mechanism, the present application has the effect of increasing the stability and life of sealed cavity.

[0003] Although the above-mentioned patent technology has the effect of increasing the stability and life of the sealed cavity, the sealing groove in the patent is located between the plurality of lifting screws, which limits the space, so that the number of chips detected at one time is limited, and it is also troublesome to take out the chips from the sealing groove, which requires a certain amount of time, and thus the test efficiency is easily affected. UTILITY MODEL CONTENTS

[0004] The utility model aims at providing a kind of chip packaging sealing property test fixture, to solve the above-mentioned problems existing in prior art.

[0005] In order to achieve the above-mentioned purpose, the utility model adopts the following technical solutions:

[0006] The utility model provides a chip package leakproofness test fixture, including test gas release device, pumping detection device and the upper die, lower die and fixture frame that install successively from top to bottom, pumping detection device installs in the upper end of upper die, one side of fixture frame is equipped with drive mechanism, is used for driving upper die and lower die through drive mechanism and is driven to the direction of approaching each other or far from each other in vertical direction synchronous sliding, the upper end of lower die middle and / or other side is equipped with at least two sealed cavities, the bottom surface of sealed cavity is provided with through -hole, and the through -hole is matched with the chip support column of sealing cooperation with lower die and is inserted, and the lower end of chip support column is connected to the fixture frame, the outside of sealed cavity above is provided with sealing groove, and the lower end of upper die is provided with the sealing plug that is matched with sealing groove, test gas release device is communicated all sealed cavities through the air outlet pipeline, and pumping detection device is communicated the middle part of the lower end of sealing plug through the air pumping pipeline.

[0007] As a preferred technical scheme in the utility model, the drive mechanism comprises a driving motor, a bidirectional screw rod and a limiting column, the driving motor is installed in the fixture frame, the lower end of the bidirectional screw rod is connected with the motor shaft of the driving motor, the lower part of the bidirectional screw rod is rotationally connected with the fixture frame, and the upper die and the lower die are respectively threadedly connected with the two ends of the bidirectional screw rod.

[0008] As a preferred technical scheme in the utility model, the limiting column is provided with two, the two limiting columns are respectively located on the two sides of the bidirectional screw rod, the upper ends of the two limiting columns are connected with a limiting block, and the upper end of the bidirectional screw rod is rotationally connected with the limiting block.

[0009] As a preferred technical scheme in the utility model, the fixture frame comprises an upper bottom plate and a lower bottom plate, the lower end of the upper bottom plate is connected with the lower bottom plate through a plurality of connecting columns, the driving motor and the test gas release device are installed on the lower bottom plate, the bidirectional screw rod is rotationally connected with the upper bottom plate, and the chip support column and the limiting column are fixedly connected with the upper bottom plate.

[0010] As a preferred technical scheme in the utility model, the upper part of the bidirectional screw rod is provided with a first external thread, the lower part of the bidirectional screw rod is provided with a second external thread, the thread direction of the first external thread is opposite to the thread direction of the second external thread, and the pitch of the first external thread is greater than the pitch of the second external thread.

[0011] As a preferred technical scheme in the utility model, the sealing groove is a conical groove extending outwardly at the upper end of the sealed cavity, the inner diameter of the conical groove gradually decreases from top to bottom, and the lower part of the sealing plug is a conical rubber plug matched with the sealed cavity.

[0012] As one preferred technical scheme in the utility model, the air outlet pipeline is a hose or a bellows, and the air outlet pipeline is in communication with one side of the sealing cavity.

[0013] As one preferred technical scheme in the utility model, the lower mold and the jig frame are connected with a telescopic sealing pipe sleeved outside the chip support column, and two ends of the telescopic sealing pipe are connected with the lower mold and the jig frame through flanges.

[0014] As one preferred technical scheme in the utility model, the telescopic sealing pipe is a bellows.

[0015] Beneficial effects: before the sealing test, the upper end face of the chip support column can be controlled to be higher than the upper end face of the lower mold, or the upper end face of the chip support column and the upper end face of the lower mold are located on the same horizontal plane, thereby facilitating the placement of the chip; after the chip is placed in place, the lower mold and the upper mold are controlled to be close to each other by the driving mechanism, thereby reducing the time of mold movement; when the sealing plug cooperates to block the sealing groove, the upper end face of the chip support column can be controlled to be located at the bottom of the sealing cavity at the same time, leaving enough space for the chip to test; after the test is completed, the driving mechanism controls the lower mold and the upper mold to be away from each other until the upper end face of the chip support column is higher than the upper end face of the lower mold, or the upper end face of the chip support column and the upper end face of the lower mold are located on the same horizontal plane, facilitating the taking of the chip, further saving the time of taking the chip, and improving the test efficiency. BRIEF DESCRIPTION OF DRAWINGS

[0016] Figure 1 It is a schematic view when the sealing plug and the sealing groove are sealed in the utility model;

[0017] Figure 2 It is a schematic view when the sealing plug and the sealing groove are separated in the utility model.

[0018] In the figure: 1-test gas release device; 2-gas extraction detection device; 3-upper mold; 4-lower mold; 5-jig frame; 6-sealing cavity; 7-chip support column; 8-sealing groove; 9-sealing plug; 10-air outlet pipeline; 11-driving motor; 12-bi-directional screw; 13-limiting column; 14-limiting block; 15-telescopic sealing pipe. DETAILED DESCRIPTION

[0019] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the present application will be briefly introduced below in combination with the drawings and the description of the embodiments or the prior art. Obviously, the following description of the drawings is only some embodiments of the present application, and for those skilled in the art, other drawings can also be obtained without creative labor on the basis of these drawings. It should be noted that the description of these embodiments is used to help understand the present application, but does not constitute a limitation on the present application.

[0020] Embodiment:

[0021] As shown in Figure 1 and Figure 2 , the present embodiment provides a chip package sealing test fixture, which comprises a test gas releasing device 1, a gas extraction detection device 2, and an upper mold 3, a lower mold 4 and a fixture frame 5 installed in turn from top to bottom. The main equipment is similar to the prior art, and the unimproved equipment in the following can refer to the prior art, such as the test gas releasing device 1 and the gas extraction detection device 2. The gas extraction detection device 2 is installed at the upper end of the upper mold 3. One side of the fixture frame 5 is provided with a driving mechanism, which is used to drive the upper mold 3 and the lower mold 4 to slide synchronously in the vertical direction towards each other or away from each other, so that the driving mechanism only occupies one side of the whole, and more space can be saved, and the chip is more convenient to take and place.

[0022] Further, at least two sealing cavities 6 are formed in the middle and / or the upper end of the other side of the lower mold 4. According to the size of the lower mold 4 and the upper mold 3, a row of sealing cavities 6 can be arranged in the middle of the lower mold 4. If the size allows, a row of sealing cavities 6 can also be arranged on the other side of the lower mold 4, so that more chips can be tested for sealing at one time, and the test efficiency is improved. The bottom surface of each sealing cavity 6 is provided with a through hole, and a chip support column 7 matched with the lower mold 4 is inserted in the through hole, which does not affect the sealing test. The lower end of the chip support column 7 is connected to the fixture frame 5, so as to ensure the stability of the chip support column 7. The outer side above the sealing cavity 6 is provided with a sealing groove 8, and the lower end of the upper mold 3 is provided with a sealing plug 9 matched with the sealing groove 8. When the two are matched, the sealing property of the sealing cavity 6 can be ensured. The test gas releasing device 1 is connected to all the sealing cavities 6 through a gas outlet pipe 10, so as to facilitate the delivery of test gas into the sealing cavities 6. The gas extraction detection device 2 is connected to the middle part below the lower end of the sealing plug 9 through a gas extraction pipe, so as to facilitate the extraction of test gas in the sealing cavities 6, and the sealing test is completed.

[0023] The utility model discloses a chip support column 7's upper end face can be controlled higher than the upper end face of lower mould 4 or the upper end face of chip support column 7 can be controlled with the upper end face of lower mould 4 on the same horizontal plane before carrying out the sealing test, and then the chip is conveniently placed, after the chip is placed in place, the lower mould 4 and upper mould 3 are controlled to be close to each other through the drive mechanism, and then the time of mould movement is reduced, when sealing plug 9 cooperates and blocks sealing groove 8, the upper end face of chip support column 7 can be controlled to be located at the bottom of sealing cavity 6 simultaneously, and enough space is left for the chip to test, after the test ends, the lower mould 4 and upper mould 3 are controlled to be away from each other through the drive mechanism again, until the upper end face of chip support column 7 is higher than the upper end face of lower mould 4 or the upper end face of chip support column 7 is controlled with the upper end face of lower mould 4 on the same horizontal plane, the chip is conveniently taken, the time of taking the chip is further saved, and the efficiency of test is improved.

[0024] As one preferred embodiment in the embodiment, it needs to be further explained that the drive mechanism includes a driving motor 11, a bidirectional screw rod 12 and a limiting column 13, the driving motor 11 is installed in the jig frame 5, the lower end of the bidirectional screw rod 12 is connected with the motor shaft of the driving motor 11, the lower part of the bidirectional screw rod 12 is rotatably connected to the jig frame 5, and the upper mould 3 and the lower mould 4 are respectively threadedly connected with the two ends of the bidirectional screw rod 12.

[0025] As one preferred embodiment in the embodiment, it needs to be further explained that the limiting column 13 is provided with two, and the two limiting columns 13 are respectively located on the two sides of the bidirectional screw rod 12, further enhancing the stability when the upper mould 3 and the lower mould 4 move, and the upper ends of the two limiting columns 13 are connected with a limiting block 14, and the upper end of the bidirectional screw rod 12 is rotatably connected to the limiting block 14, further enhancing the stability of the structure.

[0026] As one preferred embodiment in the embodiment, it needs to be further explained that the jig frame 5 includes an upper bottom plate and a lower bottom plate, the lower end of the upper bottom plate is connected with the lower bottom plate through a plurality of connecting columns, the driving motor 11 and the test gas releasing device 1 are installed on the lower bottom plate, the bidirectional screw rod 12 is rotatably connected to the upper bottom plate, and the chip support column 7 and the limiting column 13 are fixedly connected to the upper bottom plate, so that the installation of the equipment is more convenient.

[0027] As a preferred embodiment in the embodiment, it needs to be explained further that the upper part of the bidirectional screw rod 12 is provided with a first external thread, the lower part of the bidirectional screw rod 12 is provided with a second external thread, the thread direction of the first external thread is opposite to the thread direction of the second external thread, and the pitch of the first external thread is greater than the pitch of the second external thread, so that the movement of the upper mold 3 is faster, and when the machine is stopped, the upper mold 3 and the lower mold 4 can be kept at a sufficient distance as much as possible, facilitating the taking and placing of the chip.

[0028] As a preferred embodiment in the embodiment, it needs to be explained further that the sealing groove 8 is a tapered groove extending outwardly at the upper end of the sealing cavity 6, the inner diameter of the tapered groove gradually decreases from top to bottom, and the lower part of the sealing plug 9 is a tapered rubber plug matched with the sealing cavity 6 for sealing, so that the sealing property of the sealing cavity 6 can be ensured when the two are matched.

[0029] As a preferred embodiment in the embodiment, it needs to be explained further that the air outlet pipeline 10 is a hose or a bellows, the air outlet pipeline 10 is connected with one side of the sealing cavity 6, so that the length can be changed appropriately, and the lifting of the lower mold 4 is facilitated.

[0030] As a preferred embodiment in the embodiment, it needs to be explained further that the lower mold 4 and the jig frame 5 are connected with a telescopic sealing pipe 15 sleeved outside the chip support column 7, the two ends of the telescopic sealing pipe 15 are connected with the lower mold 4 and the jig frame 5 through flanges, so that the sealing property between the chip support column 7 and the lower mold 4 can be further strengthened, and preferably, sealing rings are arranged on the flanges at the upper end and the lower end of the telescopic sealing pipe 15, so that the sealing property is further strengthened.

[0031] As a preferred embodiment in the embodiment, it needs to be explained further that the telescopic sealing pipe 15 is a bellows, which is commonly used and can be purchased directly on the market, so that the cost is low and controllable.

[0032] Finally, it should be noted that the above only describes preferred embodiments of the utility model, and is not used to limit the protection scope of the utility model. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the utility model should be included in the protection scope of the utility model.

Claims

1. A chip package sealing test fixture, comprising a test gas releasing device (1), a gas extraction detection device (2), and an upper mold (3), a lower mold (4) and a fixture frame (5) installed in sequence from top to bottom, the gas extraction detection device (2) being installed at the upper end of the upper mold (3); characterized in that, The side of the jig frame (5) is provided with a driving mechanism, which is used to drive the upper die (3) and the lower die (4) to slide in the vertical direction towards each other or away from each other; the middle and / or the upper end of the other side of the lower die (4) is provided with at least two sealed cavities (6), the bottom surface of the sealed cavity (6) is provided with a through hole, the through hole is matched with a chip support column (7) which is sealed with the lower die (4), the lower end of the chip support column (7) is connected to the jig frame (5); the outer side above the sealed cavity (6) is provided with a sealing groove (8), the lower end of the upper die (3) is provided with a sealing plug (9) matched with the sealing groove (8); the test gas release device (1) is connected to all the sealed cavities (6) through the gas outlet pipeline (10), and the gas extraction detection device (2) is connected to the middle of the lower end of the sealing plug (9) through the gas extraction pipeline.

2. The chip package leak test fixture of claim 1, wherein, The driving mechanism comprises a driving motor (11), a bidirectional screw (12) and a limiting column (13), the driving motor (11) is installed in the jig frame (5), the lower end of the bidirectional screw (12) is connected with the motor shaft of the driving motor (11), the lower part of the bidirectional screw (12) is rotatably connected with the jig frame (5), and the upper die (3) and the lower die (4) are respectively threadedly connected with the two ends of the bidirectional screw (12); the lower part of the limiting column (13) is fixed on the jig frame (5), and the limiting column (13) matches the through holes of the upper die (3) and the lower die (4).

3. The chip package leak test fixture of claim 2, wherein, The limiting column (13) is provided with two, and the two limiting columns (13) are respectively located on the two sides of the bidirectional screw (12), the upper ends of the two limiting columns (13) are connected with a limiting block (14), and the upper end of the bidirectional screw (12) is rotatably connected with the limiting block (14).

4. The chip package leak test fixture of claim 2 or 3, wherein, The jig frame (5) comprises an upper bottom plate and a lower bottom plate, the lower end of the upper bottom plate is connected with the lower bottom plate through a plurality of connecting columns, the driving motor (11) and the test gas release device (1) are installed on the lower bottom plate, the bidirectional screw (12) is rotatably connected with the upper bottom plate, and the chip support column (7) and the limiting column (13) are fixedly connected with the upper bottom plate.

5. The chip package leak test fixture of claim 2 or 3, wherein, The upper part of the bidirectional screw (12) is provided with a first external thread, the lower part of the bidirectional screw (12) is provided with a second external thread, the thread direction of the first external thread is opposite to that of the second external thread, and the pitch of the first external thread is greater than that of the second external thread.

6. The chip package leak test fixture of claim 1, wherein, The sealing groove (8) is a tapered groove extending outwardly at the upper end of the sealed cavity (6), the inner diameter of the tapered groove gradually decreases from top to bottom, and the lower part of the sealing plug (9) is a tapered rubber plug matched with the sealed cavity (6).

7. The chip package leak test fixture of claim 1, wherein, The gas outlet pipeline (10) is a hose or a bellows, and the gas outlet pipeline (10) is connected with one side of the sealed cavity (6).

8. The chip package leak test fixture of claim 1, wherein, The lower die (4) and the jig frame (5) are connected with a telescopic sealing tube (15) sleeved outside the chip support column (7), and the two ends of the telescopic sealing tube (15) are respectively connected with the lower die (4) and the jig frame (5) through flanges.

9. The chip package leak test fixture of claim 8, wherein, The telescopic sealing tube (15) is a bellows.

Citation Information

Patent Citations

  • Chip packaging tightness test fixture

    CN215492255U