Integrated circuit test carrier plate

Abstract

The utility model discloses an integrated circuit test carrier plate, which comprises a test carrier plate, an aluminum oxide plate, a radiator and a crimping assembly, the radiator is fixedly connected to the bottom of the test carrier plate, the aluminum oxide plate is fixedly connected to the top of the radiator, the upper part of the aluminum oxide plate is positioned in a through frame on the test carrier plate or extends to the upper part of the through frame, and the crimping assembly is connected to the test carrier plate. The radiator comprises a heat dissipation plate, a protruding block longitudinally arranged in the middle of the heat dissipation plate and two sets of heat dissipation fins arranged on the left side and the right side of the protruding block, the multiple heat dissipation fins in each set are longitudinally arranged at intervals, and an air inlet channel used for introducing air for heat dissipation is formed in the front side of the protruding block. A plurality of air outlets which transversely penetrate through the protruding block and communicate with the air inlet channel are longitudinally formed in the protruding block at intervals, and each air outlet corresponds to a gap between every two adjacent cooling fins. By adopting the technical scheme, gas can be introduced between every two radiating fins, so that uniform cooling can be realized, and the test effect of the integrated circuit board is ensured.

Description

TECHNICAL FIELD

[0001] The utility model relates to the related technical field of circuit test especially relates to an integrated circuit test carrier board. BACKGROUND

[0002] Integrated circuit (integrated circuit) is a kind of microelectronic device or component. Using certain process, the transistor, resistance, capacitance and inductance and other components and wiring interconnection in a circuit required are interconnected together, are made on a small piece or several small pieces semiconductor wafer or dielectric substrate, then are encapsulated in a tube shell, become the microstructure with required circuit function;All components have made a whole in structure, make electronic components towards small, low power consumption, intelligent and high reliability.

[0003] Chinese patent CN216670187U discloses an integrated circuit test carrier plate, when integrated circuit board test demand is cooled, air can be quickly passed through the surface of the heat dissipation fin by opening the air extraction fan arranged on one side of the heat dissipation fin to carry out air extraction treatment on the heat dissipation fin, and the heat on the surface of the heat dissipation fin is taken away, so that the heat exchange efficiency of the heat dissipation fin on the integrated circuit board is better, and the stability of the integrated circuit board is greatly increased. The cooling mode is realized by multiple air extraction fans, but the airflow flow between the gaps of the heat dissipation fins corresponding to the air extraction fan is fast, and the airflow flow between the heat dissipation fins far away from the air extraction fan is relatively slow. When the air extraction fan is set less, the airflow between the heat dissipation fins far away from the air extraction fan may not flow, resulting in uneven heat dissipation and affecting the test effect of the integrated circuit board. Utility model content

[0004] In order to overcome the technical defects of the prior art, the purpose of the utility model is to provide an integrated circuit test carrier plate to solve the above technical problems.

[0005] The technical scheme adopted by the utility model to solve the technical problems is as follows:

[0006] According to one aspect of the utility model, design a kind of integrated circuit test carrier plate, comprising: test carrier plate, alumina plate, radiator and crimping component, the radiator is fixedly connected in the test carrier plate bottom, the alumina plate is fixedly connected in the radiator top, alumina plate upper portion is located in the through frame on test carrier plate or extends to the above-mentioned through frame, the crimping component is connected on the test carrier plate, for the integrated circuit board crimping on the alumina plate, the radiator includes heat sink, the protruding block being longitudinally arranged in the middle of heat sink and the two groups of radiating fins being arranged on the left and right sides of protruding block, the multiple radiating fins of each group are longitudinally spaced, the protruding block front side is provided with the gas inlet channel for passing into gas and carrying out heat dissipation, multiple gas outlets are longitudinally spaced on the protruding block and are transversely penetrated and communicated with the gas inlet channel, and each gas outlet corresponds to the gap between the adjacent two radiating fins.

[0007] Using the above technical scheme, by setting protruding block in the middle of radiator, and setting gas inlet channel on the front side of protruding block and longitudinally spacing multiple gas outlets on the protruding block and transversely penetrating and communicated with the gas inlet channel, and controlling each gas outlet to correspond to the gap between the adjacent two radiating fins, when gas is passed into the gas inlet channel, the gas is output from the gas outlet on the protruding block after entering the gas inlet channel, and is output from the left and right sides of the protruding block and passes through the gap between the adjacent two radiating fins, so as to take away heat and achieve cooling, since each gas outlet corresponds to the gap between the adjacent two radiating fins, gas can be passed into between every two radiating fins, so that uniform cooling can be realized, and the test effect of integrated circuit board is guaranteed.

[0008] In order to better solve the above technical defects, the utility model also has better technical schemes:

[0009] In some embodiments, the test carrier plate bottom is provided with a transverse through slot, the radiator is fixedly connected in the through slot, and the test carrier plate is provided with a relief hole corresponding to the gas inlet channel.

[0010] In some embodiments, the crimping component includes a guide rail fixedly connected on the test carrier plate top, a sliding block in transverse sliding cooperation with the guide rail, a pull-out plate in longitudinal movable insertion with a through hole on the sliding block, a pressing plate arranged below one end of the pull-out plate, and a rubber head screw matched with a threaded hole on the pull-out plate, wherein the lower end of the rubber head screw is fixedly connected with an inner shaft sleeve of a bearing, and an outer shaft sleeve of the bearing is fixedly connected on the pressing plate.

[0011] In some embodiments, a first locking member is threadedly connected on the top of the sliding block, and screwing the first locking member can make the lower end thereof abut against the pull-out plate. Thus, locking and fixing of the pull-out plate can be realized, and the position of the pressing plate for each crimping is fixed.

[0012] In some embodiments, the front side of the sliding block is threadedly connected with a second locking member, and screwing the second locking member can make one end thereof abut against the guide rail. Thus, the sliding block can be locked and fixed to prevent movement thereof, and the position of the pressing plate is fixed each time.

[0013] In some embodiments, the top of the pressing plate is fixedly connected with two sliding rods, and the two sliding rods are correspondingly slidably connected with the sliding holes on the pull plate.

[0014] In some embodiments, the bottom of the pressing plate is fixedly connected with a silica gel block. The silica gel block can prevent the integrated circuit board from being pressed.

[0015] In some embodiments, the rear side of the protruding block is also provided with air inlet channels for air inlet for heat dissipation, and the two air inlet channels extend to the middle part of the protruding block and are not communicated. BRIEF DESCRIPTION OF DRAWINGS

[0016] Figure 1 A structure schematic view of an integrated circuit test carrier plate according to one embodiment of the present application;

[0017] Figure 2 A structure schematic view of the integrated circuit test carrier plate from another perspective;

[0018] Figure 3 A structure schematic view of a heat sink;

[0019] Figure 4 A cross-sectional structure schematic view of the heat sink;

[0020] Figure 5 A structure schematic view of a heat sink on an integrated circuit test carrier plate according to another embodiment of the present application;

[0021] REFERENCE SIGNS

[0022] 1, test carrier plate; 11, avoiding hole; 2, alumina plate; 3, heat sink; 31, heat dissipation plate; 32, protruding block; 321, air inlet channel; 322, air outlet; 33, heat dissipation fin; 4, pressing assembly; 41, guide rail; 42, sliding block; 43, pull plate; 44, pressing plate; 45, glue head screw; 46, sliding rod; 5, first locking member; 6, second locking member. DETAILED DESCRIPTION

[0023] In order to make the purpose, technical scheme and advantages of the present application more clear, the present application is further described in detail below with reference to the drawings. It should be understood that the description is only exemplary and is not intended to limit the scope of the present application. In addition, in the following description, the description of the known structures and technologies is omitted to avoid unnecessary confusion of the concept of the present application.

[0024] In the description of the utility model, it needs to be understood that, when the direction description is related to, for example, the direction or position relation of the indication such as upper, lower, front, back, left, right is shown based on the direction or position relation of the drawing, only for the convenience of describing the utility model and simplifying the description, and it is not indicated or implied that the indicated device or element must have a specific direction, be constructed and operated in a specific direction, therefore it cannot be understood as the limitation of the utility model.

[0025] In the description of the utility model, unless otherwise explicitly limited, the words such as setting, installation, connection, fixation should be understood broadly, and the specific meaning of the above words in the utility model can be determined by the person skilled in the art in combination with the specific content of the technical scheme.

[0026] Embodiment one

[0027] Reference Figures 1 to 4 As shown in the utility model provides a kind of integrated circuit test carrier plate, comprising: test carrier plate 1, alumina plate 2, radiator 3 and crimping assembly 4, test carrier plate 1 has the through frame of up and down, test carrier plate 1 bottom is provided with the transverse through groove, radiator 3 is fixedly connected in the through groove, alumina plate 2 is fixedly connected in the top of radiator 3, alumina plate 2 upper part is located in the through frame on test carrier plate 1 or extends to above the through frame, crimping assembly 4 is connected on test carrier plate 1, for crimping integrated circuit board on the alumina plate 2, radiator 3 includes heat sink 31, the lug 32 of longitudinal set in the middle part of heat sink 31 and the two groups of radiating fins 33 of being set in the left and right sides of lug 32, the multiple radiating fins 33 of each group are longitudinally spaced, lug 32 front side is provided with the gas inlet passage 321 for passing into gas and carrying out heat dissipation, gas inlet passage 321 extends to the rear end of lug 32, and does not penetrate, the gas inlet end of gas inlet passage 321 is used for connecting gas inlet connector, gas inlet connector is used for being connected gas pump by gas pipe, gas is passed into gas inlet passage 321 by gas pump, test carrier plate 1 is provided with the avoidance hole 11 corresponding with gas inlet passage 321, multiple gas outlets 322 of transverse penetration and communication with gas inlet passage 321 are longitudinally spaced on lug 32, and each gas outlet 322 corresponds with the gap between adjacent two radiating fins 33.

[0028] The crimping assembly 4 is provided with one or two, and the embodiment is preferably provided with two crimping assemblies 4, which comprises a guide rail 41 fixed transversely on the top of the test board 1, a sliding block 42 in transverse sliding fit with the guide rail 41, a pull plate 43 in longitudinal movable fit with the through hole on the sliding block 42, a pressing plate 44 arranged below one end of the pull plate 43, and a rubber head screw 45 in fit with the threaded hole on the pull plate 43. One or two or three sliding blocks 42 are in sliding fit on each guide rail 41, and the embodiment is preferably two sliding blocks 42 in sliding fit on each guide rail 41. The lower end of the rubber head screw 45 is fixedly connected with the inner sleeve of a bearing, the outer sleeve of the bearing is fixedly connected with the pressing plate 44, the top of the pressing plate 44 is fixedly connected with two sliding rods 46, the two sliding rods 46 are in sliding fit with the sliding hole on the pull plate 43, the upper end of the rubber head screw 45 can drive the pressing plate 44 to move up and down by being screwed, and the bottom of the pressing plate 44 is fixedly connected with a silica gel block.

[0029] The top of the sliding block 42 is threadedly connected with a first locking piece 5, and the lower end of the first locking piece 5 is in abutment with the pull plate 43 by being screwed, so as to fix the pull plate 43. The first locking piece 5 is a bolt or a rubber head screw or a butterfly screw.

[0030] The front side of the sliding block 42 is threadedly connected with a second locking piece 6, and one end of the second locking piece 6 is in abutment with the guide rail 41 by being screwed, so as to fix the sliding block 42. The second locking piece 6 is a bolt or a rubber head screw or a butterfly screw.

[0031] Embodiment two

[0032] Reference Figure 5 As shown in the drawings, the utility model provides another integrated circuit test board, and the difference between the embodiment and the first embodiment is that the rear side of the convex block 32 is also provided with an air inlet channel 321 for the air inlet for heat dissipation, and the two air inlet channels 321 extend to the middle part of the convex block 32 and are not communicated.

[0033] The above only describes some embodiments of the utility model, and those skilled in the art can make some modifications and improvements without departing from the creative concept of the utility model, and these all belong to the protection scope of the utility model.

Claims

1. An integrated circuit test board, characterized by, The application relates to a test carrier plate, an aluminum oxide plate, a heat sink and a compression assembly, wherein the heat sink is fixed at the bottom of the test carrier plate, the aluminum oxide plate is fixed at the top of the heat sink, the upper part of the aluminum oxide plate is located in a through frame on the test carrier plate or extends above the through frame, the compression assembly is connected on the test carrier plate and is used for compressing an integrated circuit board on the aluminum oxide plate, the heat sink comprises a heat sink plate, a protrusion arranged at the middle part of the heat sink plate in the longitudinal direction and two groups of heat dissipation fins arranged at the left and right sides of the protrusion, a plurality of heat dissipation fins in each group are arranged in the longitudinal direction at intervals, the front side of the protrusion is provided with an air inlet channel for passing in gas for heat dissipation, a plurality of air outlet openings are arranged on the protrusion in the longitudinal direction at intervals and penetrate the protrusion in the transverse direction and are communicated with the air inlet channel, and each air outlet opening corresponds to the gap between two adjacent heat dissipation fins. The bottom of the test carrier plate is provided with a transversely penetrating groove, the heat sink is fixed in the penetrating groove, and the test carrier plate is provided with an avoiding hole corresponding to the air inlet channel.

2. The integrated circuit test board of claim 1, wherein, The compression assembly comprises a guide rail fixed transversely on the top of the test carrier plate, a sliding block in transversely sliding cooperation with the guide rail, a pull plate in longitudinal movable cooperation with the through hole on the sliding block, a pressing plate arranged below one end of the pull plate and a rubber head screw matched with the threaded hole on the pull plate, the lower end of the rubber head screw is fixed with the inner shaft sleeve of a bearing, and the outer shaft sleeve of the bearing is fixed on the pressing plate.

3. An integrated circuit test board according to claim 1 or 2, wherein, The top of the sliding block is screw-connected with a first locking piece, and the lower end of the first locking piece can abut against the pull plate by screwing the first locking piece.

4. The integrated circuit test board of claim 3, wherein, The front side of the sliding block is screw-connected with a second locking piece, and one end of the second locking piece can abut against the guide rail by screwing the second locking piece.

5. The integrated circuit test board of claim 3, wherein the plurality of test sockets are arranged in a plurality of rows and columns. The top of the pressing plate is fixed with two sliding rods, and the two sliding rods are in sliding cooperation with the sliding holes on the pull plate.

6. The integrated circuit test board of claim 3, wherein, The bottom of the pressing plate is fixed with a silica gel block.

7. The integrated circuit test board of claim 3, wherein the plurality of test sockets are arranged in a plurality of rows and columns. The rear side of the protrusion is also provided with air inlet channels for passing in gas for heat dissipation, the two air inlet channels extend to the middle part of the protrusion and are not communicated.

8. The integrated circuit test board of claim 1, wherein, ​

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