Contact type detection probe for defect detection of semiconductor chip

Abstract

The utility model discloses a contact type detection probe for defect detection of a semiconductor chip, which relates to the technical field of detection devices and comprises a mounting sleeve and a detection probe sealing device. A detection probe is slidably connected into the mounting sleeve; the detection probe sealing device comprises three mounting blocks, three guide rods, three positioning clamping balls and three convex blocks. The sealing device comprises a mounting sleeve, three mounting blocks, three guide rods, three positioning clamping balls, three springs and a rubber sealing ring, the three mounting blocks are circularly and fixedly connected to the surface of the mounting sleeve at equal intervals, the three guide rods are slidably connected into the three mounting blocks in a sleeved mode respectively, the three positioning clamping balls are fixedly connected to the upper ends of the three guide rods respectively, and the rubber sealing ring is extruded on the inner wall of a sealing sliding groove to complete sealing. And when the detection probe slides to any position, the rubber sealing ring can extrude the inner wall of the sealing sliding groove for sealing, so that the sealing performance of the detection probe is improved, moisture is prevented from entering the detection probe, and normal operation of the detection probe is ensured.

Description

TECHNICAL FIELD

[0001] The utility model relates to detection device technical field, especially in a kind of semiconductor chip defect detection is with contact type detection probe. BACKGROUND

[0002] Semiconductor chip, etching is carried out on semiconductor sheet, wiring, the semiconductor device made can realize certain function, not only silicon chip, common also include gallium arsenide, germanium etc. semiconductor material, in order to meet the demand on mass production, the electrical property of semiconductor must be predictable and stable, so the purity including dopant and the quality of semiconductor lattice structure must be strictly required, the application of semiconductor chip is very extensive, detection probe plays an important role when inducting detection to measured piece.

[0003] The existing semiconductor contact type detection probe is tightly attached and avoids damaging the detected object. The existing semiconductor contact type detection probe has a probe position that is elastically contractible. However, the contraction structure is usually similar to the telescopic rod structure. The detection probe is only slidingly sleeved and sealed. Since the sliding contact position is prone to gaps, the detection probe has general sealing performance. This leads to poor sealing performance of the existing semiconductor contact type detection probe. Moisture can easily enter the inside of the detection probe, causing the detection probe to fail to operate normally and affecting the normal use of the detection probe. UTILITY MODEL CONTENTS

[0004] The utility model discloses a semiconductor chip defect detection is with contact type detection probe, can solve since the sliding contact position is prone to gap, and then make detection probe sealing performance general, lead to the sealing performance of the existing semiconductor contact type detection probe is bad, moisture can easily enter the inside of detection probe, cause detection probe to fail to operate normally, the problem of affecting the normal use of detection probe.

[0005] To achieve the above object, the utility model provides the following technical scheme: a kind of semiconductor chip defect detection is with contact type detection probe, including installation sleeve and detection probe sealing device;Detection probe is slidably connected in the inside of installation sleeve;Detection probe sealing device includes three mounting blocks, three guide rods, three positioning balls, three protrusions. Three springs and rubber sealing ring, three mounting blocks are circular equidistant fixedly connected on the surface of installation sleeve, three guide rods are slidably sleeved in the inside of three mounting blocks respectively, three positioning balls are fixedly connected on the upper end of three guide rods respectively, three protrusions are circular equidistant fixedly connected on the surface of detection probe respectively, the lower end of three guide rods is fixedly connected on the top of three protrusions respectively, three springs are slidably sleeved on the surface of three guide rods respectively.

[0006] Preferably, the upper end of the spring is fixedly connected to the bottom of the mounting block, and the lower end of the spring is fixedly connected to the top of the protrusion.

[0007] Preferably, the surface of the detection probe is provided with an annular groove, the rubber sealing ring is slidably installed inside the annular groove, the inner surface of the mounting sleeve is provided with a sealing groove, and the rubber sealing ring is slidably connected inside the sealing groove.

[0008] Preferably, a connecting wire is slidably installed inside the mounting sleeve, and the lower end of the connecting wire is fixedly connected to the top of the detection probe.

[0009] Preferably, the inner surface of the mounting sleeve is circularly and equidistantly connected with four connecting shafts, and cylindrical guide blocks are fixedly connected to the inner sides of the four connecting shafts.

[0010] Preferably, the cylindrical guide block has a through hole on its surface, which extends through the interior of the cylindrical guide block, and the connecting wire is slidably installed inside the through hole.

[0011] Preferably, the cylindrical guide block has an annular groove inside, and a ball is slidably connected inside the annular groove. The ball is distributed in a circular and equidistant manner inside the annular groove, and the ball is in contact with the surface of the connecting wire.

[0012] Compared with the prior art, the beneficial effects of this utility model are:

[0013] 1. The contact-type detection probe for semiconductor chip defect detection uses a rubber sealing ring that is pressed against the inner wall of the sealing groove to complete the seal. Furthermore, the rubber sealing ring can be pressed against the inner wall of the sealing groove to seal the probe at any position, thereby improving the sealing performance of the detection probe and preventing moisture from entering the probe, ensuring the normal operation and use of the detection probe. Attached Figure Description

[0014] The present invention will be further described below with reference to the accompanying drawings and embodiments:

[0015] Figure 1 This is a schematic diagram of the overall structure of a contact-type detection probe for semiconductor chip defect detection according to this utility model;

[0016] Figure 2 This is a schematic diagram of the internal structure of the mounting sleeve of this utility model;

[0017] Figure 3 This is a schematic diagram of the surface structure of the detection probe of this utility model;

[0018] Figure 4 This is a cross-sectional structural diagram of the cylindrical guide block of this utility model.

[0019] Reference: 1, mounting sleeve; 2, detection probe; 3, mounting block; 4, guide rod; 5, positioning ball; 6, protruding block; 7, spring; 8, annular clamping groove; 9, rubber sealing ring; 10, sealing sliding groove; 11, connecting wire; 12, connecting shaft; 13, cylindrical guide block; 14, through hole; 15, annular groove; 16, rolling ball. DETAILED DESCRIPTION

[0020] This part will describe the specific embodiments of the utility model in detail, the preferred embodiments of the utility model are shown in the drawings, the role of the drawings is to supplement the description of the text part with graphics, so that people can intuitively and visually understand each technical feature and the overall technical scheme of the utility model, but it cannot be understood as the limitation of the protection scope of the utility model.

[0021] In the description of the utility model, it is understood that the orientation description, such as the orientation or position relationship of the upper, lower, front, rear, left, right and the like indicated by the drawings, is only for the convenience of describing the utility model and simplifying the description, and cannot be understood as the limitation of the utility model.

[0022] In the description of the utility model, greater than, less than, more than and the like are understood as not including the number, and above, below and the like are understood as including the number.If there is a description to the first, second, it is only used for distinguishing technical features for the purpose, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of indicated technical features or implicitly indicating the sequence of indicated technical features.

[0023] In the description of the utility model, unless otherwise explicitly limited, the words such as setting, installation and connection should be broadly understood, and the person skilled in the art can reasonably determine the specific meaning of the above words in the utility model according to the specific content of the technical scheme.

[0024] Please refer to Figures 1-4The utility model provides a technical scheme: a kind of semiconductor chip defect detection is with contact type detection probe, including mounting sleeve 1 and detection probe sealing device, the inside sliding connection of mounting sleeve 1 has detection probe 2, and detection probe sealing device includes three mounting blocks 3, three guide rods 4, three positioning ball 5, three lugs 6.Three springs 7 and rubber sealing ring 9, three mounting blocks 3 are circular equidistance fixedly connected in the surface of mounting sleeve 1, three guide rods 4 are respectively slidingly connected in the inside of three mounting blocks 3, three positioning ball 5 are respectively fixedly connected in the upper end of three guide rods 4, three lugs 6 are respectively circular equidistance fixedly connected in the surface of detection probe 2, the lower end of three guide rods 4 is respectively fixedly connected in the top of three lugs 6, three springs 7 are respectively slidingly connected in the surface of three guide rods 4, the upper end of spring 7 is fixedly connected in the bottom of mounting block 3, the lower end of spring 7 is fixedly connected in the top of lug 6, the surface of detection probe 2 is equipped with annular clamping groove 8, and rubber sealing ring 9 is slidingly installed in the inside of annular clamping groove 8, and the inner surface of mounting sleeve 1 is equipped with sealing sliding groove 10, and rubber sealing ring 9 is slidingly connected in the inside of sealing sliding groove 10.

[0025] The detection probe is used, and mounting sleeve 1 can drive detection probe 2 to move and contact chip to detect, and after detection probe 2 contacts chip, it can slide in the inside of mounting sleeve 1 due to the pressure between chip, detection probe 2 slides and can drive three guide rods 4 to slide in the inside of three mounting blocks 3 through three lugs 6, at this time, three guide rods 4 can be used to guide and limit detection probe 2, so that detection probe 2 can slide vertically in the inside of mounting sleeve 1, lug 6 can extrude spring 7 when sliding, spring 7 can release elastic force and push lug 6 to slide, lug 6 can drive detection probe 2 to move out of the inside of mounting sleeve 1 and automatically reset, and three guide rods 4 can be limited by three positioning ball 5, so that guide rod 4 is prevented from separating from the inside of mounting block 3, when detection probe 2 slides up and down, detection probe 2 can drive rubber sealing ring 9 to slide up and down in the inside of sealing sliding groove 10 through annular clamping groove 8, at this time, rubber sealing ring 9 contacts the inner wall of sealing sliding groove 10, because rubber sealing ring 9 is soft structure, it can be deformed after extruding between rubber sealing ring 9 and the inner wall of sealing sliding groove 10, at this time, rubber sealing ring 9 can be sealed by extruding in the inner wall of sealing sliding groove 10, and rubber sealing ring 9 can extrude in the inner wall of sealing sliding groove 10 and be sealed when detection probe 2 slides to any position, improve the sealing property of the detection probe, prevent moisture from entering the inside of detection probe, ensure that detection probe operates normally, and ensure normal use of detection probe.

[0026] The inside of the mounting sleeve 1 is slidably mounted with a connecting wire 11, the lower end of the connecting wire 11 is fixedly connected to the top of the detection probe 2, the inner surface of the mounting sleeve 1 is circularly and equidistantly fixedly connected with four connecting shafts 12, the inner side of the four connecting shafts 12 is fixedly connected with a cylindrical guide block 13, the surface of the cylindrical guide block 13 is provided with a through hole 14, the through hole 14 penetrates the inside of the cylindrical guide block 13, the connecting wire 11 is slidably mounted in the inside of the through hole 14, the inside of the cylindrical guide block 13 is provided with an annular groove 15, the annular groove 15 is slidably connected with a rolling ball 16, the rolling ball 16 is circularly and equidistantly distributed in the inside of the annular groove 15, and the rolling ball 16 is in contact with the surface of the connecting wire 11.

[0027] When the detection probe 2 slides, the connecting wire 11 can slide up and down in the inside of the mounting sleeve 1, the up-and-down sliding of the connecting wire 11 can drive the rolling ball 16 to roll in the inside of the annular groove 15 through friction, the contact area between the rolling ball 16 and the connecting wire 11 is smaller, so that the friction between the rolling ball 16 and the connecting wire 11 is smaller, thereby reducing the resistance of the connecting wire 11 sliding in the inside of the cylindrical guide block 13, improving the stability of the connecting wire 11 sliding up and down in the inside of the cylindrical guide block 13, and preventing the connecting wire 11 from being stuck in the inside of the cylindrical guide block 13.

[0028] Structure description:

[0029] Mounting sleeve 1: The mounting sleeve 1 is the external structure of the whole contact detection probe, and the detection probe 2 and the connecting wire 11 are slidably connected in the inside thereof, and the surface thereof is equidistantly fixedly connected with three mounting blocks 3 and four connecting shafts 12; it provides mounting and support for the detection probe 2 and other components, and can drive the detection probe 2 to move for chip detection operation;

[0030] Detection probe 2: The detection probe 2 is slidably connected in the inside of the mounting sleeve 1, and is the core component for detecting defects of a semiconductor chip; the surface thereof is provided with an annular clamping groove 8, and when the detection probe 2 is in contact with the chip, the detection probe 2 will slide in the mounting sleeve 1 due to pressure, realizes the guiding and resetting functions through the convex block 6 and the guide rod 4, and drives the connecting wire 11 to move, cooperates with the rubber sealing ring 9 to ensure the sealing of the device;

[0031] Mounting block 3: The number of the mounting blocks 3 is three, the three mounting blocks 3 are circularly and equidistantly fixedly connected to the surface of the mounting sleeve 1, the inside thereof is slidably sleeved with the guide rod 4, provides a mounting position and a sliding track for the guide rod 4, and assists the guiding and limiting of the detection probe 2;

[0032] Guide rod 4: the number of guide rods 4 is three, three guide rods 4 are respectively sleeved in the inside of three mounting blocks 3, the upper end is fixedly connected with positioning ball 5, the lower end is fixedly connected with protrusion 6, when the detection probe 2 slides, the guide rod 4 is guided and limited in the mounting block 3, and the vertical up-and-down sliding of the detection probe 2 in the mounting sleeve 1 is guaranteed;

[0033] Positioning ball 5: the number of positioning ball 5 is three, three positioning ball 5 are respectively fixedly connected with the upper end of three guide rods 4, for limiting guide rod 4, preventing it from separating from the inside of mounting block 3, and guaranteeing the stability and reliability of the device;

[0034] Protrusion 6: the number of protrusion 6 is three, three protrusion 6 are respectively circular equidistantly fixedly connected on the surface of detection probe 2, the top is connected with guide rod 4, and the top is also connected with spring 7; When the detection probe 2 slides, the spring 7 is extruded, and the detection probe 2 is reset under the elastic force of the spring 7;

[0035] Spring 7: the number of spring 7 is three, three spring 7 are respectively sleeved on the surface of three guide rods 4, the upper end is fixedly connected with the bottom of mounting block 3, and the lower end is fixedly connected with the top of protrusion 6; When the detection probe 2 slides, the spring 7 is extruded, the elastic force of the spring 7 can be released to push the protrusion 6, and the automatic reset of the detection probe 2 is realized;

[0036] Annular clamping groove 8: annular clamping groove 8 is arranged on the surface of detection probe 2, for installing rubber sealing ring 9, and driving rubber sealing ring 9 to slide in sealing sliding groove 10 when the detection probe 2 slides up and down, so that the sealing property of the device is guaranteed;

[0037] Rubber sealing ring 9: rubber sealing ring 9 is slidably installed in the inside of annular clamping groove 8, and is slidably connected in the inside of sealing sliding groove 10; Because of the soft structure, the rubber sealing ring 9 is extruded and deformed with the inner wall of the sealing sliding groove 10, can seal the sealing sliding groove 10 when the detection probe 2 slides to any position, and prevents moisture from entering the inside of the detection probe;

[0038] Sealing sliding groove 10: sealing sliding groove 10 is arranged on the inner surface of mounting sleeve 1, cooperates with rubber sealing ring 9, guarantees the sealing property of the detection probe, and prevents moisture from affecting the normal operation of the probe;

[0039] Connecting wire 11: connecting wire 11 is slidably installed in the inside of mounting sleeve 1, and the lower end is fixedly connected with the top of detection probe 2, for transmitting detection signals, and sliding up and down in the mounting sleeve 1 when the detection probe 2 slides, and the sliding is reduced by rolling ball 16;

[0040] Connecting shaft 12: the number of connecting shaft 12 is four, four connecting shaft 12 are circular equidistantly fixedly connected on the inner surface of mounting sleeve 1, and the inside is connected with cylindrical guide block 13, so as to provide support for the cylindrical guide block 13;

[0041] Cylindrical guide block 13: the surface of the cylindrical guide block 13 is provided with a through hole 14, and an annular groove 15 is provided in the inside, which provides a sliding channel for the connecting wire 11 and reduces the sliding resistance of the connecting wire 11 through the rolling ball 16 in the annular groove 15;

[0042] Through hole 14: the through hole 14 penetrates the inside of the cylindrical guide block 13, and the connecting wire 11 is slidingly installed therein to provide a sliding path for the connecting wire 11;

[0043] Annular groove 15: the annular groove 15 is provided in the inside of the cylindrical guide block 13, and the rolling ball 16 is slidingly connected in the inside, which is circularly and equidistantly distributed in the annular groove 15 to provide an installation position and a rolling track for the rolling ball 16;

[0044] Rolling ball 16: the rolling ball 16 is circularly and equidistantly distributed in the inside of the annular groove 15, and is in contact with the surface of the connecting wire 11, which rolls when the connecting wire 11 slides up and down, reduces the friction by reducing the contact area with the connecting wire 11, improves the stability of the connecting wire 11 in the cylindrical guide block 13, and prevents it from being stuck.

[0045] The embodiments of the utility model are described in detail above combined with the drawings, but the utility model is not limited to the above-mentioned embodiments, and various changes can be made within the knowledge range possessed by ordinary skilled in the art without departing from the purpose of the utility model.

Claims

1. A contact detection probe for detecting defects in semiconductor chips, characterized in that, The utility model relates to a kind of detection probe sealing device and detection probe, which belong to detection probe sealing device and detection probe technical field. Detection probe (2) is slidably connected inside installation sleeve (1). Detection probe sealing device includes three mounting blocks (3), three guide rods (4), three positioning ball clamps (5), three lugs (6), three springs (7) and rubber sealing ring (9), three mounting blocks (3) are circularly equidistantly fixedly connected on the surface of installation sleeve (1), three guide rods (4) are slidably sleeved in the inside of three mounting blocks (3) respectively, three positioning ball clamps (5) are fixedly connected to the upper end of three guide rods (4) respectively, three lugs (6) are circularly equidistantly fixedly connected on the surface of detection probe (2) respectively, the lower end of three guide rods (4) is fixedly connected to the top of three lugs (6) respectively, three springs (7) are slidably sleeved on the surface of three guide rods (4) respectively. The upper end of the spring (7) is fixedly connected to the bottom of the mounting block (3), and the lower end of the spring (7) is fixedly connected to the top of the lug (6).

2. The contact probe for detecting defects of a semiconductor chip according to claim 1, wherein: The surface of the detection probe (2) is provided with an annular clamping groove (8), and the rubber sealing ring (9) is slidably installed in the annular clamping groove (8). The inner surface of the installation sleeve (1) is provided with a sealing sliding groove (10), and the rubber sealing ring (9) is slidably connected in the sealing sliding groove (10).

3. The contact probe for detecting defects of a semiconductor chip according to claim 1, wherein: The inside of the installation sleeve (1) is slidably provided with a connecting wire (11), and the lower end of the connecting wire (11) is fixedly connected to the top of the detection probe (2).

4. The contact probe for detecting defects of a semiconductor chip according to claim 1, wherein: The inner surface of the installation sleeve (1) is circularly equidistantly fixedly connected with four connecting shafts (12), and the inner side of the four connecting shafts (12) is fixedly connected with a cylindrical guide block (13).

5. The contact probe for detecting defects of a semiconductor chip according to claim 4, wherein: The surface of the cylindrical guide block (13) is provided with a through hole (14) penetrating through the inside of the cylindrical guide block (13), and the connecting wire (11) is slidably installed in the through hole (14).

6. The contact probe for detecting defects of a semiconductor chip according to claim 5, wherein: The inside of the cylindrical guide block (13) is provided with an annular groove (15), and the inside of the annular groove (15) is slidably connected with a rolling ball (16), which is circularly equidistantly distributed in the inside of the annular groove (15), and the rolling ball (16) is in contact with the surface of the connecting wire (11).

7. The contact probe for detecting defects of a semiconductor chip according to claim 6, wherein: ​

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