Water-cooling heat dissipation device for electronic product

Abstract

The utility model discloses a water-cooling heat dissipation device for an electronic product, and the device comprises an upper cover which comprises a refrigerant cooling plate and two heat dissipation supports, the refrigerant cooling plate is provided with at least two groups of flow channels for accommodating refrigerants and a plurality of heating assemblies communicated with the flow channels, and the two ends of the refrigerant cooling plate are provided with an outlet and an inlet which are opposite and are communicated with the flow channels; the guide pipes are arranged at the outlet and the inlet, and a supporting frame is arranged at the upper end of each guide pipe; the condenser is arranged on the supporting frame, side frames are arranged on the two sides of the condenser, and the condenser comprises at least two cooling flow channels, a plurality of heat conduction plates and a plurality of heat dissipation amplification pieces; the refrigerant cooling plate comprises a first-layer bottom plate, a second-layer composite plate, a third-layer metal plate and a fourth-layer top plate which are overlapped with one another, the refrigerant is gasified and the condenser is cooled into a liquid state through a heat source of the heating component, and circulation is generated by utilizing a siphon principle and a pressure difference.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of heat dissipation devices, in particular to an electronic product water-cooled heat dissipation device. BACKGROUND

[0002] The heat dissipation device commonly used in electronic products or Internet of Things or monitoring systems or warehouse management or inventory management on the market is mainly provided with high-level CPU and GPU components on an aluminum extrusion, a plurality of fins are arranged on the top and side of the aluminum extrusion, the heat source of the high-level CPU and GPU components is conducted to the fins with increased heat dissipation area, and the heat source of the fins is taken away by air through the contact of the fins with air. Since the fins are used for static heat dissipation, the heat dissipation effect is poor. In order to quickly dissipate the heat source of the fins to the air, a powerful fan is installed on the fins of the aluminum extrusion, the fan blows strong wind to the fins and the aluminum extrusion with the fins arranged around the periphery, increasing the cost of the heat dissipation device and the energy consumption. The aluminum extrusion with the fins arranged on the top and around the periphery and the fan arranged on the top increase the cost of using the components and easily increase the failure probability of the fan. The aluminum extrusion in contact with the high-level CPU and GPU to conduct the heat source has the same poor effect, which greatly reduces the practicability, which is the place that the industry and consumers want to break through. SUMMARY

[0003] To solve the above-mentioned problems of the prior art, the main purpose of the present application is to provide an electronic product water-cooled heat dissipation device, which comprises an upper cover, a conduit and a condenser. The upper cover comprises a refrigerant cold plate and heat dissipation supports arranged on both sides of the refrigerant cold plate. The refrigerant cold plate is provided with flow channels and a plurality of heat generating components in communication with the flow channels. The refrigerant cold plate is provided with an outlet and an inlet in communication with the flow channels and has a conduit at the upper end. The upper end of the conduit is connected to the condenser in communication with the conduit, so as to overcome the difficulties in the prior art.

[0004] The secondary purpose of the present application is to provide an electronic product water-cooled heat dissipation device, which uses the heat generating components to heat the low-temperature liquid refrigerant in the flow channels to absorb heat and vaporize. The liquid refrigerant rises to the condenser through the conduit and is cooled to a liquid state. The siphon principle and pressure difference are used to circulate the liquid refrigerant into the flow channels of the refrigerant cold plate through the opposite conduit to absorb the heat source of the heat generating components.

[0005] Another purpose of the present application is to provide an electronic product water-cooled heat dissipation device, which effectively improves the convenience of use, does not need to use energy-consuming fans, dissipates heat quickly and reduces the cost.

[0006] The present application aims to solve the problem of the general market common electronic product or Internet of Things or monitoring system or warehouse management or inventory management and the like heat sink, which mainly has high-order CPU and GPU components on the aluminum extrusion type. The aluminum extrusion type is provided with multiple fins on the upper side and the side, or the fins are additionally provided with a powerful fan, and the heat source of the high-order CPU and GPU components is in contact with the aluminum extrusion type, and is conducted to the fins with increased heat dissipation area, or is blown by the powerful fan, and the heat source is taken away by the fins or the powerful fan. The heat dissipation effect is not good. The fins or the powerful fan are provided on the upper end of the aluminum extrusion type, which increases the cost of the heat sink and the cost of using the components, and the energy consumption is higher, and the fan failure probability is easy to occur, which greatly reduces the practicability.

[0007] The technical means for solving the problem is to achieve the above purpose. The present application provides an electronic product water cooling heat dissipation device, comprising:

[0008] An upper cover comprises a refrigerant cold plate and two heat dissipation supports. The refrigerant cold plate is provided with the heat dissipation supports on both sides. The refrigerant cold plate is provided with at least two groups of flow channels containing refrigerant. The refrigerant cold plate is provided with multiple heat generating components in communication with the flow channels. The two ends of the refrigerant cold plate are staggered and provided with an outlet and an inlet opposite to each other and in communication with the flow channels.

[0009] Multiple pipes are respectively provided at the outlet and the inlet of the refrigerant cold plate of the upper cover. The upper end of the pipe is provided with a support frame in communication with the outlet and the inlet.

[0010] A condenser is provided on the support frame of the pipe. The condenser is provided with a side frame between the two sides and the upper end of the refrigerant cold plate. The condenser comprises at least two cooling flow channels, multiple heat conducting plates and multiple heat dissipation expansion pieces. The two ends of the cooling flow channel are closed and respectively provided with a support frame in communication with the pipe. The heat conducting plates are provided with a support frame in communication with the pipe. The heat dissipation expansion pieces are connected to each other and provided with a support frame in communication with the pipe.

[0011] The heat generating components are heated to make the flow channel low-temperature liquid refrigerant absorb heat and vaporize. The refrigerant rises to the condenser and is cooled to a liquid state by the pipe. The refrigerant is circulated into the flow channel of the refrigerant cold plate by the principle of siphon and pressure difference.

[0012] Further optimization of the technical scheme is that the heat dissipation fins are provided on the outer side of the heat dissipation support of the upper cover.

[0013] Further optimization technical solutions for, the present application the refrigerant cold plate system includes a first layer of bottom plate, a second layer of composite plate, a third layer of metal plate and a fourth layer of top plate, the second layer of composite plate and the third layer of metal plate are provided with at least two groups of refrigerant containing flow channel, the fourth layer of top plate is provided with the outlet and the inlet and communicated with the flow channel of the second layer of composite plate and the third layer of metal plate.

[0014] Further optimization technical solutions for, the third layer of metal plate of the present application refrigerant cold plate is but not limited to aluminum plate.

[0015] Further optimization technical solutions for, the present application the upper cover is but not limited to metal upper cover.

[0016] Further optimization technical solutions for, the present application the metal upper cover is but not limited to aluminum extrusion upper cover.

[0017] Further optimization technical solutions for, the first layer of bottom plate, the second layer of composite plate, the third layer of metal plate and the fourth layer of top plate of the present application refrigerant cold plate are superimposed by brazing technology.

[0018] Further optimization technical solutions for, the present application the heat generating component is but not limited to vehicle-mounted electronic device heat generating component, computer peripheral device heat generating component, other computer peripheral device heat generating component and control device heat generating component.

[0019] Compared with the prior art, the present application includes the upper cover, the conduit, the condenser, the upper cover includes the refrigerant cold plate and the heat dissipation support arranged on both sides of the refrigerant cold plate, the refrigerant cold plate is provided with the flow channel and a plurality of heat generating components communicated with the flow channel, the refrigerant cold plate is provided with the outlet and the inlet communicated with the flow channel and has the conduit at the upper end, the upper end of the conduit is connected and provided with the condenser communicated with the conduit; further achieve, the heat generating component is heated to make the flow channel low temperature liquid refrigerant absorb heat and gasify, rise to the condenser through the conduit and become liquid by cooling, use siphon principle and generate pressure difference through the relative conduit descending cycle into the flow channel of the refrigerant cold plate to absorb the heat source of the heat generating component; effectively improve the convenience, do not need to use energy-consuming fan, heat dissipation is fast and can reduce the cost, which can greatly expand the utilization of industry and has novelty and progressiveness. BRIEF DESCRIPTION OF DRAWINGS

[0020] Figure 1 It is a perspective exploded view of the present application.

[0021] Figure 2 It is a perspective assembly view of the present application.

[0022] Figure 3 It is a combined sectional view of the present application.

[0023] Figure 4: Another combined profile view of the present invention.

[0024] Figure 5 : The heat generated by the heat generating component of the present invention vaporizes the coolant, which rises and flows through the outlet of the conduit into the cooling flow channel of the condenser, and then cools down to a liquid state and flows into another conduit, and then drops into the inlet to reach the coolant cold plate, which uses the siphon principle and pressure difference to generate circulation.

[0025] Figure 6 : Another profile view of the present invention, in which the coolant vaporizes and cools down to a liquid state when heated.

[0026] Figure 7 : The present invention is a heat dissipation support with fins. Figure 2

[0027] Among them,

[0028] 1…Upper cover

[0029] 11…Coolant cold plate

[0030] 110…Heat generating component

[0031] 111…First layer of bottom plate

[0032] 112…Second layer of composite plate

[0033] 1120…Flow channel

[0034] 113…Third layer of metal plate

[0035] 114…Fourth layer of top plate

[0036] 1141…Outlet

[0037] 1142…Inlet

[0038] 12…Heat dissipation support

[0039] 121…Fins

[0040] 2…Conduit

[0041] 21…Support frame

[0042] 3…Condenser

[0043] 31…Cooling flow channel

[0044] 32…Thermal conductive plate

[0045] 33…Heat dissipation expansion piece. DETAILED DESCRIPTION

[0046] ​With reference to the drawings of the embodiments of the present application, the technical solutions in the embodiments of the present application will be described clearly and completely. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments of the present application. Based on the embodiments of the present application, all the other embodiments obtained by those skilled in the art without creative work are within the scope of protection of the present application.

[0047] Please refer to Figure 1 、 Figure 2 、 Figure 3 、 Figure 4 and Figure 5 、 Figure 6 and Figure 7 , which are the exploded view of the present application, the assembled view of the present application, the assembled cross-sectional view of the present application, another assembled cross-sectional view of the present application, and the embodiment view of the present application, showing that the heat generated by the heat dissipation assembly causes the refrigerant to vaporize and rise, enter the cooling flow channel of the condenser through the outlet, flow through the conduit, become liquid state through heat dissipation, and then flow into another conduit, drop into the inlet, reach the refrigerant cold plate, and circulate by using the siphon principle and pressure difference. Figure 2 The electronic product water-cooling heat dissipation device of the present application includes an upper cover 1, a plurality of conduits 2, and a condenser 3 in a preferred embodiment.

[0048] The aforementioned upper cover 1 includes a refrigerant cold plate 11 and two heat dissipation supports 12. The refrigerant cold plate 11 is provided with the heat dissipation supports 12 on both sides. The refrigerant cold plate 11 is provided with at least two groups of flow channels 1120 for containing refrigerant. The refrigerant cold plate 11 is also provided with a plurality of heat generating components 110 which communicate with the flow channels 1120. In this embodiment, the heat generating components 110 are high-order CPUs or GPUs, but the present application is not limited thereto. The refrigerant cold plate 11 is provided with an outlet 1141 and an inlet 1142 which are opposite to each other and communicate with the flow channels 1120 at both ends. The heat dissipation supports 12 of the upper cover 1 are provided with a plurality of heat dissipation fins 121 (such as Figure 7The heat dissipation fin 121 is a fin in this embodiment, but the present application is not limited thereto. The refrigerant cold plate 11 includes a first layer bottom plate 111, a second layer composite plate 112, a third layer metal plate 113, and a fourth layer top plate 114, which are laminated. The second layer composite plate 112 and the third layer metal plate 113 are provided with at least two groups of flow channels 1120 for accommodating refrigerant. The fourth layer top plate 114 is provided with an outlet 1141 and an inlet 1142, which are in communication with the flow channels 1120 of the second layer composite plate 112 and the third layer metal plate 113. The third layer metal plate 113 of the refrigerant cold plate 11 is an aluminum plate in this embodiment. However, the present application is not limited thereto. The upper cover 1 is a metal upper cover in this embodiment, but the present application is not limited thereto. The metal upper cover is an aluminum extrusion upper cover in this embodiment, but the present application is not limited thereto. The first layer bottom plate 111, the second layer composite plate 112, the third layer metal plate 113, and the fourth layer top plate 114 of the refrigerant cold plate 11 are laminated by brazing technology (as shown in Figure 1 、 Figure 2 、 Figure 3 、 Figure 4 The heat generating component 110 is a vehicle-mounted electronic device heat generating component, a computer peripheral device heat generating component, another computer peripheral device heat generating component, and a control device heat generating component in this embodiment, but the present application is not limited thereto. The vehicle-mounted electronic device of the vehicle-mounted electronic device heat generating component can be, for example, an electric vehicle charging management device, an autonomous driving computer management device, an intelligent vehicle fleet management device, a vehicle police management device, a mass transportation tool movement and passenger information management device, and a commercial vehicle intelligent cockpit device, but the present application is not limited thereto. The computer peripheral device of the computer peripheral device heat generating component can be, for example, a mainframe computer, an industrial computer, a personal computer, a laptop computer, and a server, but the present application is not limited thereto. The other computer peripheral device of the other computer peripheral device heat generating component can be, for example, a point of sale (POS) system, a kiosk, a vending machine, a digital electronic billboard, and an autonomous mobile robot, but the present application is not limited thereto. The control device of the control device heat generating component can be, for example, a mobile vehicle license plate recognition control device, a vehicle face recognition control device, an outdoor image monitoring device, an agricultural condition (soil humidity, temperature, light, air quality, etc.) collection and monitoring device, a livestock condition (environmental conditions of livestock farms, animal behavior health status, etc.) collection and monitoring device, and an intelligent factory automation control device, but the present application is not limited thereto.

[0049] The plurality of conduits 2 are respectively arranged at the outlet 1141 and the inlet 1142 of the refrigerant cold plate 11 of the upper cover 1. The upper end of the conduit 2 is provided with a support frame 21 in communication with the outlet 1141 and the inlet 1142 (as shown inFigure 1 、 Figure 2 、 Figure 3 、 Figure 4 .

[0050] The condenser 3 is arranged on the support frame 21 of the conduit 2, and is connected to the upper end of the condenser 3 through a side frame 30. The condenser 3 comprises at least two cooling flow channels 31, a plurality of heat-conducting plates 32, and a plurality of heat-dissipation expansion pieces 33. The cooling flow channels 31 are closed at both ends and are arranged across the support frame 21 of the conduit 2. The heat-conducting plates 32 are sleeved at both ends of the cooling flow channels 31. The heat-dissipation expansion pieces 33 are connected to the heat-conducting plates 32 in pairs (as shown in Figure 1 、 Figure 2 、 Figure 3 、 Figure 4 ); the heat generated by the heat-generating component 110 causes the flow channel 1120 to absorb heat and vaporize the low-temperature liquid refrigerant, which rises to the condenser 3 through the conduit 2 and is cooled to a liquid state. The siphon principle and pressure difference are used to circulate the flow channel 1120 of the condenser 3 downward relative to the conduit 2 and enter the flow channel 1120 of the condenser 3 (as shown in Figure 5 、 Figure 6 ).

[0051] The present application comprises the upper cover 1, the conduit 2, and the condenser 3. The upper cover 1 comprises the condenser 3 and the heat-dissipation support frame 12 arranged on both sides of the condenser 3. The condenser 3 is internally provided with the flow channel 1120 and a plurality of heat-generating components 110 connected to the flow channel 1120. The condenser 3 is provided with the outlet 1141 and the inlet 1142 connected to the flow channel 1120 and is provided with the conduit 2 at the upper end. The conduit 2 is connected to the condenser 3 at the upper end. The heat generated by the heat-generating component 110 causes the flow channel 1120 to absorb heat and vaporize the low-temperature liquid refrigerant, which rises to the condenser 3 through the conduit 2 and is cooled to a liquid state. The siphon principle and pressure difference are used to circulate the flow channel 1120 of the condenser 3 downward relative to the conduit 2 and enter the flow channel 1120 of the condenser 3 to absorb the heat source of the heat-generating component 110. The use convenience is effectively improved, and the energy-consuming fan is not required. The heat dissipation is rapid, and the cost is reduced. The industrial utilization is greatly expanded, and the novelty and progressiveness are achieved.

[0052] As can be seen from the above, the present application has achieved the desired effects after breaking through the previous technology, and is not easily thought of by those skilled in the art. Furthermore, the present application has not been disclosed before the application, and has novelty and progressiveness, which has met the application requirements of the invention patent.

Claims

1. An electronic product water cooling heat dissipation device, characterized in that, The application relates to a heat dissipation device, which comprises the following parts: an upper cover, which comprises a refrigerant cooling plate and two heat dissipation supports, the refrigerant cooling plate is provided with the heat dissipation supports on both sides, the refrigerant cooling plate is provided with at least two groups of flow channels for containing refrigerant, the refrigerant cooling plate is provided with a plurality of heat generating components which are in communication with the flow channels, and the refrigerant cooling plate is provided with an outlet and an inlet which are opposite to each other and in communication with the flow channels at both ends; a plurality of pipes, which are respectively arranged at the outlet and the inlet of the refrigerant cooling plate of the upper cover, and the pipes are provided with supports which are in communication with the outlet and the inlet at the upper ends; a condenser, which is arranged at the supports of the pipes, and the condenser is provided with side supports between both sides and the upper end of the refrigerant cooling plate, the condenser comprises at least two cooling flow channels, a plurality of heat conducting plates and a plurality of heat dissipation expansion pieces, the cooling flow channels are closed at both ends and are arranged in communication with the supports of the pipes, the heat conducting plates are sleeved at both ends of the cooling flow channels, and the heat dissipation expansion pieces are arranged in connection with the heat conducting plates which are opposite to each other. The heat generating components are heated to make the flow channels absorb heat and gasify the refrigerant in liquid state, the refrigerant is raised to the condenser in liquid state through the pipes, and the refrigerant is circulated into the flow channels of the refrigerant cooling plate through the pipes by siphon principle and pressure difference.

2. The electronic product water-cooling heat dissipation device according to claim 1, wherein, The heat supports of the upper cover are provided with a plurality of heat dissipation fins outside.

3. The electronic product water-cooling heat dissipation device according to claim 1, wherein, The heat generating components are but not limited to heat generating components of vehicle-mounted electronic devices, computer peripheral devices, other computer peripheral devices and control devices.

4. The electronic product water-cooling heat dissipation device according to claim 1 or 2 or 3, characterized in that, The refrigerant cooling plate comprises a first layer of bottom plate, a second layer of composite plate, a third layer of metal plate and a fourth layer of top plate, the second layer of composite plate and the third layer of metal plate are provided with at least two groups of flow channels for containing refrigerant, and the fourth layer of top plate is provided with the outlet and the inlet and is in communication with the flow channels of the second layer of composite plate and the third layer of metal plate.

5. The electronic product water-cooling heat dissipation device according to claim 4, wherein, The third layer of metal plate of the refrigerant cooling plate is but not limited to an aluminum plate.

6. The electronic product water-cooling heat dissipation device according to claim 1, wherein, The upper cover is but not limited to a metal upper cover.

7. The electronic product water-cooling heat dissipation device according to claim 6, wherein, The metal upper cover is but not limited to an aluminum extrusion upper cover.

8. The electronic product water-cooling heat dissipation device according to claim 4, wherein, The first layer of bottom plate, the second layer of composite plate, the third layer of metal plate and the fourth layer of top plate of the refrigerant cooling plate are overlapped through a brazing technology.

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