Film coating equipment for semiconductor processing

Abstract

The utility model discloses coating equipment for semiconductor processing, which comprises a workbench, the top of the workbench is provided with two clamping assemblies, the two clamping assemblies are symmetrically distributed left and right, and each clamping assembly comprises a fixed plate, a rotating plate, a side electric rod, a clamping plate and a soft cushion, the bottom of the fixing plate is fixedly connected with the workbench, a rotating plate is rotationally connected to the fixing plate, a side electric rod is fixedly connected to the side, away from the fixing plate, of the rotating plate, a clamping plate is fixedly connected to the side, away from the rotating plate, of the side electric rod, and a soft cushion is fixedly connected to the side, away from the side electric rod, of the clamping plate. A motor is fixedly connected to the right side wall of the fixing plate on the right side. By arranging the collecting box, the upper filter screen, the lower filter screen, the connecting pipe and the sucking pump, when coating is carried out, the sucking pump is started, coating dust on the upper portion can be received, and therefore redundant coating materials are collected in a centralized mode, and the coating materials are saved.

Description

TECHNICAL FIELD

[0001] The utility model relates to the technical field of semiconductor processing, specifically is a kind of plating equipment for semiconductor processing. BACKGROUND

[0002] Semiconductor refers to the conductivity performance between conductor and insulator at room temperature, and semiconductor is applied in integrated circuit, consumer electronics, communication system, photovoltaic power generation, illumination, high-power power conversion and other fields.Semiconductor plating is one of the key steps in semiconductor manufacturing process, and its purpose is to deposit thin film of specific material on wafer surface to form various functional layers of semiconductor device.

[0003] In the existing semiconductor plating process, a large amount of plating dust will be generated, which will not only cause waste of plating material, but also cause harm to human body when escaping in the air. UTILITY MODEL CONTENT

[0004] The utility model aims at providing a kind of plating equipment for semiconductor processing, when plating, start air suction pump, can receive upper plating dust, thereby the surplus plating material is collected in concentration, saves plating material, when plating, main electric lever can be started, glass cover is moved down, thereby semiconductor and plating device are protected inside, reduce the overflow of dust in plating process, thereby improve the security of plating.

[0005] To achieve the above purpose, a kind of plating equipment for semiconductor processing is provided, comprising: workbench, the top of the workbench is provided with clamping assembly, the number of the clamping assembly is provided with two, and it is symmetrically distributed left and right, the clamping assembly includes fixed plate, rotating plate, side electric lever, clamping plate and soft pad, the bottom of the fixed plate is fixedly connected with workbench, the rotating plate is rotatably connected on the fixed plate, the side electric lever is fixedly connected on the side of the rotating plate away from the fixed plate, the clamping plate is fixedly connected on the side of the side electric lever away from the rotating plate, the soft pad is fixedly connected on the side of the clamping plate away from the side electric lever, the right side The right side wall of the fixed plate is fixedly connected with motor, the left side output end of the motor is fixedly connected with the rotating plate, the top of the workbench is fixedly connected with collecting box, the inside of the collecting box is fixedly connected with upper filter screen and lower filter screen, the mesh number of the lower filter screen is twice that of the upper filter screen, the bottom of the collecting box is fixedly connected with connecting pipe, the bottom of the connecting pipe is fixedly connected with air suction pump, the top of the workbench is provided with glass cover, the inside top surface of the glass cover is provided with sliding groove, the sliding groove is slidably connected with sliding block The bottom of the sliding block is fixedly connected with upper electric lever, the bottom of the upper electric lever is fixedly connected with moving plate, the bottom of the moving plate is fixedly connected with plating spray head, the right side wall of the sliding block is fixedly connected with top electric lever, the inside top surface of the glass cover is fixedly connected with main electric lever.

[0006] According to the coating equipment for semiconductor processing, the bottom of the main electric rod is fixedly connected with the workbench, the number of the main electric rods is four, and the main electric rods are symmetrically distributed at the four corner positions inside the glass cover.

[0007] According to the coating equipment for semiconductor processing, the right side of the top electric rod is fixedly connected with the glass cover.

[0008] According to the coating equipment for semiconductor processing, the clamping assemblies and the collecting box are located inside the glass cover, and the collecting box is located between the two clamping assemblies.

[0009] According to the coating equipment for semiconductor processing, the connecting pipe is located inside the workbench, and the top of the air suction pump is fixedly connected with the workbench.

[0010] According to the coating equipment for semiconductor processing, the coating nozzle is located above the collecting box, and the coating nozzle is connected with the external coating equipment through a hose.

[0011] According to the coating equipment for semiconductor processing, the bottom of the workbench is fixedly connected with the support, the number of the support is four, and the support is symmetrically distributed at the four corner positions of the workbench.

[0012] Compared with the prior art, the coating equipment for semiconductor processing has the beneficial effects that:

[0013] 1. By arranging the collecting box, the upper filter screen, the lower filter screen, the connecting pipe and the air suction pump, when coating, the air suction pump is started to collect the coating dust above, so that the excess coating material is collected and the coating material is saved.

[0014] 2. By arranging the glass cover, the sliding groove, the sliding block, the upper electric rod, the moving plate, the coating nozzle, the top electric rod and the main electric rod, when coating, the main electric rod is started to move the glass cover downward, so that the semiconductor and the coating device are protected inside, the dust overflow in the coating process is reduced, and the safety of the coating is improved.

[0015] Additional aspects and advantages of the present application will be given in part in the following description, will become apparent from the following description, or will be learned by practice of the present application. BRIEF DESCRIPTION OF DRAWINGS

[0016] The present application will be further described below in combination with the drawings and examples.

[0017] Figure 1 It is a front view of the coating equipment for semiconductor processing.

[0018] Figure 2The utility model provides a clamping assembly structure diagram of coating equipment for semiconductor processing,

[0019] Figure 3 The utility model provides a glass cover section view of coating equipment for semiconductor processing,

[0020] Figure 4 The utility model provides a collection box section view of coating equipment for semiconductor processing.

[0021] In the drawing: 1, workbench, 2, fixed plate, 3, rotating plate, 4, side electric lever, 5, clamping plate, 6, soft pad, 7, motor, 8, collection box, 9, upper filter screen, 10, lower filter screen, 11, connecting pipe, 12, air suction pump, 13, glass cover, 14, sliding slot, 15, sliding block, 16, upper electric lever, 17, moving plate, 18, coating nozzle, 19, top electric lever, 20, main electric lever, 21, support column. DETAILED DESCRIPTION

[0022] The technical solutions in the embodiments of the utility model will be clearly and completely described below with reference to the drawings in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of the utility model.

[0023] Please refer to Figures 1-4 The utility model provides a technical scheme: a coating equipment for semiconductor processing, include: workbench 1, the top of workbench 1 is provided with clamping assembly, the quantity of clamping assembly is provided with two, and left and right symmetrical distribution, clamping assembly includes fixed plate 2, rotating plate 3, side electric lever 4, clamping plate 5 and soft pad 6, the bottom of fixed plate 2 is fixedly connected with workbench 1, rotating plate 3 is pivotally connected on fixed plate 2, the side fixedly connected with side electric lever 4 of rotating plate 3 away from fixed plate 2, the side fixedly connected with clamping plate 5 of side electric lever 4 away from rotating plate 3, the side fixedly connected with soft pad 6 of clamping plate 5 away from side electric lever 4, the right side wall of right fixed plate 2 is fixedly connected with motor 7, and the left side output end of motor 7 is fixedly connected with rotating plate 3, places the semiconductor between two soft pads 6, starts side electric lever 4 and clamps the middle semiconductor, when starting motor 7, can make two rotating plates 3 and middle semiconductor rotate, thereby conveniently carrying out uniform coating.

[0024] The top of the workbench 1 is fixedly connected with a collecting box 8, the inside of the collecting box 8 is fixedly connected with an upper filter screen 9 and a lower filter screen 10, the mesh number of the lower filter screen 10 is twice that of the upper filter screen 9, the bottom of the collecting box 8 is fixedly connected with a connecting pipe 11, the bottom of the connecting pipe 11 is fixedly connected with a suction pump 12, the connecting pipe 11 is located in the inside of the workbench 1, the top of the suction pump 12 is fixedly connected with the workbench 1, when the suction pump 12 is started, the excess material during the upper film coating can be collected, and the material is saved.

[0025] The top of the workbench 1 is provided with a glass cover 13, the glass cover 13 is provided with air holes, the inside top surface of the glass cover 13 is provided with a sliding groove 14, the sliding groove 14 is slidably connected with a sliding block 15, the bottom of the sliding block 15 is fixedly connected with an upper electric rod 16, the bottom of the upper electric rod 16 is fixedly connected with a moving plate 17, the bottom of the moving plate 17 is fixedly connected with a film coating nozzle 18, the film coating nozzle 18 is located above the collecting box 8, the film coating nozzle 18 is connected with an external film coating equipment through a hose, the right side wall of the sliding block 15 is fixedly connected with a top electric rod 19, the right side of the top electric rod 19 is fixedly connected with the glass cover 13, the inside top surface of the glass cover 13 is fixedly connected with a main electric rod 20, when the film coating is carried out, the main electric rod 20 is started, the glass cover 13 can be moved downward, so that the inside semiconductor is sealed, at the same time, the film coating dust overflow can be reduced during the film coating, the film coating safety is improved, the top electric rod 19 is started, the sliding block 15 can be pushed to move left and right, so that the film coating nozzle 18 can be uniformly sprayed and coated.

[0026] The bottom of the main electric rod 20 is fixedly connected with the workbench 1, the number of the main electric rod 20 is four, and is symmetrically distributed at the inside four corner positions of the glass cover 13.

[0027] The clamping assembly and the collecting box 8 are located in the inside of the glass cover 13, and the collecting box 8 is located between the two clamping assemblies.

[0028] The bottom of the workbench 1 is fixedly connected with a support column 21, the number of the support column 21 is four, and is symmetrically distributed at the four corner positions of the workbench 1.

[0029] Working principle: when the film coating is carried out, the semiconductor is placed between the two soft pads 6, the side electric rod 4 is started to clamp the middle semiconductor, the main electric rod 20 is started, the glass cover 13 is moved downward, so that the inside semiconductor is sealed, the motor 7 is started, the two rotating plates 3 and the middle semiconductor are rotated, at the same time, the film coating nozzle 18 and the top electric rod 19 are started, the sliding block 15 is pushed to move left and right, so that the lower semiconductor is uniformly coated, the suction pump 12 is started, the lower semiconductor is pumped, so that the excess film coating material is collected in the collecting box 8, and the waste is reduced.

[0030] The utility model embodiment makes the detailed explanation in combination with the drawing, but the utility model is not limited to the above -mentioned embodiment, still can make various changes in the knowledge range that the person skilled in the art has possesses without departing from the utility model's tenet under the precondition that the knowledge range that the person skilled in the art has possesses.

Claims

1. A plating apparatus for semiconductor processing, comprising: The workbench (1) is characterized in that the top of the workbench (1) is provided with clamping assemblies, the number of the clamping assemblies is two, and the clamping assemblies are symmetrically distributed left and right, the clamping assembly comprises a fixed plate (2), a rotating plate (3), a side electric rod (4), a clamping plate (5) and a soft pad (6), the bottom of the fixed plate (2) is fixedly connected with the workbench (1), the rotating plate (3) is rotatably connected on the fixed plate (2), the side electric rod (4) is fixedly connected on the side of the rotating plate (3) away from the fixed plate (2), the clamping plate (5) is fixedly connected on the side of the side electric rod (4) away from the rotating plate (3), the soft pad (6) is fixedly connected on the side of the clamping plate (5) away from the side electric rod (4), the right side wall of the right side fixed plate (2) is fixedly connected with a motor (7), the left side output end of the motor (7) is fixedly connected with the rotating plate (3), the top of the workbench (1) is fixedly connected with a collection box (8), the inside of the collection box (8) is fixedly connected with an upper filter screen (9) and a lower filter screen (10), the mesh number of the lower filter screen (10) is twice that of the upper filter screen (9), the bottom of the collection box (8) is fixedly connected with a connecting pipe (11), the bottom of the connecting pipe (11) is fixedly connected with a suction pump (12), the upper side of the workbench (1) is provided with a glass cover (13), the inside top surface of the glass cover (13) is provided with a sliding groove (14), the inside of the sliding groove (14) is slidably connected with a sliding block (15), the bottom of the sliding block (15) is fixedly connected with an upper electric rod (16), the bottom of the upper electric rod (16) is fixedly connected with a moving plate (17), the bottom of the moving plate (17) is fixedly connected with a coated nozzle (18), the right side wall of the sliding block (15) is fixedly connected with a top electric rod (19), the inside top surface of the glass cover (13) is fixedly connected with a main electric rod (20).

2. The apparatus as set forth in claim 1, wherein: The bottom of the main electric rod (20) is fixedly connected with the workbench (1), the number of the main electric rod (20) is four, and the main electric rod (20) is symmetrically distributed at the four corners of the inside of the glass cover (13).

3. The apparatus as set forth in claim 1, wherein the apparatus is characterized by: The right side of the top electric rod (19) is fixedly connected with the glass cover (13).

4. The apparatus as set forth in claim 1, wherein the apparatus is characterized by: The clamping assembly and the collection box (8) are located in the inside of the glass cover (13), and the collection box (8) is located between the two clamping assemblies.

5. The apparatus as set forth in claim 1, wherein the apparatus is characterized by: The connecting pipe (11) is located in the inside of the workbench (1), and the top of the suction pump (12) is fixedly connected with the workbench (1).

6. The apparatus as set forth in claim 1, wherein: The coated nozzle (18) is located above the collection box (8), and the coated nozzle (18) is connected with an external coating equipment through a hose.

7. The apparatus as set forth in claim 1, wherein the apparatus is characterized by: The bottom of the workbench (1) is fixedly connected with a support column (21), the number of the support column (21) is four, and the support column (21) is symmetrically distributed at the four corners of the workbench (1).

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