Wafer preheating device of high-temperature injection equipment

Abstract

The utility model relates to the technical field of high-temperature injection equipment, in particular to a wafer preheating device of high-temperature injection equipment, which comprises a machine body and a first mechanical arm arranged at the shaft end of the machine body, a preheating box is fixedly connected to a base of the first mechanical arm through a connecting assembly, and a second mechanical arm is fixedly installed in the preheating box. Wherein an opening is formed in the front end of the preheating box, and the clamping end of the second mechanical arm enters and exits along the opening so as to take the wafer. By adopting the design of the preheating box, the second mechanical arm can be arranged in the preheating box for preheating in advance when the wafer is transferred; according to the technical scheme, the wafer can be heated before being conveyed to the suction cup in advance, the heating time of the wafer on the suction cup is shortened, therefore, the production efficiency is improved, under the cooperation of moving-out of the first mechanical arm and moving-in of the second mechanical arm, the wafer conveying and heating functions are achieved, and the efficiency of wafer heating operation is further improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to high temperature injection equipment technical field especially relates to a wafer preheating device of high temperature injection equipment. BACKGROUND

[0002] In the semiconductor manufacturing process, high temperature injection is a key step, which involves injecting dopants into wafers to change their electrical properties. This process is usually carried out in a high temperature injection equipment, where the heating of the wafer is crucial. Currently, the heating of the wafer mainly relies on a chuck device, which heats the wafer by contacting its bottom.

[0003] However, the existing wafer heating technology has a significant limitation: the lack of an effective preheating process. Since the chuck device directly heats the wafer without preheating it first, this results in a low efficiency of the wafer's temperature rise. This inefficient heating method not only prolongs the entire high temperature injection process, but also directly affects the production capacity. In the semiconductor manufacturing environment, which is a large-scale production environment, any factor that affects the production capacity will have a significant impact on production efficiency and cost.

[0004] Based on this, in order to improve the heating efficiency of the wafer, we propose a wafer preheating device for high temperature injection equipment. SUMMARY

[0005] The purpose of the utility model is to solve the lack of effective preheating process and other shortcomings in the prior art, and to propose a wafer preheating device for high temperature injection equipment.

[0006] In order to achieve the above purpose, the utility model adopts the following technical scheme:

[0007] A wafer preheating device for high temperature injection equipment is designed, which includes:

[0008] A machine body and a first mechanical arm mounted on the shaft end of the machine body;

[0009] A preheating box is fixedly connected to the base of the first mechanical arm through a connecting assembly, and a second mechanical arm is fixedly installed inside the preheating box;

[0010] The front end of the preheating box is open, and the clamping end of the second mechanical arm enters and exits along the opening to realize the taking and placing of the wafer, and a heating unit is installed on the top of the preheating box.

[0011] Further, the connecting assembly includes a plurality of first rods fixedly connected to the base of the first mechanical arm and a second rod connected to the preheating box;

[0012] A sleeve part is arranged at the top of the first rod, and the second rod is inserted into the sleeve part, wherein locking structures are arranged between the second rod and the sleeve part.

[0013] Further, the locking structures include positioning beads embedded on the end face of the second rod, and a plurality of positioning holes are arranged at the outer side of the sleeve part and are spaced apart from each other, and the telescopic end of the positioning bead is clamped with the positioning hole.

[0014] Further, the heating unit includes a mounting frame fixed at the top of the preheating box, the top of the preheating box is provided with a through hole in communication with the mounting frame, the inner side of the mounting frame is spaced apart and provided with a plurality of heating wires, and a shell is detachably connected to the top of the mounting frame, and a fan is mounted on the end face of the shell.

[0015] Further, the upper end of the mounting frame is provided with a surrounding part, and the surrounding part is inserted with the shell.

[0016] Further, the two sides of the surrounding part are provided with grooves, and the grooves are provided with elastic claws, and the two sides of the shell are provided with clamping grooves matched with the elastic claws.

[0017] Further, the front end of the preheating box is rotatably connected with a box door covering the opening, and a driving member is arranged at the side of the preheating box to drive the rotation of the box door.

[0018] Further, the driving member is an electric push rod pin-connected to the side of the preheating box, and the shaft end of the electric push rod is pin-connected with the side of the box door.

[0019] Further, the hand of the second mechanical arm is provided with an aluminum oxide piece.

[0020] The wafer preheating device of the high-temperature injection equipment has the beneficial effects that: in the utility model, the preheating box is designed, the second mechanical arm can be preheated in the preheating box when moving the wafer, the wafer can be heated before being conveyed to the suction cup, the heating time of the wafer on the suction cup is reduced, and the production efficiency is improved, the first mechanical arm is moved out and the second mechanical arm is moved in, the wafer conveying and heating functions are realized, and the wafer heating operation efficiency is further improved. BRIEF DESCRIPTION OF DRAWINGS

[0021] Figure 1 The utility model discloses a three-dimensional Figure 1 ;

[0022] Figure 2 The utility model discloses a three-dimensional Figure 2 ;

[0023] Figure 3 isFigure 2 A magnified structural diagram of area A;

[0024] Figure 4 This is a schematic diagram of the heating unit structure of this utility model.

[0025] In the diagram: 1. Body; 2. First robotic arm; 3. Connecting assembly; 31. First rod; 32. Second rod; 33. Sleeve section; 34. Positioning glass bead; 35. Positioning hole; 4. Preheating box; 41. Box door; 42. Drive component; 5. Second robotic arm; 51. Hand gripper; 6. Heating unit; 61. Mounting frame; 62. Heating wire; 63. Outer shell; 64. Fan; 65. Enclosure section; 66. Elastic claw; 67. Slot. Detailed Implementation

[0026] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present utility model. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments.

[0027] Reference Figures 1-4 As one embodiment of this utility model, a wafer preheating device for a high-temperature injection equipment is disclosed. Specifically, the preheating device includes a body 1 and a first robotic arm 2 installed on the shaft end of the body 1. In this embodiment, the body 1 is provided with a lifting drive mechanism for driving the shaft to rise and a rotation drive mechanism for driving the shaft to rotate. The specific structure and control principle have been disclosed in the prior art and will not be described in detail here.

[0028] A preheating box 4 is fixedly connected to the base of the first robotic arm 2 via a connecting assembly 3, and a second robotic arm 5 is fixedly installed inside the preheating box 4;

[0029] The preheating box 4 has an opening at the front end, and the gripping end of the second robotic arm 5 moves in and out along the opening to pick up and remove the wafer. A heating unit 6 is installed on the top of the preheating box 4.

[0030] In this embodiment of the invention, the heating unit 6 is used to heat the preheating box 4. When the second robotic arm 5 picks up the wafer, it can be placed in the preheating box 4 for preheating before being fed in, thereby reducing the heating time of the wafer in the subsequent process. Furthermore, in this embodiment, insulation cotton can be adhered to the inside of the preheating box 4, which can further improve its overall insulation effect. Of course, a temperature sensor can also be installed in the preheating box 4 to detect the current heating temperature in real time, so as to facilitate convenient control of the heating temperature.

[0031] In some embodiments, the connecting assembly 3 in the utility model includes a plurality of first rods 31 fixedly connected with the base of the first mechanical arm 2 and a second rod 32 connected with the preheating box 4.

[0032] The top of the first rod 31 is provided with a sleeve part 33, and the second rod 32 is inserted into the sleeve part 33, wherein locking structures are arranged between the second rod 32 and the sleeve part 33.

[0033] Specifically, in the embodiment, the first rod 31 is distributed along the side edge of the base of the first mechanical arm 2, and of course, the second rod 32 is also provided with two corresponding structures for mutual connection. In addition, in the embodiment, a sleeve part 33 is formed at the end of the first rod 31, and in the actual assembly process, the end of the second rod 32 can be inserted into the sleeve part 33 to adjust the height of the entire preheating box 4.

[0034] In a preferred embodiment, the locking structure includes a positioning glass bead 34 embedded on the end face of the second rod 32, and a plurality of positioning holes 35 are arranged on the outer side of the sleeve part 33. The telescopic end of the positioning glass bead 34 is clamped with the positioning hole 35. In the embodiment, the telescopic end of the positioning glass bead 34 is clamped with the positioning hole 35 to adjust the height of the second rod 32 and the sleeve part 33. When adjustment is needed, the telescopic end of the positioning glass bead 34 is retracted, and then the height of the preheating box 4 can be freely adjusted. When the adjustment is completed, the telescopic end of the positioning glass bead 34 is clamped with the current positioning hole 35. The operation is simple and convenient, and the convenience of assembly and adjustment is improved.

[0035] When the wafer needs to be taken out of the load lock chamber, the second mechanical arm 5 in the preheating box 4 is extended, and the height and circumferential angle of the taking are controlled by the machine body 1. Since the second mechanical arm 5 is connected to the first mechanical arm 2 through the connecting assembly 3, the second mechanical arm 5 will also rotate synchronously. After adjusting to the required height and angle, the wafer is taken out of the load lock chamber. At this time, the second mechanical arm 5 is retracted into the preheating box 4 and heated to a predetermined temperature by the heating unit 6, and then transferred to the suction cup. After injection, it is taken out of the suction cup by the first mechanical arm 2 and transmitted to the output load lock chamber.

[0036] Further, the heating unit 6 includes a mounting frame 61 fixed to the top of the preheating box 4, and the top of the preheating box 4 has a through hole communicated with the mounting frame 61. Of course, the bottom of the mounting frame 61 also has an air outlet communicated with the through hole.

[0037] The inner side of the mounting frame 61 is provided with a plurality of heating wires 62, and the top of the mounting frame 61 is detachably connected with a shell 63, and the end surface of the shell 63 is provided with a fan 64.

[0038] That is, when heating is needed, the heating wires 62 are heated, and after the heating is completed, the heat on the heating wires 62 is blown into the inside of the preheating box 4 by the fan 64, so that the heating operation of the preheating box 4 is realized.

[0039] On the basis of the above embodiment, the upper end of the mounting frame 61 is provided with a surrounding part 65, the surrounding part 65 is in a ring structure, and the surrounding part 65 is inserted with the shell 63.

[0040] The two sides of the surrounding part 65 are provided with grooves, and the grooves are provided with elastic claws 66, and the two sides of the shell 63 are provided with clamping grooves 67 matched with the elastic claws 66.

[0041] Specifically, one end of the elastic claw 66 in the embodiment is fixed in the groove, and the elastic claw 66 can be made of high-temperature-resistant plastic parts, which is deformed by bending to realize the separation of the clamping groove 67.

[0042] When assembling, the shell 63 is sleeved on the outside of the surrounding part 65 and is inserted until the elastic claw 66 is clamped on the inside of the clamping groove 67, and the connection and fixation of the shell 63 are completed, of course, when the shell 63 needs to be disassembled for maintenance and replacement of the internal heating wires 62 and other elements, one end of the elastic claw 66 can be pressed to be retracted and separated from the clamping groove 67, and the shell 63 can be pulled outwards to separate from the mounting frame 61.

[0043] In a preferred embodiment, the front end of the preheating box 4 is rotatably connected with a box door 41 covering the opening, and a driving element 42 for driving the box door 41 to rotate is arranged on the side of the preheating box 4, and in the embodiment, the box door 41 is driven to rotate by the driving element 42 to realize the automatic opening and closing of the box door 41, when the second mechanical arm 5 is extended, the box door 41 is opened, and vice versa, the box door 41 is closed to realize heat preservation.

[0044] Preferably, the driving element 42 is an electric push rod pin-connected to the side of the preheating box 4, and the shaft end of the electric push rod is pin-connected to the side of the box door 41.

[0045] It should be noted that the hand claw 51 of the second mechanical arm 5 in the embodiment is made of an aluminum oxide part, and by using the aluminum oxide part, the problem of deformation of the hand claw in the preheating box 4 after long-time heating is avoided due to the high-temperature resistance of the aluminum oxide.

[0046] In conclusion, through the design of the preheating box 4, the second mechanical arm 5 can be built-in in the preheating box 4 to preheat in advance when moving the wafer, the wafer can be heated before being conveyed to the suction disc, the heating time of the wafer on the suction disc is reduced, and thus the production efficiency is improved.

[0047] The above merely provides the preferred embodiments of the present application, but the protection scope of the present application is not limited to this. Any skilled person in the art, according to the technical scheme and the inventive concept of the present application, can make equivalent replacement or change within the technical range disclosed by the present application, which should be covered in the protection scope of the present application.

Claims

1. A wafer preheating device of a high temperature injection apparatus, characterized by, Include: Machine body (1) and first mechanical arm (2) mounted on the shaft end of the machine body (1); A preheating box (4) is fixedly connected to the base of the first mechanical arm (2) through a connecting assembly (3), and a second mechanical arm (5) is fixedly installed inside the preheating box (4); Wherein the front end of the preheating box (4) is open, and the clamping end of the second mechanical arm (5) enters and exits along the opening to realize the taking and placing of the wafer, and a heating unit (6) is installed on the top of the preheating box (4).

2. The wafer preheating device for high temperature implantation apparatus according to claim 1, wherein: The connecting assembly (3) includes a plurality of first rods (31) fixedly connected with the base of the first mechanical arm (2) and a second rod (32) connected with the preheating box (4); A sleeve part (33) is provided on the top of the first rod (31), and the second rod (32) is inserted into the sleeve part (33), wherein a locking structure is provided between the second rod (32) and the sleeve part (33).

3. The wafer preheating device for high temperature implantation apparatus according to claim 2, wherein: The locking structure includes a positioning glass bead (34) embedded on the end face of the second rod (32), a plurality of positioning holes (35) are provided on the outer side of the sleeve part (33), and the telescopic end of the positioning glass bead (34) is clamped with the positioning hole (35).

4. The wafer preheating device for high temperature implantation apparatus according to claim 2, wherein: The heating unit (6) includes a mounting frame (61) fixed on the top of the preheating box (4), and the top of the preheating box (4) has a through hole communicating with the mounting frame (61), wherein a plurality of heating wires (62) are installed on the inner side of the mounting frame (61), and an outer shell (63) is detachably connected to the top of the mounting frame (61), and a fan (64) is installed on the end face of the outer shell (63).

5. The wafer preheating apparatus of a high temperature implantation apparatus according to claim 4, wherein: The upper end of the mounting frame (61) has a surrounding part (65), and the surrounding part (65) is inserted into the outer shell (63); Wherein the two sides of the surrounding part (65) are provided with grooves, and the grooves are provided with elastic claws (66), and the two sides of the outer shell (63) are provided with clamping grooves (67) matched with the elastic claws (66).

6. The wafer preheating apparatus for high temperature implantation equipment according to claim 1, wherein: The front end of the preheating box (4) is rotatably connected with a box door (41) covering the opening, and a driving member (42) for driving the box door (41) to rotate is arranged on the side of the preheating box (4).

7. The wafer preheating apparatus of a high temperature implant apparatus according to claim 6, wherein: The driving member (42) is an electric push rod pinned to the side of the preheating box (4), and the shaft end of the electric push rod is pinned to the side of the box door (41).

8. The wafer preheating device of a high temperature injection apparatus according to any one of claims 1-7, wherein: The hand claw (51) of the second mechanical arm (5) is made of alumina.

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