Film uncovering table top, film uncovering workbench and film uncovering machine table

Abstract

The utility model relates to a film uncovering table top, a film uncovering workbench and a film uncovering machine table. The film uncovering machine bears a thinned wafer through a film uncovering workbench; the film uncovering worktable comprises a base and a film uncovering tabletop; the film uncovering table board is fixed on the base; a partial area of the top of the film uncovering table board is concave downwards to form a sinking area, the rest areas, except the sinking area, of the film uncovering table board are a central area and an edge area, suction holes are formed in the central area and the edge area, and pin holes allowing the lifting pins to pass through are further formed in the central area. Through the configuration, the contact area between the film uncovering table top and the thinned wafer is reduced, and the probability that foreign matters fall off and adhere to the film uncovering table top is also reduced, so that the risk that the wafer is cracked by the foreign matters is reduced, and the reliability and safety of film uncovering operation are improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to a semiconductor technical field, concretely relates to a kind of uncovering membrane mesa, uncovering membrane workbench and uncovering membrane machine platform. BACKGROUND

[0002] As Figure 1 As shown in the semiconductor device manufacturing process, wafer back thinning needs to be pasted film 1 on front, protect chip on wafer 2 in subsequent processing process is not damaged. After thinning, it is also necessary to remove the film 1 from wafer 2, this process is uncovering membrane or peeling film processing. When uncovering membrane, wafer 2 is placed on workbench 3, wafer 2 is supported, then, remove the film 1 on wafer 2 front. However, the mesa of workbench 3 is easy to contaminate foreign matter 4 at present stage, plus the mesa of workbench 3 and wafer 2 back are full contact, contact area is big, so that wafer 2 is easy to be foreign matter 4 and crack, especially wafer is very thin, more easily appear such problem, cause product scrap. Furthermore, due to the reasons such as missing detection, late detection, the problem cannot be discovered in time, will directly affect subsequent production process, reduce the reliability and yield of product. SUMMARY

[0003] The utility model aims at providing a kind of uncovering membrane mesa, uncovering membrane workbench and uncovering membrane machine platform, to solve the problem that wafer is damaged in prior art uncovering membrane workbench mesa due to full contact wafer back.

[0004] To achieve the above object, the utility model provides a kind of uncovering membrane mesa, the top part area of the uncovering membrane mesa is concave, forms subsided area, the rest area except the subsided area on the uncovering membrane mesa is center area and edge area, air suction hole is arranged on the edge area and the center area, and pinhole for top pin is further provided on the center area.

[0005] Optionally, the subsided area is symmetrically distributed on the two sides of the center area.

[0006] Optionally, one piece of continuous subsided area is arranged on the two sides of the center area, and / or the cross-sectional shape of the subsided area is arcuate.

[0007] Optionally, the total area of the subsided area accounts for 30% to 60% of the area of the entire uncovering membrane mesa.

[0008] Optionally, the depth of the subsided area is 1mm to 3mm.

[0009] Optionally, the maximum diameter defined by the edge of the subsided area is less than the diameter of the thinned wafer, the diameter of the thinned wafer is less than or equal to the diameter of the uncovering membrane mesa, and / or the width of the center area is greater than the width of the press roller for uncovering membrane.

[0010] Optionally, the edge of the edge region is provided with a plurality of mounting holes, each of which is provided in a stepped shape, and / or a positioning hole is arranged at the center of the bottom of the film stripping table top.

[0011] Optionally, the film stripping table top is made of ceramic or stainless steel material.

[0012] Further, based on the same inventive concept, the utility model also provides a film stripping workbench, which comprises a base and the film stripping table top of any one of the embodiments; the film stripping table top is fixed on the base.

[0013] Further, based on the same inventive concept, the utility model also provides a film stripping machine, which is provided with the film stripping workbench.

[0014] Compared with the prior art, the technical scheme provided by the utility model has at least the following beneficial effects:

[0015] The film stripping table top is concave downward in the top partial region to form a sunken region, thereby reducing the contact area between the film stripping table top and the back surface of the thinned wafer, and reducing the probability of foreign matter falling and sticking to the film stripping table top, so that the risk of continuous top cracking caused by foreign matter when the wafer contacts the film stripping table top can be reduced, and the rejection rate of semiconductor products can be further reduced; in addition, the film stripping table top reserves an edge region and a center region, and the thinned wafer can be supported and fixed through the regions, and almost no influence is generated on the original function.

[0016] If the film stripping table top is made of stainless steel material, since the surface of the stainless steel is designed as a bright surface, the film stripping table top made of stainless steel can make the inspection and cleaning work more convenient, especially the bright surface of the stainless steel is less likely to stick to foreign matter, so that the probability of the film stripping table top sticking to foreign matter can be further reduced, and the stainless steel is easier to process and manufacture than ceramic, so that the processing cost is reduced. BRIEF DESCRIPTION OF DRAWINGS

[0017] Those skilled in the art will understand that the drawings provided are for a better understanding of the utility model, and do not constitute any limitation on the scope of the utility model.

[0018] Figure 1 is a schematic diagram of a workbench for carrying a wafer to tear off a film in the prior art, and the arrow in the diagram indicates the film tearing direction;

[0019] Figure 2 is a top view of the film stripping table top according to an embodiment of the utility model;

[0020] Figure 3 is a sectional view of the film stripping table top according to an embodiment of the utility model;

[0021] Figure 4It is the schematic view of the wafer supported by the film uncovering table top when the film is uncovered.

[0022] The film uncovering table top is fixed on the base. Figures 2-4 The film uncovering table top is fixed on the base. Specific embodiments

[0023] The utility model makes further detailed instructions in combination with drawings. According to the following description, the advantages and characteristics of the utility model will be more clear. It should be noted that drawings all adopt very simplified form and all use non-precise scale, only to facilitate, clear and assist the purpose of explaining the embodiment of the utility model. It should be recognized that the relative terms such as "upper", "lower", "top", "bottom", "upper" and "lower" in the drawings can be used to describe the relationship between various elements. These relative terms are intended to cover different orientations of elements in addition to the orientation depicted in the drawings. For example, if the device is inverted relative to the view in the drawing, the element described as being "above" another element will now be below that element.

[0024] One of the purposes of the utility model is to provide a film uncovering table top, which aims at reducing the area of the film uncovering table top and the back surface of the thinned wafer, so as to realize partial contact between the film uncovering table top and the thinned wafer, thereby reducing the risk of the thinned wafer being cracked by foreign matter on the film uncovering table top, and overcoming the problem of batch cracking of the thinned wafer due to full contact in the prior art.

[0025] The second purpose of the utility model is to provide a film uncovering workbench, which comprises a film uncovering table top and a base, and the film uncovering table top is fixed on the base. Since the application does not involve improvement of the base, the base can be understood by referring to the prior art, and detailed description is not repeated here.

[0026] The third purpose of the utility model is to provide a film uncovering machine, which is provided with a film uncovering workbench, and the thinned wafer is carried by the film uncovering workbench, so as to implement film uncovering treatment on the thinned wafer.

[0027] It should be noted that the diameter and thickness of the thinned wafer are not specially required in the application, and the thinned wafer that needs to be torn by the machine can apply the film uncovering table top, the film uncovering workbench and the film uncovering machine provided by the utility model to solve the similar or same problems proposed in the application. Here, as an example, the thickness of the thinned wafer is limited to 130 μm-200 μm, but it can not be limited to this.

[0028] The application will be described in detail below with reference to the accompanying drawings.

[0029] Please refer to Figures 2 to 4 The embodiment provides a film stripping table top 10, which is concave at the top portion to form a sunken area 11. From this, the rest of the film stripping table top 10, except the sunken area 11, is a central area 12 and an edge area 13. The sunken area 11 is concave relative to the central area 12 and the edge area 13. The central area 12 and the edge area 13 are both planar portions, which can be in contact with the back surface of the thinned wafer 2 to support and fix the thinned wafer 2, while the sunken area 11 is not in contact with the back surface of the thinned wafer 2.

[0030] As can be seen, the setting of the sunken area 11 reduces the contact area between the top of the film stripping table top 10 and the back surface of the thinned wafer 2, and also reduces the probability of foreign matter falling and sticking on the film stripping table top 10, thereby reducing the risk of continuous top cracking of the wafer 2 caused by foreign matter when the wafer 2 is in contact with the film stripping table top 10. That is, because of the sunken area 11 of the film stripping table top 10, even if there is foreign matter at the wafer contact position, it will not cause continuous top cracking of the wafer 2 as in full contact. Moreover, even if foreign matter falls and sticks on the sunken area 11, the foreign matter in the sunken area 11 will not affect the wafer 2.

[0031] The film stripping table top 10 is a whole or integral structure, which is made of porous ceramic material or stainless steel. Since the processing and customization of ceramic is difficult and the processing cost is high, the stainless steel material is more preferred. The advantage of using stainless steel is that the surface of the stainless steel can present a bright and smooth effect, which is usually called bright surface. Such a bright surface is not easy to stick foreign matter, and it is easy to be observed, so the film stripping table top 10 made of stainless steel can reduce the probability of foreign matter sticking, and better solve the problem of wafer top cracking caused by foreign matter. Moreover, the foreign matter on such a bright surface is easy to be visually detected, avoiding the risk of missed detection, and at the same time, it is easy to clean, improving work efficiency.

[0032] The depth (h) of the sunken area 11 can be set according to the size of the foreign matter to ensure that the largest foreign matter in the production process will not contact the back surface of the thinned wafer 2. Preferably, the depth (h) of the sunken area 11 is 1mm-3mm, more preferably 2mm. This depth can cover most of the foreign matter sizes in actual production process, ensuring the safety and reliability of wafer thin film stripping.

[0033] The sunken area 11 can be set in one continuous piece, or multiple small sunken areas 11 can be set discretely and independently. In other words, the specific number and specific distribution of the sunken area 11 are not limited in the present application, as long as the film stripping table top 10 can ensure that the thinned wafer 2 is uniformly stressed and will not be deformed.

[0034] Preferably, the sink regions 11 are evenly distributed on the film stripping mesa 10. In the present embodiment, the sink regions 11 are symmetrically distributed on both sides of the central region 12 and have substantially the same size and shape. Preferably, one continuous sink region 11 is provided on each side of the central region 12. Such a large area is easy to manufacture. Of course, the actual implementation is not limited thereto. It should be noted that the sink regions 11 can be made in various shapes. Therefore, the cross-sectional shape includes, but is not limited to, the arc shape shown in the figure.

[0035] Preferably, the total area of the sink regions 11 accounts for 30% to 60% of the area of the film stripping mesa 10, for example, 30%, 40%, 50%, or 60%, more preferably 40% or 50%. Such a proportion can ensure that the film stripping mesa 10 provides sufficient support area for the thinned wafer 2, while minimizing the foreign matter falling and sticking to the wafer contact position. Here, the area of the film stripping mesa 10 refers to the area of the entire planar pattern when the top of the film stripping mesa 10 is not formed with the sink regions 11.

[0036] Preferably, the diameter (d) defined by the edge of the sink region 11 is smaller than the diameter of the thinned wafer 2, so as to reduce the dead area. The diameter of the thinned wafer 2 is smaller than or equal to the diameter (D) of the film stripping mesa 10. As an example, the diameter D of the film stripping mesa 10 is 220 mm, the diameter d of the sink region 11 is 186 mm, and the diameter of the thinned wafer 2 is 200 mm.

[0037] For details Figure 2 and Figure 4 The central region 12 and the edge region 13 are used to support the thinned wafer 2. In addition, the central region 12 and the edge region 13 are both provided with suction holes 14. The suction holes 14 can generate negative pressure to adsorb the wafer 2, thereby achieving the effect of fixing the wafer 2. The suction holes 14 are mostly circular holes. However, the number and diameter of the suction holes 14 are not limited by the present application. These can be adjusted and set according to actual needs, as long as the adsorption force is evenly distributed and the wafer 2 is not deformed. In addition, the suction holes 14 can also be designed with micropores to reduce the possibility of blockage and improve the stability of adsorption. Alternatively, the diameter of the suction holes 14 is 1 mm. The depth of the suction holes 14 is not limited. For example, in the present embodiment, the depth of the suction holes 14 is 8 mm.

[0038] In addition, for the edge area 13 of the film stripping mesa 10, the air suction holes 14 should be within the coverage of the wafer 2, without air leakage, to ensure the sealing. For example, in the embodiment, two circles of air suction holes 14 are arranged on the edge area 13, and the two circles of air suction holes 14 are staggered, wherein the diameter of the circle where the center of the outer circle of air suction holes 14 is located is less than the sum of the diameter of the air suction hole 14 and the diameter of the thinned wafer 2, for example, the diameter of the circle where the center of the outer circle of air suction holes 14 is located is 198 mm, the diameter of the air suction hole 14 is 1 mm, and the diameter of the wafer 2 is 200 mm.

[0039] In another aspect, the center area 12 is usually also provided with three pin holes 15 distributed in a triangular shape, each pin hole 15 is provided for a corresponding top pin, and the three top pins can lift the wafer 2, so as to facilitate the mechanical hand to take away the wafer 2. After the mechanical hand takes away the wafer 2, the top pins fall into the film stripping mesa 10.

[0040] In addition, the center area 12 can also provide good support for the rolling film tearing. As shown in Figure 4 The width (W2) of the center area 13 can be set according to the width (W1) of the pressure roller 5, and preferably W2>W1, so that the film stripping mesa 10 provides better support in the rolling film tearing area. For example, the width (W1) of the pressure roller 5 is 50 mm, and the width (W2) of the center area 12 can be set to 60 mm.

[0041] In addition, the film stripping mesa 10 of the embodiment needs to be installed on the base of the film stripping workbench. Therefore, the film stripping mesa 10 needs to be fixed on the base by a suitable fixing method, which can be bonding, bolt fixing, etc. More conveniently, bolt fixing is adopted.

[0042] As shown in Figure 2 and Figure 3 The edge of the edge area 13 is provided with a plurality of mounting holes 16, preferably four mounting holes 16, which can be mounted with bolts, and then fixed with the base. The mounting hole 16 is a through hole, and is preferably a stepped shape, so as to avoid the bolts protruding from the top of the film stripping mesa 11 and affecting the wafer.

[0043] As shown in Figure 3 Optionally, the bottom center of the film stripping mesa 10 is provided with a positioning hole 17, which is used to cooperate with the boss on the base to limit the position of the film stripping mesa 10 relative to the base, so as to ensure the accuracy of the position of the film stripping mesa 10.

[0044] Based on this, the embodiment also provides a film stripping machine, which is provided with a film stripping workbench, and the film stripping workbench comprises a base and the film stripping mesa 10 described in any embodiment, and the film stripping mesa 10 is fixed on the base.

[0045] Since the film uncovering machine and the film uncovering workbench provided by the embodiment belong to the same inventive concept as the film uncovering table top 10 provided by the embodiment, the film uncovering machine and the film uncovering workbench provided by the embodiment have all the advantages of the film uncovering table top 10 provided by the embodiment, and thus the beneficial effects of the film uncovering machine and the film uncovering workbench provided by the embodiment are not described here.

[0046] It should be understood that the above embodiments specifically disclose the features of the preferred embodiments of the present application, so that those skilled in the art can better understand the present application. Those skilled in the art should understand that, on the basis of the disclosure of the present application, the present application can be appropriately modified to achieve the same purpose and / or achieve the same advantages as the disclosed embodiments of the present application. Those skilled in the art should also realize that such similar structures do not deviate from the scope disclosed by the present application, and they can be variously changed, replaced and changed without deviating from the scope disclosed by the present application.

Claims

1. A de-masking table top, characterized in that, The top part of the film stripping table is recessed to form a sunken area, the rest of the film stripping table is a center area and an edge area, the edge area and the center area are provided with air suction holes, and the center area is further provided with a pin hole for a top pin.

2. The de-masking table top of claim 1, wherein, The sunken areas are symmetrically distributed on both sides of the center area.

3. The de-masking table top of claim 2, wherein, The center area is provided with a continuous sunken area on each side, and / or the cross-sectional shape of the sunken area is arcuate.

4. The de-masking table top of claim 1, wherein, The total area of the sunken area accounts for 30% to 60% of the area of the film stripping table.

5. The de-masking table top of claim 1, wherein, The depth of the sunken area is 1mm to 3mm.

6. The de-masking table top of claim 1, wherein, The maximum diameter defined by the edge of the sunken area is less than the diameter of a thinned wafer, the diameter of the thinned wafer is less than or equal to the diameter of the film stripping table, and / or the width of the center area is greater than the width of a pressing roller used for film stripping.

7. The de-masking table top of claim 1, wherein, The edge of the edge area is provided with a plurality of mounting holes, each of which is provided in a stepped shape, and / or the bottom center of the film stripping table is provided with a positioning hole.

8. The de-masking table top of claim 1, wherein, The film stripping table is made of ceramic or stainless steel material.

9. A de-masking station, characterized in that, A base and a film stripping table according to any one of claims 1-8 are included; the film stripping table is fixed on the base.

10. A film stripping machine, characterized by, A film stripping workbench according to claim 9 is provided.

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