Frame structure for chip bonding

Abstract

The utility model relates to a frame structure for chip bonding, and relates to the field of chip processing and manufacturing, the frame structure comprises a chip structure, a substrate and a bonding layer, the chip structure is bonded on the substrate through the bonding layer, the surface of the substrate is recessed to form groove channels, the groove channels are interwoven to form a net structure, and the groove channels are arranged in the net structure. And the bonding layer is partially embedded in the groove channel. The chip structure has the advantages that the bonding strength is enhanced in a mechanical interlocking mode, the adhesive can be better filled and embedded through the groove channels, and therefore the bonding firmness of the chip structure and the substrate is improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the chip processing manufacturing field, and particularly relates to a frame structure for chip bonding. BACKGROUND

[0002] In the semiconductor packaging technology, a chip needs to be fixed to a substrate. A traditional method is to bond the chip to the substrate by using epoxy glue, die bonding glue or UV glue, so as to achieve the fixed connection of the chip and the substrate.

[0003] In order to improve the bonding effect between the chip and the substrate, the surface of the substrate needs to be punched or roughened by using a chemical method, so that the adhesion of the glue is better, and the fixing effect of the chip is more firm. However, in some environments with large thermal expansion and cold contraction, the bonding effect is limited, and the chip is prone to cracking under vibration. CONTENT OF THE INVENTION

[0004] In order to improve the problem that the bonding effect between the chip and the substrate is limited and the chip is prone to cracking under vibration, the present application provides a frame structure for chip bonding.

[0005] The frame structure for chip bonding provided by the present application adopts the following technical scheme:

[0006] The frame structure for chip bonding comprises a chip structure, a substrate and a bonding layer. The chip structure is bonded to the substrate through the bonding layer. The surface of the substrate is concave to form groove channels. The groove channels are interwoven to form a net-shaped structure. The bonding layer is partially embedded in the groove channels.

[0007] By using the above technical scheme, the groove channels which are straightened into a net-shaped structure are formed on the surface of the substrate. The actual contact area of the bonding layer and the substrate is increased. The bonding strength is enhanced by mechanical interlocking. The groove channels enable the adhesive to be better filled and embedded, thereby improving the firmness of the bonding of the chip structure and the substrate. The groove channels are processed by concave processing in the substrate, so that the stress can be better dispersed and the stress concentration phenomenon is reduced. This structure enables the adhesive to more uniformly distribute the stress under stress, thereby improving the bonding strength.

[0008] Preferably, the groove channels are arranged perpendicular to each other to form a rectangular net-shaped structure.

[0009] By using the above technical scheme, the groove channels are regularly arranged, so that the processing of the groove channels is facilitated.

[0010] Preferably, the groove channels are arranged to cross each other to form a rhombic net-shaped structure.

[0011] By adopting the technical scheme, the recessed channels are mutually crossed to form a rhombus, the density of the net structure is increased, and the bonding strength between the bonding layer and the substrate is improved.

[0012] Preferably, the cross section of the recessed channel is rectangular.

[0013] Preferably, the cross section of the recessed channel is "U" shaped.

[0014] Preferably, the cross section of the recessed channel is "V" shaped.

[0015] Preferably, the substrate is provided with a receiving groove at the net structure, the receiving groove is located above the recessed channel, and the bonding layer is embedded in the receiving groove, so that the bonding layer forms a continuous layer connected with the chip structure and a root layer inserted in the recessed channel.

[0016] By adopting the technical scheme, when the glue is applied on the substrate, the glue flowing into the recessed channel solidifies to form a root layer, the glue located between the receiving groove and the bottom of the chip structure solidifies to form a continuous layer, and the setting of the receiving cavity can ensure that there is enough bonding layer between the chip structure and the substrate for connection, thereby improving the bonding strength of the chip structure and the substrate.

[0017] Preferably, the recessed channel is located at the position of the edge of the receiving groove.

[0018] By adopting the technical scheme, the substrate at the net structure can be conveniently cut to form the receiving groove, and the receiving groove can be conveniently processed.

[0019] In summary, the present application has at least one of the following beneficial technical effects:

[0020] 1. By providing a plurality of recessed channels which are straightened into a net structure on the surface of the substrate, the actual contact area between the bonding layer and the substrate can be increased, the bonding strength can be enhanced by mechanical interlocking, the recessed channels can make the adhesive better fill and embed, and thus the firmness of the bonding between the chip structure and the substrate is improved. The recessed channels are processed by recessing in the substrate, stress can be better dispersed, and stress concentration phenomenon is reduced. This structure can make the adhesive more uniformly distribute stress when stressed, thereby improving the bonding strength;

[0021] 2. When the glue is applied on the substrate, the glue flowing into the recessed channel solidifies to form a root layer, the glue located between the receiving groove and the bottom of the chip structure solidifies to form a continuous layer, and the setting of the receiving cavity can ensure that there is enough bonding layer between the chip structure and the substrate for connection, thereby improving the bonding strength of the chip structure and the substrate;

[0022] 3. The recessed channels are mutually crossed to form a rhombus, the density of the net structure is increased, and the bonding strength between the bonding layer and the substrate is improved. Attached Figure Description

[0023] Figure 1 This is a schematic diagram of a chip bonding frame structure according to Embodiment 1 of this application.

[0024] Figure 2 This is a top view of the substrate in this embodiment.

[0025] Figure 3 This is a schematic diagram of a chip bonding frame structure according to Embodiment 2 of this application.

[0026] Figure 4 This is a schematic diagram of a chip bonding frame structure according to Embodiment 3 of this application.

[0027] Figure 5 This is a schematic diagram of a chip bonding frame structure according to Embodiment 4 of this application.

[0028] Figure 6 This is a schematic diagram of a chip bonding frame structure according to Embodiment 5 of this application.

[0029] Explanation of reference numerals in the attached figures: 1. Chip structure; 2. Substrate; 3. Adhesive layer; 31. Continuous layer; 32. Root layer; 4. Groove channel; 5. Mesh structure; 6. Receiving groove. Detailed Implementation

[0030] The following is in conjunction with the appendix Figures 1-6 This application will be described in further detail.

[0031] This application discloses a frame structure for chip bonding.

[0032] Example 1

[0033] Reference Figure 1 , Figure 2 A chip bonding frame structure includes a chip structure 1, a substrate 2, and an adhesive layer 3. This embodiment uses a 10mm × 10mm chip as an example. The adhesive layer 3 includes, but is not limited to, one of epoxy resin, die bond adhesive, and UV adhesive. The chip structure 1 is bonded to the substrate 2 via the adhesive layer 3. A recessed channel 4 is formed on the surface of the substrate 2. In this embodiment, the recessed channel 4 has a rectangular cross-section, a depth of 20μm-30μm, and a width of 50μm-60μm. The recessed channels 4 interweave to form a mesh structure 5. In this embodiment, the recessed channels 4 are arranged perpendicularly to each other, resulting in rectangular mesh openings in the mesh structure 5. The bottom of the adhesive layer 3 is embedded within the recessed channel 4 and bonded to the substrate 2.

[0034] The implementation principle of the embodiment 1 is that the glue is first applied on the substrate 2, the recessed channels 4 with the straightened net structure 5 are opened on the surface of the substrate 2, the actual contact area of the adhesive layer 3 and the substrate 2 is increased, the adhesive strength is enhanced by the mechanical interlocking mode, the recessed channels 4 enable the adhesive to be better filled and embedded, and thus the firmness of the bonding between the chip structure 1 and the substrate 2 is improved. The recessed channels 4 are processed by the concave processing in the substrate 2, the stress can be better dispersed, and the stress concentration phenomenon is reduced. The structure can make the adhesive more uniformly distribute the stress when stressed, and thus the adhesive strength is improved.

[0035] Embodiment 2

[0036] With reference to Figure 3 , the difference between the embodiment and the embodiment 1 is that the recessed channels 4 are arranged in a cross manner, so that the mesh holes in the net structure 5 are rhombic, the acute angle of the rhombic is 45°, and the obtuse angle is 135°.

[0037] The implementation principle of the embodiment 2 is that the recessed channels 4 are arranged in a cross manner to form a rhombic, the density of the net structure 5 is increased, and the adhesive strength between the adhesive layer 3 and the substrate 2 is improved.

[0038] Embodiment 3

[0039] With reference to Figure 4 , the difference between the embodiment and the embodiment 1 is that the cross section of the recessed channel 4 in the embodiment is in a “U” shape.

[0040] Embodiment 4

[0041] With reference to Figure 5 , the difference between the embodiment and the embodiment 1 is that the cross section of the recessed channel 4 in the embodiment is in a “V” shape.

[0042] Embodiment 5

[0043] With reference to Figure 6 , the difference between the embodiment and the embodiment 1 is that the substrate 2 is provided with a receiving groove 6 at the position opposite to the chip structure 1, the depth of the receiving groove 6 is 5-10 μm, the receiving groove 6 is arranged above the recessed channel 4, the length and width of the receiving groove 6 are both smaller than the length and width of the chip structure 1, and the recessed channel 4 is located at the position of the four peripheral edges of the receiving groove 6. When the glue is applied on the substrate 2, the glue in the receiving groove 6 forms a continuous layer 31 connected with the chip structure 1, and the glue entering into the recessed channel 4 forms a root layer 32. When the glue is applied on the substrate 2, the glue flowing into the recessed channel 4 is solidified to form the root layer 32, the glue between the receiving groove 6 and the bottom of the chip structure 1 is solidified to form the continuous layer 31, and the arrangement of the receiving cavity can ensure that there is enough adhesive layer 3 between the chip structure 1 and the substrate 2 for connection, so as to improve the bonding strength between the chip structure 1 and the substrate 2.

[0044] In the process of machining the recessed channels 4 and the accommodating grooves 6, the recessed channels 4 are first milled on the substrate 2 by a milling cutter, and then the accommodating grooves 6 are milled by a milling cutter, which facilitates the cutting of the substrate 2 at the net structure 5 to form the accommodating grooves 6 and facilitates the machining of the accommodating grooves 6.

[0045] The above are preferred embodiments of the present application, and are not intended to limit the protection scope of the present application, so that: any equivalent changes made according to the structure, shape, principle of the present application should be covered within the protection scope of the present application.

Claims

1. A frame structure for die bonding, characterized by: The chip structure (1) is adhered to the substrate (2) through the adhesive layer (3), the surface of the substrate (2) is concave to form groove channels (4), the groove channels (4) are interwoven to form a mesh structure (5), and the adhesive layer (3) is partially embedded in the groove channels (4).

2. The frame structure for die bonding according to claim 1, characterized by: The groove channels (4) are arranged perpendicularly to each other to form a rectangular mesh structure (5).

3. The frame structure for die bonding according to claim 1, wherein: The groove channels (4) are arranged to cross each other to form a diamond mesh structure (5).

4. The frame structure for die bonding according to claim 2 or 3, characterized in that: The cross section of the groove channel (4) is in a rectangular shape.

5. The frame structure for die bonding according to claim 2 or 3, characterized by: The cross section of the groove channel (4) is in a "U" shape.

6. The frame structure for die bonding according to claim 2 or 3, characterized by: The cross section of the groove channel (4) is in a "V" shape.

7. The frame structure for die bonding according to Claim 1, wherein: The substrate (2) is provided with a receiving groove (6) at the mesh structure (5), the receiving groove (6) is located above the groove channel (4), the adhesive layer (3) is embedded in the receiving groove (6), so that the adhesive layer (3) forms a continuous layer (31) connected with the chip structure (1) and a root layer (32) inserted in the groove channel (4).

8. The frame structure for die bonding according to claim 7, wherein: The groove channel (4) is located at the edge of the receiving groove (6).

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