Guard ring and encapsulation structure

Abstract

The application provides a protection ring and a packaging structure, and relates to the technical field of semiconductor packaging. The protection ring comprises one or more protection bodies arranged side by side. Each protection body comprises a plurality of metal layers, and a plurality of interconnected conductive members are arranged between adjacent metal layers. At least two interconnected conductive members are provided with an electrical connecting column, and the interconnected conductive members and the electrical connecting column are electrically connected with the metal layers, respectively. A plurality of rows of interconnected conductive members are arranged on at least one side of the metal layers. The protection ring is provided with a plurality of rows of interconnected conductive members on at least one side of the metal layers, so that the structural strength of the protection ring can be improved. After the structural strength of the protection ring is improved, the design width of the protection ring can be reduced, so that the area occupied by the protection ring on the substrate can be reduced.

Description

TECHNICAL FIELD

[0001] The utility model relates to the technical field of semiconductor packaging, especially to a protection ring and packaging structure. BACKGROUND

[0002] The scribe lane plays an important role in the semiconductor manufacturing process, and it is a part of integrated circuit design, especially for large-scale integrated circuits and microelectronic devices. The scribe lane occupies a large part of the silicon wafer area, so the design of the scribe lane has a great influence on the performance of the chip and the packaging efficiency. When designing the scribe lane, a protective ring is designed to reduce the risk of damage to the chip during packaging and cutting. This is because when laser grooving and diamond knife cutting are used to cut the scribe lane, heat and mechanical stress will be generated during the material removal process. Without proper protection measures such as a protective ring, the following problems may occur:

[0003] First, thermal stress problem. At high temperatures, the difference in thermal expansion between the chip and the protective ring can cause stress accumulation. If the stress exceeds the tolerance range of the chip material, it may cause cracks and even damage the internal circuit of the chip.

[0004] Second, mechanical stress problem. The impact force during cutting may cause the chip to move or deform, especially when the diamond knife cuts through the protective ring. If the force is not properly controlled, it will directly act on the chip, causing physical damage to the chip.

[0005] Third, chip function damage problem. Incorrect cutting path or cutting too deep may touch the chip itself, causing short circuits or other forms of chip function failure.

[0006] The current protective ring has a large width to ensure sufficient structural strength to effectively protect the chip, which occupies a large area of the silicon wafer, resulting in a small effective utilization area of the silicon wafer and low chip packaging efficiency. INVENTION CONTENTS

[0007] The utility model aims to provide a protective ring and packaging structure that can reduce the width of the protective ring, reduce the volume of the protective ring, reduce the area ratio of the protective ring in the silicon wafer substrate, improve the effective utilization rate of the silicon wafer, and improve the chip packaging efficiency and packaging quality while ensuring the structural strength of the protective ring.

[0008] In the first aspect, the utility model provides a protective ring, which comprises:

[0009] One or more protective bodies arranged side by side;

[0010] Each protective body comprises multiple metal layers, and multiple interconnected conductive members are arranged between adjacent metal layers.

[0011] At least two of the interconnecting conductive members are provided with an electrical connecting column; the interconnecting conductive members and the electrical connecting column are electrically connected with the metal layer respectively.

[0012] A plurality of rows of the interconnecting conductive members are provided on at least one side of the metal layer.

[0013] In an optional embodiment, the plurality of rows of the interconnecting conductive members at least include a first conductive member and a second conductive member arranged side by side, the first conductive member includes a plurality of first conductive sections arranged at intervals, and a first gap is formed between adjacent first conductive sections; the second conductive member includes a plurality of second conductive sections arranged at intervals, and a second gap is formed between adjacent second conductive sections; the first gap and the second gap are arranged in a staggered manner.

[0014] In an optional embodiment, the first gap and the second gap are provided with a buffer portion.

[0015] In an optional embodiment, the buffer portion is made of an oxide or a non-metallic medium material, and is used to separate a plurality of the first conductive sections or a plurality of the second conductive sections.

[0016] In an optional embodiment, the metal layers are arranged in a staggered manner along a first direction, and the protective body includes a first sub-portion, a connecting portion and a second sub-portion connected in sequence along the first direction;

[0017] The first sub-portion and the second sub-portion each include a plurality of metal layers and the interconnecting conductive members and the electrical connecting columns arranged between the metal layers; the connecting portion includes the interconnecting conductive members and the electrical connecting columns for connecting the metal layers of the first sub-portion and the metal layers of the second sub-portion;

[0018] In the first sub-portion, at least one side is provided with a plurality of rows of the interconnecting conductive members.

[0019] In an optional embodiment, at least one side of the connecting portion is provided with a plurality of rows of the interconnecting conductive members, and the plurality of rows of the interconnecting conductive members in the connecting portion and the plurality of rows of the interconnecting conductive members in the first sub-portion are located on the same side.

[0020] In an optional embodiment, in the first sub-portion, the number of the interconnecting conductive members and the number of the electrical connecting columns are greater than or equal to 3:2.

[0021] In an optional embodiment, in the connecting portion, the number of the interconnecting conductive members and the number of the electrical connecting columns are greater than or equal to 2:1.

[0022] In an optional embodiment, two protective bodies arranged side by side along a second direction are included, and a plurality of rows of the interconnecting conductive members located on one side of the metal layer are arranged side by side along the second direction.

[0023] In a second aspect, the utility model provides a kind of packaging structure, including substrate, chip and the protection ring as any preceding embodiment, the protection ring is located on the substrate, the chip is located in the protection ring;Cutting path is formed between adjacent the protection ring;The side of the protection ring close to the cutting path is equipped with multiple rows of the interconnection conductive piece.

[0024] The protection ring provided by the utility model embodiment has the beneficial effects of the packaging structure, which includes:

[0025] The protection ring provided by the utility model embodiment has the beneficial effects of the packaging structure, which includes:

[0026] The packaging structure provided by the utility model embodiment includes the above protection ring, which is beneficial to reduce the area ratio of the protection ring in the substrate, improve the effective utilization rate of the substrate and the chip packaging efficiency. BRIEF DESCRIPTION OF DRAWINGS

[0027] In order to more clearly illustrate the specific embodiments of the utility model or the technical solutions in the prior art, the following will briefly introduce the drawings needed to be used in the specific embodiments or prior art description. Obviously, the drawings described below are some embodiments of the utility model, and those skilled in the art can also obtain other drawings according to these drawings without creative labor.

[0028] Figure 1 A structural schematic view of the protection ring provided by the utility model embodiment is shown in the figure.

[0029] Figure 2 A structural schematic view of the protection body of the protection ring provided by the utility model embodiment is shown in the figure.

[0030] Figure 3 A structural schematic view of the protection ring provided by the utility model embodiment is shown in the figure.

[0031] Figure: 100-protection ring;10-protection body;110-metal layer;120-interconnection conductive piece;121-first conductive piece;122-first gap;123-second conductive piece;124-second gap;130-electricity column;141-first part;142-connection part;143-second part. DETAILED DESCRIPTION

[0032] In order to make the purpose, technical scheme and advantages of the embodiments of the present application clearer, the technical scheme of the embodiments of the present application will be described clearly and completely below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, rather than all the embodiments. The components of the embodiments of the present application described and shown in the drawings can be arranged and designed in various different configurations.

[0033] Therefore, the following detailed description of the embodiments of the present application provided in the drawings is not intended to limit the scope of the claimed present application, but only represents selected embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative labor fall within the scope of the present application.

[0034] It should be noted that: similar reference numbers and letters represent similar items in the following drawings, therefore, once an item is defined in one drawing, it does not need to be further defined and explained in subsequent drawings.

[0035] In the description of the present application, it should be noted that the orientations or positional relationships indicated by the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. are based on the orientations or positional relationships shown in the drawings, or the orientations or positional relationships in which the product of the present application is usually placed, and are only for the convenience of describing the present application and simplifying the description, and therefore cannot be understood as indicating or implying that the indicated device or element must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the present application. In addition, the terms "first", "second", "third", etc. are only used for differentiation in description, and cannot be understood as indicating or implying relative importance.

[0036] In addition, the terms "horizontal", "vertical", "overhanging", etc. do not mean that the components must be absolutely horizontal or overhanging, but can be slightly inclined. For example, "horizontal" only means that its direction is relatively more horizontal than "vertical", and does not mean that the structure must be completely horizontal, but can be slightly inclined.

[0037] In the description of the present application, it should also be noted that, unless otherwise explicitly specified and limited, the terms "arrangement", "installation", "connection", "connection" should be understood broadly, for example, it can be fixedly connected, or it can be detachably connected, or integrally connected; it can be mechanically connected, or it can be electrically connected; it can be directly connected, or it can be indirectly connected through an intermediate medium; it can be the communication inside two elements. For those of ordinary skill in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0038] Some embodiments of the present application will be described in detail with reference to the drawings. In the case of no conflict, the following examples and features in the examples can be combined with each other.

[0039] The protective ring provided by the embodiment of the present application is applied in a semiconductor packaging structure, and plays a protective role on elements such as chips in a cutting process, and reduces the risk of damage of the chips in the cutting process.

[0040] In combination Figure 1 The protective ring 100 provided by the embodiment of the present application includes one or more protective bodies 10 arranged side by side. The protective body 10 can be one, two, three, four or more, which is not specifically limited here. It should be understood that the more the number of protective bodies 10 is, the greater the structural strength is, but the overall area occupied is also larger. In the present embodiment, the protective ring 100 includes two protective bodies 10 arranged side by side, and the structure of each protective body 10 is substantially the same. It can not only meet the requirement of structural strength and effectively protect the chip, but also has a smaller overall area occupied, and more effective packaging space is reserved for the substrate.

[0041] In combination Figure 2 And Figure 3 Each protective body 10 includes a plurality of metal layers 110, and a plurality of interconnection conductive pieces 120 are arranged between adjacent metal layers 110. At least two interconnection conductive pieces 120 are provided with an electrically connected column 130. The interconnection conductive piece 120 and the electrically connected column 130 are respectively electrically connected with the metal layer 110. It can be understood that the interconnection conductive piece 120 is a metal wire for forming a conductive path, and can realize signal or power transmission between structures in the same layer in the packaging structure. The electrically connected column 130 is a longitudinal metal column, which can realize power or signal transmission in different layer structures. Here, the different layers can be signal transmission between two adjacent metal layers 110 or two non-adjacent metal layers 110.

[0042] Optionally, in some embodiments, the interconnection conductive piece 120 and the electrically connected column 130 in the protective ring can be connected with the ground end of the chip circuit through the metal layer 110, thereby playing a role of grounding enhancement, which is beneficial to realize electrostatic discharge or enhance the effect of electromagnetic shielding.

[0043] Optionally, from Figure 1As viewed from the illustrated perspective, the plurality of metal layers 110 are spaced apart in a first direction, i.e. in a height direction. One end of the interconnection conductive member 120 is electrically connected to one of the two adjacent metal layers 110, and the other end of the interconnection conductive member 120 is electrically connected to the other of the two adjacent metal layers 110. One end of the electrical connecting column 130 is electrically connected to one of the metal layers 110 in the plurality of metal layers 110, and the other end of the electrical connecting column 130 is electrically connected to the other of the metal layers 110 in the plurality of metal layers 110. The plurality of interconnection conductive members 120 are spaced apart in a second direction. The electrical connecting column 130 is arranged between two interconnection conductive members 120, and a plurality of electrical connecting columns 130 are spaced apart in the second direction. The second direction is perpendicular to the first direction.

[0044] It should be noted that the number of electrical connecting columns 130 is set according to actual needs, and the electrical connecting column 130 can be arranged only between a group of adjacent interconnection conductive members 120, or can be arranged between a plurality of groups of adjacent interconnection conductive members 120.

[0045] A plurality of rows of interconnection conductive members 120 are arranged on at least one side of the metal layer 110. It can be understood that the plurality of rows of interconnection conductive members 120 on one side include two rows, three rows, four rows, or more rows of interconnection conductive members 120. In order to improve the structural strength, no electrical connecting column 130 is arranged in the plurality of rows of interconnection conductive members 120. The plurality of rows of interconnection conductive members 120 can be arranged only on one side of the metal layer 110, which can be any side, or a plurality of rows of interconnection conductive members 120 can be arranged on both sides of the metal layer 110.

[0046] As Figure 2 In the embodiment, three rows of interconnection conductive members 120 are arranged. A single row of interconnection conductive members 120 is arranged on one side (left side of the illustrated perspective) of the metal layer 110, and two rows of interconnection conductive members 120 are arranged on the other side (right side of the illustrated perspective) of the metal layer 110, and no electrical connecting column 130 is arranged between the two rows of interconnection conductive members 120 on the right side. The electrical connecting column 130 is arranged between the single row of interconnection conductive members 120 on the left side and the plurality of rows of interconnection conductive members 120 on the right side. The number of rows of interconnection conductive members 120 can be flexibly designed, such as four rows, five rows, or more.

[0047] Optionally, four rows of interconnection conductive members 120 are arranged. One row on the left side, one row in the middle, and two rows on the right side. The electrical connecting column 130 can be arranged between the interconnection conductive member 120 on the left side and the interconnection conductive member 120 in the middle, or between the interconnection conductive member 120 in the middle and the interconnection conductive member 120 on the right side, or an electrical connecting column 130 is arranged between the interconnection conductive member 120 on the left side and the interconnection conductive member 120 in the middle, and between the interconnection conductive member 120 in the middle and the interconnection conductive member 120 on the right side.

[0048] Optionally, as Figure 3The same side of the plurality of rows of interconnection conductive members 120 at least includes side-by-side first conductive members 121 and second conductive members 123. The first conductive members 121 include a plurality of first conductive sections arranged at intervals, and first gaps 122 are formed between adjacent first conductive sections. The second conductive members 123 include a plurality of second conductive sections arranged at intervals, and second gaps 124 are formed between adjacent second conductive sections. The first gaps 122 and the second gaps 124 are arranged in a staggered manner. In this way, stress buffering can be achieved, and the extension of micro-cracks caused by cutting to the inside of the chip can be effectively blocked.

[0049] Optionally, the first gaps 122 and the second gaps 124 are provided with buffer portions. The buffer portions are made of oxide or other non-metallic dielectric materials, and are used to separate the plurality of first conductive sections or the plurality of second conductive sections. The buffer portions can buffer stress and prevent the extension of micro-cracks caused by cutting to the inside of the chip.

[0050] It should be noted that when the interconnection conductive members 120 are in a single row, the interconnection conductive members 120 can be continuous conductive members, such as long strips, or can be intermittently arranged. When the interconnection conductive members 120 are in two rows, the two rows of conductive members are intermittently arranged, and the gaps in the two rows of conductive members are staggered with each other. When the interconnection conductive members 120 are in three or more rows, the plurality of rows of conductive members are intermittently arranged, and the gaps in the adjacent two rows of conductive members are staggered with each other.

[0051] Optionally, the protective body 10 includes, in the first direction, a first sub-portion 141, a connecting portion 142, and a second sub-portion 143 connected in sequence. That is, in the height direction, the first sub-portion 141, the connecting portion 142, and the second sub-portion 143 are sequentially arranged from top to bottom. The first sub-portion 141 and the second sub-portion 143 each include a plurality of metal layers 110, and interconnection conductive members 120 and electrical connecting columns 130 located between the respective metal layers 110. The connecting portion 142 includes interconnection conductive members 120 and electrical connecting columns 130 for connecting the metal layers 110 of the first sub-portion 141 and the metal layers 110 of the second sub-portion 143.

[0052] Optionally, at least one side of the first sub-portion 141 is provided with a plurality of rows of interconnection conductive members 120. In this embodiment, the right side of the metal layers 110 is provided with two rows of interconnection conductive members 120 to improve the structural strength. Of course, in other embodiments, three or more rows of interconnection conductive members 120 can also be provided. The plurality of rows of interconnection conductive members 120 can be located on the left side or the right side of the first sub-portion 141, or a plurality of rows of interconnection conductive members 120 can be provided on the left side and the right side, respectively.

[0053] At least one side of the connecting portion 142 is provided with the plurality of rows of interconnection conductive pieces 120, and the plurality of rows of interconnection conductive pieces 120 in the connecting portion 142 and the plurality of rows of interconnection conductive pieces 120 in the first sub-portion 141 are located at the same side. It can be understood that if the plurality of rows of interconnection conductive pieces 120 in the first sub-portion 141 are only arranged on the left side, the left side of the connecting portion 142 also needs to be provided with the plurality of rows of interconnection conductive pieces 120.

[0054] Optionally, in the first sub-portion 141, the number ratio of the interconnection conductive pieces 120 to the electric connecting columns 130 is greater than or equal to 3:2. In the connecting portion 142, the number ratio of the interconnection conductive pieces 120 to the electric connecting columns 130 is greater than or equal to 2:1. It should be noted that the number here can be understood as the number of rows arranged at intervals in the second direction. In this way, the more the number of interconnection conductive pieces 120, the greater the structural strength of the protection ring 100, and the more effective the protection of the chip in the protection ring 100. In the embodiment, the number ratio of the interconnection conductive pieces 120 to the electric connecting columns 130 in the second sub-portion 143 is not limited.

[0055] Optionally, the protection ring 100 in the embodiment includes two protection bodies 10 arranged side by side in the second direction, and the plurality of rows of interconnection conductive pieces 120 located on one side of the metal layer 110 are arranged side by side in the second direction. That is, the arrangement direction of the protection bodies 10 is consistent with the arrangement direction of the interconnection conductive pieces 120. In this way, the overall width of the protection ring 100 can be reduced, and the overall structural strength can be improved through the plurality of rows of interconnection conductive pieces 120 on one side.

[0056] The protection ring 100 is provided with the plurality of rows of interconnection conductive pieces 120 on at least one side of the metal layer 110, which can improve the structural strength of the protection ring 100. After improving the structural strength of the protection ring 100, it is beneficial to reduce the design width of the protection ring 100, thereby reducing the occupation area of the protection ring 100 on the substrate. The effective utilization rate of the silicon wafer substrate is improved, and the chip packaging efficiency and packaging quality are improved.

[0057] The utility model embodiment further provides a packaging structure, including substrate, chip and like preceding any one of the implementation ways of protection ring 100, protection ring 100 is located on the substrate, and the chip is located in the protection ring 100. Adjacent protection rings 100 form a cutting channel, and the side of the protection ring 100 close to the cutting channel is provided with a plurality of rows of interconnection conductive pieces 120.

[0058] In summary, the protection ring 100 and the packaging structure provided by the utility model embodiment have the following beneficial effects, including:

[0059] The protective ring 100 provided by the embodiment of the utility model, multiple rows of interconnected conductive pieces 120 are arranged on at least one side of the metal layer 110, which can effectively improve the structural strength of the protective ring 100, thus helping to reduce the design width of the protective ring 100, reduce the volume of the protective ring 100, reduce the area ratio of the protective ring 100 in the silicon wafer substrate, improve the effective utilization rate of the silicon wafer, improve the chip packaging efficiency and packaging quality. The multiple rows of interconnected conductive pieces 120 are arranged in an intermittent manner, the gaps are staggered with each other, and a buffer part is arranged at the gap, which is beneficial to stress buffering, effectively blocks the extension of micro-cracks caused by cutting to the inside of the chip, and effectively compensates for the structural strength of the protective ring 100.

[0060] The packaging structure provided by the embodiment of the utility model comprises the protective ring 100, which is beneficial to reduce the area ratio of the protective ring 100 in the substrate, improve the effective utilization rate of the substrate, and improve the chip packaging efficiency. Moreover, the protective ring 100 has high structural strength, can effectively protect the chip, reduce the risk of damage of the chip in the cutting process, and improve the packaging quality and packaging reliability.

[0061] Finally, it should be noted that: the above embodiments are only used to illustrate the technical solutions of the utility model, and not to limit them; although the utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that: it can still modify the technical solutions recorded in the foregoing embodiments, or make equivalent replacement to part or all of the technical features; any modification, equivalent replacement, improvement, etc. should be included in the protection scope of the utility model.

Claims

1. A guard ring, characterized in that The application relates to a protective body (10) comprising: one or more protective bodies (10) arranged side by side; each of the protective bodies (10) comprises a plurality of metal layers (110); a plurality of interconnected conductive members (120) are arranged between adjacent metal layers (110); at least two of the interconnected conductive members (120) are provided with an electrically connected column (130); the interconnected conductive members (120) and the electrically connected column (130) are respectively electrically connected with the metal layers (110); a plurality of rows of the interconnected conductive members (120) are arranged on at least one side of the metal layers (110).

2. The guard ring of claim 1, wherein, The plurality of rows of the interconnected conductive members (120) at least comprise a first conductive member (121) and a second conductive member (123) arranged side by side; the first conductive member (121) comprises a plurality of first conductive sections arranged at intervals, and a first gap (122) is formed between adjacent first conductive sections; the second conductive member (123) comprises a plurality of second conductive sections arranged at intervals, and a second gap (124) is formed between adjacent second conductive sections; the first gap (122) and the second gap (124) are arranged in a staggered manner.

3. The guard ring of claim 2, wherein, The first gap (122) and the second gap (124) are provided with a buffer part.

4. The guard ring of claim 3, wherein, The buffer part is made of an oxide or a non-metal medium material and is used for separating a plurality of first conductive sections or a plurality of second conductive sections.

5. The guard ring of claim 1, wherein, The metal layers (110) are arranged in a staggered manner along a first direction, and the protective body (10) comprises a first subpart (141), a connecting part (142) and a second subpart (143) connected in sequence along the first direction; the first subpart (141) and the second subpart (143) respectively comprise a plurality of metal layers (110) and the interconnected conductive members (120) and the electrically connected columns (130) arranged between the metal layers (110); the connecting part (142) comprises the interconnected conductive members (120) and the electrically connected columns (130) for connecting the metal layers (110) of the first subpart (141) and the metal layers (110) of the second subpart (143); at least one side of the first subpart (141) is provided with a plurality of rows of the interconnected conductive members (120).

6. The guard ring of claim 5, wherein, At least one side of the connecting part (142) is provided with a plurality of rows of the interconnected conductive members (120), and the plurality of rows of the interconnected conductive members (120) in the connecting part (142) and the plurality of rows of the interconnected conductive members (120) in the first subpart (141) are located on the same side.

7. The guard ring of claim 5, wherein, In the first subpart (141), the number of the interconnected conductive members (120) and the number of the electrically connected columns (130) are greater than or equal to 3:

2.

8. The guard ring of claim 5, wherein, In the connecting part (142), the number of the interconnected conductive members (120) and the number of the electrically connected columns (130) are greater than or equal to 2:

1.

9. The guard ring of any one of claims 1 to 8, wherein, The application relates to a protective body (10) comprising: two protective bodies (10) arranged side by side along a second direction, and a plurality of rows of the interconnected conductive members (120) arranged on one side of the metal layers (110) along the second direction.

10. A package structure, characterized by, The application further discloses a wafer including a substrate, chips and the protection rings as claimed in any one of claims 1 to 9, the protection rings being arranged on the substrate, the chips being arranged in the protection rings; a cutting path is formed between adjacent protection rings; and a plurality of rows of the interconnection conductive members (120) are arranged on a side of the protection ring close to the cutting path.

Images