Mounting structure

Abstract

The utility model provides an installation structure, comprising an emission part used for emitting signals; the transmitting component is arranged on the base; the base is provided with a first mounting groove and a second mounting groove, and the inner wall of the first mounting groove is a cambered surface; and the inner wall of the second mounting groove is a plane. The mounting structure provided by the utility model solves the technical problem that the mounting of the patch type transmitting tube in the prior art is not firm.

Description

TECHNICAL FIELD

[0001] The utility model relates to electric appliance welding technical field, concretely relates to a mounting structure. BACKGROUND

[0002] The surface mounted emission tube is also called as the patch emission tube, is a kind of infrared signal emission device, is the application field of household appliances, air conditioner remote controller, fan remote controller etc., and the main function is used to emit infrared control signal to air conditioner, fan etc.

[0003] Therefore, the prior art needs further development. CONTENT OF UTILITY MODEL

[0004] The utility model discloses a mounting structure to solve the technical problem of the mounting of the patch emission tube in the related art.

[0005] To achieve the above technical purpose, the utility model takes the following technical scheme: provide a mounting structure, comprising:

[0006] Emission component for emitting signal;

[0007] Base, the emission component is arranged on the base;The base is provided with first installation slot and second installation slot, the inner wall of first installation slot is arc surface;The inner wall of second installation slot is plane.

[0008] Further, the base includes:

[0009] Mounting surface, the emission component is arranged on the mounting surface;The mounting surface is provided with the through groove that communicates with first installation slot;

[0010] Side, the side is connected with the mounting surface, and first installation slot is arranged on the side;

[0011] Bottom surface, the bottom surface is connected with the side, and second installation slot is arranged on the bottom surface.

[0012] Further, the side includes the first side and the second side that are connected with each other;First installation slot includes first inner slot and second inner slot;The first inner slot is recessed and arranged on the first side;Second inner slot is recessed and arranged on the first side and the second side.

[0013] Further, the first inner groove is two, and the two first inner grooves are arranged at intervals; and / or, the second inner groove is two, and the two second inner grooves are arranged at intervals.

[0014] Further, a first mounting portion is arranged on the inner wall of the first mounting groove, and the first mounting portion is copper plated on the inner wall of the first mounting groove.

[0015] Further, the mounting structure further comprises a second mounting portion, the second mounting portion is arranged around the second mounting groove, and the second mounting portion is copper plated around the second mounting groove.

[0016] Further, the mounting structure further comprises a first mounting boss and a second mounting boss protruding from the base; the second mounting groove is located between the first mounting boss and the second mounting boss; and the second mounting portion is arranged on the first mounting boss.

[0017] Further, the mounting structure further comprises a connecting boss protruding from the base, one end of the connecting boss is connected with the first mounting boss, and the other end of the connecting boss is connected with the second mounting boss.

[0018] Further, one end of the second mounting groove is connected with the connecting boss, and the other end of the second mounting groove is communicated to the outside of the base.

[0019] Further, the second mounting groove is two; the first mounting boss, the second mounting boss and the connecting boss are all two, and the two first mounting bosses, the two second mounting bosses and the two connecting bosses are arranged in one-to-one correspondence with the two second mounting grooves; and the two connecting bosses have a mounting gap therebetween.

[0020] Beneficial effects:

[0021] The mounting structure of the utility model discloses, comprising: transmitting component, for transmitting signal, base, transmitting component sets up on base, base is provided with first mounting groove and second mounting groove, the inner wall of first mounting groove is cambered surface, the inner wall of second mounting groove is plane, and the mounting structure of the utility model discloses solves the technical problem of not firm installation of patch type transmitting tube in prior art. BRIEF DESCRIPTION OF DRAWINGS

[0022] Figure 1 It is the structure schematic view of the mounting structure that the utility model embodiment adopts;

[0023] Figure 2 It is the structure schematic view of the base of the mounting structure that the utility model embodiment adopts;

[0024] Figure 3 is a top view of the mounting structure adopted by the embodiment of the utility model;

[0025] Figure 4 is a side view of the mounting structure adopted by the embodiment of the utility model;

[0026] Figure 5 is a bottom view of the mounting structure provided by the embodiment of the utility model;

[0027] Figure 6 is a structure schematic view of the emitting component of the mounting structure provided by the embodiment of the utility model.

[0028] Among them, the above-mentioned drawing includes the following figure marks:

[0029] 1, emitting component; 2, base; 21, first installation slot; 211, first inner groove; 212, second inner groove; 22, second installation slot; 23, installation surface; 231, lead-through groove; 24, side surface; 241, first side surface; 242, second side surface; 25, bottom surface; 26, first installation boss; 27, second installation boss; 28, connecting boss. DETAILED DESCRIPTION

[0030] In order to make the personnel in the technical field better understand the scheme of the present application, the technical scheme in the embodiments of the present application will be described clearly and completely below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, not all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by the person skilled in the art without creative labor should belong to the scope of protection of the present application.

[0031] According to the embodiment of the utility model, a kind of mounting structure is provided, comprising: emitting component 1, for emitting signal;Base 2, the emitting component 1 is arranged on the base 2;The base 2 is provided with first installation slot 21 and second installation slot 22, the inner wall of the first installation slot 21 is arc surface;The inner wall of the second installation slot 22 is plane.

[0032] With the above setting, the soldering pad formed by the first installation slot 21 and the soldering pad formed by the second installation slot 22 can be fully fused with the soldering end in SMT mounting with larger contact area, and the soldering pad outside the first installation slot 21 and the second installation slot 22 can absorb solder, prevent deviation, play a role in fixing and preventing deviation during welding, solve the technical problem of insecure installation of the patch type emitting tube in the prior art.

[0033] Specifically, the first installation slot 21 is a semicircular hole structure.

[0034] Specifically, the first mounting groove 21 and the second mounting groove 22 on the base 2 constitute the soldering pad.

[0035] Specifically, the base 2 bears the whole product of the transmitting tube and plays a role of fixation.

[0036] In the mounting structure of the embodiment, referring to Figures 1 to 6 , the base 2 comprises: a mounting surface 23, on which the transmitting component 1 is arranged; a through groove 231 is arranged on the mounting surface 23 and communicates with the first mounting groove 21; a side surface 24, which is connected with the mounting surface 23 and on which the first mounting groove 21 is arranged; and a bottom surface 25, which is connected with the side surface 24 and on which the second mounting groove 22 is arranged.

[0037] With the above arrangement, two grooves of different structures are formed, so that the first mounting groove 21 can adapt to more different sizes of connecting structures.

[0038] Referring to Figures 1 to 6 , in the mounting structure of the embodiment, the side surface 24 comprises a first side surface 241 and a second side surface 242 which are connected with each other; the first mounting groove 21 comprises a first inner groove 211 and a second inner groove 212; the first inner groove 211 is recessed on the first side surface 241; and the second inner groove 212 is recessed on the first side surface 241 and the second side surface 242.

[0039] With the above arrangement, each side surface of the base 2 is fully utilized, so that the occupied space of the first mounting groove 21 is saved and the volume of the base 2 is reduced.

[0040] In the mounting structure of the embodiment, referring to Figures 1 to 6 , the first inner groove 211 is two, and the two first inner grooves 211 are arranged at intervals; and / or the second inner groove 212 is two, and the two second inner grooves 212 are arranged at intervals.

[0041] With the above arrangement, the welding positions are increased, so that the fitting of the mounting structure is more firm.

[0042] Referring to Figures 1 to 6 , in the mounting structure of the embodiment, a first mounting part is arranged on the inner wall of the first mounting groove 21, and the first mounting part is copper plated on the inner wall of the first mounting groove 21.

[0043] With the above arrangement, the soldering pad formed by the first mounting groove 21 can be fully fused with the soldering material in a larger contact area at the soldering end during SMT mounting, the half-hole type soldering pad can adsorb the soldering material to prevent deviation, and the soldering pad can be fixed during soldering to prevent deviation.

[0044] In the mounting structure of the embodiment, referring to Figures 1 to 6 , the mounting structure further comprises a second mounting portion, which is arranged around the second mounting groove 22, and the second mounting portion is copper plated around the second mounting groove 22.

[0045] With the above arrangement, the U-shaped soldering pad can be fully fused with the soldering material in a larger contact area at the soldering end during SMT mounting, the U-shaped soldering pad can adsorb the soldering material to prevent deviation, and the soldering pad can be fixed during soldering to prevent deviation.

[0046] In the mounting structure of the embodiment, referring to Figures 1 to 6 , the mounting structure further comprises a first mounting boss 26 and a second mounting boss 27 protruding from the base 2; the second mounting groove 22 is located between the first mounting boss 26 and the second mounting boss 27; and the second mounting portion is arranged on the first mounting boss 26.

[0047] With the above arrangement, the U-shaped soldering pad is designed as a hollow structure, which divides a large-area soldering pad into two parts to avoid the phenomenon of continuous soldering of a large-area soldering pad during soldering.

[0048] Referring to Figures 1 to 6 , in the mounting structure of the embodiment, the mounting structure further comprises a connecting boss 28 protruding from the base 2, one end of the connecting boss 28 is connected to the first mounting boss 26, and the other end of the connecting boss 28 is connected to the second mounting boss 27.

[0049] With the above arrangement, the U-shaped soldering pad is designed as a hollow structure, and since a large-area soldering pad is prone to the phenomenon of continuous soldering during soldering, the large-area soldering pad is divided into two parts, and the two parts are connected to each other. The U-shaped soldering pad design is equivalent to dividing a soldering pad into two parts, which enhances stability and soldering firmness and reduces the possibility of soldering pad falling off due to vibration or external force.

[0050] Referring to Figures 1 to 6 , in the mounting structure of the embodiment, one end of the second mounting groove 22 is connected to the connecting boss 28, and the other end of the second mounting groove 22 is communicated to the outside of the base 2.

[0051] With the above arrangement, the soldering pad can be conveniently formed.

[0052] In the mounting structure of the embodiment, referring to Figures 1 to 6 The second mounting groove 22 is two; the first mounting boss 26, the second mounting boss 27 and the connecting boss 28 are two, and the two first mounting bosses 26, the second mounting bosses 27 and the two connecting bosses 28 are respectively arranged in one-to-one correspondence with the two second mounting grooves 22; the two connecting bosses 28 have a mounting gap therebetween.

[0053] With the above arrangement, the welding position is increased, so that the fit of the mounting structure is more firm.

[0054] The first mounting groove 21 is designed at the side part of the base 2, the inner hole wall of the half hole is treated with copper plating, and the double half holes simultaneously serve as the polarity output of the transmitting tube device (i.e. the transmitting part 1).

[0055] The U-shaped structure solder pad is designed at the bottom part of the base 2, and the U-shaped solder pad simultaneously serves as the polarity output of the device, and the center area of the U-shaped structure is in a hollow state without a solder pad.

[0056] The first mounting groove 21 and the U-shaped structure solder pad can be welded with the soldering end in SMT to have a larger contact area with the solder, the half hole and the U-shaped solder pad can absorb the solder to prevent deviation, and play a role in fixing and preventing deviation in the welding process.

[0057] There are two welding methods for the surface-mounted transmitting tube device in actual application:

[0058] Side welding, i.e. the first mounting groove 21 on the side and the PCB are combined by solder;

[0059] Bottom welding, i.e. the U-shaped solder pad at the bottom and the PCB are combined by solder.

[0060] Introduction of the base 2 structure:

[0061] The base 2 is a fixed support or fixed substrate of the entire transmitting device, and the material is not required to be forced to be an epoxy resin substrate, and the base 2 can make the main body structure of the entire transmitting tube device more stably fixed.

[0062] The base 2 is a rectangular structure, and the solder pads of the device are arranged at both ends of one side of the base 2. The solder pad structure at one end is two half-hole type solder pads, one half-hole type solder pad is arranged at the edge position, the hole diameter is slightly larger, and one half-hole type solder pad is further arranged near the inside, the hole diameter is slightly smaller, and the two half-hole type solder pad structures are called the first mounting groove 21. The same structure of the solder pad is symmetrically distributed at the other end. The double half holes simultaneously serve as the polarity output of the transmitting tube device.

[0063] The inner hole wall surface of the two half-hole type soldering pads is plated with copper, and the copper layer serves as an electrical connection.

[0064] The bottom of the base 2 is provided with a U-shaped soldering pad, which is symmetrically distributed on both sides, has an appearance like a "U" shape, and has an opening outward. The central area of the U-shaped soldering pad is empty. The U-shaped soldering pad is made of copper and serves as an electrical connection. The U-shaped soldering pad at the bottom is in communication with the first mounting groove 21, respectively, which ensures that the product can be vertically mounted (side welding) or flatly mounted (bottom welding), so that the product has multiple application characteristics.

[0065] The transmitting component 1 has an appearance similar to a hemispherical structure and is located at the upper part of the product. The transmitting component 1 is made of transparent resin material, and the inner part of the hemisphere is a signal transmitter. The transmitter is welded to the PCB board through the copper circuit and the soldering pad mentioned above, and forms an electrical connection.

[0066] The transmitter of the utility model structure is welded with the PCB board through the SMT welding technology, the double soldering pad structure can be combined with the solder in a larger area during the welding process, the combination of the device and the welding is improved, the problems of device deviation and misplacement are solved, and the reliability of device welding is improved.

[0067] The product has simple and practical structure, can be welded by SMT or manually, and has wide application range.

[0068] It should be noted that the terms "first", "second", and the like in the description and claims of the application and the above drawings are used to distinguish similar objects, and do not have to be used to describe a particular order or sequence. It should be understood that the data used in this way can be interchanged under appropriate circumstances, so that the embodiments of the application described herein can be implemented in an order other than those illustrated or described herein. In addition, the terms "include" and "have" and any variations thereof are intended to cover non-exclusive inclusion, for example, a process, method, system, product or device including a series of steps or units does not have to be limited to those steps or units clearly listed, but can include other steps or units not clearly listed or inherent to these processes, methods, products or devices.

[0069] Optionally, the specific examples in the embodiments can refer to the examples described in the above embodiments, and the embodiments will not be described here.

[0070] The above application embodiment serial numbers are only for description, and do not represent the advantages and disadvantages of the embodiments.

[0071] In the above embodiments of the application, the description of each embodiment has its own emphasis, and the parts not described in detail in a certain embodiment can be referred to the related description of other embodiments.

[0072] The above merely preferred embodiments of the present application, it should be noted that for those of ordinary skill in the art, without departing from the principles of the present application, can also make a number of improvements and refinements, these improvements and refinements should also be considered as the scope of protection of the present application.

Claims

1. A mounting structure characterized by comprising: The installation structure comprises: a transmitting component (1) for transmitting signals; a base (2) on which the transmitting component (1) is arranged; the base (2) is provided with a first mounting groove (21) and a second mounting groove (22), the inner wall of the first mounting groove (21) is arc-shaped, and the inner wall of the second mounting groove (22) is planar.

2. The mounting structure according to claim 1, characterized by The base (2) comprises: a mounting surface (23) on which the transmitting component (1) is arranged; the mounting surface (23) is provided with a through groove (231) in communication with the first mounting groove (21); a side surface (24) connected with the mounting surface (23), the first mounting groove (21) being arranged on the side surface (24); a bottom surface (25) connected with the side surface (24), the second mounting groove (22) being arranged on the bottom surface (25).

3. The mounting structure according to claim 2, characterized by The side surface (24) comprises a first side surface (241) and a second side surface (242) connected with each other; the first mounting groove (21) comprises a first inner groove (211) and a second inner groove (212); the first inner groove (211) is recessively arranged on the first side surface (241); the second inner groove (212) is recessively arranged on the first side surface (241) and the second side surface (242).

4. The mounting structure according to claim 3, wherein The first inner groove (211) is two, and the two first inner grooves (211) are arranged at intervals; and / or the second inner groove (212) is two, and the two second inner grooves (212) are arranged at intervals.

5. The mounting structure according to claim 1, wherein The inner wall of the first mounting groove (21) is provided with a first mounting part, which is copper plated on the inner wall of the first mounting groove (21).

6. The mounting structure according to claim 1, wherein The installation structure further comprises a second mounting part, which is arranged around the second mounting groove (22), and the second mounting part is copper plated around the second mounting groove (22).

7. The mounting structure according to claim 6, wherein The installation structure further comprises a first mounting boss (26) and a second mounting boss (27) protruding from the base (2); the second mounting groove (22) is located between the first mounting boss (26) and the second mounting boss (27); and the second mounting part is arranged on the first mounting boss (26).

8. The mounting structure according to claim 7, wherein The installation structure further comprises a connecting boss (28) protruding from the base (2), one end of the connecting boss (28) is connected with the first mounting boss (26), and the other end of the connecting boss (28) is connected with the second mounting boss (27).

9. The mounting structure according to claim 8, wherein One end of the second mounting groove (22) is connected with the connecting boss (28), and the other end of the second mounting groove (22) is in communication with the outside of the base (2).

10. The mounting structure according to claim 8, wherein The second installation slot (22) is two; the first installation boss (26), the second installation boss (27) and the connecting boss (28) are two, two first installation bosses (26), the second installation boss (27) and two connecting bosses (28) are set up one by one with two second installation slots (22) one by one; two connecting bosses (28) have installation gap between them.

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