Wireless signal transmitting and receiving device for communication engineering
By using a heat-conducting frame and a heat dissipation vent structure, the problem of overheating of the circuit board in the wireless signal transceiver under high load is solved, achieving efficient heat dissipation and ensuring signal stability.
Patent Information
- Application Number
- CN202520229547.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-02-13
- Publication Date
- 2025-11-28
- Estimated Expiration
- 2035-02-13
AI Technical Summary
The circuit board of the wireless signal transceiver overheats under high load, causing the processor to reduce its frequency for protection, which affects the signal quality.
It adopts a heat-conducting frame and heat dissipation duct structure, and forms an air duct through the heat-conducting plate. Combined with the heat dissipation duct and heat dissipation mechanism, it achieves efficient heat dissipation.
It effectively reduces the temperature of the circuit board, ensuring stable operation of the wireless signal transceiver under high load and improving signal transmission performance.
Smart Images

Figure CN223613328U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model belongs to wireless signal transceiving device technical field, specifically wireless signal transceiving device for communication engineering. BACKGROUND
[0002] The wireless transceiver for communication engineering, also known as wireless transceiving module or wireless communication module, is an electronic device capable of realizing wireless signal sending and receiving.
[0003] It usually includes three parts of transmitter, receiver and circuit board, the transmitter is responsible for converting the information to be sent into wireless signal and sending out, the receiver is responsible for receiving the wireless signal from other devices and converting it into identifiable information, and the controller on the circuit board is responsible for controlling the work of the transmitter and receiver, ensuring the smooth progress of the whole communication process.
[0004] Among them, the wireless signal transceiving device is in high temperature when working under high load, the processor on the circuit board may appear frequency reduction protection, which will greatly affect the effect of the wireless signal transceiving device, therefore, aiming at the above problems, a wireless signal transceiving device for communication engineering is proposed. UTILITY MODEL CONTENT
[0005] In order to make up for the deficiencies of the prior art and solve at least one technical problem proposed in the background art, the utility model provides a wireless signal transceiving device for communication engineering.
[0006] The utility model solves the technical scheme that the utility model discloses a wireless signal transceiving device for communication engineering, including device shell, signal transmitter and signal receiver are provided on the device shell, the inside bottom of device shell is provided with heat conduction frame, wireless signal circuit board is provided above heat conduction frame, the both sides of device shell are symmetrically provided with groove, the detachable heat dissipation air exhaust is provided on the groove of one side, the dust screen is provided on the groove of the other side, the lead connection mechanism is provided on heat conduction frame, and the heat removal mechanism is arranged on the upper portion of device shell.
[0007] Preferably, the heat conduction frame includes a lower heat conduction plate arranged on the inner bottom of the device shell, a plurality of vertical heat conduction plates are uniformly arranged above the lower heat conduction plate, and an upper heat conduction plate is arranged above the plurality of vertical heat conduction plates.
[0008] Preferably, the thickness of the upper heat conduction plate, the lower heat conduction plate and the vertical heat conduction plate is 2-4mm, and the material of the upper heat conduction plate, the lower heat conduction plate and the vertical heat conduction plate is copper.
[0009] Preferably, the lead-in mechanism comprises two connectors arranged on two sides inside the device shell, the two connectors are respectively matched with the two groove bodies, the connectors are provided with gaskets, the gaskets are matched with the side portions of the heat conduction frame, and the connector close to the side of the heat dissipation air outlet is provided with the air guide frame.
[0010] Preferably, the air guide frame is in an inverted L shape, and the air outlet of the air guide frame is directed to the components of the wireless signal circuit board.
[0011] Preferably, the heat dissipation mechanism comprises a drainage arc plate arranged on the upper portion of the device shell, the drainage arc plate is provided with a drainage groove, the drainage groove is provided with a discharge fan, and a plurality of heat dissipation holes are evenly arranged on the upper portion of the device shell.
[0012] The utility model discloses the beneficial effects of the following:
[0013] The utility model provides a wireless signal transceiving device for communication engineering, through the structural setting of lead-in mechanism, cooperation uses the heat dissipation air outlet, guides and transports the air volume of heat dissipation air outlet, thereby efficiently carries out the heat dissipation treatment to the electric appliance component on the wireless signal circuit board.
[0014] The utility model provides a wireless signal transceiving device for communication engineering, through the structural setting of heat dissipation mechanism, discharges the heat inside the device shell, and efficiently carries out the heat dissipation treatment to the inside of wireless signal transceiving device. DRAWINGS
[0015] The drawings described herein are used to provide further understanding of the utility model and constitute a part of the application, and the illustrative embodiment of the utility model and the explanation thereof are used to explain the utility model and do not constitute improper limitation to the utility model.
[0016] In the drawings:
[0017] Figure 1 It is the perspective view of the utility model;
[0018] Figure 2 It is the partial section view of the utility model;
[0019] Figure 3 It is the structural schematic view of heat conduction frame, wireless signal circuit board and connector;
[0020] Figure 4 It is Figure 3 The enlarged view of A in the figure.
[0021] Legend:
[0022] 1, device shell; 2, signal transmitter; 3, signal receiver; 4, wireless signal circuit board; 5, groove; 6, heat dissipation fan; 7, dust screen; 8, lower heat conducting plate; 9, vertical heat conducting plate; 10, upper heat conducting plate; 11, connecting piece; 12, gasket; 13, air guide frame; 14, drainage arc plate; 15, guide groove; 16, heat exhaust hole; 17, exhaust fan. DETAILED DESCRIPTION
[0023] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of the present application.
[0024] The specific embodiments are given below.
[0025] Please refer to Figures 1-4 , the present application provides a kind of wireless signal transceiver for communication engineering, including device shell 1;Device shell 1 is provided with signal transmitter 2 and signal receiver 3, signal transmitter 2 is responsible for the information to be sent into wireless signal and sends out, signal receiver 3 is responsible for receiving the wireless signal from other equipment and converts it into identifiable information, the inside bottom of device shell 1 is provided with heat conducting frame, heat conducting frame is used to support wireless signal circuit board 4, and the heat generated by electrical components on wireless signal circuit board 4 can be conducted, so that the electrical components on wireless signal circuit board 4 are heat treated, wireless signal circuit board 4 is provided above heat conducting frame, the both sides of device shell 1 are symmetrically provided with groove 5, the groove 5 of one side is detachably provided with heat dissipation fan 6, a plurality of fans are provided on heat dissipation fan 6, dust screen 7 is provided on the other side of groove 5, reduce dust into the inside of device shell 1, guide mechanism is provided on heat conducting frame, the air volume of heat dissipation fan 6 is guided to transport, so that the electrical components on wireless signal circuit board 4 are heat treated, heat dissipation mechanism is provided on the upper portion of device shell 1, the heat in the inside of device shell 1 is discharged.
[0026] Further, as shown in Figure 3 and Figure 4 , heat conducting frame includes lower heat conducting plate 8 provided in the inside bottom of device shell 1, a plurality of vertical heat conducting plates 9 are uniformly provided above lower heat conducting plate 8, upper heat conducting plate 10 is provided above a plurality of vertical heat conducting plates 9, upper heat conducting plate 10, lower heat conducting plate 8 and vertical heat conducting plate 9 form a plurality of air ducts, the heat generated by electrical components on wireless signal circuit board 4 can be conducted through heat conducting frame, so that the electrical components on wireless signal circuit board 4 are heat treated.
[0027] Further, as shown in Figure 3 The thickness of the upper heat-conducting plate 10, the lower heat-conducting plate 8 and the vertical heat-conducting plate 9 is 2-4mm, and the material of the upper heat-conducting plate 10, the lower heat-conducting plate 8 and the vertical heat-conducting plate 9 is copper, which conducts heat and dissipates heat for the electrical elements on the wireless signal circuit board 4.
[0028] Further, as shown in Figure 3 The guide mechanism includes two connecting pieces 11 arranged on the two sides inside the device shell 1, the two connecting pieces 11 are respectively matched with the two groove bodies 5, the connecting piece 11 is provided with a gasket 12 which is attached to the side of the heat-conducting frame, and the connecting piece 11 near the side of the heat-dissipating air exhaust 6 is provided with a wind guide frame 13 which guides and transports the air volume of the heat-dissipating air exhaust 6, so as to dissipate heat for the electrical elements on the wireless signal circuit board 4.
[0029] Further, as shown in Figure 3 and Figure 4 The wind guide frame 13 is in inverted L shape, and the air outlet of the wind guide frame 13 points to the elements of the wireless signal circuit board 4, so as to dissipate heat for the wireless signal circuit board 4.
[0030] Further, as shown in Figure 2 The heat-dissipating mechanism includes a drainage arc plate 14 on the upper part of the device shell 1, the drainage arc plate 14 is provided with a drainage groove 15, the drainage groove 15 is provided with a discharge fan 17, and multiple heat-dissipating holes 16 are evenly arranged on the upper two sides of the device shell 1.
[0031] Working principle: when the wireless signal transceiver device for communication engineering is used under high load, the electrical elements on the wireless signal circuit board 4 generate high temperature;
[0032] Through the structure of the guide mechanism, the heat-dissipating air exhaust 6 is used to guide and transport the air volume of the heat-dissipating air exhaust 6, so as to efficiently dissipate heat for the electrical elements on the wireless signal circuit board 4. The upper heat-conducting plate 10 of the heat-conducting frame is attached to the wireless signal circuit board 4, so as to conduct heat and dissipate heat for the wireless signal circuit board 4. Multiple air channels are formed by the lower heat-conducting plate 8 and the vertical heat-conducting plate 9, and the connecting pieces 11 are arranged on the two sides of the heat-conducting frame and connected with the groove bodies 5 on the two sides. Through the operation of the heat-dissipating air exhaust 6, part of the transported air carries the heat on the heat-conducting frame out of the device shell 1 through the air channels, and the other part of the transported air directly blows to the electrical elements on the wireless signal circuit board 4 through the heat-conducting frame, so as to dissipate heat for the electrical elements on the wireless signal circuit board 4.
[0033] The heat inside the device shell 1 is discharged through the heat discharge mechanism, the inside of the wireless signal transceiver device is efficiently cooled, the air on the upper part is guided through the guide arc plate 14, the exhaust fan 17 is rotated, so that the air is guided into the cavity formed by the guide arc plate 14 and the upper part of the inside of the device shell 1, the hot air is prevented from staying in the inside of the device shell 1 for a long time, and the hot air is discharged through the heat discharge holes 16 on the upper two sides of the device shell 1.
[0034] The basic principle, main features and advantages of the present application are shown and described above. Those skilled in the art should understand that the present application is not limited by the above examples, and the above examples and descriptions in the specification are only to illustrate the principles of the present application. Without departing from the spirit and scope of the present application, various changes and improvements can be made to the present application, and these changes and improvements all fall within the scope of the present application.
Claims
1. A wireless signal transceiver device for communication engineering, comprising a device housing (1); characterized in that: The device shell (1) is provided with a signal transmitter (2) and a signal receiver (3), the inner side bottom of the device shell (1) is provided with a heat conducting frame, the heat conducting frame is provided with a wireless signal circuit board (4) above, the both sides of the device shell (1) are symmetrically provided with a groove (5), the groove (5) on one side is detachably provided with a heat dissipation air exhaust (6), the groove (5) on the other side is provided with a dust screen (7), the heat conducting frame is provided with a lead-through mechanism, and the upper part of the device shell (1) is provided with a heat exhaust mechanism.
2. The wireless signal transceiver device for communication engineering of claim 1, wherein: The heat conducting frame comprises a lower heat conducting plate (8) arranged on the inner side bottom of the device shell (1), a plurality of vertical heat conducting plates (9) are uniformly arranged above the lower heat conducting plate (8), and an upper heat conducting plate (10) is arranged above the plurality of vertical heat conducting plates (9); the upper heat conducting plate (10), the lower heat conducting plate (8) and the vertical heat conducting plates (9) form a plurality of air ducts.
3. The wireless signal transceiver device for communication engineering of claim 2, wherein: The thickness of the upper heat conducting plate (10), the lower heat conducting plate (8) and the vertical heat conducting plates (9) is 2-4mm, and the material of the upper heat conducting plate (10), the lower heat conducting plate (8) and the vertical heat conducting plates (9) is copper.
4. The wireless signal transceiver device for communication engineering of claim 3, wherein: The lead-through mechanism comprises a connecting piece (11) arranged on each side inside the device shell (1), the two connecting pieces (11) are respectively matched with the two grooves (5), the connecting piece (11) is provided with a gasket (12), the gasket (12) is attached to the side of the heat conducting frame, and the connecting piece (11) near the heat dissipation air exhaust (6) is provided with a wind guide frame (13).
5. The wireless signal transceiver device for communication engineering of claim 4, wherein: The wind guide frame (13) is in inverted L shape, and the air outlet of the wind guide frame (13) points to the components of the wireless signal circuit board (4).
6. The wireless signal transceiver device for communication engineering of claim 1, wherein: The heat exhaust mechanism comprises a drainage arc plate (14) on the upper part of the device shell (1), the drainage arc plate (14) is provided with a drainage groove (15), the drainage groove (15) is provided with an exhaust fan (17), and the upper sides of the device shell (1) are respectively and uniformly provided with a plurality of heat exhaust holes (16).