Microphone sealing structure of earphone

Abstract

The utility model relates to a microphone sealing structure of earphone, including mesh cloth module, circuit board and microphone, the mesh cloth module includes mesh cloth, back adhesive layer and foam rubber layer, the foam rubber layer is bonded fixed on the other side surface of mesh cloth, is provided with second through -hole on the foam rubber layer, is provided with the pickup hole on the circuit board, and the pickup hole is communicated with second through -hole, the microphone sets up on the circuit board, and the microphone has the sound hole, and the sound hole is communicated with pickup hole. Public through the back adhesive layer bonding fixed on the side surface of mesh cloth, back adhesive layer and earphone shell bonding fixed, cooperate with the circuit board bonding fixed on the foam rubber layer again, the foam rubber layer has excellent elasticity and softness, after earphone assembly is completed, the foam rubber layer is compressed and presents compression state under pressure, realizes the interference fit of earphone shell and microphone sealing mechanism fully, will not happen air leakage, and effectively eliminates the influence such as die size deviation, material tolerance, assembly deviation.

Description

TECHNICAL FIELD

[0001] The utility model relates to earphone field technology especially is a microphone sealing structure of earphone. BACKGROUND

[0002] With the rapid development of science and technology, wireless Bluetooth earphone has become an indispensable part of our daily life. Whether it is exercise, work or leisure time, wireless Bluetooth earphone wins the favor of the majority of users with its convenience and comfort. At present, the TWS and OWS Bluetooth wireless earphone widely used by consumers has problems such as waterproof and echo in conversation, so it is generally hoped that the microphone has an independent cavity, and the isolation degree is required to be high, that is, the microphone needs to be sealed. When the microphone is assembled, there is a back glue mesh cloth, EVA or silicone rubber sleeve. When the earphone is assembled, the microphone pickup hole can only pass through the sealing structure to receive external sound signals from the pickup channel, and the periphery is sealed to block the microphone pickup and the nonlinear echo in the cavity, thereby destroying the conversation experience.

[0003] As Figure 1 It can be seen that the single-sided back glue mesh cloth is pasted on the inner wall of the earphone shell, and the microphone patch is on the FPC or PCBA. Through structural design, the FPC or PCBA is attached to the single-sided back glue mesh cloth. Through assembly, the back glue with elastic recovery on the mesh cloth plays a role of interference extrusion, so as to ensure that the microphone hole and the pickup pipeline will not produce the phenomenon of air leakage between the assembled parts. The final goal is that the external sound signal can only enter the microphone from the microphone hole, and cannot enter other internal space of the earphone. However, since the circuit board is generally planar, it is easy to be attached to the mesh cloth, so as to prevent air leakage. The earphone shell is related to the appearance of the earphone, mainly with slope and arc, and sometimes the assembly cannot be vertically pressed to combine the shell, so it is more prone to air leakage. Therefore, the mesh cloth in the middle plays the role of sealing and adjusting the air volume. In actual production, mold size deviation, material tolerance, assembly deviation and the like will cause that the microphone structure is not fully interfered after assembly, so that the microphone cannot be sealed and air leakage occurs. Therefore, it is necessary to propose a new scheme to solve the above problems. Utility model content

[0004] Therefore, the utility model mainly aims at the defects of the prior art, and provides a microphone sealing structure of earphone, which can effectively solve the problem that the existing microphone sealing structure is easily affected by mold size deviation, material tolerance and assembly deviation, resulting in insufficient interference of the microphone structure.

[0005] To achieve the above purpose, the utility model adopts the following technical scheme:

[0006] The application discloses a microphone sealing structure of an earphone, which comprises a mesh module, a circuit board and a microphone.

[0007] As a preferred solution, the second through hole is in communication with the first through hole through the mesh, and the radius of the second through hole is the same as that of the first through hole.

[0008] As a preferred solution, the thickness of the foam adhesive layer is 0.15-0.50 mm, and the foam adhesive layer has different thicknesses, such as 0.15 mm, 0.2 mm, 0.25 mm, 0.3 mm, 0.35 mm, 0.4 mm, 0.45 mm and 0.5 mm, etc. The total thickness of the mesh module can be controlled by adjusting the thickness of the foam adhesive layer, and as long as the interference amount is greater than 0.15 mm, the ideal air leakage prevention effect can be achieved. In actual production, the thickness of the foam adhesive layer can be finally locked by selecting different batches of trial assembly to adapt to earphones of different models.

[0009] As a preferred solution, the circuit board is FPC.

[0010] As a preferred solution, the microphone is arranged on the circuit board in a patch form.

[0011] As a preferred solution, the pickup hole is opposite to the microphone hole of the earphone.

[0012] As a preferred solution, the foam adhesive layer is made of low-density polyethylene.

[0013] As a preferred solution, the radius of the first through hole is greater than that of the microphone hole of the earphone, and the radius of the second through hole is greater than that of the pickup hole.

[0014] Compared with the prior art, the application has obvious advantages and beneficial effects, specifically speaking, the above technical solution can know that:

[0015] The back adhesive layer is adhered and fixed on one side of the mesh, the back adhesive layer is adhered and fixed to the earphone shell, the circuit board is adhered and fixed on the foam adhesive layer, the foam adhesive layer has excellent elasticity and softness, the foam adhesive layer is in a compressed state after the earphone is assembled, the interference fit between the earphone shell and the microphone sealing mechanism is achieved, air leakage is avoided, and the influence of mold size deviation, material tolerance and assembly deviation is effectively eliminated.

[0016] In order to make the structural features and functions of the present application more clear, the present application will be described in detail below with reference to the drawings and specific embodiments. BRIEF DESCRIPTION OF DRAWINGS

[0017] Figure 1 is a structural schematic diagram of a microphone sealing structure in the prior earphone;

[0018] Figure 2 is a structural schematic diagram of a preferred embodiment of the present application;

[0019] Figure 3 is a sectional view of the mesh module in the preferred embodiment of the present application;

[0020] Figure 4 is a partial assembly diagram of an earphone using the microphone sealing structure of the present application;

[0021] Figure 5 is Figure 4 is a partial schematic diagram in a state without assembling the mesh module;

[0022] Figure 6 is a test curve diagram of a conventional earphone and the earphone using the present application.

[0023] BRIEF DESCRIPTION OF DRAWINGS

[0024] 10, mesh module 11, mesh

[0025] 12, adhesive layer 121, first through hole

[0026] 13, foam adhesive layer 131, second through hole

[0027] 20, circuit board 21, sound pickup hole

[0028] 30, microphone 31, sound receiving hole

[0029] 40, earphone shell 41, microphone hole. DETAILED DESCRIPTION

[0030] Please refer to Figures 2 to 4 , which shows the specific structure of the preferred embodiment of the present application, including mesh module 10, circuit board 20 and microphone 30.

[0031] The mesh module 10 comprises a mesh 11, a back adhesive layer 12 and a foam adhesive layer 13. The back adhesive layer 12 is fixed on one side of the mesh 11. The back adhesive layer 12 is provided with a first through hole 121 which is communicated with the microphone hole 41 of the earphone shell 40. The foam adhesive layer 13 is fixed on the other side of the mesh 11. The foam adhesive layer 13 is provided with a second through hole 131 which is communicated with the first through hole 121 through the mesh 11. In this embodiment, the second through hole 131 is communicated with the first through hole 121 through the mesh 11, and the radius of the second through hole 131 is the same as that of the first through hole 121. The thickness of the foam adhesive layer 13 is 0.15-0.50mm. The foam adhesive layer 13 has different thicknesses, such as 0.15mm, 0.2mm, 0.25mm, 0.3mm, 0.35mm, 0.4mm, 0.45mm and 0.5mm. The total thickness of the mesh module 10 can be controlled by adjusting the thickness of the foam adhesive layer 13. As long as the interference amount is greater than 0.15mm, the ideal air leakage prevention effect can be achieved. In actual production, the thickness of the foam adhesive layer 13 can be finally locked by trial assembly in batches to adapt to different types of earphones. In addition, the foam adhesive layer 13 is made of low-density polyethylene material. The radius of the first through hole 121 is greater than that of the microphone hole 41 of the earphone shell 40. Specifically, the back adhesive layer 12 can use ordinary back adhesive, such as the T4982 adhesive layer. The thickness of the T4982 adhesive is about 0.1mm. Compared with the conventional 9448AB adhesive, the thickness of the 9448AB adhesive is 0.15mm. The thin adhesive layer can better fit the surface of the circuit board 20. The too thick adhesive layer is too soft and is more likely to cause displacement after fitting. The thickness of the mesh 11 is 0.06mm, and the model of the foam adhesive layer 13 is 5240. This material is full of viscosity and has elasticity and softness. When the earphone is assembled, it can fully adhere to the inner wall to meet the sealing requirements.

[0032] The circuit board 20 is fixed on the foam adhesive layer 13. The circuit board 20 is provided with a pickup hole 21 which is communicated with the second through hole 131. In this embodiment, the circuit board 20 is FPC, and the pickup hole 21 is opposite to the microphone hole 41 of the earphone 40. The radius of the second through hole 131 is greater than that of the pickup hole 21.

[0033] The microphone 30 is arranged on the circuit board 20. The microphone 30 has a sound collecting hole 31 which is communicated with the pickup hole 21. In this embodiment, the microphone 30 is arranged on the circuit board 20 by patching.

[0034] In order to verify the feasibility and superiority of the technical scheme of the utility model patent application, the acoustic microphone blocking test is used for verification, that is, the earphone respectively adopts normal microphone test, microphone test frequency response curve after the microphone hole is blocked by mud glue, the microphone blocking test shows that the most ideal use state of the earphone microphone, the external sound signal can only be received from the microphone hole exposed outside, and the microphone hole is blocked by mud glue, the sound signal should not be transmitted into the microphone structure from the small gap of the earphone shell, and then the microphone receives, so the microphone acoustic test comparison is a quite effective method for testing the sealing of the microphone structure. The difference in sensitivity (dB) degree of the two is compared, and the greater the difference is, the better the sealing effect of the microphone structure is, and the comparison curve of the utility model is shown in Figure 6 The test uses two same earphone samples #1 and #2, #1 adopts a conventional single-sided back glue mesh cloth, and #2 adopts the mesh cloth module in the utility model, that is, the microphone sealing structure in the utility model. Figure 6 As shown in the figure, the microphone curves (FR) of the two earphones are quite consistent and almost completely coincide, which shows that the acoustic performance of the two is consistent and there is no deviation. The microphone curve of #1 is obviously higher than that of #2, which fully shows that the reception of external signals of #1 is much more than that of #2 under the condition of blocking the microphone hole, which fully shows that the microphone sealing structure in the utility model is much better than the single-sided back glue for the sealing effect of the microphone.

[0035] The design emphasis of the utility model is that the back glue layer is adhered and fixed on one side of the mesh cloth, the back glue layer is adhered and fixed with the earphone shell, and then the circuit board is adhered and fixed on the foam glue layer, the foam glue layer has excellent elasticity and softness, the foam glue layer is in a compressed state after the earphone is assembled, the interference fit between the earphone shell and the microphone sealing mechanism is realized, air leakage does not occur, and the influence of mold size deviation, material tolerance and assembly deviation is effectively eliminated.

[0036] The above is only a preferred embodiment of the utility model, and does not limit the technical range of the utility model, so any slight modification, equivalent change and modification according to the technical essence of the utility model are still within the scope of the technical scheme of the utility model.

Claims

1. A microphone sealing structure for an earphone, characterized in that: The earphone comprises a mesh module, a circuit board and a microphone; the mesh module comprises a mesh, a back adhesive layer and a foam adhesive layer, the back adhesive layer is fixed on one side of the mesh, the back adhesive layer is provided with a first through hole communicated with a microphone hole of an earphone shell, the foam adhesive layer is fixed on the other side of the mesh, the foam adhesive layer is provided with a second through hole, the second through hole is communicated with the first through hole through the mesh; the circuit board is fixed on the foam adhesive layer, the circuit board is provided with a sound pickup hole communicated with the second through hole; the microphone is arranged on the circuit board, the microphone is provided with a sound collecting hole communicated with the sound pickup hole.

2. The microphone seal structure of a headphone according to claim 1, characterized by: The second through hole is communicated with the first through hole through the mesh, and the radius of the second through hole is the same as that of the first through hole.

3. The microphone seal structure of the earphone of claim 1, wherein: The thickness of the foam adhesive layer is 0.15-0.50 mm.

4. The microphone seal structure of the earphone of claim 1, wherein: The circuit board is FPC.

5. The earphone microphone seal structure of claim 1, wherein: The microphone is arranged on the circuit board in a patch form.

6. The microphone seal structure of the earphone of claim 1, wherein: The sound pickup hole is opposite to the microphone hole of the earphone.

7. The earphone microphone seal structure of claim 1, wherein: The foam adhesive layer is made of low-density polyethylene.

8. The earphone microphone seal structure of claim 1, wherein: The radius of the first through hole is greater than that of the microphone hole of the earphone shell, and the radius of the second through hole is greater than that of the sound pickup hole.

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