Circuit board assembly and electronic equipment

Abstract

The utility model relates to the technical field of electronic equipment, in particular to a circuit board assembly and electronic equipment, the circuit board assembly comprises a first circuit board, a second circuit board and an adapter plate, and the second circuit board and the first circuit board are stacked; the adapter plate is arranged between the first circuit board and the second circuit board, the adapter plate is provided with a through hole group, the through hole group comprises a signal through hole and a plurality of shielding through holes, the signal through hole is filled with a signal transmission piece, and the shielding through holes are filled with shielding pieces. Wherein the plurality of shielding through holes surround the signal through hole along a preset track, a preset interval is formed between adjacent shielding through holes in the plurality of shielding through holes, the size of each shielding through hole along the preset track is a first size, and the size of each shielding through hole along the direction perpendicular to the preset track is a second size, the first size is larger than the second size.

Description

TECHNICAL FIELD

[0001] The present disclosure relates to the technical field of electronic devices, and in particular, to a circuit board assembly and an electronic device. BACKGROUND

[0002] With the development and progress of technology, people have more and more functional requirements for electronic devices such as mobile phones. In order to realize the thinness of electronic devices, the space for installing and arranging various functional devices in electronic devices is limited. In order to improve the utilization rate of space in electronic devices, a multi-layer stacked circuit board can be used in electronic devices. The multi-layer stacked circuit board realizes signal transmission between adjacent circuit boards through a signal via, and electromagnetic interference is easily generated when the via transmits a high-frequency signal.

[0003] It should be noted that the information disclosed in the above background section is only used to strengthen the understanding of the background of the present disclosure, and therefore can include information that does not constitute prior art known to those of ordinary skill in the art. SUMMARY

[0004] The purpose of the present disclosure is to provide a circuit board assembly and an electronic device, thereby at least partially improving the isolation of the circuit board assembly and improving the anti-interference ability.

[0005] According to an aspect of an embodiment of the present disclosure, a circuit board assembly is provided, comprising:

[0006] a first circuit board;

[0007] a second circuit board, the second circuit board and the first circuit board being stacked;

[0008] an adapter plate, the adapter plate being arranged between the first circuit board and the second circuit board, the adapter plate being provided with a through hole group, the through hole group comprising a signal through hole and a plurality of shielding through holes, the signal through hole being filled with a signal transmission member, and the shielding through holes being filled with shielding members;

[0009] wherein the plurality of shielding through holes surround the signal through hole along a preset track, and the adjacent shielding through holes among the plurality of shielding through holes have a preset interval, the size of the shielding through hole along the preset track is a first size, the size of the shielding through hole in a direction perpendicular to the preset track is a second size, and the first size is greater than the second size.

[0010] In some embodiments of the present disclosure, the preset track is circular, and the shielding through hole is an arc-shaped through hole;

[0011] or, the preset track is a polygon, and the shielding through hole is a straight line-shaped through hole or a broken line-shaped through hole.

[0012] In some embodiments of the present disclosure, the shielding member comprises:

[0013] a ring-shaped shielding layer formed on an inner wall of the shielding via;

[0014] a first insulating portion filled in the ring-shaped shielding layer;

[0015] a shielding pad connected with the ring-shaped shielding layer and extending at least partially to a surface of the adapter board.

[0016] In some embodiments of the present disclosure, the shielding pad comprises a first pad portion and a second pad portion, which are respectively arranged at two ends of the shielding via along the preset track.

[0017] In some embodiments of the present disclosure, a ground terminal is arranged on the first circuit board and / or the second circuit board, and the shielding pad is electrically connected with the ground terminal.

[0018] In some embodiments of the present disclosure, the signal transmission member comprises:

[0019] a ring-shaped transmission layer formed on an inner wall of the signal via;

[0020] a second insulating portion filled in the ring-shaped transmission layer;

[0021] a signal pad connected with the ring-shaped transmission layer and extending at least partially to a surface of the adapter board.

[0022] In some embodiments of the present disclosure, a first signal terminal is arranged on the first circuit board, and a second signal terminal is arranged on the second circuit board.

[0023] A first signal pad is arranged on a side of the adapter board facing the first circuit board and electrically connected with the first signal terminal, and a second signal pad is arranged on a side of the adapter board facing the second circuit board and electrically connected with the second signal terminal.

[0024] In some embodiments of the present disclosure, adjacent first via groups and second via groups are arranged on the adapter board, and the shielding via in the first via group close to the second via group and the shielding via in the second via group close to the first via group are communicated.

[0025] In some embodiments of the present disclosure, a dimension of the preset interval along the preset track is less than the first dimension.

[0026] In some embodiments of the present disclosure, the number of the shielding vias in the via group is 3 or 4.

[0027] In some embodiments of the present disclosure, the signal transmission member is used for transmitting a radio frequency signal or a high frequency signal with a frequency greater than or equal to 5 GHz.

[0028] According to another aspect of the present disclosure, an electronic device is provided, which includes the circuit board assembly described above.

[0029] The technical solutions provided by the embodiments of the present disclosure can include the following beneficial effects:

[0030] The circuit board assembly provided by the embodiments of the present disclosure realizes signal interaction between the first circuit board and the second circuit board through the signal transmission member in the signal via, and effectively prevents signal leakage and interference through filling the shielding member in the shielding via surrounding the signal via, thereby improving signal isolation. In order to ensure the strength of the adapter plate, the interval between adjacent shielding holes in the plurality of shielding holes needs to be greater than a preset distance. If the number of interval regions is large, the shielding performance will be affected. By setting the first size of the shielding via to be greater than the second size, the number of interval regions on the adapter plate can be reduced, thereby improving the shielding performance and signal isolation.

[0031] It should be understood that the foregoing general description and the following detailed description are only exemplary and explanatory, and cannot limit the present disclosure. BRIEF DESCRIPTION OF DRAWINGS

[0032] The accompanying drawings, which are incorporated into and form part of the specification, illustrate embodiments consistent with the present disclosure and, together with the description, serve to explain the principles of the disclosure. Obviously, the drawings in the following description are only some embodiments of the present disclosure, and other drawings can be obtained by those skilled in the art without creative labor on the basis of these drawings.

[0033] Figure 1 An exploded schematic view of a circuit board assembly according to an exemplary embodiment of the present disclosure;

[0034] Figure 2 A structural schematic view of an adapter plate according to an exemplary embodiment of the present disclosure;

[0035] Figure 3 A partial view of a circuit board assembly according to an exemplary embodiment of the present disclosure;

[0036] Figure 4 A partial enlarged view of an adapter plate according to an exemplary embodiment of the present disclosure;

[0037] Figure 5A structural diagram of a conductive structure provided for an exemplary embodiment of the present disclosure;

[0038] Figure 6 A structural diagram of a signal transmission provided for an exemplary embodiment of the present disclosure;

[0039] Figure 7 A structural diagram of a shielding provided for an exemplary embodiment of the present disclosure;

[0040] Figure 8 A structural diagram of another shielding provided for an exemplary embodiment of the present disclosure;

[0041] Figure 9 A structural diagram of a via group provided for an exemplary embodiment of the present disclosure;

[0042] Figure 10 A structural diagram of another via group provided for an exemplary embodiment of the present disclosure;

[0043] Figure 11 A structural diagram of an electronic device provided for an exemplary embodiment of the present disclosure;

[0044] Figure 12 A block diagram of an electronic device provided for an exemplary embodiment of the present disclosure.

[0045] Explanation of reference signs:

[0046] 100, a circuit board assembly; 10, a first circuit board; 20, a second circuit board; 30, an adapter board; 31, a via group; 301, a signal via; 302, a shielding via; 41, a signal transmission; 42, a shielding; 411, a ring-shaped transmission layer; 412, a signal pad; 413, a second insulating portion; 421, a ring-shaped shielding layer; 422, a first insulating portion; 423, a shielding pad; 401, a first pad portion; 402, a second pad portion; 200, a display device; 300, a middle frame; 400, a back cover; 502, a processing assembly; 504, a memory; 506, a power supply assembly; 508, a multimedia assembly; 510, an audio assembly; 512, an interface; 514, a sensor assembly; 516, a communication assembly; 520, a processor. DETAILED DESCRIPTION

[0047] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are some of the embodiments of the present application, rather than all the embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative work fall within the scope of protection of the present application.

[0048] The terms "first" and "second" are used only for descriptive purposes and should not be construed as indicating or implying relative importance. The term "a plurality" refers to two or more, unless otherwise expressly defined. Unless otherwise defined, all technical terms used in the embodiments of the present application have the same meanings as commonly understood by one of ordinary skill in the art. In order to make the technical solutions and advantages of the present application clearer, the embodiments of the present application will be further described in detail below with reference to the drawings.

[0049] The exemplary embodiments of the present disclosure first provide a circuit board assembly 100, as shown in Figure 1 and Figure 2 The circuit board assembly 100 includes a first circuit board 10, a second circuit board 20, and an adapter board 30, the second circuit board 20 and the first circuit board 10 are stacked, the adapter board 30 is arranged between the first circuit board 10 and the second circuit board 20, the adapter board 30 is provided with a through hole group 31, the through hole group 31 includes a signal through hole 301 and a plurality of shielding through holes 302, the signal through hole 301 is filled with a signal transmission member 41, and the shielding through hole 302 is filled with a shielding member 42. As shown in Figure 3 and Figure 4 The plurality of shielding through holes 302 surround the signal through hole 301 along a preset track, and there is a preset interval between adjacent shielding through holes 302 in the plurality of shielding through holes 302, the size of the shielding through hole 302 along the preset track is a first size L1, the size of the shielding through hole 302 in the direction perpendicular to the preset track is a second size L2, and the first size L1 is greater than the second size L2.

[0050] The circuit board assembly 100 provided by the embodiments of the present disclosure realizes signal interaction between the first circuit board 10 and the second circuit board 20 through the signal transmission member 41 in the signal through hole 301, and effectively prevents signal leakage and interference by filling the shielding member 42 in the shielding through hole 302 surrounding the signal through hole 301, thereby improving signal isolation. In order to ensure the strength of the adapter board 30, the interval between adjacent shielding holes in the plurality of shielding holes needs to be greater than a preset distance, and if the number of interval regions is large, the shielding performance will be affected, by setting the first size L1 of the shielding through hole 302 to be greater than the second size L2, the number of interval regions on the adapter board 30 can be reduced, thereby improving the shielding performance and signal isolation.

[0051] The circuit board assembly 100 provided by the embodiments of the present disclosure will be described below:

[0052] The first circuit board 10 and the second circuit board 20 are stacked, and the adapter board 30 is arranged between the first circuit board 10 and the second circuit board 20. The adapter board 30 is used to support the first circuit board 10 and the second circuit board 20, so that a space is formed between the first circuit board 10 and the second circuit board 20, which can be used to arrange electrical components. The adapter board 30 is also used to insulate the first circuit board 10 and the second circuit board 20, so as to avoid short circuit of the first circuit board 10 and the second circuit board 20.

[0053] The stacking of the first circuit board 10 and the second circuit board 20 can be understood as a large surface stacking. The first circuit board 10 has a plurality of surfaces, and the large surfaces of the first circuit board 10 are two surfaces with the largest area among the plurality of surfaces of the first circuit board 10 (the two large surfaces are parallel). The second circuit board 20 has a plurality of surfaces, and the large surface of the second circuit board 20 is the surface with the largest area among the plurality of surfaces of the second circuit board 20 (the two large surfaces are parallel). When stacked, one large surface of the first circuit board 10 and one large surface of the second circuit board 20 are opposite, and the adapter board 30 is located between the large surface of the first circuit board 10 and the large surface of the second circuit board 20.

[0054] For example, the first circuit board 10 can be a printed circuit board or a flexible circuit board, and the second circuit board 20 can be a printed circuit board or a flexible circuit board. The first circuit board 10 and the second circuit board 20 can be the same, for example, the first circuit board 10 and the second circuit board 20 are both printed circuit boards, or the first circuit board 10 and the second circuit board 20 are both flexible circuit boards. Or the first circuit board 10 and the second circuit board 20 are different, for example, the first circuit board 10 is a printed circuit board, and the second circuit board 20 is a flexible circuit board.

[0055] The shape of the first circuit board 10 can be the same as the shape of the second circuit board 20, that is, the orthographic projection of the first circuit board 10 on the second circuit board 20 coincides with the second circuit board 20. Or, the shapes of the first circuit board 10 and the second circuit board 20 are different, for example, the first circuit board 10 is a main circuit board, the second circuit board 20 is stacked with the first circuit board 10, and at least one avoiding notch is arranged on the second circuit board 20, which is used to avoid other devices in the electronic device.

[0056] Electronic components can be arranged on the large surface of the first circuit board 10 facing the second circuit board 20, or electronic components can be arranged on both large surfaces of the first circuit board 10. Electronic components can be arranged on the large surface of the second circuit board 20 facing the first circuit board 10, or electronic components can be arranged on both large surfaces of the second circuit board 20.

[0057] The adapter plate 30 is made of an insulating material, for example, the adapter plate 30 can be made of resin fiber, etc. The adapter plate 30 can include an adapter area for connecting the first circuit board 10 and the second circuit board 20, and a hollow area forming a receiving space for receiving electronic components between the first circuit board 10 and the second circuit board 20.

[0058] The adapter plate 30 is provided with a through hole group 31, which includes a signal through hole 301 filled with a signal transmission member 41 and a plurality of shielding through holes 302 filled with shielding members 42. Among them, the plurality of shielding through holes 302 surround the signal through hole 301 along a preset track, and the adjacent shielding through holes 302 in the plurality of shielding through holes 302 have a preset interval, the size of the shielding through hole 302 along the preset track is a first size, the size of the shielding through hole 302 along the direction perpendicular to the preset track is a second size, and the first size is greater than the second size.

[0059] Among them, the first size is the maximum distance of the shielding through hole 302 along the preset track. The shielding through hole 302 has a first end and a second end along the preset track, and the distance of the shielding through hole 302 along the preset track from the first end to the second end is the first size. The shielding through hole 302 has a first side wall and a second side wall, the first side wall of the shielding through hole 302 is the side wall of the shielding through hole 302 close to the signal through hole 301, and the second side wall of the shielding through hole 302 is the side wall of the shielding through hole 302 away from the signal through hole 301. The second size is the distance from the first side wall to the second side wall in the direction perpendicular to the preset track.

[0060] It should be noted that the preset track in the embodiment of the present disclosure is a closed ring, and the preset track can be a smooth ring or a polygon. When the preset track is a smooth ring, the shielding through hole 302 is arc-shaped, and the direction perpendicular to the preset track is the tangent line perpendicular to the preset track. For example, when the preset track is a circle, the first size is the size (arc length) of the shielding through hole 302 along the axial direction, and the second size is the size of the shielding through hole 302 along the radial direction.

[0061] For example, the preset track is a circle, and the shielding through hole 302 is an arc-shaped through hole. Or as Figure 9 shown, the preset track is a polygon, and the shielding through hole 302 is a straight line-shaped through hole or a broken line-shaped through hole. For example, as Figure 10 shown, the preset track is a triangle, and the shielding through hole 302 can be a rectangular through hole located on the side of the triangle. The signal through hole 301 can be a circular hole, or the signal through hole 301 can also be a polygonal hole, etc.

[0062] In some embodiments of the present disclosure, the adapter plate 30 can include a center region and a peripheral region, the center region being formed within a ring structure of the plurality of shielded through holes 302, and the peripheral region being formed outside the ring structure. The two adjacent shielded through holes 302 in the through hole group 31 have a spacing therebetween, so as to ensure the connection between the center region and the peripheral region when the shielded through holes 302 are processed on the adapter plate 30, and avoid the separation of the center region and the peripheral region. The distance between the two adjacent shielded through holes 302 in the through hole group 31 is greater than a preset distance, which can ensure that the spacing between the two shielded through holes 302 has sufficient strength when the shielded through holes 302 are processed, so that the center region will not be separated from the peripheral region, and the processing of the shielded through holes 302 will not damage the spacing region.

[0063] On this basis, as shown in Figure 5 , the number of shielded through holes 302 in the through hole group 31 is 3 or 4. The 3 or 4 shielded through holes 302 can be uniformly distributed around the signal through hole 301. In this way, the strength of the adapter plate 30 is ensured, and the clearance around the signal through hole 301 is also taken into account, thereby ensuring the signal isolation degree.

[0064] The signal transmission member 41 is arranged in the signal through hole 301, and is used to electrically connect the first circuit board 10 and the second circuit board 20. The signal transmission member 41 is used to transmit radio frequency signals and high frequency signals, and the frequency of the high frequency signals is greater than or equal to 5 GHz.

[0065] In some embodiments of the present disclosure, as shown in Figure 6 , the signal transmission member 41 includes a ring-shaped transmission layer 411, a second insulating portion 413, and a signal pad 412, the ring-shaped transmission layer 411 being formed on the inner wall of the signal through hole 301; the second insulating portion 413 being filled in the ring-shaped transmission layer 411; and the signal pad 412 being connected with the ring-shaped transmission layer 411 and extending at least partially to the surface of the adapter plate 30.

[0066] The ring-shaped transmission layer 411 can be a metal layer, and the ring-shaped transmission layer 411 can be formed on the inner wall of the signal through hole 301 by electroplating or the like, for example, the ring-shaped transmission layer 411 can be a copper plating layer. The second insulating portion 413 is formed by an insulating material, for example, the second insulating portion 413 can be formed by inserting resin into the ring-shaped transmission layer 411. The signal pad 412 is connected with the ring-shaped transmission layer 411 and extends outward from the ring-shaped transmission layer 411 to form a metal ring on the large surface of the adapter plate 30. For example, the signal pad 412 is a copper ring surrounding the ring-shaped transmission layer 411.

[0067] For example, the first circuit board 10 is provided with a first signal end, and the second circuit board 20 is provided with a second signal end; the adapter board 30 is provided with a first signal pad 412 on the side facing the first circuit board 10, and the first signal pad 412 is electrically connected with the first signal end; the adapter board 30 is provided with a second signal pad 412 on the side facing the second circuit board 20, and the second signal pad 412 is electrically connected with the second signal end.

[0068] In some embodiments of the present disclosure, as shown in Figure 7 The shielding member 42 includes a ring-shaped shielding layer 421, a first insulating portion 422, and a shielding pad 423. The ring-shaped shielding layer 421 is formed on the inner wall of the shielding through hole 302. The first insulating portion 422 is filled in the ring-shaped shielding layer 421. The shielding pad 423 is connected with the ring-shaped shielding layer 421, and the shielding pad 423 at least partially extends to the surface of the adapter board 30.

[0069] The ring-shaped shielding layer 421 can be a metal layer, and the ring-shaped shielding layer 421 can be formed on the inner wall of the shielding through hole 302 by electroplating or the like. For example, the ring-shaped shielding layer 421 can be a copper plating layer. The ring-shaped shielding layer 421 is shaped according to the shielding through hole 302, and the ring-shaped shielding layer 421 is tightly attached to the inner wall of the shielding through hole 302. When the shielding through hole 302 is an arc-shaped through hole, the ring-shaped shielding layer 421 is an arc-shaped ring.

[0070] The first insulating portion 422 is formed by an insulating material. For example, the first insulating portion 422 can be formed by inserting resin into the ring-shaped shielding layer 421. The shielding pad 423 is connected with the ring-shaped shielding layer 421, and the shielding pad 423 extends outward from the ring-shaped shielding layer 421 to form a metal pad on the large surface of the adapter board 30.

[0071] In a feasible implementation, the shielding pad 423 can surround the ring-shaped shielding layer 421. The shielding pad 423 is connected with the ring-shaped shielding layer 421, and the shielding pad 423 extends outward to form a metal pad surrounding the ring-shaped shielding layer 421 on the large surface of the adapter board 30. The shielding pad 423 surrounding the ring-shaped shielding layer 421 is formed on the adapter board 30, which is simple in process and is conducive to controlling the production cost.

[0072] In another feasible implementation, as shown in Figure 8 The shielding pad 423 includes a first pad portion 401 and a second pad portion 402. The first pad portion 401 and the second pad portion 402 are respectively arranged at two ends of the shielding through hole 302 along the preset track. That is, the shielding pad 423 is formed by two parts, and no pad is arranged in the middle region of the ring-shaped shielding layer 421, which can save space. In addition, the projection area of the shielding pad 423 on the first circuit board 10 and the second circuit board 20 is small, that is, the space on the first circuit board 10 and the second circuit board 20 is saved.

[0073] The shielding member 42 shields the signal transmission member 41 by grounding. The first circuit board 10 and / or the second circuit board 20 is provided with a grounding end, and the shielding pad 423 is electrically connected with the grounding end. The shielding pad 423 is electrically connected with the grounding end, which can ensure that the potential of the annular shielding layer 421 and the shielding pad 423 is stable, thereby improving the signal isolation degree.

[0074] For example, the two ends of the annular shielding layer 421 are respectively provided with a first shielding pad 423 and a second shielding pad 423, the first circuit board 10 is provided with a first grounding end, the second circuit board 20 is provided with a second grounding end, the first shielding pad 423 is connected with the first grounding end, and the second shielding pad 423 is connected with the second grounding end.

[0075] In some embodiments of the present disclosure, the adapter plate 30 is provided with adjacent first and second through hole groups 31, and the shielding through holes 302 in the first through hole group 31 close to the second through hole group 31 and the shielding through holes 302 in the second through hole group 31 close to the first through hole group 31 are communicated. By communicating the adjacent shielding through holes 302 in the two through hole groups 31, on the one hand, it is convenient for processing, and on the other hand, the two shielding through holes 302 are communicated, and then the two shielding members 42 are connected, so that the gap between the two signal through holes 301 can be reduced, thereby improving the signal isolation degree.

[0076] The manufacturing method of the adapter plate 30 in the embodiments of the present disclosure can be as follows:

[0077] A base body of the adapter plate 30 is provided, such as a resin fiber base body;

[0078] Signal through holes 301 are processed and formed on the base body of the adapter plate 30;

[0079] An annular transmission layer 411 is formed by electroplating (copper plating) in the signal through hole 301;

[0080] A second insulating part 413 is filled (resin is inserted) in the annular transmission layer 411;

[0081] The device after the second insulating part 413 is cured is polished, copper is reduced, and overflow glue is removed;

[0082] A plurality of shielding through holes 302 are processed and formed on the base body of the adapter plate 30;

[0083] An annular shielding layer 421 is formed by electroplating (copper plating) in the shielding through hole 302;

[0084] A first insulating part 422 is filled (resin is inserted) in the annular shielding layer 421;

[0085] The device after the first insulating part is cured is polished, copper is reduced, and overflow glue is removed;

[0086] The copper is formed on the base of the adapter plate 30 (signal pads 412 and shielding pads 423).

[0087] In the related art, the shielding via hole 302 completely surrounding the signal via hole 301 is arranged around the signal via hole 301. The shielding via hole 302 completely surrounding the signal via hole 301 separates the central region in the adapter plate 30 and the peripheral region of the adapter plate 30 when the shielding via hole 302 is processed, and the central region needs to be filled in the subsequent step. In the present disclosure, it can be known from the above manufacturing method that the central region does not need to be filled, and therefore the manufacturing process of the circuit board assembly 100 provided in the embodiment of the present disclosure is simple, thereby improving the production efficiency and reducing the cost.

[0088] The electronic device provided in the embodiment of the present disclosure, and the circuit board assembly 100 provided in the embodiment of the present disclosure, realize the signal interaction of the first circuit board 10 and the second circuit board 20 through the signal transmission member 41 in the signal via hole 301, and can effectively prevent signal leakage and interference by filling the shielding member 42 in the shielding via hole 302 surrounding the signal via hole 301, thereby improving the signal isolation degree. In order to ensure the strength of the adapter plate 30, the interval between adjacent shielding holes in the plurality of shielding holes needs to be greater than a preset distance, and if the number of interval regions is large, the shielding performance will be affected. By setting the shielding via hole 302 to have a first size greater than a second size, the number of interval regions on the adapter plate 30 can be reduced, thereby improving the shielding performance and the signal isolation degree.

[0089] The exemplary embodiment of the present disclosure also provides an electronic device, such as Figure 11 As shown in the figure, the electronic device includes the above-mentioned circuit board assembly 100.

[0090] The circuit board assembly 100 can be used as the mainboard of the electronic device. The circuit board assembly 100 is a stacked circuit board, which occupies less space inside the electronic device when stacked, and can arrange more electronic devices, thereby improving the integration of the internal devices of the electronic device and facilitating the thinning of the electronic device.

[0091] The electronic device can be a mobile phone, a tablet computer, an e-reader, an MP3 player, an MP4 player, a notebook computer, a car machine, or a desktop computer, a portable terminal, a laptop terminal, a desktop terminal, a sports camera, a drone, a monitor camera, and the like.

[0092] Taking the mobile phone as an example, the electronic device can further include a display device 200, a middle frame 300, and a back cover 400, and the display device 200 and the back cover 400 are respectively connected to two sides of the middle frame 300. The display device 200, the middle frame 300, and the back cover 400 form a containing space inside the electronic device, and the circuit board assembly 100 is arranged in the containing space.

[0093] As shown in Figure 12 the electronic device can further include one or more of the following components: a processing component 502, a memory 504, a power supply component 506, a multimedia component 508, an audio component 510, an input / output (I / O) interface 512, a sensor component 514, and a communication component 516.

[0094] The processing component 502 usually controls overall operations of the electronic device, such as operations associated with display, phone call, data communication, camera operation and recording operation. The processing component 502 can include one or more processors 520 to execute instructions to complete all or part of steps of the methods described above. In addition, the processing component 502 can include one or more modules to facilitate the interaction between the processing component 502 and other components. For example, the processing component 502 can include a multimedia module to facilitate the interaction between the multimedia component 508 and the processing component 502.

[0095] The memory 504 is configured to store various types of data to support operations of the device. Examples of these data include instructions for any application or method operating on the electronic device, contact data, phonebook data, messages, pictures, videos, etc. The memory 504 can be implemented by any type of volatile or non-volatile storage devices or a combination thereof, such as static random access memory (SRAM), electrically erasable programmable read-only memory (EEPROM), erasable programmable read-only memory (EPROM), programmable read-only memory (PROM), read-only memory (ROM), magnetic storage, flash memory, magnetic disk or optical disk.

[0096] The power supply component 506 provides power for various components of the electronic device. The power supply component 506 can include a power supply management system, one or more power supplies, and other components associated with generating, managing and distributing power for the electronic device.

[0097] The multimedia component 508 includes a screen providing an output interface between the electronic device and a user. In some embodiments, the screen can include a liquid crystal display (LCD) and a touch panel (TP). If the screen includes a touch panel, the screen can be implemented as a touch screen to receive input signals from a user. The touch panel includes one or more touch sensors to sense touch, slide and gesture on the touch panel. The touch sensor can not only sense a boundary of a touching or sliding action, but also detect duration and pressure related to the touching or sliding action. In some embodiments, the multimedia component 508 includes a front camera and / or a rear camera. When the device is in an operation mode, such as a shooting mode or a video mode, the front camera and / or the rear camera can receive external multimedia data. Each of the front and rear camera can be a fixed optical lens system or have a focal length and optical zoom capability.

[0098] The audio component 510 is configured to output and / or input audio signals. For example, the audio component 510 includes a microphone (MIC) configured to receive external audio signals when the electronic device is in an operation mode, such as a call mode, a recording mode, and a voice recognition mode. The received audio signals can be further stored in the memory 504 or transmitted via the communication component 516. In some embodiments, the audio component 510 also includes a speaker for outputting audio signals.

[0099] The I / O interface 512 provides an interface between the processing component 502 and peripheral interface modules, which can be a keypad, a click wheel, buttons, and the like. The buttons can include, but are not limited to, a home button, a volume button, a start button, and a lock button.

[0100] The sensor component 514 includes one or more sensors to provide various state assessments for the electronic device. For example, the sensor component 514 can detect an open / closed state of the device, relative positioning of components, such as a display and a keypad of the electronic device, a change in position of the electronic device or a component of the electronic device, presence or absence of user contact with the electronic device, the electronic device's orientation or acceleration / deceleration, and a temperature change of the electronic device. The sensor component 514 can include a proximity sensor configured to detect presence of a nearby object without any physical touch. The sensor component 514 can further include a light sensor, such as a CMOS or CCD image sensor, for use in an imaging application. In some embodiments, the sensor component 514 can further include an acceleration sensor, a gyroscope sensor, a magnetic sensor, a pressure sensor, or a temperature sensor.

[0101] The communication components 516 are configured to facilitate wired or wireless communication between the electronic device and other devices. The electronic device can access a wireless network based on a communication standard, such as WiFi, 3G, 4G, 5G, other communication standards, or a combination thereof. In some embodiments of the present disclosure, the communication components 516 receive a broadcast signal or broadcast related information from an external broadcast management system via a broadcast channel. In some embodiments of the present disclosure, the communication components 516 also include a Near Field Communication (NFC) module to facilitate short-range communication. For example, the NFC module can be implemented based on Radio Frequency Identification (RFID) techniques, infrared data association (IrDA) techniques, Ultra-Wide Band (UWB) techniques, Bluetooth (BT) techniques, and other techniques.

[0102] Other embodiments of the present disclosure will be apparent to those skilled in the art from consideration of the specification and practice of the aspects disclosed herein. For example, the specification and examples can be used to assess the value of the present disclosure for accomplishing related and / or similar purposes. Such other embodiments are also within the scope of the present disclosure. It is intended that the specification and examples be considered as exemplary only, with the true scope and spirit of the present disclosure being indicated by the following claims.

Claims

1. A circuit board assembly, characterized by The circuit board assembly comprises: a first circuit board; a second circuit board, which is stacked with the first circuit board; an adapter plate, which is arranged between the first circuit board and the second circuit board, and is provided with a through hole group, the through hole group comprises signal through holes and a plurality of shielding through holes, the signal through holes are filled with signal transmission members, and the shielding through holes are filled with shielding members; wherein the plurality of shielding through holes surround the signal through holes along a preset track, and the shielding through holes have a preset interval between adjacent shielding through holes, the size of the shielding through holes along the preset track is a first size, the size of the shielding through holes along a direction perpendicular to the preset track is a second size, and the first size is greater than the second size.

2. The circuit board assembly of claim 1, wherein, The preset track is circular, and the shielding through holes are arc-shaped through holes. Or, the preset track is polygonal, and the shielding through holes are linear through holes or zigzag-shaped through holes.

3. The circuit board assembly of claim 1, wherein, The shielding member comprises: a ring-shaped shielding layer, which is formed on the inner wall of the shielding through hole; a first insulating part, which is filled in the ring-shaped shielding layer; a shielding pad, which is connected with the ring-shaped shielding layer and at least partially extends to the surface of the adapter plate.

4. The circuit board assembly of claim 3, wherein, The shielding pad comprises a first pad part and a second pad part, which are respectively arranged at the two ends of the shielding through hole along the preset track.

5. The circuit board assembly of claim 3, wherein, The first circuit board and / or the second circuit board is provided with a grounding terminal, and the shielding pad is electrically connected with the grounding terminal.

6. The circuit board assembly of claim 1, wherein, The signal transmission member comprises: a ring-shaped transmission layer, which is formed on the inner wall of the signal through hole; a second insulating part, which is filled in the ring-shaped transmission layer; a signal pad, which is connected with the ring-shaped transmission layer and at least partially extends to the surface of the adapter plate.

7. The circuit board assembly of claim 6, wherein, The first circuit board is provided with a first signal terminal, and the second circuit board is provided with a second signal terminal; the adapter plate is provided with a first signal pad on the side facing the first circuit board, the first signal pad is electrically connected with the first signal terminal, the adapter plate is provided with a second signal pad on the side facing the second circuit board, and the second signal pad is electrically connected with the second signal terminal.

8. The circuit board assembly of claim 1, wherein, The adapter plate is provided with adjacent first and second through hole groups, and the shielding through holes in the first through hole group close to the second through hole group are in communication with the shielding through holes in the second through hole group close to the first through hole group.

9. The circuit board assembly of any of claims 1-8, wherein, The distance between two adjacent shielding through holes in the through hole group is greater than a preset distance, and the number of the shielding through holes in the through hole group is 3 or 4.

10. The circuit board assembly of any one of claims 1-8, wherein, The signal transmission member is used for transmitting radio frequency signals or high frequency signals, and the frequency of the high frequency signals is greater than or equal to 5 GHz.

11. An electronic device, comprising: The electronic device comprises the circuit board assembly of any one of claims 1-10.

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