AC socket pad structure and portable energy storage power supply

Abstract

The present disclosure provides an AC socket pad structure, which comprises a semi-enclosed pad structure and a circuit board. The semi-enclosed pad structure is arranged on the circuit board. The semi-enclosed pad structure comprises a first pad body part, a second pad body part, a pad connecting part and a soldering leg via part. The soldering leg via part penetrates the circuit board. The soldering leg via part is located on the inner side of the first pad body part, the second pad body part and the pad connecting part. The soldering leg via part is arranged separately from the first pad body part, the second pad body part and the pad connecting part. Due to the adoption of the semi-enclosed pad structure, the soldering process can be changed from double-sided tin to single-sided tin, thereby simplifying the soldering steps and improving the soldering efficiency. Meanwhile, the pad gap is arranged between the soldering leg via part and the pad body part and the connecting part. This design increases the operation space of the soldering work, thereby facilitating the soldering or disassembly and repair work of the operator.

Description

TECHNICAL FIELD

[0001] The present disclosure relates to the technical field of pad structure design, and particularly relates to an AC socket pad structure and a portable energy storage power supply. BACKGROUND

[0002] In the current electronic industry, the pad structure design of the output socket of the portable energy storage whole machine as an important energy conversion equipment has been facing many challenges. The traditional pad design has many inconveniences in the maintenance and welding process. Specifically, the traditional pad design is usually fully wrapped with a soldering leg, and tin needs to be added on both sides during welding, so that the traditional pad design has the problems of low welding efficiency and complicated operation process, thereby increasing the difficulty and cost of maintenance. CONTENT OF THE UTILITY MODEL

[0003] The purpose of the present disclosure is to overcome the deficiencies in the prior art and provide a non-metallized via pad structure and a PCB.

[0004] The purpose of the present disclosure is achieved by the following technical solutions:

[0005] An AC socket pad structure, comprising a semi-enclosed pad structure and a circuit board, wherein the semi-enclosed pad structure is arranged on the circuit board.

[0006] The semi-enclosed pad structure comprises a first pad body part, a second pad body part, a pad connecting part, and a soldering leg via part, the soldering leg via part penetrates the circuit board, one end of the first pad body part is connected to one end of the pad connecting part, one end of the second pad body part is connected to the other end of the pad connecting part, the second end of the first pad body part is arranged opposite to and spaced apart from the second end of the second pad body part, the soldering leg via part is located inside the first pad body part, the second pad body part, and the pad connecting part, and the soldering leg via part is arranged spaced apart from the first pad body part, the second pad body part, and the pad connecting part, respectively.

[0007] In one of the embodiments, the soldering leg via part is a non-metallized soldering leg via part.

[0008] In one of the embodiments, at least one of the first pad body part and the second pad body part is in a semi-circular ring shape.

[0009] In one of the embodiments, at least one of the angle range of the central angle of the first pad body part and the angle range of the central angle of the second pad body part is 170 to 180 degrees.

[0010] In one of the embodiments, the inner ring radius of the first pad body part ranges from 1.3mm to 1.4mm, and the inner ring radius of the second pad body part ranges from 1.3mm to 1.4mm.

[0011] In one of the embodiments, the width of the first pad body part, the width of the second pad body part, and the width of the pad connecting part all range from 1.7mm to 1.8mm.

[0012] In one of the embodiments, the width of the soldering leg via part ranges from 1.1mm to 1.2mm.

[0013] In one of the embodiments, the gap width between the soldering leg via part and the first pad body part, the gap width between the soldering leg via part and the second pad body part, and the gap width between the soldering leg via part and the pad connecting part all range from 0.4mm to 0.5mm.

[0014] In one of the embodiments, the length of the pad structure ranges from 9mm to 10mm.

[0015] A portable energy storage power supply comprising the AC socket pad structure of any of the above embodiments.

[0016] Compared with the prior art, the present disclosure has at least the following advantages:

[0017] 1. The AC socket pad structure described above adopts a half-enclosed pad structure, and the half-enclosed pad structure can be changed from traditional double-sided soldering to single-sided soldering during soldering and tinning, thereby simplifying the soldering process and improving the soldering efficiency. At the same time, since the soldering leg via part is respectively provided with a pad gap between the first pad body part, the second pad body part, and the pad connecting part, the operation space for soldering is increased, thereby facilitating the operator to solder or disassemble and repair the half-enclosed pad structure, and thereby reducing the difficulty of soldering and repairing the AC socket pad structure. BRIEF DESCRIPTION OF DRAWINGS

[0018] In order to more clearly illustrate the technical solutions of the embodiments of the present disclosure, the following will briefly introduce the drawings needed to be used in the embodiments. It should be understood that the following drawings only show some embodiments of the present disclosure, and therefore should not be regarded as a limitation on the scope. For those skilled in the art, other related drawings can also be obtained without creative labor on the basis of these drawings.

[0019] Figure 1 It is a structural schematic diagram of the pad structure of an embodiment;

[0020] Figure 2 It is a structural schematic diagram of the existing pad structure;

[0021] Figure 3 As Figure 1 Another structural diagram of the pad structure shown. DETAILED DESCRIPTION

[0022] For the purpose of promoting the understanding of the disclosure, the disclosure will be described in further detail below with reference to the relevant drawings. The preferred embodiments of the disclosure are shown in the drawings. However, the disclosure can be implemented in many different forms and is not limited to the embodiments described herein. Rather, the purpose of providing these embodiments is to make the disclosure more comprehensively and thoroughly understood.

[0023] It should be noted that when an element is referred to as being "fixed" to another element, it can be directly on the other element or there can be an intervening element. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or there can be an intervening element. The terms "vertical", "horizontal", "left", "right", and similar expressions used herein are for illustrative purposes only and are not intended to be the only implementation.

[0024] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure belongs. The terminology used in the description of the disclosure herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the disclosure. As used herein, the term "and / or" includes any and all combinations of one or more of the associated listed items.

[0025] In order to better understand the technical solutions and beneficial effects of the disclosure, the disclosure will be further described in detail below in combination with specific embodiments:

[0026] As Figures 1 to 3 shown, the AC socket pad structure 10 of an embodiment of the disclosure includes a semi-enclosed pad structure 100 and a circuit board, and the semi-enclosed pad structure 100 is arranged on the circuit board.

[0027] The semi-enclosed pad structure 100 includes a first pad body part 110, a second pad body part 120, a pad connecting part 130, and a soldering leg via part 140. The soldering leg via part 140 penetrates through the circuit board. A first end of the first pad body part 110 is connected to one end of the pad connecting part 130, and a first end of the second pad body part 120 is connected to the other end of the pad connecting part 130. A second end of the first pad body part 110 and a second end of the second pad body part 120 are oppositely and spacedly arranged. The soldering leg via part 140 is located inside the first pad body part 110, the second pad body part 120, and the pad connecting part 130, and is spacedly arranged with the first pad body part 110, the second pad body part 120, and the pad connecting part 130, respectively.

[0028] In the present embodiment, as shown in Figure 2 The traditional pad design is shown in the figure, and the present embodiment changes the conventional full-coverage pad to a half-coverage pad structure 100, which includes a first pad body part 110, a second pad body part 120, a pad connecting part 130, and a solder leg via part 140. The second end of the first pad body part 110 is arranged opposite to the second end of the second pad body part 120 but is not connected, so that the pad structure is changed to the half-coverage pad structure 100. When welding the half-coverage pad structure 100, soldering can be completed by adding solder on one side only, which greatly improves the welding efficiency of the half-coverage pad structure 100 compared with the traditional two-side soldering method, thereby reducing the operation time in the welding process. In addition, in the traditional pad design, there is usually no sufficient gap between the pad and the solder leg, which makes it difficult and costly to disassemble and weld. Therefore, a pad gap is arranged between the inner side of the first pad body part 110, the second pad body part 120, and the pad connecting part 130, and the solder leg via part 140. The pad gap with appropriate width facilitates the operator to easily separate the soldering points when the half-coverage pad structure 100 needs to be disassembled and welded, thereby reducing the difficulty and loss rate of maintenance.

[0029] The AC socket pad structure 10 described above adopts the half-coverage pad structure 100, and the half-coverage pad structure 100 can be changed from the traditional double-sided soldering to one-side soldering in the soldering process, thereby simplifying the welding process and improving the welding efficiency. At the same time, since the solder leg via part 140 is arranged with a pad gap between the first pad body part 110, the second pad body part 120, and the pad connecting part 130, the operation space for welding is increased, thereby facilitating the operator to weld or disassemble and maintain the half-coverage pad structure 100, and thereby reducing the difficulty of welding and maintenance of the AC socket pad structure 10.

[0030] As shown in Figure 3 In one embodiment, the solder leg via part is a non-metallized solder leg via part to reduce the risk of poor welding or short circuit of the component during welding. In the present embodiment, the traditional pad design usually uses a via for electrical connection. However, due to the metallization of the via, the solder tin is easily immersed in the hole during the welding process, increasing the risk of poor welding or short circuit. When welding is performed, since the solder leg via part is not metallized, its insulation property effectively prevents the solder tin from flowing disorderly inside the via. During one-side soldering, the solder tin will not flow to other parts that should not be connected due to the metal guide of the via wall, greatly reducing the risk of short circuit caused by accidental connection of the solder tin. At the same time, for some components with high requirements for welding precision, the non-metallized solder leg via part avoids the risk of virtual welding caused by metallization of the via, thereby improving the accuracy of welding.

[0031] AsFigure 3 As shown in the drawings, in one embodiment, at least one of the first pad body part 110 and the second pad body part 120 is in the shape of a semi-circular ring. In this embodiment, the first pad body part 110 and the second pad body part 120 in the shape of a semi-circular ring each surround the two sides of the soldering leg in the shape of a semi-circular ring and are connected by the pad connecting part 130, and together form a semi-enclosed pad structure 100. This design not only maintains good electrical connection between the pad and the soldering leg, but also the open structure is conducive to welding and maintenance. Compared with the traditional full-enclosed soldering leg pad structure, since the pad does not completely enclose the soldering leg, the soldering work can be completed by adding tin on one side of the pad, without the need to add tin on both sides of the pad, thereby simplifying the soldering process and improving the soldering efficiency. In addition, when disassembling and repairing, the semi-enclosed pad structure 100 is more conducive to the separation between the soldering point and the pad, thereby improving the efficiency of disassembly and repair.

[0032] As shown in the drawings, Figure 3 In one embodiment, at least one of the central angle range of the first pad body part 110 and the central angle range of the second pad body part 120 is 170 to 180 degrees, that is, the central angle range of the first pad body part 110 is 170 to 180 degrees, or the central angle range of the second pad body part 120 is 170 to 180 degrees, or both the central angle range of the first pad body part 110 and the central angle range of the second pad body part 120 are 170 to 180 degrees. In this embodiment, both the central angle range of the first pad body part 110 and the central angle range of the second pad body part 120 are 170 to 180 degrees. When the central angle of the first pad body part 110 and the central angle of the second pad body part 120 are close to 180 degrees, the contact area between the pad and the soldering leg increases, thereby making the tin flow more smoothly during soldering, and the soldering point is more firm. At the same time, since the semi-enclosed pad structure 100 only needs to add tin on one side of the pad to complete the soldering work, the soldering efficiency is improved, and the stability of the soldering point is ensured. When the central angle range of the pad is 170 to 180 degrees, the pad still does not completely enclose the soldering leg, which is conducive to the operator to contact the soldering leg for disassembly and repair.

[0033] As shown in the drawings, Figure 3As shown, in one embodiment, the inner ring radius R1 of the first pad body portion 110 and the inner ring radius R2 of the second pad body portion 120 are both in the range of 1.3mm to 1.4mm. In this embodiment, this inner ring radius range allows a moderate contact area between the pad and the soldering leg, which facilitates the uniform flow of soldering material during the soldering process, and makes the soldering joint more robust and aesthetically pleasing. Meanwhile, the moderate contact area also reduces the risk of poor soldering or short circuit caused by excessive contact area. Within this inner ring radius range, the gap between the pad and the soldering leg facilitates the disassembly and repair of the pad structure 10 by the operator, so that the operator can easily access the soldering leg and uniformly heat and separate the soldering joint, thereby reducing the difficulty and loss rate during the repair process.

[0034] As shown, in one embodiment, the width range W1 of the first pad body portion 110, the width range W2 of the second pad body portion 120, and the width range W3 of the pad connecting portion 130 are all in the range of 1.7mm to 1.8mm. In this embodiment, this width range ensures that the pad can sufficiently contact the soldering material during the soldering process, making the soldering joint more robust and uniform. A moderate width can avoid the problems of excessive soldering material loss caused by excessive width and insufficient soldering material coverage caused by insufficient width, thereby improving the stability and reliability of the soldering. In addition, during disassembly and repair, a moderate width range facilitates the operator to heat and separate the soldering joint, thereby reducing the difficulty and loss rate during the repair process, improving the repair efficiency, and reducing the damage to components caused by improper repair. Figure 3 As shown, in one embodiment, the width range W4 of the soldering leg via portion 140 is in the range of 1.1mm to 1.2mm. In this embodiment, the soldering leg via portion 140 in this width range can provide stable electrical connection for the component, while avoiding excessive width causing loose electrical connection, thereby improving the electrical performance of the circuit board. Moreover, since the soldering leg via portion 140 is composed of non-metalized material, it can effectively prevent soldering tin from flowing into its interior during the soldering process, thereby avoiding the risk of poor soldering or short circuit, and helping to ensure the quality and reliability of the soldering joint, thereby improving the overall performance of the circuit board. A moderate width of the soldering leg via portion 140 makes it easier for the operator to handle the soldering joint near the soldering leg via portion 140 during disassembly and repair.

[0035] Figure 3 As shown, in one embodiment, the width range W4 of the soldering leg via portion 140 is in the range of 1.1mm to 1.2mm. In this embodiment, the soldering leg via portion 140 in this width range can provide stable electrical connection for the component, while avoiding excessive width causing loose electrical connection, thereby improving the electrical performance of the circuit board. Moreover, since the soldering leg via portion 140 is composed of non-metalized material, it can effectively prevent soldering tin from flowing into its interior during the soldering process, thereby avoiding the risk of poor soldering or short circuit, and helping to ensure the quality and reliability of the soldering joint, thereby improving the overall performance of the circuit board. A moderate width of the soldering leg via portion 140 makes it easier for the operator to handle the soldering joint near the soldering leg via portion 140 during disassembly and repair.

[0036] As shown, in one embodiment, the width range W4 of the soldering leg via portion 140 is in the range of 1.1mm to 1.2mm. In this embodiment, the soldering leg via portion 140 in this width range can provide stable electrical connection for the component, while avoiding excessive width causing loose electrical connection, thereby improving the electrical performance of the circuit board. Moreover, since the soldering leg via portion 140 is composed of non-metalized material, it can effectively prevent soldering tin from flowing into its interior during the soldering process, thereby avoiding the risk of poor soldering or short circuit, and helping to ensure the quality and reliability of the soldering joint, thereby improving the overall performance of the circuit board. A moderate width of the soldering leg via portion 140 makes it easier for the operator to handle the soldering joint near the soldering leg via portion 140 during disassembly and repair. Figure 3 ​As shown, in one embodiment, the gap width W5 between the solder pin via and the first pad body, the second pad body, and the pad connection portion is between 0.4mm and 0.5mm. In this embodiment, the appropriate pad gap width allows the solder to fully fill the area between the pad and the solder pin during flow, without excessive diffusion due to excessive gap, thus ensuring the integrity and strength of the solder joint. In single-sided soldering operations, the pad gap guides the solder to be evenly distributed on the contact surface between the pad and the solder pin, forming a good metal connection, which helps to improve the quality and stability of the soldering, thereby achieving a reliable electrical connection. On the other hand, during desoldering and repair, the moderate gap provides sufficient operating space for the operator. When it is necessary to heat and separate the solder joint, the repair tool can more easily reach between the solder joint and the pad, allowing the operator to more accurately control the heating position and intensity, evenly heat the solder joint, and thus quickly melt the solder and separate it from the pad and the solder pin, reducing the difficulty of desoldering.

[0037] like Figure 3 As shown, in one embodiment, the length L of the pad structure 10 ranges from 9mm to 10mm. In this embodiment, the length of the pad structure 10 is within this range, ensuring that each pad structure 10 on the circuit board does not occupy excessive space, thus not affecting the layout of adjacent components. Furthermore, insufficient length does not restrict soldering and repair operations, helping to improve the space utilization of the circuit board and making the circuit board design more efficient and reliable. In addition, the appropriate pad length provides sufficient operating space for the soldering process. Operators can apply solder to one side of the pad, ensuring that the solder evenly covers the pad and solder foot, forming a strong solder joint.

[0038] This application also provides a portable energy storage power supply, including the AC socket pad structure 10 of any of the above embodiments. In this embodiment, as... Figure 2As shown in the traditional pad design, the embodiment is changed from a conventional full-coverage pad to a half-coverage pad structure 100, which includes a first pad body part 110, a second pad body part 120, a pad connecting part 130, and a solder leg via part 140. The second end of the first pad body part 110 is arranged opposite to the second end of the second pad body part 120 but is not connected, so that the pad structure is changed to the half-coverage pad structure 100. When welding the half-coverage pad structure 100, only one side of tin needs to be added to complete the welding work. Compared with the traditional two-side tin method, the welding efficiency of the half-coverage pad structure 100 is greatly improved, thereby reducing the operation time in the welding process. In addition, in the traditional pad design, there is usually not enough gap between the pad and the solder leg, so it is difficult to disassemble and has high loss. Therefore, a pad gap is arranged between the inner side of the first pad body part 110, the second pad body part 120, and the pad connecting part 130, and the solder leg via part 140. The pad gap with appropriate width is beneficial to the operator to easily separate the solder joint when the half-coverage pad structure 100 needs to be disassembled, thereby reducing the maintenance difficulty and loss rate.

[0039] Compared with the prior art, the present disclosure has at least the following advantages:

[0040] 1. The AC socket pad structure 10 described above adopts a half-coverage pad structure 100, and the half-coverage pad structure 100 can be changed from the traditional double-sided tin to single-sided tin during welding and tinning, thereby simplifying the welding process and improving the welding efficiency. At the same time, since the solder leg via part 140 is arranged between the first pad body part 110, the second pad body part 120, and the pad connecting part 130, respectively, the operation space for welding is increased, thereby facilitating the operator to weld or disassemble and maintain the half-coverage pad structure 100, thereby reducing the difficulty of welding and maintenance of the AC socket pad structure 10.

[0041] The above-described embodiments only express several embodiments of the present disclosure, and the description is more specific and detailed, but it cannot be understood as a limitation on the scope of the disclosed patent. It should be noted that for ordinary skilled persons in the art, without departing from the concept of the present disclosure, a number of modifications and improvements can be made, which are within the scope of the present disclosure. Therefore, the protection scope of the present disclosure patent should be subject to the appended claims.

Claims

1. A structure of an AC socket pad, comprising a semi-enclosed pad structure and a circuit board, wherein the semi-enclosed pad structure is disposed on the circuit board, and characterized in that, the semi-enclosed pad structure comprises a first pad body part, a second pad body part, a pad connecting part, and a soldering pin via part, the soldering pin via part penetrates the circuit board, a first end of the first pad body part is connected to one end of the pad connecting part, a first end of the second pad body part is connected to the other end of the pad connecting part, a second end of the first pad body part is opposite to and spaced apart from a second end of the second pad body part, the soldering pin via part is located inside the first pad body part, the second pad body part, and the pad connecting part, and the soldering pin via part is spaced apart from the first pad body part, the second pad body part, and the pad connecting part, respectively.

2. The AC socket pad structure according to claim 1, wherein, The soldering pin via part is a non-metallized soldering pin via part.

3. The AC socket pad structure according to claim 1, wherein, At least one of the first pad body part and the second pad body part is a semi-circular ring shape.

4. The AC socket pad structure according to claim 3, wherein, At least one of the central angle of the first pad body part and the central angle of the second pad body part is in the range of 170 degrees to 180 degrees.

5. The AC socket pad structure according to claim 3, wherein, The inner ring radius of the first pad body part and the inner ring radius of the second pad body part are both in the range of 1.3 mm to 1.4 mm.

6. The AC socket pad structure according to claim 1, wherein, The width of the first pad body part, the width of the second pad body part, and the width of the pad connecting part are all in the range of 1.7 mm to 1.8 mm.

7. The AC socket pad structure according to claim 1, wherein, The width of the soldering pin via part is in the range of 1.1 mm to 1.2 mm.

8. The AC socket pad structure of claim 1, wherein, The gap width of the soldering pin via part with respect to the first pad body part, the second pad body part, and the pad connecting part is in the range of 0.4 mm to 0.5 mm.

9. The AC socket pad structure of claim 1, wherein, The length of the pad structure is in the range of 9 mm to 10 mm.

10. A portable energy storage power source, characterized by, An AC socket pad structure according to any one of claims 1 to 9.

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