Heat dissipation assembly and electronic equipment

Abstract

The utility model relates to a heat dissipation assembly and electronic equipment, the heat dissipation assembly comprises a heat dissipation plate and a heat conduction block, and the heat conduction block comprises a heat conduction part which is arranged in a protruding mode in the direction opposite to the heat dissipation plate. When the heat dissipation assembly is installed on the electronic equipment to be used, only the heat conduction part of the heat conduction block needs to stretch into the shielding cover opening of the shielding cover and make contact with the heating element, installation and fixation of parts such as a heat dissipation plate do not need to be carried out, and therefore the assembly efficiency of the electronic equipment can be improved. Heat generated when the heating element works is transmitted to the heat conduction block through the heat conduction part, heat of the heat conduction block is transmitted to the external environment through the heat dissipation plate, and heat dissipation of the heating element is achieved.

Description

TECHNICAL FIELD

[0001] The present disclosure relates to the technical field of electronic devices, in particular to a heat dissipation assembly and an electronic device. BACKGROUND

[0002] The heat-dissipating element (for example, a chip) in the electronic device is usually cooled by a thermoelectric refrigeration sheet. Specifically, the thermoelectric refrigeration sheet is arranged in a metal shielding cover, the cold face of the thermoelectric refrigeration sheet is in contact with the heat-dissipating element, the hot face of the thermoelectric refrigeration sheet is in contact with the metal shielding cover, the outer surface of the metal shielding cover is in contact with a heat dissipation plate, and the heat dissipation of the heat-dissipating element is achieved. In addition, the metal shielding cover is electrically connected with the circuit board, so that a closed cavity is formed between the metal shielding cover and the circuit board, the heat-dissipating element is in the closed cavity and is electrically connected with the circuit board, and the closed cavity plays an electromagnetic shielding role. This results in the need for installation and fixation of the thermoelectric refrigeration sheet, the heat dissipation plate and other scattered heat dissipation components during the assembly of the electronic device, thereby reducing the assembly efficiency of the electronic device. SUMMARY

[0003] The present disclosure provides a heat dissipation assembly to improve the assembly efficiency of the electronic device.

[0004] The heat dissipation assembly of the present disclosure comprises a heat dissipation plate and a heat-conducting block, wherein the heat-conducting block comprises a heat-conducting part protruding in a direction away from the heat dissipation plate.

[0005] Optionally, the heat dissipation assembly further comprises a thermoelectric refrigeration sheet, and the thermoelectric refrigeration sheet is arranged between the heat-conducting block and the heat dissipation plate.

[0006] Optionally, the heat dissipation assembly further comprises a mounting shell, and the heat dissipation plate and the heat-conducting block are connected with the mounting shell.

[0007] Optionally, the mounting shell has a cavity, and a first opening and a second opening are oppositely arranged, the heat dissipation plate is arranged outside the cavity and blocks the first opening, the heat-conducting block is arranged in the cavity, and the heat-conducting part protrudes in the direction away from the heat dissipation plate and is arranged at the second opening.

[0008] Optionally, the mounting shell is a heat-insulating shell.

[0009] Optionally, the mounting shell is a plastic shell, the heat-conducting block is a metal block, and the heat-conducting block is integrally injection molded with the mounting shell.

[0010] Optionally, the heat-conducting block is an electrically-conducting block, the heat dissipation assembly further comprises an electrical connector, the electrical connector is electrically connected with the heat-conducting block, and the electrical connector has an electrical connection part.

[0011] Optionally, the outer circumferential surface of the heat-conducting part and the mounting shell have a first spacing, and the heat-conducting block and the mounting shell enclose an annular groove through the first spacing; the electrical connector is annular, the electrical connector is arranged in the groove, and the electrical connection part is arranged to protrude from the mounting shell in a direction away from the heat-dissipating plate.

[0012] Optionally, the electrical connector is an elastic member.

[0013] Optionally, the electrical connector and the mounting shell have a second spacing.

[0014] Optionally, the heat-dissipating assembly comprises a first heat-conducting adhesive arranged between the thermoelectric refrigeration piece and the heat-conducting block; and / or, the heat-dissipating assembly comprises a second heat-conducting adhesive arranged between the thermoelectric refrigeration piece and the heat-dissipating plate.

[0015] Optionally, the thermoelectric refrigeration piece and the mounting shell have a third spacing.

[0016] Optionally, the mounting shell and the heat-dissipating plate are detachably connected.

[0017] The electronic device of the present disclosure comprises a heat-generating element and a heat-dissipating assembly, the heat-dissipating assembly being any one of the heat-dissipating assemblies described above, and the heat-conducting part being in contact with the heat-generating element.

[0018] Optionally, the electronic device further comprises a shielding cover and a circuit board, the shielding cover being connected with the circuit board and enclosing a shielding cavity, the heat-generating element being arranged in the shielding cavity and electrically connected with the circuit board; the shielding cover has a shielding cover opening, and the heat-conducting block seals the shielding cover opening and is electrically connected with the shielding cover.

[0019] Optionally, the shielding cavity is filled with a third heat-conducting adhesive, and the heat-conducting part is in contact with the heat-generating element through the third heat-conducting adhesive.

[0020] When the heat-dissipating assembly of the present disclosure is used in an electronic device, only the heat-conducting part of the heat-conducting block needs to be inserted into the shielding cover opening of the shielding cover and in contact with the heat-generating element, without the need for installation and fixation of components such as heat-dissipating plates, thereby improving the assembly efficiency of the electronic device. The heat generated by the heat-generating element during operation is transmitted to the heat-conducting block through the heat-conducting part, and the heat of the heat-conducting block is transmitted to the external environment through the heat-dissipating plate, thereby achieving heat dissipation of the heat-generating element. BRIEF DESCRIPTION OF DRAWINGS

[0021] Figure 1 is a sectional view of the heat-dissipating assembly of one embodiment of the present disclosure.

[0022] Figure 2 is a use state diagram of the heat-dissipating assembly of one embodiment of the present disclosure.

[0023] Figure 3 This is a schematic diagram of the assembly structure of the heat-conducting block and the heat-generating component of a heat dissipation component according to an embodiment of the present disclosure.

[0024] Figure 4 This is a schematic diagram of the structure of a heat dissipation component and a heat generation component before assembly according to an embodiment of this disclosure.

[0025] Figure 5 yes Figure 4 A schematic diagram of the structure of the heating element.

[0026] Figure label:

[0027] 10. Heat dissipation components;

[0028] 1. Mounting shell; 11. Cavity; 12. First opening; 13. Second opening; 14. Groove;

[0029] 2. Heat sink;

[0030] 3. Heat-conducting block; 31. Heat-conducting part;

[0031] 4. Thermoelectric cooling element; 41. Cold side; 42. Hot side;

[0032] 5. Electrical connectors;

[0033] 6. First thermally conductive adhesive;

[0034] 7. Second thermally conductive adhesive;

[0035] 8. Screws;

[0036] 20. Heating components;

[0037] 201. Heating element;

[0038] 202. Shielding cover; 2021. Shielding cover opening; 2022. Shielding cavity;

[0039] 203. Circuit board;

[0040] 204. Third thermal conductive adhesive. Detailed Implementation

[0041] Embodiments of this disclosure are described in detail below, with examples of these embodiments illustrated in the accompanying drawings. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain this disclosure, and should not be construed as limiting it.

[0042] like Figure 1 As shown, the heat dissipation assembly 10 of this embodiment includes a heat dissipation plate 2 and a heat-conducting block 3. The heat-conducting block 3 includes a heat-conducting portion 31 that protrudes in the direction away from the heat dissipation plate 2.

[0043] As Figure 2 shown, when the heat dissipation assembly 10 is installed on an electronic device for use, only the heat conduction part 31 of the heat conduction block 3 needs to be inserted into the shielding cover opening 2021 of the shielding cover 202 and contacted with the heat generating element 201, without the need for installation and fixation of the heat dissipation plate 2 and other components, thereby improving the assembly efficiency of the electronic device. The heat generated by the heat generating element 201 is transmitted to the heat conduction block 3 through the heat conduction part 31, and the heat of the heat conduction block 3 is transmitted to the external environment through the heat dissipation plate 2, thereby achieving heat dissipation of the heat generating element 201.

[0044] In some embodiments, as Figure 1 shown, the heat dissipation assembly 10 further comprises a thermoelectric refrigeration sheet 4, which is arranged between the heat conduction block 3 and the heat dissipation plate 2.

[0045] Among them, the cold face 41 of the thermoelectric refrigeration sheet 4 is in contact with the heat conduction block 3, and the hot face 42 of the thermoelectric refrigeration sheet 4 is in contact with the heat dissipation plate 2.

[0046] By arranging the thermoelectric refrigeration sheet 4 between the heat conduction block 3 and the heat dissipation plate 2, the heat of the heat conduction block 3 is absorbed by the cold face 41 of the thermoelectric refrigeration sheet 4, and the heat of the hot face 42 of the thermoelectric refrigeration sheet 4 is transmitted to the external environment through the heat dissipation plate 2, which is conducive to improving the heat dissipation effect of the heat generating element 201.

[0047] In some embodiments, as Figure 1 shown, the heat dissipation assembly 10 further comprises a mounting shell 1, and the heat dissipation plate 2 and the heat conduction block 3 are connected with the mounting shell 1.

[0048] By arranging the mounting shell 1, the heat dissipation plate 2 and the heat conduction block 3 form a stable whole, which is conducive to improving the reliability of the heat dissipation assembly 10.

[0049] In some embodiments, as Figure 1 , Figure 2 and Figure 4 shown, the mounting shell 1 has a cavity 11, and a first opening 12 and a second opening 13 are oppositely arranged, the heat dissipation plate 2 is arranged outside the cavity 11 and blocks the first opening 12, the heat conduction block 3 and the thermoelectric refrigeration sheet 4 are arranged in the cavity 11, and the heat conduction part 31 is arranged to protrude out of the second opening 13 in a direction away from the heat dissipation plate 2.

[0050] By arranging the heat dissipation plate 2 outside the cavity 11, it is convenient for the heat dissipation plate 2 to transmit heat to the external environment, thereby improving the heat dissipation effect of the heat generating element 201. In addition, by arranging the heat conduction block 3 and the thermoelectric refrigeration sheet 4 in the cavity 11, the cavity 11 can be used to protect the heat conduction block 3 and the thermoelectric refrigeration sheet 4, thereby avoiding damage to the heat conduction block 3 and the thermoelectric refrigeration sheet 4, and improving the reliability of the heat dissipation assembly 10.

[0051] Of course, in other embodiments, the mounting shell 1 can also be used only as a mounting base of the heat dissipation plate 2, the heat conduction block 3 and the thermoelectric refrigeration piece 4, for example, the mounting shell 1 is a mounting rack, and the heat dissipation plate 2, the heat conduction block 3 and the thermoelectric refrigeration piece 4 are connected with the mounting shell 1.

[0052] In order to make the technical solutions of the present disclosure easier to be understood, the height direction of the mounting shell 1 is taken as an example below, and the technical solutions of the present disclosure are further described. The up-down direction is as shown in Figures 1 to 4 .

[0053] For example, as shown in Figure 1 , Figure 2 and Figure 4 , the first opening 12 and the second opening 13 are oppositely arranged along the up-down direction, and the first opening 12 is arranged on the upper side of the second opening 13. The heat dissipation plate 2 is arranged on the outer side of the mounting shell 1 and blocks the first opening 12, and the heat conduction block 3 and the thermoelectric refrigeration piece 4 are both arranged in the cavity 11, and the heat conduction part 31 protrudes downward and is arranged on the second opening 13. As shown in Figure 2 and Figure 3 , when the heat dissipation assembly 10 is used on an electronic device, the heat dissipation assembly 10 can be placed on the upper side of the heat generating element 201, and the heat conduction part 31 is in contact with the upper surface of the heat generating element 201.

[0054] Optionally, the mounting shell 1 is a heat insulation shell. The mounting shell 1 being a heat insulation shell can be understood as that the mounting shell 1 is made of a heat insulation material, i.e. the mounting shell 1 is made of a material with poor heat conduction performance.

[0055] By arranging the mounting shell 1 as a heat insulation shell, the heat transferred between the heat dissipation plate 2 and the heat conduction block 3 through the mounting shell 1 can be reduced, the heat transferred from the heat dissipation plate 2 to the heat conduction block 3 through the mounting shell 1 can be reduced, the heat transfer short circuit problem between the cold face 41 and the hot face 42 can be avoided, the refrigeration effect of the thermoelectric refrigeration piece 4 can be improved, and thus the heat dissipation effect of the heat generating element 201 can be improved.

[0056] Optionally, the heat conduction block 3 is a metal block.

[0057] By arranging the heat conduction block 3 as a metal block, the heat conduction effect of the heat conduction block 3 can be improved, and thus the heat generating element 201 can be more effectively transferred to the cold face 41 of the thermoelectric refrigeration piece 4 through the heat conduction block 3, and the heat dissipation effect of the heat generating element 201 can be improved.

[0058] Optionally, the mounting shell 1 is a plastic shell, the heat conduction block 3 is a metal block, and the heat conduction block 3 is integrally injection molded with the mounting shell 1.

[0059] By integrally injection molding the heat-conducting block 3 with the mounting shell 1, the connection of the heat-conducting block 3 with the mounting shell 1 is facilitated, and the connection stability of the heat-conducting block 3 with the mounting shell 1 is good, which is conducive to reducing the manufacturing cost of the heat dissipation assembly 10 and improving the reliability of the heat dissipation assembly 10.

[0060] In some embodiments, as shown in Figure 1 、 Figure 2 and Figure 4 , the heat dissipation assembly 10 includes a first heat-conducting glue 6, which is arranged between the cold face 41 of the thermoelectric refrigeration piece 4 and the heat-conducting block 3.

[0061] By arranging the first heat-conducting glue 6, the cold face 41 of the thermoelectric refrigeration piece 4 and the heat-conducting block 3 are in contact through the first heat-conducting glue 6, which can increase the contact area of the heat-conducting block 3 and the cold face 41 of the thermoelectric refrigeration piece 4, thereby improving the heat transfer effect between the heat-conducting block 3 and the cold face 41 of the thermoelectric refrigeration piece 4, and further improving the heat dissipation effect of the heat-generating element 201.

[0062] In some embodiments, as shown in Figure 1 、 Figure 2 and Figure 4 , the heat dissipation assembly 10 includes a second heat-conducting glue 7, which is arranged between the hot face 42 of the thermoelectric refrigeration piece 4 and the heat dissipation plate 2.

[0063] By arranging the second heat-conducting glue 7, the hot face 42 of the thermoelectric refrigeration piece 4 and the heat dissipation plate 2 are in contact through the second heat-conducting glue 7, which can increase the contact area of the heat dissipation plate 2 and the hot face 42 of the thermoelectric refrigeration piece 4, thereby improving the heat transfer effect between the heat dissipation plate 2 and the hot face 42 of the thermoelectric refrigeration piece 4, and further improving the heat dissipation effect of the heat-generating element 201.

[0064] In some embodiments, as shown in Figure 2 and Figure 3 , the heat-conducting block 3 is an electrically-conducting block, and the heat dissipation assembly 10 further includes an electrically connecting piece 5, which is electrically connected with the heat-conducting block 3 and has an electrically connecting portion. The heat-conducting block 3 being an electrically-conducting block can be understood as that the heat-conducting block 3 is made of an electrically-conducting material.

[0065] By arranging the heat-conducting block 3 as an electrically-conducting block and electrically connecting the electrically connecting piece 5 with the heat-conducting block 3, when the heat dissipation assembly 10 is installed on an electronic device for use, the electrically connecting portion of the electrically connecting piece 5 can be electrically connected with an electrically-conducting piece in the electronic device, realizing the electrical connection of the electrically-conducting piece of the electronic device with the heat-conducting block 3, so that the heat dissipation assembly 10 has more functions.

[0066] For example, as shown in Figure 2As shown, the electrically connecting part of the electric connecting piece 5 is electrically connected with the shielding cover 202 of the electronic device, and the shielding cover 202 is a metal shielding cover. The shielding cover opening 2021 of the shielding cover 202 is blocked by the heat-conducting block 3, so that the shielding cover 202, the electric connecting piece 5 and the heat-conducting block 3 jointly form a shielding cover.

[0067] Optionally, as shown in Figure 1 , Figure 2 and Figure 4 , the outer circumferential surface of the heat-conducting part 31 has a first interval with the mounting shell 1, and the heat-conducting block 3 and the mounting shell 1 jointly form an annular groove 14 through the first interval. The electric connecting piece 5 is annular, and is arranged in the groove 14, and the electrically connecting part is arranged on the mounting shell 1 in a direction away from the heat-dissipating plate 2.

[0068] By arranging the electric connecting piece 5 in the groove 14, the compactness of the heat-dissipating assembly 10 can be improved, which is beneficial to the lightweight and small-size design of the heat-dissipating assembly 10. In addition, the electrically connecting part is arranged on the mounting shell 1 in a direction away from the heat-dissipating plate 2, which facilitates the electrical connection between the electrically connecting part and other conductive parts in the electronic device.

[0069] Optionally, the electric connecting piece 5 is a resilient piece.

[0070] For example, the electric connecting piece 5 is a conductive foam.

[0071] By arranging the electric connecting piece 5 as a resilient piece, the electric connecting piece 5 can maintain electrical connection with the heat-conducting block 3 and the corresponding conductive part through elastic deformation, thereby improving the electrical connection reliability between the heat-conducting block 3 and the corresponding conductive part in the electronic device.

[0072] Optionally, the electric connecting piece 5 has a second interval with the mounting shell 1.

[0073] By arranging the second interval between the electric connecting piece 5 and the mounting shell 1, the electrical insulation performance between the electric connecting piece 5 and the mounting shell 1 can be improved, thereby improving the safety of the heat-dissipating assembly 10.

[0074] In some examples, the thermoelectric refrigeration piece 4 has a third interval with the mounting shell 1.

[0075] By arranging the third interval between the thermoelectric refrigeration piece 4 and the mounting shell 1, heat transfer between the cold face 41 and the hot face 42 through the mounting shell 1 can be avoided, thereby avoiding the heat transfer short circuit problem between the cold face 41 and the hot face 42, improving the refrigeration effect of the thermoelectric refrigeration piece 4, and thereby improving the heat-dissipating effect of the heat-generating element 201.

[0076] In some embodiments, the mounting shell 1 and the heat-dissipating plate 2 are detachably connected.

[0077] For example, the mounting shell 1 and the heat-dissipating plate 2 are connected by screws 8.

[0078] The mounting housing 1 is detachably connected to the heat sink 2, allowing the heat sink 2 to be replaced, thereby extending the service life of the heat dissipation assembly 10.

[0079] like Figures 2 to 4 As shown, the electronic device of this embodiment includes a heating element 201 and a heat dissipation assembly 10. The heat dissipation assembly 10 is the heat dissipation assembly 10 described in any of the above embodiments, and the heat-conducting part 31 is in contact with the heating element 201. The heating element 201 can be a chip.

[0080] When the heating element 201 is working, the heat generated is transferred to the heat-conducting block 3 through the heat-conducting part 31. The heat of the heat-conducting block 3 is absorbed by the cold surface 41 of the thermoelectric cooling chip 4, and the heat of the hot surface 42 is transferred to the external environment through the heat sink 2, thereby realizing the heat dissipation of the heating element 201.

[0081] Optionally, the electronic device further includes a shielding cover 202 and a circuit board 203, with the shielding cover 202 connected to the circuit board 203 to form a shielding cavity 2022. A heating element 201 is disposed within the shielding cavity 2022 and electrically connected to the circuit board 203. The shielding cover 202 has an opening 2021, and a heat-conducting block 3 seals the opening 2021 and is electrically connected to the shielding cover 202. The heating element 201, the shielding cover 202, and the circuit board 203 together form a heating assembly 20.

[0082] By placing the heating element 201 inside the shielding cavity 2022 and arranging the heat-conducting part 31 corresponding to the shielding cover opening 2021, the heat-conducting part 31 can contact the heating element 201. By sealing the shielding cover opening 2021 with the heat-conducting block 3 and electrically connecting it to the shielding cover 202, the electromagnetic shielding effect of the shielding cover 202 can be guaranteed, and the reliability of the electronic equipment can be improved.

[0083] Optionally, the shielding cavity 2022 is filled with a third thermally conductive adhesive 204, and the thermally conductive part 31 contacts the heating element 201 through the third thermally conductive adhesive 204.

[0084] By filling the shielding cavity 2022 with a third thermally conductive adhesive 204, not only can the contact area between the thermally conductive part 31 and the heating element 201 be increased, thus improving the heat dissipation effect of the heating element 201, but the third thermally conductive adhesive 204 can also be used to isolate moisture, avoid condensation on the surface of the heating element 201, and improve the reliability of electronic equipment.

[0085] In addition, the flowability of thermally conductive adhesive is worse than that of sealant. By filling the shielding cavity 2022 with a third thermally conductive adhesive 204, the third thermally conductive adhesive 204 can be prevented from flowing into the gap between the shielding cover 202 and the circuit board 203 and affecting the electromagnetic shielding performance, which can further improve the performance of electronic equipment.

[0086] The electronic device according to the embodiments of this disclosure has the following advantages:

[0087] (1) By assembling the mounting shell 1, the heat dissipation plate 2, the heat conducting block 3 and the thermoelectric refrigeration piece 4 into a heat dissipation assembly 10, the heat conducting block 3 is used for heat transfer of the cold face 41 of the thermoelectric refrigeration piece 4, the poor heat conduction performance of the mounting shell 1 is used to realize thermal isolation of the hot face 42 and the cold face 41 of the thermoelectric refrigeration piece 4, the problem of heat transfer short circuit of the hot face 42 and the cold face 41 of the thermoelectric refrigeration piece 4 is solved, the refrigeration effect of the thermoelectric refrigeration piece 4 is improved, and thus the heat dissipation effect of the heat generating element 201 is improved.

[0088] (2) By setting the first heat conducting glue 6 between the cold face 41 of the thermoelectric refrigeration piece 4 and the heat conducting block 3, only the heat of the heat generating element 201 is transferred through the first heat conducting glue 6, the temperature rise of the first heat conducting glue 6 is smaller, the refrigeration effect of the thermoelectric refrigeration piece 4 is improved, and thus the heat dissipation effect of the heat generating element 201 is improved.

[0089] (3) The shielding cover 202 is opened, the heat conducting block 3 is set as a conductive block and is electrically connected with the shielding cover 202 through the electric connecting piece 5, so that a closed shielding cavity 2022 is formed around the heat generating element 201, in addition, the shielding cavity 2022 is filled with the third heat conducting glue, which not only plays a heat conducting role, but also can isolate moisture and solve the problem of condensation.

[0090] (4) Low process complexity and low cost.

[0091] Although the embodiments of the present disclosure have been shown and described above, it can be understood that the above embodiments are exemplary and cannot be understood as limiting the present disclosure, and the changes, modifications, replacements and variations of the above embodiments made by those skilled in the art are within the protection scope of the present disclosure.

Claims

1. A heat dissipating assembly, characterized by, The heat dissipation assembly comprises: a heat dissipation plate, a heat conduction block and a mounting shell; the heat conduction block comprises a heat conduction part protruding in a direction away from the heat dissipation plate, the heat dissipation plate and the heat conduction block are connected with the mounting shell, the mounting shell has a cavity and oppositely arranged first and second openings, the heat dissipation plate is arranged outside the cavity and blocks the first opening, and the heat conduction block is arranged in the cavity.

2. The heat dissipation assembly of claim 1, wherein, The heat dissipation assembly further comprises a thermoelectric refrigeration sheet arranged between the heat conduction block and the heat dissipation plate.

3. The heat dissipation assembly of claim 1, wherein, The heat conduction part protrudes in the direction away from the heat dissipation plate and protrudes out of the second opening.

4. The heat dissipation assembly of claim 3, wherein, The mounting shell is a heat insulation shell.

5. The heat dissipation assembly of claim 3, wherein, The mounting shell is a plastic shell, the heat conduction block is a metal block, and the heat conduction block is integrally injection molded with the mounting shell.

6. The heat dissipating assembly of claim 3, wherein, The heat conduction block is an electrically conductive block, the heat dissipation assembly further comprises an electrical connector, the electrical connector is electrically connected with the heat conduction block, and the electrical connector has an electrical connection part.

7. The heat dissipating assembly of claim 6, wherein, The heat conduction part has a first gap between the outer circumferential surface and the mounting shell, and the heat conduction block and the mounting shell form an annular groove through the first gap. The electrical connector is annular, the electrical connector is arranged in the groove, and the electrical connection part protrudes out of the mounting shell in the direction away from the heat dissipation plate.

8. The heat dissipating assembly of claim 7, wherein, The electrical connector is an elastic member.

9. The heat dissipating assembly of claim 6, wherein, The electrical connector has a second gap with the mounting shell.

10. The heat dissipating assembly of claim 2, wherein, The heat dissipation assembly comprises first heat conduction glue arranged between the thermoelectric refrigeration sheet and the heat conduction block; and / or The heat dissipation assembly comprises second heat conduction glue arranged between the thermoelectric refrigeration sheet and the heat dissipation plate.

11. The heat dissipating assembly of claim 2, wherein, The heat dissipation assembly further comprises a mounting shell, the heat dissipation plate and the heat conduction block are connected with the mounting shell, and the thermoelectric refrigeration sheet has a third gap with the mounting shell.

12. The heat dissipating assembly of claim 3, wherein, The mounting shell and the heat dissipation plate are detachably connected.

13. An electronic device, comprising: The heat dissipation assembly comprises: a heat generating element; a heat dissipation assembly according to any one of claims 1-12, the heat conduction part being in contact with the heat generating element.

14. The electronic device of claim 13, wherein, The electronic device further comprises a shielding cover and a circuit board, the shielding cover being connected with the circuit board and forming a shielding cavity, the heat generating element being arranged in the shielding cavity and being electrically connected with the circuit board; the shielding cover has a shielding cover opening, the heat conduction block blocks the shielding cover opening and is electrically connected with the shielding cover.

15. The electronic device of claim 14, wherein, The shielding cavity is filled with third heat conduction glue, and the heat conduction part is in contact with the heat generating element through the third heat conduction glue.

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