Heat dissipation structure
By creating heat dissipation slots on the circuit board, the chip can be directly soldered to the boss, solving the problem of low heat dissipation efficiency in the existing technology, achieving a more efficient heat dissipation effect, and extending the life of the chip.
Patent Information
- Application Number
- CN202423182027.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-23
- Publication Date
- 2025-11-28
- Estimated Expiration
- 2034-12-23
AI Technical Summary
In existing heat dissipation structures, the insulation between the chip and the heat dissipation components by the circuit board and thermal adhesive results in low heat dissipation efficiency, which cannot effectively dissipate heat and affects the normal use and lifespan of the chip.
Heat sinks are created on the circuit board, and the chip is directly soldered to the boss through the heat sinks. Heat is directly transferred to the heat dissipation element, reducing the involvement of the circuit board and thermal adhesive and improving heat dissipation efficiency.
By directly soldering the connection, the heat from the chip can be quickly transferred to the heat dissipation component, improving heat dissipation efficiency, ensuring the normal use of the chip, and extending its lifespan.
Smart Images
Figure CN223613709U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to a heat dissipation technical field, more specifically, a heat dissipation structure. BACKGROUND
[0002] With the higher and higher requirement of automobile market to the car light, the car light is not only used for lighting and signal display, but also needs to consider information interaction, even can have mechanical dynamic effect etc. The increase of these functions all need to be driven by electric energy to complete. Whether is used for lighting and signal or drive, the current has at least 50% energy conversion into heat, and the heat needs to be dissipated in time, otherwise will affect the main lighting, signal, drive function, even will directly damage the main function.
[0003] The existing heat dissipation structure as shown in Figure 1 And Figure 2 Chip 10 (including illumination chip, drive chip etc.) is pasted on circuit board 20 through SMT technology, and circuit board 20 is attached to heat dissipation assembly 30 through heat-conducting glue 40 (gel). Since there is circuit board 20 and heat-conducting glue 40 between chip 10 and heat dissipation assembly 30, the heat dissipation efficiency is low.
[0004] Therefore, how to improve the heat dissipation efficiency of chip becomes the technical problem to be solved by the technical personnel in the field. CONTENT OF UTILITY MODEL
[0005] Therefore, the utility model aims at providing a heat dissipation structure to improve the heat dissipation efficiency of chip.
[0006] To realize the above-mentioned purpose, the utility model provides the following technical scheme:
[0007] A heat dissipation structure comprises:
[0008] Chip;
[0009] Circuit board, chip is arranged at one side of circuit board, and heat dissipation groove is formed on the position corresponding to chip on circuit board;
[0010] Heat dissipation assembly, heat dissipation assembly comprises heat dissipation element and boss arranged on heat dissipation element, one side of circuit board, away from chip, is connected with heat dissipation element, and chip is welded with boss.
[0011] Optionally, in the above-mentioned heat dissipation structure, the surface of boss is provided with welding metal layer.
[0012] Optionally, in the above-mentioned heat dissipation structure, chip comprises heat dissipation pad, and heat dissipation pad is connected with boss.
[0013] Optionally, in the above-mentioned heat dissipation structure, the size of heat dissipation groove is greater than the size of boss.
[0014] Optionally, in the heat dissipation structure, the size of the boss is greater than the size of the chip.
[0015] Optionally, in the heat dissipation structure, the cross-sectional shape of the boss comprises one of a polygon, a circle and an ellipse.
[0016] Optionally, in the heat dissipation structure, the heat dissipation element comprises at least one of a heat sink, a heat pipe and a vapor chamber.
[0017] Optionally, in the heat dissipation structure, the heat dissipation element comprises a heat sink, and the heat sink comprises a heat sink body and fins arranged on the heat sink body.
[0018] Optionally, in the heat dissipation structure, the cross-sectional area of the fins decreases from the direction close to the heat sink body to the direction away from the heat sink body.
[0019] Optionally, in the heat dissipation structure, the heat dissipation element further comprises a fan.
[0020] As can be seen from the above solution, the heat dissipation structure disclosed by the utility model opens the heat dissipation groove on the circuit board, and the boss is welded and connected with the chip through the heat dissipation groove, so that the heat of the chip is directly transmitted to the boss and then transmitted to the heat dissipation element, compared with the prior art, the circuit board and the heat-conducting adhesive between the chip and the heat dissipation assembly are reduced, the heat dissipation efficiency can be improved, the normal use of the chip is ensured, and the service life of the chip can be prolonged. BRIEF DESCRIPTION OF DRAWINGS
[0021] In order to more clearly illustrate the technical scheme in the embodiments of the utility model or the prior art, the following will briefly introduce the drawings needed to be used in the embodiment or the prior art description, and obviously, the drawings in the following description are only some embodiments of the utility model, and for those skilled in the art, other drawings can also be obtained according to these drawings without creative labor.
[0022] Figure 1 It is a schematic diagram of the heat dissipation structure of the chip in the prior art;
[0023] Figure 2 It is a partial enlarged view of Figure 1
[0024] Figure 3 It is a schematic diagram of the heat dissipation structure disclosed by the embodiment of the utility model Figure 1 ;
[0025] Figure 4 It is a schematic diagram of the heat dissipation structure disclosed by the embodiment of the utility model Figure 2 .
[0026] Wherein, 10 is a chip, 11 is a heat dissipation pad, 20 is a circuit board, 21 is a heat dissipation groove, 30 is a heat dissipation assembly, 31 is a boss, 311 is a welding metal layer, 32 is a heat dissipation element, 321 is a heat pipe, and 40 is a heat conductive glue. DETAILED DESCRIPTION
[0027] The core of the present application is to disclose a heat dissipation structure to improve the heat dissipation efficiency of the chip.
[0028] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of the present application.
[0029] As shown in the drawings, Figure 3 The present application discloses a heat dissipation structure, which comprises a chip 10, a circuit board 20 and a heat dissipation assembly 30.
[0030] The chip 10 is arranged on one side of the circuit board 20, and the circuit board 20 is provided with a heat dissipation groove 21 corresponding to the mounting position of the chip 10. The heat dissipation assembly 30 comprises a heat dissipation element 32 and a boss 31 arranged on the heat dissipation element 32. The side of the circuit board 20 away from the chip 10 is connected with the heat dissipation element 32, and the chip 10 is directly in contact with the boss 31 through the heat dissipation groove 21. Specifically, the signal processing pins of the chip 10 are welded with the pads of the circuit board 20, and the boss 31 is welded and connected with the chip 10 through the heat dissipation groove 21.
[0031] It should be noted that the connection mode of the circuit board 20 and the heat dissipation assembly 30 comprises a detachable connection mode and a non-detachable connection mode. The detachable connection mode can adopt bolt connection, and the non-detachable connection mode can adopt welding connection.
[0032] The heat dissipation structure disclosed in the embodiments of the present application is provided with the heat dissipation groove 21 on the circuit board 20, and the boss 31 is welded and connected with the chip 10 through the heat dissipation groove 21. The heat of the chip 10 is directly transmitted to the boss 31 and then to the heat dissipation element 32. Compared with the prior art, the circuit board 20 and the heat conductive glue 40 are reduced between the chip 10 and the heat dissipation assembly 30, which can improve the heat dissipation efficiency, thereby ensuring the normal use of the chip 10 and prolonging the service life of the chip 10.
[0033] It should be noted that the chip 10 can be a high-power driving chip or a light source chip LED. The heat dissipation structure disclosed in the embodiments of the present application is not only applied to automobile lamps, but also can be popularized and applied to other heat dissipation fields.
[0034] Further, in order to ensure the soldering connection between the chip 10 and the boss 31, the surface of the boss 31 is provided with a solder metal layer 311, as shown in Figure 3 The solder metal layer 311 can be formed on the surface of the boss 31 by using a metal spraying process or a metal solid deposition technology, and the solder metal layer 311 is preferably a copper layer.
[0035] Further, as shown in Figure 3 The chip 10 includes a chip body and a heat dissipation pad 11 connected to the chip body, and the heat dissipation pad 11 is connected to the boss 31, which can further improve the heat dissipation efficiency.
[0036] Further, the size of the heat dissipation groove 21 is preferably larger than the size of the boss 31, so that the boss 31 is in direct contact with the chip 10 through the heat dissipation groove 21.
[0037] Further, the size of the boss 31 is preferably larger than the size of the chip 10, so that the heat of the chip 10 can be rapidly and effectively transferred to the heat dissipation element 32, preventing the chip 10 from overheating.
[0038] Further, the cross-sectional shape of the boss 31 includes one of a polygon (such as a rectangle, a square), a circle, and an ellipse, and the cross-sectional shape of the boss 31 is preferably matched with the shape of the chip 10.
[0039] Further, the heat dissipation element 32 at least includes one of a heat sink, a heat pipe 321, and a vapor chamber, such as the heat dissipation element 32 can only use a heat sink, and the boss 31 is arranged on one side of the heat sink; or the heat dissipation element 32 can use a combination of a heat sink and a heat pipe 321, the boss 31 is connected to the heat pipe 321, and the heat pipe 321 is connected to the heat sink, as shown in Figure 4 Of course, in other embodiments, the heat dissipation element 32 can use a combination of a vapor chamber and a heat sink.
[0040] As shown in Figure 3 In some embodiments, the heat dissipation element 32 includes a heat sink, the boss 31 is arranged on one side of the heat sink close to the circuit board 20, and the heat sink includes a heat sink body and fins arranged on the heat sink body.
[0041] Further, in order to enhance heat dissipation, the cross-sectional area of the fins decreases from the side close to the heat sink body to the side away from the heat sink body, which can promote air flow and enhance the convective heat transfer effect, thereby improving the heat dissipation efficiency.
[0042] Further, in some embodiments, the heat dissipation element 32 further includes a fan to further improve the heat dissipation efficiency.
[0043] It should be noted that each of the embodiments in the specification is described in a progressive manner, and each embodiment focuses on the difference from other embodiments. The same and similar parts between the embodiments can be referred to each other.
[0044] Hereinafter, the terms "first" and "second" are used for description purposes only, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined with "first" and "second" can explicitly or implicitly include one or more of the features.
[0045] The terms "connected" and "connected" should be understood broadly, for example, it can be fixed connection, or detachable connection, or integral connection; it can be mechanical connection, or electrical connection; it can be directly connected, or indirectly connected through intermediate medium. For those skilled in the art, the specific meaning of the above terms in the embodiments of the present application can be understood according to the specific circumstances.
[0046] The principle and implementation mode of the present application are described by using specific examples in this paper. The above description of the embodiments is only used to help understand the core idea of the present application. It should be pointed out that for those skilled in the art, without departing from the principle of the present application, some improvements and modifications can be made to the present application, and these improvements and modifications also fall within the protection scope of the claims of the present application.
Claims
1. A heat dissipating structure, characterized by comprising: The chip (10) is arranged on one side of the circuit board (20), and a heat dissipation groove (21) is formed on the circuit board (20) at a position corresponding to the chip (10). The surface of the boss (31) is provided with a welding metal layer (311). The chip (10) comprises a heat dissipation pad (11) connected with the boss (31). The size of the heat dissipation groove (21) is larger than that of the boss (31).
2. The heat dissipating structure according to claim 1, wherein The size of the boss (31) is larger than that of the chip (10).
3. The heat dissipating structure according to claim 2, wherein The cross-sectional shape of the boss (31) comprises one of a polygon, a circle and an ellipse.
4. The heat dissipating structure according to claim 1, wherein The heat dissipation element (32) comprises at least one of a heat sink, a heat pipe (321) and a vapor chamber.
5. The heat dissipating structure according to claim 4, wherein The heat dissipation element (32) comprises a heat sink, and the heat sink comprises a heat sink body and fins arranged on the heat sink body.
6. The heat dissipating structure of claim 1, wherein The cross-sectional area of the fins decreases from the direction close to the heat sink body to the direction away from the heat sink body.
7. The heat dissipating structure according to claim 1, wherein The heat dissipation element (32) further comprises a fan.
8. The heat dissipating structure according to claim 7, wherein 9. The heat dissipating structure according to claim 8, wherein 10. The heat dissipating structure of claim 7, wherein