High-temperature-resistant PCB (Printed Circuit Board)
By setting a cooling plate and tilting components on the PCB circuit board and using the flow of coolant for heat dissipation, the problem of high-temperature damage caused by poor heat dissipation of the circuit board in the enclosed space is solved, and better temperature management and component protection are achieved.
Patent Information
- Application Number
- CN202520232518.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-02-13
- Publication Date
- 2025-11-28
- Estimated Expiration
- 2035-02-13
AI Technical Summary
Existing circuit boards have poor heat dissipation capabilities in enclosed spaces, leading to damage to electronic components.
A high-temperature resistant PCB circuit board was designed. By setting a cooling plate and a tilting component between the connecting brackets on both sides of the circuit board, the heat dissipation is replaced by the flow of coolant in the cooling pipe, and the heat dissipation effect is enhanced by the tilting component when it is shaken.
It effectively reduces the temperature of the circuit board, prevents heat accumulation, improves heat dissipation, and protects electronic components.
Smart Images
Figure CN223613714U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to circuit board technical field, specifically, relate to a high temperature resistant PCB circuit board. BACKGROUND
[0002] The circuit board is the support body of electronic components and is the carrier of electrical interconnection of electronic components.
[0003] But the existing circuit board when operating, will emit heat, and because the circuit board is installed in a relatively closed space, make the poor heat dissipation capacity, lead to heat accumulation, when the heat is too high, will cause the electronic components on the circuit board to be damaged. UTILITY MODEL CONTENTS
[0004] The utility model discloses a high temperature resistant PCB circuit board, solve the circuit board because install in a relatively closed space, lead to the low heat dissipation effect of circuit board, easily lead to heat high let electronic component damage.
[0005] The utility model discloses the following technical scheme realizes:
[0006] The utility model provides a high temperature resistant PCB circuit board, including circuit board, the both sides of circuit board are connected with connecting frame, and the one side of connecting frame is provided with connecting groove, and the both sides of connecting groove cooperate with circuit board, and the cooling plate is connected between connecting frame, and the inside of cooling plate is provided with cooling pipe, and the tilt component is set up between connecting frame and cooling plate, and cooling plate swings along tilt component between connecting frame.
[0007] Preferably, the both sides of the circuit board are connected to the connecting grooves on one side of the two connecting frames.
[0008] Preferably, the cooling plate is connected to the bottom of the circuit board, and the width of the cooling plate is less than the spacing between the two connecting frames.
[0009] Preferably, the tilt component includes an embedded rod, a through rod and an embedded groove, the embedded rod is arranged on one side of the connecting frame, the through rod is arranged between the two connecting frames, and the embedded groove is arranged on the both sides of the cooling plate.
[0010] Preferably, the embedded rod is arranged at opposite corners of the two connecting frames, and the embedded rod is inclined towards the bottom.
[0011] Preferably, the through rod penetrates the middle part of the cooling plate for connection.
[0012] Preferably, the embedded groove is a groove on the both sides of the cooling plate matched with the embedded rod.
[0013] The technical scheme of the utility model has at least the following advantages and beneficial effects:
[0014] 1. The device is provided with cooling plate in the flow of the cooling liquid, to reduce the temperature, to the heat generated by the circuit board replacement cooling, so that the circuit board will not be due to heat dissipation problem caused by high temperature damage.
[0015] 2. The device is also provided with tilt assembly, can produce tilt when the cooling plate follow sway, to let the cooling liquid can flow in the cooling pipe, so that the effect of heat replacement is better. BRIEF DESCRIPTION OF DRAWINGS
[0016] Figure 1 It is the overall structure schematic diagram of the utility model.
[0017] Figure 2 It is the utility model Figure 1 The enlarged structure schematic diagram of A place in the utility model.
[0018] Figure 3 It is the overhead structure schematic diagram of the utility model connecting frame and cooling plate.
[0019] The drawing figure mark: 1-circuit board, 2-connecting frame, 201-connecting slot, 202-embedded rod, 203-penetration rod, 3-cooling plate, 301-embedded slot, 302-cooling pipe. DETAILED DESCRIPTION
[0020] The utility model is described in detail below. Figures 1 to 3
[0021] A kind of high-temperature-resistant PCB circuit board, including circuit board 1, the two sides of circuit board 1 are connected with connecting frame 2, the side of connecting frame 2 is provided with connecting slot 201, connecting slot 201 cooperates with the two sides of circuit board 1, connecting frame 2 is connected with cooling plate 3 between, cooling plate 3 is provided with cooling pipe 302 inside, tilt assembly is arranged between connecting frame 2 and cooling plate 3, cooling plate 3 swings along tilt assembly between connecting frame 2, the two sides of circuit board 1 are connected with the connecting slot 201 of the side of two connecting frame 2, cooling plate 3 is connected at the bottom of circuit board 1, the width of cooling plate 3 is less than the interval of two connecting frame 2.
[0022] First, circuit board 1 is placed between two connecting frame 2, is connected with circuit board 1 by the connecting slot 201 of the side of connecting frame 2, while two connecting frame 2 are also connected together by penetration rod 203, then injects cooling liquid to cooling plate 3 at the bottom of circuit board 1 between connecting frame 2, let it flow into cooling pipe 302, the heat dissipated by circuit board 1 in cooling pipe 302 is absorbed and replaced by cooling liquid, to reduce the temperature around circuit board 1, accelerate the dissipation of heat, without heat accumulation leading to circuit board 1 damage.
[0023] Further, the tilting assembly comprises a fitting rod 202, a through rod 203 and a fitting groove 301, the fitting rod 202 is arranged at one side of the connecting frame 2, the through rod 203 is arranged between the two connecting frames 2, the fitting groove 301 is arranged at two sides of the cooling plate 3, the fitting rod 202 is arranged at opposite corners of the two connecting frames 2, the fitting rod 202 is arranged to tilt towards the bottom, the through rod 203 penetrates the middle part of the cooling plate 3 to connect, and the fitting groove 301 is a groove at two sides of the cooling plate 3 matched with the fitting rod 202.
[0024] Then, when the articles on the circuit board 1 case shake and tilt, the cooling plate 3 will displace along the through rod 203 in the tilting direction, and when the cooling plate 3 tilts and displaces to one side, the fitting groove 301 on the side will move and fit along the fitting rod 202, and because the fitting rod 202 is arranged to tilt, when the cooling plate 3 moves and fits along the fitting rod 202 through the fitting groove 301, the cooling plate 3 will tilt, so that the liquid in the cooling pipe 302 will flow up, thereby better replacing heat for heat dissipation, so that the circuit board 1 has better heat dissipation effect during use and shaking.
[0025] The following is the specific process of the present application, first, the circuit board 1 is placed between the two connecting frames 2, connected to the circuit board 1 through the connecting groove 201 on one side of the connecting frame 2, and at the same time, the two connecting frames 2 are also connected together through the through rod 203, then cooling liquid is injected into the cooling plate 3 between the connecting frames 2 at the bottom of the circuit board 1, so that it flows into the cooling pipe 302, and the cooling liquid absorbs and replaces the heat dissipated by the circuit board 1 in the cooling pipe 302, to reduce the temperature around the circuit board 1 and speed up heat dissipation, without causing the circuit board 1 to be damaged due to heat accumulation, then, when the articles on the circuit board 1 case shake and tilt, the cooling plate 3 will displace along the through rod 203 in the tilting direction, and when the cooling plate 3 tilts and displaces to one side, the fitting groove 301 on the side will move and fit along the fitting rod 202, and because the fitting rod 202 is arranged to tilt, when the cooling plate 3 moves and fits along the fitting rod 202 through the fitting groove 301, the cooling plate 3 will tilt, so that the liquid in the cooling pipe 302 will flow up, thereby better replacing heat for heat dissipation, so that the circuit board 1 has better heat dissipation effect during use and shaking.
Claims
1. A high temperature resistant PCB circuit board comprising a circuit board (1), characterized in that, Two sides of the circuit board (1) are connected with connecting frames (2), one side of the connecting frame (2) is provided with a connecting groove (201), the connecting groove (201) is matched with the two sides of the circuit board (1), the connecting frames (2) are connected with a cooling plate (3), the inside of the cooling plate (3) is provided with a cooling pipe (302), the connecting frames (2) and the cooling plate (3) are provided with an inclined assembly, and the cooling plate (3) swings between the connecting frames (2) along the inclined assembly.
2. The high-temperature-resistant PCB circuit board according to claim 1, wherein the two sides of the circuit board (1) are connected with the connecting grooves (201) on one side of the two connecting frames (2).
3. The high-temperature-resistant PCB circuit board according to claim 1, wherein the cooling plate (3) is connected at the bottom of the circuit board (1), and the width of the cooling plate (3) is smaller than the spacing between the two connecting frames (2).
4. The high-temperature-resistant PCB circuit board according to claim 1, wherein the inclined assembly comprises an embedded rod (202), a through rod (203) and an embedded groove (301), the embedded rod (202) is arranged on one side of the connecting frame (2), the through rod (203) is arranged between the two connecting frames (2), and the embedded groove (301) is arranged on the two sides of the cooling plate (3).
5. The high-temperature-resistant PCB circuit board according to claim 4, wherein the embedded rod (202) is arranged at the opposite corners of the two connecting frames (2), and the embedded rod (202) is arranged to be inclined to the bottom.
6. The high-temperature-resistant PCB circuit board according to claim 4, wherein the through rod (203) penetrates the middle part of the cooling plate (3) to be connected.
7. The high-temperature-resistant PCB circuit board according to claim 4, wherein the embedded groove (301) is a groove matched with the embedded rod (202) on the two sides of the cooling plate (3).