Silicon wafer polishing solution active agent adding device
By introducing a decomposition mechanism into the silicon wafer polishing slurry activator addition device, the problem of the stirring shaft and motor being difficult to disassemble was solved, enabling convenient disassembly of the stirring shaft and uniform mixing, thereby improving the service life and working efficiency of the equipment.
Patent Information
- Application Number
- CN202423227587.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-26
- Publication Date
- 2025-12-02
- Estimated Expiration
- 2034-12-26
AI Technical Summary
In existing silicon wafer polishing slurry activator addition devices, the stirring shaft and motor are difficult to disassemble and separate, which may cause the stirring shaft to be corroded and damaged during long-term use, affecting the activator addition work.
A device for adding activator to silicon wafer polishing slurry, including a decomposition mechanism, was designed. The stirring shaft and motor are disassembled by the cooperation of the through column and the threaded rod, which facilitates separation. The device is then combined with the stirring mechanism to perform uniform stirring and mixing.
This allows for easy disassembly of the stirring shaft and disassembly of the motor, improving operational efficiency, ensuring uniform mixing of the surfactant and polishing liquid, and reducing the risk of equipment damage.
Smart Images
Figure CN223615801U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of surfactant addition technology, specifically to a device for adding surfactants to silicon wafer polishing slurry. Background Technology
[0002] A silicon wafer polishing slurry activator addition device is a device used to precisely add activators during the silicon wafer polishing process. In the silicon wafer polishing process, the composition of the polishing slurry plays a key role in the polishing effect. Activators can improve the performance of the polishing slurry, such as reducing surface tension and improving chemical activity.
[0003] Surfactant addition devices are usually equipped with a stirring function to fully mix the added surfactant with the polishing liquid. However, common stirring devices do not allow for easy disassembly and separation of the stirring shaft and motor. As a result, the stirring shaft may be damaged by corrosion from the surfactant and polishing liquid during long-term use, which in turn affects the surfactant addition process. Utility Model Content
[0004] The purpose of this invention is to provide a device for adding activator to silicon wafer polishing slurry, so as to solve the problems mentioned in the background art.
[0005] To achieve the above objectives, the present invention provides the following technical solution: a device for adding activator to silicon wafer polishing liquid, comprising a mounting plate frame, a storage cylinder fixedly connected inside the mounting plate frame, a top plate movably connected to the top of the storage cylinder, a stirring mechanism provided at the top of the top plate, a decomposition mechanism provided at the bottom of the stirring mechanism, and a spray pipe fixedly connected to the bottom of the storage cylinder;
[0006] The decomposition mechanism includes a support frame, which is disposed on top of the stirring mechanism. A threaded rod is rotatably connected inside the support frame, and a connecting plate is threadedly connected to the outer wall of the threaded rod. A rectangular frame is fixedly connected to one side of the connecting plate, and a locking block is fixedly connected inside the rectangular frame. A through column is provided on one side of the stirring mechanism.
[0007] Preferably, the connecting plate has a sliding opening inside, and the connecting plate is slidably connected to the outside of the support frame through the sliding opening, so that the connecting plate can move stably.
[0008] Preferably, the threads on the outer walls of the two ends of the threaded rod are in opposite directions, and a torsion sleeve is fixedly connected to one end of the threaded rod to facilitate the rotation of the threaded rod through the torsion sleeve.
[0009] Preferably, a notch is provided on the outer side of the through-post, and the locking block is movably connected to the inner wall of the notch, so that the locking block can limit the through-post through the notch.
[0010] Preferably, the stirring mechanism includes a support arm, which is fixedly connected to the top of the top plate. A motor is fixedly connected to the inner side of the support arm, a U-shaped block is fixedly connected to the output shaft of the motor, a round block is fixedly connected to the bottom of the U-shaped block, and a stirring shaft is fixedly connected to the bottom of the through column, so as to facilitate stable stirring.
[0011] Preferably, the circular block is rotatably connected to the inside of the top plate, and the support frame is fixedly connected to the top of the circular block to provide stable support for the support frame.
[0012] Preferably, the circular block has a rectangular opening inside, and the through-post passes through the rectangular opening, allowing the through-post to move through the rectangular opening.
[0013] Compared with the prior art, the present invention provides a device for adding activator to silicon wafer polishing slurry, which has the following beneficial effects:
[0014] 1. The silicon wafer polishing slurry activator addition device, through the set decomposition mechanism, allows the through column to be pulled out from the inside of the circular block, thereby enabling the disassembly of the stirring shaft. This facilitates the disassembly and separation of the stirring shaft and motor, thus achieving good operational efficiency when the stirring shaft needs to be disassembled during long-term use and reducing the impact on the activator addition process.
[0015] 2. The silicon wafer polishing slurry activator addition device, through the set stirring mechanism, enables the stirring shaft to uniformly stir and mix the activator and polishing slurry, achieving good mixing quality, which facilitates the further silicon wafer polishing work. After the stirring is completed, the valve at the bottom of the storage cylinder can be opened to realize the spraying and conveying of the spray pipe. Attached Figure Description
[0016] To more clearly illustrate the technical solutions in the embodiments of this utility model, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0017] Figure 1 This is a front view of the structure of this utility model;
[0018] Figure 2 This is a schematic diagram of the structure at the stirring shaft.
[0019] Figure 3 This is a schematic diagram of the structure at the point where the column penetrates.
[0020] Figure 4 for Figure 2 Enlarged structural diagram at point A in the middle.
[0021] In the diagram: 1. Mounting plate frame; 2. Disassembly mechanism; 21. Support frame; 22. Threaded rod; 23. Connecting plate; 24. Rectangular frame; 25. Clamping block; 26. Through column; 3. Spray pipe; 4. Storage cylinder; 5. Mixing mechanism; 51. Support arm; 52. Motor; 53. U-shaped block; 54. Round block; 55. Mixing shaft; 6. Top plate. Detailed Implementation
[0022] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.
[0023] In this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.
[0024] This utility model provides the following technical solution:
[0025] Example 1
[0026] Combination Figures 1 to 4 A device for adding activator to silicon wafer polishing liquid includes a mounting frame 1, a storage cylinder 4 fixedly connected inside the mounting frame 1, a top plate 6 movably connected to the top of the storage cylinder 4, a stirring mechanism 5 provided at the top of the top plate 6, a decomposition mechanism 2 provided at the bottom of the stirring mechanism 5, and a spray pipe 3 fixedly connected to the bottom of the storage cylinder 4.
[0027] The decomposition mechanism 2 includes a support frame 21, which is located on top of the stirring mechanism 5. A threaded rod 22 is rotatably connected inside the support frame 21. A connecting plate 23 is threadedly connected to the outer wall of the threaded rod 22. A rectangular frame 24 is fixedly connected to one side of the connecting plate 23. A locking block 25 is fixedly connected inside the rectangular frame 24. A through column 26 is provided on one side of the stirring mechanism 5.
[0028] Furthermore, the connecting plate 23 has a sliding opening inside, and the connecting plate 23 is slidably connected to the outside of the support frame 21 through the sliding opening, so that the connecting plate 23 can move stably.
[0029] Furthermore, the threads on the outer walls of the two ends of the threaded rod 22 are in opposite directions, and a torsion sleeve is fixedly connected to one end of the threaded rod 22, which facilitates the rotation of the threaded rod 22 through the torsion sleeve.
[0030] Furthermore, a slot is provided on the outer side of the through post 26, and a locking block 25 is movably connected to the inner wall of the slot, so that the locking block 25 can limit the through post 26 through the slot.
[0031] Example 2
[0032] See Figures 1 to 4 Furthermore, based on Embodiment 1, the stirring mechanism 5 further includes a support arm 51, which is fixedly connected to the top of the top plate 6. A motor 52 is fixedly connected to the inner side of the support arm 51. A U-shaped block 53 is fixedly connected to the output shaft of the motor 52. A round block 54 is fixedly connected to the bottom of the U-shaped block 53. A stirring shaft 55 is fixedly connected to the bottom of the through column 26, which facilitates the purpose of stable stirring.
[0033] Furthermore, the circular block 54 is rotatably connected to the inside of the top plate 6, and the support frame 21 is fixedly connected to the top of the circular block 54 to provide stable support for the support frame 21.
[0034] Furthermore, a rectangular opening is provided inside the circular block 54, through which the through post 26 passes, allowing the through post 26 to move through the rectangular opening.
[0035] In actual operation, when this device is used, the active agent and polishing liquid to be added are first injected into the storage cylinder 4 through the top feed hopper of the top plate 6. Then, the motor 52 can be started, so that the output shaft of the motor 52 can drive the U-shaped block 53 to rotate. The U-shaped block 53 drives the round block 54 to rotate, thereby realizing the purpose of rotating the stirring shaft 55. In this way, the stirring shaft 55 can uniformly stir and mix the active agent and polishing liquid to achieve good mixing quality, which is conducive to the further silicon wafer polishing work. After the stirring is completed, the valve at the bottom of the storage cylinder 4 can be opened to spray and transport the spray pipe 3.
[0036] During prolonged use, when the stirring shaft 55 needs to be disassembled, replaced, or maintained, the torsion sleeve can be rotated to drive the threaded rod 22 to rotate. Since the threaded rod 22 and the connecting plate 23 are threadedly connected, and the connecting plate 23 can slide and limit on the outside of the support frame 21, the rotational movement of the threaded rod 22 will be commensurate with the linear movement of the connecting plate 23. This allows the connecting plate 23 to move the locking block 25 through the rectangular frame 24, enabling the locking block 25 to be removed from the inside of the through column 26, thus removing the limit on the through column 26. Subsequently, the through column 26 will be pulled out from the inside of the round block 54, thereby achieving the disassembly of the stirring shaft 55. This facilitates the disassembly and separation of the stirring shaft 55 and the motor 52, thus achieving good operational efficiency when the stirring shaft 55 needs to be disassembled during prolonged use and reducing the impact on the addition of surfactants.
[0037] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.
Claims
1. A device for adding activator to silicon wafer polishing slurry, comprising a mounting plate (1), characterized in that: The mounting frame (1) is fixedly connected to a storage cylinder (4), the top of the storage cylinder (4) is movably connected to a top plate (6), the top of the top plate (6) is provided with a stirring mechanism (5), the bottom of the stirring mechanism (5) is provided with a decomposition mechanism (2), and the bottom of the storage cylinder (4) is fixedly connected to a spray pipe (3); the decomposition mechanism (2) includes a support frame (21), the support frame (21) is located on the top of the stirring mechanism (5), the support frame (21) is rotatably connected to a threaded rod (22), the outer wall of the threaded rod (22) is threadedly connected to a connecting plate (23), a rectangular frame (24) is fixedly connected to one side of the connecting plate (23), a locking block (25) is fixedly connected inside the rectangular frame (24), and a through column (26) is provided on one side of the stirring mechanism (5).
2. The device for adding activator to silicon wafer polishing slurry according to claim 1, characterized in that: The connecting plate (23) has a sliding opening inside, and the connecting plate (23) is slidably connected to the outside of the support frame (21) through the sliding opening.
3. The device for adding activator to silicon wafer polishing slurry according to claim 1, characterized in that: The threads on the outer walls of the two ends of the threaded rod (22) are in opposite directions, and a torsion sleeve is fixedly connected to one end of the threaded rod (22).
4. The device for adding activator to silicon wafer polishing slurry according to claim 1, characterized in that: The through column (26) has a slot on its outer side, and the locking block (25) is movably connected to the inner wall of the slot.
5. The device for adding activator to silicon wafer polishing slurry according to claim 1, characterized in that: The stirring mechanism (5) includes a support arm (51), which is fixedly connected to the top of the top plate (6). A motor (52) is fixedly connected to the inner side of the support arm (51). A U-shaped block (53) is fixedly connected to the output shaft of the motor (52). A round block (54) is fixedly connected to the bottom of the U-shaped block (53). A stirring shaft (55) is fixedly connected to the bottom of the through column (26).
6. The device for adding activator to silicon wafer polishing slurry according to claim 5, characterized in that: The circular block (54) is rotatably connected to the inside of the top plate (6), and the support frame (21) is fixedly connected to the top of the circular block (54).
7. The device for adding activator to silicon wafer polishing slurry according to claim 5, characterized in that: The circular block (54) has a rectangular opening inside, and the through-hole (26) passes through the rectangular opening.