Gluing device for electronic component manufacturing

By designing a collection component in the glue application device, the problem of glue dripping caused by unsealed glue inlets was solved, enabling the cleaning and convenient maintenance of the processing table.

CN223616150UActive Publication Date: 2025-12-02CHENGDU ZONGCHUANG XINRUI TECHNOLOGY CO LTD
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Patent Information

Application Number
CN202423089175.2
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-12-15
Publication Date
2025-12-02
Estimated Expiration
2034-12-15

AI Technical Summary

Technical Problem

The dispensing port of the existing electronic component coating device is not equipped with a sealing structure, which causes the glue to drip onto the processing table, affecting the hygiene of the processing table.

Method used

Design an adhesive application device, including a collection component comprising a fixing mechanism, an adjusting mechanism, and a receiving mechanism. The adjusting mechanism drives the receiving mechanism to move to the lower end of the adhesive outlet to collect leaked liquid, preventing adhesive dripping and facilitating the cleaning of a fully loaded collection component.

Benefits of technology

It effectively prevents colloid dripping, keeps the processing table clean, and is easy to operate and clean.

✦ Generated by Eureka AI based on patent content.

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    Figure CN223616150U_ABST
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Abstract

The utility model relates to the technical field of electronic components, and discloses a gluing device for manufacturing electronic components, which comprises a base and a turntable movably mounted at the upper end of the base, a collecting component is fixedly mounted at the lower end of one side of the inner wall of a support frame, and an operator adjusts the position of an inserting block in an inner cavity of a T-shaped block to collect glue. A clamping ball in an inner cavity of a clamping groove is pressed so that the clamping ball can drive an elastic element to contract, then an inserting block can be moved, and after the inserting block drives the elastic element and the clamping ball to move to a new clamping point, the inserting block can move to the clamping groove; the clamping balls can be clamped into clamping groove inner cavities in different positions of the two sides of the inner wall of the insertion groove again under the elastic force effect of the elastic element to be fixed, meanwhile, the hollow round block moves to the lower end of the glue outlet, leaked liquid of the glue outlet which is not used is collected, and the leaked liquid is prevented from dripping all around.
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Description

Technical Field

[0001] This utility model relates to the field of electronic component technology, specifically to a glue coating device for manufacturing electronic components. Background Technology

[0002] Electronic components are the building blocks of electronic parts and small machines and instruments. They are the basic elements in electronic circuits and are usually individually packaged. During the manufacturing process of electronic components, adhesive needs to be applied to their surface.

[0003] Dispensing is a widely used process, also known as gluing, coating, potting, or dripping, that involves applying electronic adhesives, oils, or other liquids to products through application, potting, or dripping. This allows the products to perform functions such as adhesion, encapsulation, insulation, fixation, and surface smoothing. Dispensing adhesives to electronic components allows for pre-fixation of components, which is beneficial for automated production.

[0004] For example, the patent with publication number CN218982117U discloses an electronic component coating device, including a base, a turntable, a workpiece tray, a cavity, a central shaft seat, a central column, and a drive assembly. This electronic component coating device is designed with a first telescopic push rod to adjust the height position of the glue injection cylinder, a second telescopic push rod on the glue injection cylinder, and a push plug in the glue injection cylinder, so as to complete the mechanized glue injection work of electronic components.

[0005] In the aforementioned patent, electronic components are injected with glue by pushing the pusher at the upper end of the inner cavity of the glue injection cylinder. After the glue injection cylinder completes one injection, because the glue injection port of the glue injection cylinder is not equipped with a sealing structure, the glue residue at the injection port will drip onto the processing table, affecting the hygiene of the processing table.

[0006] Therefore, we propose a coating device for electronic component manufacturing to solve the problems mentioned above. Utility Model Content

[0007] The purpose of this invention is to provide a glue-applying device for manufacturing electronic components, in order to solve the problem mentioned in the background art where residual glue from the glue-applying nozzle drips onto the processing table due to the lack of a sealing structure at the nozzle.

[0008] To achieve the above objectives, the present invention provides the following technical solution: a glue-applying device for manufacturing electronic components, comprising a base and a turntable movably mounted on the upper end of the base, a working plate being provided on the upper end of the turntable, a support frame being fixedly mounted on one end of the outer wall of the base, a receiving frame being provided on one side of the upper end of the support frame via a telescopic push rod, a glue-dispensing cylinder being provided on one side of the upper end of the receiving frame, and a collection component being fixedly mounted on the lower end of one side of the inner wall of the support frame, the collection component being adapted to collect the leakage liquid at the lower end of the glue-dispensing cylinder;

[0009] The collecting component includes a fixing mechanism and an adjustment mechanism that is movable and embedded in one end of the fixing mechanism. A receiving mechanism is threadedly fixed to one side of the upper end of the adjustment mechanism. The adjustment mechanism is designed to be suitable for moving and adjusting the receiving mechanism to a different position.

[0010] Preferably, the glue injection cylinder includes a cylinder body and a pusher plug movably installed at the upper end of the inner cavity of the cylinder body, and a glue outlet is provided at the lower end of the cylinder body.

[0011] Preferably, the fixing mechanism includes a T-shaped block and an insertion groove formed at the middle of one end of the T-shaped block, with slots formed on both sides of the inner wall of the insertion groove.

[0012] Preferably, the adjustment mechanism includes an insertion block and elastic elements respectively fixedly installed on both sides of one end of the outer wall of the insertion block. A retaining ball is fixedly installed at one end of the elastic element, and a through groove is opened in the middle of one side of the upper end of the insertion block.

[0013] Preferably, the receiving mechanism includes a hollow circular block and a threaded rod fixedly installed at the lower center of the bottom surface of the hollow circular block.

[0014] Preferably, the outer surface of the threaded rod is threaded with a fixing nut, a round rod is fixedly installed around the outer wall of the fixing nut, and a round ring is fixedly installed at one end of the round rod.

[0015] Compared with the prior art, the beneficial effects of this utility model are:

[0016] 1. By pressing the retaining ball in the inner cavity of the retaining groove, the operator can move the insertion block after the retaining ball causes the elastic element to contract. After the insertion block moves the elastic element and the retaining ball to a new insertion point, the retaining ball will be re-inserted into the inner cavity of the retaining groove at different positions on both sides of the inner wall of the insertion groove under the elastic force of the elastic element for fixation. At the same time, the hollow round block moves to the lower end of the glue outlet to collect the leakage from the unused glue outlet and prevent the leakage from dripping everywhere.

[0017] 2. After the leakage liquid in the inner cavity of the hollow round block is collected, the operator rotates the ring to drive the round rod and the fixing nut to rotate, so that the fixing nut can be removed from the outer surface of the threaded rod, and the hollow round block can be directly removed and cleaned from the upper side of the insertion block. Attached Figure Description

[0018] Figure 1 This is a schematic diagram of the overall three-dimensional structure of this utility model;

[0019] Figure 2 This is a three-dimensional structural diagram of the glue injection cylinder of this utility model;

[0020] Figure 3 This is a three-dimensional structural diagram of the fixing mechanism and the adjusting mechanism of this utility model;

[0021] Figure 4 This is a three-dimensional structural diagram of the receiving mechanism of this utility model.

[0022] In the diagram: 1. Base; 2. Turntable; 3. Working plate; 4. Support frame; 5. Receiving frame; 6. Glue injection cylinder; 61. Cylinder body; 62. Push plug; 63. Glue outlet; 7. Collection assembly; 71. Fixing mechanism; 711. T-block; 712. Insertion slot; 713. Slot; 72. Adjustment mechanism; 721. Insertion block; 722. Elastic element; 723. Ball retainer; 724. Through slot; 73. Receiving mechanism; 731. Hollow round block; 732. Threaded rod; 733. Fixing nut; 734. Round rod; 735. Ring. Detailed Implementation

[0023] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0024] Example 1: Please refer to Figures 1-3 An adhesive coating device for manufacturing electronic components includes a base 1 and a turntable 2 movably mounted on the upper end of the base 1 (the lower end of the turntable 2 is driven to rotate by a motor to achieve rotation of the turntable 2). A working plate 3 is provided on the upper end of the turntable 2. A support frame 4 is fixedly installed on one end of the outer wall of the base 1. A receiving frame 5 is provided on one side of the upper end of the support frame 4 through a telescopic push rod. An adhesive injection cylinder 6 is provided on one side of the upper end of the receiving frame 5. A collection component 7 is fixedly installed on the lower end of one side of the inner wall of the support frame 4. The collection component 7 is adapted to collect the leakage liquid at the lower end of the adhesive injection cylinder 6.

[0025] The collecting component 7 includes a fixing mechanism 71 and an adjusting mechanism 72 that is movable and embedded in one end of the fixing mechanism 71. A receiving mechanism 73 is threadedly fixed to one side of the upper end of the adjusting mechanism 72. The adjusting mechanism 72 is configured to drive the receiving mechanism 73 to move and adjust its position.

[0026] The glue dispensing cylinder 6 includes a cylinder 61 and a pusher 62 movably installed at the upper end of the inner cavity of the cylinder 61. The lower end of the cylinder 61 is provided with a glue outlet 63. By pushing the pusher 62, the glue in the inner cavity of the cylinder 61 is dispensed through the glue outlet 63.

[0027] The fixing mechanism 71 includes a T-shaped block 711 and an insertion groove 712 opened in the middle of one end of the T-shaped block 711. The inner walls of the insertion groove 712 are respectively provided with slots 713 on both sides.

[0028] The adjustment mechanism 72 includes an insertion block 721 and elastic elements 722 respectively fixedly installed on both sides of one end of the outer wall of the insertion block 721. A retaining ball 723 is fixedly installed on one end of the elastic element 722. A through groove 724 is opened in the middle of one side of the upper end of the insertion block 721. One end of the insertion block 721 is movably installed in the inner cavity of the insertion groove 712. The retaining ball 723 is movably embedded in the inner cavity of the retaining groove 713 under the elastic force of the elastic element 722.

[0029] In this embodiment: the operator adjusts the position of the insertion block 721 in the inner cavity of the T-shaped block 711 to move the hollow round block 731. By pressing the retaining ball 723 in the inner cavity of the retaining groove 713, the retaining ball 723 causes the elastic element 722 to contract, thus moving the insertion block 721. After the insertion block 721 moves the elastic element 722 and the retaining ball 723 to a new insertion point, the retaining ball 723 will be re-inserted into the inner cavity of the retaining groove 713 at different positions on both sides of the inner wall of the insertion groove 712 under the elastic force of the elastic element 722 for fixation. At the same time, the hollow round block 731 moves to the lower end of the glue outlet 63 to collect the leaking liquid from the unused glue outlet 63 and prevent the leaking liquid from dripping everywhere.

[0030] Example 2: This example is an improvement on Example 1. For details, please refer to [link / reference]. Figure 4 The receiving mechanism 73 includes a hollow round block 731 and a threaded rod 732 fixedly installed at the lower middle part of the bottom surface of the hollow round block 731. The threaded rod 732 is movably installed in the inner cavity of the through groove 724 and is fixedly pressed into the lower end of the groove of the through groove 724 by a fixing nut 733.

[0031] The outer surface of the threaded rod 732 is threaded with a fixing nut 733. A round rod 734 is fixedly installed around the outer wall of the fixing nut 733. A ring 735 is fixedly installed at one end of the round rod 734. The ring 735 is designed to drive the round rod 734 and the fixing nut 733 to rotate, thereby facilitating the disassembly of the fixing nut 733.

[0032] In this embodiment: after the leakage liquid in the inner cavity of the hollow round block 731 is collected, the operator rotates the ring 735 to drive the round rod 734 and the fixing nut 733 to rotate, so that the fixing nut 733 can be removed from the outer surface of the threaded rod 732, and the hollow round block 731 can be directly removed and cleaned from the upper side of the insertion block 721, which is convenient to use.

[0033] Working principle: The operator adjusts the position of the insertion block 721 within the cavity of the T-shaped block 711 to move the hollow circular block 731. By pressing the retaining ball 723 within the cavity of the retaining groove 713, the retaining ball 723 causes the elastic element 722 to retract, thus moving the insertion block 721. After the insertion block 721 moves the elastic element 722 and the retaining ball 723 to a new engagement point, the retaining ball 723 will re-engage into the insertion groove 712 under the elastic force of the elastic element 722. The hollow round block 731 is fixed in the inner cavity of the slot 713 at different positions on both sides of the wall, and at the same time, it moves to the lower end of the glue outlet 63 to collect the leakage from the unused glue outlet 63. After the leakage in the inner cavity of the hollow round block 731 is full, the operator rotates the ring 735 to drive the round rod 734 and the fixing nut 733 to rotate, so that the fixing nut 733 can be removed from the outer surface of the threaded rod 732, and the hollow round block 731 can be directly removed and cleaned from the upper side of the insertion block 721.

[0034] The contents not described in detail in this specification are existing technologies known to those skilled in the art.

[0035] Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A glue-applying device for manufacturing electronic components, comprising a base (1) and a turntable (2) movably mounted on the upper end of the base (1), a working plate (3) being provided on the upper end of the turntable (2), a support frame (4) being fixedly installed on one end of the outer wall of the base (1), a receiving frame (5) being provided on one side of the upper end of the support frame (4) via a telescopic push rod, and a glue-applying cylinder (6) being provided on one side of the upper end of the receiving frame (5), characterized in that: A collection assembly (7) is fixedly installed on the lower end of one side of the inner wall of the support frame (4). The collection assembly (7) is adapted to collect the leakage from the lower end of the glue injection cylinder (6). The collecting component (7) includes a fixing mechanism (71) and an adjusting mechanism (72) that is movable and embedded in one end of the fixing mechanism (71). A receiving mechanism (73) is threadedly fixed on one side of the upper end of the adjusting mechanism (72). The adjusting mechanism (72) is configured to drive the receiving mechanism (73) to move and adjust its position.

2. The adhesive coating apparatus for manufacturing electronic components according to claim 1, characterized in that: The glue injection cylinder (6) includes a cylinder body (61) and a pusher (62) movably installed on the upper end of the inner cavity of the cylinder body (61). The lower end of the cylinder body (61) is provided with a glue outlet (63).

3. The adhesive coating apparatus for manufacturing electronic components according to claim 1, characterized in that: The fixing mechanism (71) includes a T-shaped block (711) and an insertion groove (712) opened in the middle of one end of the T-shaped block (711). The inner walls of the insertion groove (712) are respectively provided with slots (713).

4. The adhesive coating apparatus for manufacturing electronic components according to claim 1, characterized in that: The adjustment mechanism (72) includes an insertion block (721) and elastic elements (722) fixedly installed on both sides of one end of the outer wall of the insertion block (721). A retaining ball (723) is fixedly installed on one end of the elastic element (722), and a through groove (724) is opened in the middle of one side of the upper end of the insertion block (721).

5. The adhesive coating apparatus for manufacturing electronic components according to claim 1, characterized in that: The receiving mechanism (73) includes a hollow round block (731) and a threaded rod (732) fixedly installed at the lower center of the bottom surface of the hollow round block (731).

6. The adhesive coating apparatus for manufacturing electronic components according to claim 5, characterized in that: The outer surface of the threaded rod (732) is threaded with a fixing nut (733), and a round rod (734) is fixedly installed around the outer wall of the fixing nut (733). A ring (735) is fixedly installed at one end of the round rod (734).

Citation Information

Patent Citations

  • Gluing device for electronic component

    CN218982117U