Laser cutting device for semiconductor wafer processing
By using support and anti-detachment devices, the stability and precision issues of silicon wafers during the cutting process are solved, achieving efficient laser cutting results and ensuring the quality and precision of semiconductor wafer processing.
Patent Information
- Application Number
- CN202423214044.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-25
- Publication Date
- 2025-12-02
- Estimated Expiration
- 2034-12-25
AI Technical Summary
Traditional laser cutting equipment struggles to ensure precise alignment and stable positioning of silicon wafers. During the cutting process, external forces can easily cause displacement or detachment, affecting cutting accuracy and efficiency.
The device employs a support mechanism and an anti-detachment mechanism. The support mechanism uses a servo motor and an adjusting screw to keep the silicon wafer disk stable, while the anti-detachment mechanism uses a DC motor and a bidirectional screw to prevent the silicon wafer disk from shifting or falling off during the cutting process.
This ensures the stability and precision of silicon wafers during the cutting process, improves cutting accuracy and processing quality, and facilitates wafer handling.
Smart Images
Figure CN223616969U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of laser cutting equipment technology, specifically to a laser cutting device for semiconductor wafer processing. Background Technology
[0002] In the field of semiconductor wafer processing, laser cutting is a key technology. However, traditional laser cutting equipment has some problems. On the one hand, it is difficult to ensure that the silicon wafer disk is in a precise and stable position during the cutting process. Due to the difference in wafer thickness, different jigs are required, making it difficult to accurately align the wafer surface with the laser cutting position, which affects the cutting accuracy. Moreover, it is not convenient to remove the wafer after processing. On the other hand, the silicon wafer disk is easily affected by various external forces during cutting. The force generated by laser cutting and the vibration of the equipment during operation can cause the wafer to shift or even fall off. This not only leads to cutting failure and waste of wafer material, but also affects the stability and efficiency of the entire processing process, reducing the quality of semiconductor wafer processing.
[0003] This laser cutting device for semiconductor wafer processing effectively solves the aforementioned problems by using a support device to ensure wafer stability and easy handling, and by using an anti-detachment device to prevent wafer displacement and detachment. Utility Model Content
[0004] To address the shortcomings of existing technologies, the technical solution adopted by this utility model is as follows: a laser cutting device for semiconductor wafer processing, comprising: a base, a fixing frame fixedly connected to the outer wall of the top of the base, an adjusting rod slidably connected to the inner wall of the fixing frame, and a laser nozzle slidably connected to the outer wall of the adjusting rod; a limiting device, the outer wall of which is fixedly connected to the outer wall of the base, the limiting device being used to place and limit a silicon wafer disk; the limiting device includes an L-shaped plate, a worktable fixedly connected to the outer wall of the L-shaped plate, extraction grooves symmetrically formed on the outer wall of the worktable, a supporting device fixedly connected to the outer wall of the worktable, and an anti-detachment device slidably connected to the outer wall of the worktable through a limiting groove, the limiting groove being formed in the wall of the worktable, and the outer wall of the L-shaped plate being fixedly connected to the outer wall of the base.
[0005] Preferably, the support device includes a servo motor, the output end of which is fixedly connected to an adjusting screw, the outer wall of which is threaded with an internal thread block, the top outer wall of which is fixedly connected to a support plate, the top outer wall of which is fixedly connected to a limit frame, and the support plate has pick-up grooves on both sides.
[0006] Preferably, the outer wall of the servo motor is fixedly connected to the outer wall of the worktable, the end of the adjusting screw away from the servo motor is rotatably connected to the inner wall of the worktable, the outer wall of the internal thread block is slidably connected to the inner side wall of the worktable, and a support device is provided to ensure that the silicon wafer disk is stable during the cutting process, so that the laser cutting can accurately act on the wafer surface, and at the same time, the pick-up slot makes it convenient for the operator to pick up the cut silicon wafer.
[0007] Preferably, the anti-detachment device includes a DC motor, the output end of which is fixedly connected to a bidirectional screw, a positioning block is rotatably connected to the outer wall of the bidirectional screw, a movable block is symmetrically threaded to the outer wall of the bidirectional screw, a limit block is fixedly connected to the outer wall of the movable block, and an anti-detachment ring is fixedly connected to the outer wall of the limit block.
[0008] Preferably, the outer wall of the DC motor is fixedly connected to the outer wall of the worktable, the end of the bidirectional screw away from the DC motor is rotatably connected to the inner wall of the worktable, the outer wall of the top of the worktable is fixedly connected to the outer wall of the bottom of the positioning block, the outer wall of the limiting block is slidably connected to the outer wall of the worktable through the limiting groove, and the outer wall of the movable block is slidably connected to the outer wall of the worktable. By setting an anti-detachment device, the silicon wafer disk is prevented from shifting or falling off during the cutting process due to factors such as laser cutting force and equipment vibration, so as to ensure the stability and accuracy of the cutting process and ensure the quality and precision of semiconductor wafer processing.
[0009] The beneficial effects of this utility model are as follows:
[0010] 1. This utility model ensures the stability of the silicon wafer disk during the cutting process by setting a support device, so that the laser cutting can be accurately applied to the wafer surface. At the same time, the pick-up slot makes it convenient for operators to pick up the cut silicon wafer.
[0011] 2. This utility model, by setting an anti-detachment device, prevents the silicon wafer disk from shifting or falling off during the cutting process due to factors such as laser cutting force and equipment vibration, thus ensuring the stability and accuracy of the cutting process and ensuring the quality and precision of semiconductor wafer processing. Attached Figure Description
[0012] Figure 1 This is a schematic diagram of the structure of this utility model;
[0013] Figure 2 This is a schematic diagram of the internal structure of this utility model;
[0014] Figure 3 This is a schematic diagram of the structure of the support device of this utility model;
[0015] Figure 4 This is a schematic diagram of the anti-detachment device of this utility model.
[0016] In the diagram: 1. Base; 2. Fixing frame; 3. Adjusting rod; 4. Laser nozzle; 5. Limiting device; 51. L-shaped plate; 52. Worktable; 53. Extraction slot; 54. Support device; 55. Anti-detachment device; 56. Limiting slot; 541. Servo motor; 542. Adjusting screw; 543. Internal thread block; 544. Support plate; 545. Limiting frame; 546. Picking slot; 551. DC motor; 552. Bidirectional screw; 553. Positioning block; 554. Movable block; 555. Limiting block; 556. Anti-detachment ring. Detailed Implementation
[0017] The present invention will now be described in further detail with reference to the accompanying drawings and specific embodiments. The embodiments of the present invention are given for illustrative and descriptive purposes only, and are not intended to be exhaustive or to limit the present invention to the disclosed forms. Many modifications and variations will be apparent to those skilled in the art. The embodiments were chosen and described to better illustrate the principles and practical applications of the present invention, and to enable those skilled in the art to understand the present invention and design various embodiments with various modifications suitable for a particular purpose.
[0018] Example: Please refer to Figure 1 - Figure 4 This utility model provides a technical solution: a laser cutting device for semiconductor wafer processing, comprising: a base 1, a fixing frame 2 fixedly connected to the outer wall of the top of the base 1, an adjusting rod 3 slidably connected to the inner wall of the fixing frame 2, and a laser nozzle 4 slidably connected to the outer wall of the adjusting rod 3; a limiting device 5, the outer wall of the limiting device 5 being fixedly connected to the outer wall of the base 1, the limiting device 5 being used to place and limit the silicon wafer disk; the limiting device 5 includes an L-shaped plate 51, a worktable 52 fixedly connected to the outer wall of the L-shaped plate 51, extraction grooves 53 symmetrically formed on the outer wall of the worktable 52, a supporting device 54 fixedly connected to the outer wall of the worktable 52, and an anti-detachment device 55 slidably connected to the outer wall of the worktable 52 through a limiting groove 56, the limiting groove 56 being formed in the wall of the worktable 52, and the outer wall of the L-shaped plate 51 being fixedly connected to the outer wall of the base 1.
[0019] The support device 54 includes a servo motor 541. An adjusting screw 542 is fixedly connected to the output end of the servo motor 541. An internal thread block 543 is threadedly connected to the outer wall of the adjusting screw 542. A support plate 544 is fixedly connected to the outer wall of the top of the internal thread block 543. A limit frame 545 is fixedly connected to the outer wall of the top of the support plate 544. There are pick-up slots 546 on both sides of the support plate 544.
[0020] The outer wall of the servo motor 541 is fixedly connected to the outer wall of the worktable 52. The end of the adjusting screw 542 away from the servo motor 541 is rotatably connected to the inner wall of the worktable 52. The outer wall of the internal thread block 543 is slidably connected to the inner side wall of the worktable 52. When the servo motor 541 is started, it drives the adjusting screw 542 to rotate. The internal thread block 543, which is threadedly connected to the adjusting screw 542, will slide along the screw direction under the restriction of the inner side wall of the worktable 52. The support plate 544 and the limit frame 545 on the internal thread block 543 move accordingly. In this way, the silicon wafer can be placed stably and pushed to the processing position before processing. With the clamping of the worktable 52, the silicon wafer is kept stable during the cutting process.
[0021] The anti-detachment device 55 includes a DC motor 551, a bidirectional screw 552 fixedly connected to the output end of the DC motor 551, a positioning block 553 rotatably connected to the outer wall of the bidirectional screw 552, a movable block 554 symmetrically threaded to the outer wall of the bidirectional screw 552, a limit block 555 fixedly connected to the outer wall of the movable block 554, and an anti-detachment ring 556 fixedly connected to the outer wall of the limit block 555.
[0022] The outer wall of the DC motor 551 is fixedly connected to the outer wall of the worktable 52. The end of the bidirectional screw 552 away from the DC motor 551 is rotatably connected to the inner wall of the worktable 52. The outer wall of the top of the worktable 52 is fixedly connected to the outer wall of the bottom of the positioning block 553. The outer wall of the limiting block 555 is slidably connected to the outer wall of the worktable 52 through the limiting groove 56. The outer wall of the movable block 554 is slidably connected to the outer wall of the worktable 52. When the silicon wafer is placed on the worktable 52, the anti-detachment device 55 starts to work. The DC motor 551 drives the bidirectional screw 552 to rotate in the positioning block 553. The movable blocks 554 on the bidirectional screw 552 will move closer or further away from each other under the action of the screw. The movable blocks 554 drive the limiting blocks 555 to slide along the limiting groove 56, so that the anti-detachment ring 556 can move closer or further away from the silicon wafer. When the anti-detachment ring 556 moves closer to the silicon wafer, it can limit the silicon wafer from the periphery.
[0023] Working principle:
[0024] In use, the base 1 provides a stable support foundation for the entire device, and the fixed bracket 2 on its top is used to install and support subsequent components. The adjusting rod 3 can slide within the fixed bracket 2 to adjust the position of the laser nozzle 4 within a certain range, thereby adjusting the laser cutting position according to the cutting requirements of semiconductor wafers.
[0025] The limiting device 5 plays a role in the cutting operation. The L-shaped plate 51 firmly fixes the worktable 52 on the base 1. The extraction slot 53 on the worktable 52 facilitates the placement and removal of the silicon wafer placed on it. The silicon wafer can be placed or removed from the extraction slot 53 by the clamp.
[0026] In the support device 54, the servo motor 541 starts, driving the adjusting screw 542 to rotate. The internal thread block 543, which is threadedly connected to the adjusting screw 542, slides along the screw direction under the constraint of the inner side wall of the worktable 52. The support plate 544 and the limit frame 545 on the internal thread block 543 move accordingly. In this way, the silicon wafer disk can be placed stably and pushed to the processing position before processing. With the clamping of the worktable 52, the silicon wafer disk is kept stable during the cutting process, so that the laser cutting can be accurately applied to the wafer surface. At the same time, the pick-up slot 546 makes it convenient for the operator to pick up the cut silicon wafer.
[0027] After the silicon wafer disk is placed on the worktable 52, the anti-detachment device 55 starts to work. The DC motor 551 drives the bidirectional screw 552 to rotate in the positioning block 553. The movable blocks 554 on the bidirectional screw 552 will move closer or further apart under the action of the thread. The movable blocks 554 drive the limiting block 555 to slide along the limiting groove 56, so that the anti-detachment ring 556 can move closer or further away from the silicon wafer disk. When the anti-detachment ring 556 is close to the silicon wafer disk, it can limit the silicon wafer disk from the periphery to prevent it from being displaced or falling off during the cutting process due to laser cutting force, equipment vibration and other factors, so as to ensure the stability and accuracy of the cutting process and ensure the quality and precision of semiconductor wafer processing.
[0028] Obviously, the described embodiments are only a part of the embodiments of this utility model, and not all of them. All other embodiments obtained by those skilled in the art and related fields based on the embodiments of this utility model without creative effort should fall within the protection scope of this utility model. Structures, devices, and operating methods not specifically described and explained in this utility model, unless otherwise specified or limited, shall be implemented according to conventional means in the art.
Claims
1. A laser cutting apparatus for semiconductor wafer processing, characterized in that, include: The base (1) has a fixed frame (2) fixedly connected to the outer wall of the top of the base (1), and an adjusting rod (3) is slidably connected to the inner wall of the fixed frame (2). A laser nozzle (4) is slidably connected to the outer wall of the adjusting rod (3). Limiting device (5), the outer wall of the limiting device (5) is fixedly connected to the outer wall of the base (1), the limiting device (5) is used to place and limit the silicon wafer disk; The limiting device (5) includes an L-shaped plate (51), a workbench (52) is fixedly connected to the outer wall of the L-shaped plate (51), an extraction groove (53) is symmetrically formed on the outer wall of the workbench (52), a support device (54) is fixedly connected to the outer wall of the workbench (52), and an anti-detachment device (55) is slidably connected to the outer wall of the workbench (52) through a limiting groove (56), and the limiting groove (56) is formed in the wall of the workbench (52).
2. The laser cutting apparatus for semiconductor wafer processing according to claim 1, characterized in that: The outer wall of the L-shaped plate (51) is fixedly connected to the outer wall of the base (1).
3. The laser cutting apparatus for semiconductor wafer processing according to claim 1, characterized in that: The support device (54) includes a servo motor (541), the output end of which is fixedly connected to an adjusting screw (542), the outer wall of which is threadedly connected to an internal thread block (543), the top outer wall of which is fixedly connected to a support plate (544), the top outer wall of which is fixedly connected to a limit frame (545), and the two sides of which are provided with pick-up slots (546).
4. The laser cutting apparatus for semiconductor wafer processing according to claim 3, characterized in that: The outer wall of the servo motor (541) is fixedly connected to the outer wall of the worktable (52), the end of the adjusting screw (542) away from the servo motor (541) is rotatably connected to the inner wall of the worktable (52), and the outer wall of the internal thread block (543) is slidably connected to the inner side wall of the worktable (52).
5. The laser cutting apparatus for semiconductor wafer processing according to claim 1, characterized in that: The anti-detachment device (55) includes a DC motor (551), the output end of which is fixedly connected to a bidirectional screw (552), the outer wall of which is rotatably connected to a positioning block (553), the outer wall of which is symmetrically threaded with a movable block (554), the outer wall of which is fixedly connected to a limit block (555), and the outer wall of which is fixedly connected to an anti-detachment ring (556).
6. The laser cutting apparatus for semiconductor wafer processing according to claim 5, characterized in that: The outer wall of the DC motor (551) is fixedly connected to the outer wall of the worktable (52). The end of the bidirectional screw (552) away from the DC motor (551) is rotatably connected to the inner wall of the worktable (52). The outer wall of the top of the worktable (52) is fixedly connected to the outer wall of the bottom of the positioning block (553). The outer wall of the limiting block (555) is slidably connected to the outer wall of the worktable (52) through the limiting groove (56). The outer wall of the movable block (554) is slidably connected to the outer wall of the worktable (52).