Improved semi-automatic wafer scribing cutting machine
The rotating and moving system driven by motors and cylinders enables flexible movement of the semi-automatic wafer dicing machine's worktable and stable clamping of wafers, solving the problem of insufficient flexibility in existing technologies and improving cutting accuracy and production efficiency.
Patent Information
- Application Number
- CN202423200833.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-25
- Publication Date
- 2025-12-02
- Estimated Expiration
- 2034-12-25
AI Technical Summary
Existing semi-automatic wafer dicing machines lack flexibility due to the fixed worktable, making it difficult to adjust the wafer position, increasing the difficulty of equipment debugging and preparation, and limiting their ability to adapt to different production scenarios.
The system employs a motor-driven rotating rod and rotating disk system. The rotating shaft drives the rotating plate and moving plate to move the worktable left and right. Combined with the cylinder-driven push plate and rotating plate, the wafer is fixed and stably clamped to ensure cutting accuracy.
It improves the ease of operation and production efficiency of the equipment, ensures the positional stability of the wafers during the dicing process, enhances the dicing accuracy and quality, and reduces the generation of waste.
Smart Images
Figure CN223617976U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of semiconductor manufacturing technology, and in particular to an improved semi-automatic wafer dicing machine. Background Technology
[0002] A wafer refers to a silicon wafer used in the fabrication of silicon semiconductor integrated circuits. Wafers need to be diced to separate the numerous chips fabricated on them. A semi-automatic dicing machine is a type of equipment used for wafer dicing. It can precisely dice wafers, separating the chips one by one for subsequent packaging and other processes.
[0003] The semi-automatic wafer dicing machine consists of a worktable, a cutting section, and a fixing section. The worktable comprises a work frame and a material tray. The work frame serves as the support for the entire cutting mechanism, providing a mounting base and stable structural support for other components, ensuring the stability of the equipment during the cutting process. The material tray is used to place the wafer dicing pieces to be cut. Its design needs to ensure that the wafers can be accurately placed in the predetermined positions and will not shift during the cutting process. The cutting section consists of a laser cutting head, which is the key component for wafer dicing and cutting. It emits a high-energy laser beam to precisely cut the wafer dicing pieces, offering advantages such as high cutting accuracy and good cut quality. The fixing section consists of a fixing assembly and a ring-shaped fixing component. The fixing assembly includes a second mounting plate, a push rod motor, and a ring-shaped fixing component. The second mounting plate is fixed on the worktable, and the push rod motor is mounted on the second mounting plate. Its push rod passes through the wall of the material placement groove and is connected to the annular fixing part. The annular fixing part has a fixing part. By pushing the push rod motor, the fixing part abuts against the wafer dicing in the material placement groove, thereby firmly fixing the wafer dicing in the material placement groove, preventing the wafer dicing from moving or shaking during the cutting process, and ensuring cutting accuracy.
[0004] In existing technologies, some semi-automatic wafer dicing and dicing machines have fixed worktables due to their high-precision cutting requirements, complex transmission components, laser cutting methods, and the balance of cutting force and reaction force. This results in insufficient flexibility when adjusting wafer positions or processing wafers of different specifications, increasing the difficulty and time of equipment debugging and preparation, and also limiting their ability to adapt to different production scenarios. Therefore, an improved semi-automatic wafer dicing and dicing machine is proposed to solve the above problems. Utility Model Content
[0005] To overcome the above shortcomings, this utility model provides an improved semi-automatic wafer dicing and cutting machine, which aims to improve the problem in the prior art where the worktable is fixed to the equipment due to the high precision cutting requirements, complex transmission components, laser cutting method, and balance of cutting force and reaction force.
[0006] To achieve the above objectives, the present invention adopts the following technical solution:
[0007] An improved semi-automatic wafer dicing machine includes a housing, a support plate fixedly connected to the inner wall of the housing, a motor fixedly connected to the front side of the support plate, a rotating rod fixedly connected to the drive end of the motor, a rotating disk fixedly connected to the rear side of the rotating rod, a rotating shaft fixedly connected to the rear side of the rotating disk, a rotating plate slidably connected to the outside of the rotating shaft, a movable plate fixedly connected to the top of the rotating plate, a fixed rod fixedly connected to the rear side of the support plate, a rotating plate rotatably connected to the outside of the fixed rod, a connecting plate fixedly connected to the front side of the movable plate, a movable plate 2 fixedly connected to the front side of the connecting plate, a fixed plate 1 fixedly connected to the top of the movable plate 2, and a clamping assembly for fixing wafers fixedly connected to the top of the fixed plate 1.
[0008] As a further description of the above technical solution:
[0009] The clamping assembly includes a worktable, the bottom of which is fixedly connected to the top of the fixed plate one. A cylinder is fixedly connected to the inner wall of the worktable, and a push plate is fixedly connected to the drive end of the cylinder. Two rotating shafts two are fixedly connected to the top of the push plate, and rotating plates three are fixedly connected to the outside of each of the two rotating shafts two. Fixed plates two are rotatably connected to the opposite sides of the two rotating plates three, and a moving block is fixedly connected to the front side of the fixed plate two.
[0010] As a further description of the above technical solution:
[0011] The other side of the rotating plate two is rotatably connected to the bottom rear side of the rotating plate one, and the inner wall of the rotating plate one is provided with a groove one;
[0012] As a further description of the above technical solution:
[0013] The bottom of the second movable plate is slidably connected to the top of the support plate, and the outside of the first fixed plate is slidably connected to the top of the outer shell.
[0014] As a further description of the above technical solution:
[0015] The bottom of the push plate is slidably connected to a guide plate two, and the bottom of the guide plate two is fixedly connected to the inner wall of the workbench.
[0016] As a further description of the above technical solution:
[0017] The bottom of the movable block is slidably connected to a guide plate, and the bottom of the guide plate is fixedly connected to the inner wall of the workbench.
[0018] As a further description of the above technical solution:
[0019] Two horizontal plates are fixedly connected to the bottom of the cylinder, and a slot is provided on the top of the workbench;
[0020] As a further description of the above technical solution:
[0021] A fixed block is fixedly connected to the top of the movable block, and a clamp is fixedly connected to the top of the fixed block.
[0022] This utility model has the following beneficial effects:
[0023] 1. In this utility model, a motor drives a rotating rod to rotate, which in turn rotates a rotating disk. This, in turn, drives a rotating shaft to rotate a rotating plate, which in turn moves a movable plate along with a movable plate, thus moving the worktable. This allows for left and right movement of the worktable and flexible adjustment of the wafer position, facilitating precise dicing operations. This increases the ease of operation of the equipment and improves production efficiency.
[0024] 2. In this invention, a cylinder drives a push plate to move, which in turn rotates a rotating plate, causing the moving block to move, which in turn moves the fixed block, thus moving the fixture. This achieves wafer fixation and ensures stable wafer positioning during dicing, improving dicing accuracy and quality. Stable fixation also helps improve production efficiency and reduce waste caused by wafer movement. Attached Figure Description
[0025] Figure 1 This is a three-dimensional schematic diagram of an improved semi-automatic wafer dicing machine proposed in this utility model;
[0026] Figure 2 This is a schematic diagram of the support plate structure of an improved semi-automatic wafer dicing machine proposed in this utility model.
[0027] Figure 3 This is a schematic diagram of the fixing plate structure of an improved semi-automatic wafer dicing machine proposed in this utility model.
[0028] Figure 4 This is a schematic diagram of the push plate structure of an improved semi-automatic wafer dicing machine proposed in this utility model.
[0029] Legend:
[0030] 1. Outer shell; 2. Support plate; 3. Motor; 4. Rotating rod; 5. Rotating disk; 6. Rotating shaft one; 7. Rotating plate one; 8. Fixed rod; 9. Rotating plate two; 10. Moving plate one; 11. Connecting plate; 12. Moving plate two; 13. Fixed plate one; 14. Worktable; 15. Cylinder; 16. Push plate; 17. Rotating shaft two; 18. Rotating plate three; 19. Fixed plate two; 20. Moving block; 21. Guide plate one; 22. Guide plate two; 23. Fixed block; 24. Fixture. Detailed Implementation
[0031] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.
[0032] Reference Figure 2 and Figure 3 This utility model provides an embodiment of an improved semi-automatic wafer dicing and cutting machine, including a housing 1. The housing 1 provides protection for the entire wafer dicing and cutting machine, preventing damage to internal precision components from the external environment, and also plays a certain safety protection role, preventing operators from contacting dangerous parts during equipment operation. A support plate 2 is fixedly connected to the inner wall of the housing 1. The support plate 2 provides a stable mounting support platform for the motor 3 and other components, ensuring that each component maintains a relatively fixed positional relationship during equipment operation, thus ensuring the stability and accuracy of the equipment. A motor 3 is fixedly connected to the front side of the support plate 2. The motor 3 provides a power source for the entire equipment, driving the rotating rod 4 to rotate, thereby driving the movement of a series of subsequent components. The driving end of the motor 3 is fixedly connected to the rotating rod 4. The rotating rod 4 transmits the rotational power of the motor 3 to the rotating disk 5, playing a connecting and transmission role. The rotating disk 5 is fixedly connected to the rear side of the rotating rod 4. The rotating disk 5 rotates with the rotation of the rotating rod 4, and its rotational motion drives the rotating shaft 6 to move, thereby pushing the rotating plate 7 to move. The rotating shaft 6 is fixedly connected to the rear side of the rotating disk 5.
[0033] Rotating shaft 6 slides under the drive of rotating disk 5, converting the circular motion of rotating disk 5 into linear motion, thus pushing rotating plate 7 to move. Rotating plate 7 is slidably connected to the outside of rotating shaft 6. Rotating plate 7 moves under the action of rotating shaft 6, thereby driving moving plate 10 to move. Moving plate 10 is fixedly connected to the top of rotating plate 7. Moving plate 10 moves under the drive of rotating plate 7. At the same time, moving plate 12 is connected through connecting plate 11, transmitting motion to moving plate 12. A fixed rod 8 is fixedly connected to the rear side of support plate 2. The fixed rod 8 provides rotational support for rotating plate 29, ensuring that rotating plate 29 can rotate stably around it. Rotating plate 29 is rotatably connected to the outside of fixed rod 8. Rotating plate 29 cooperates with other components during equipment operation. During the process, it plays a role in transmission or adjustment of the direction of movement. A connecting plate 11 is fixedly connected to the front side of the moving plate 10. The connecting plate 11 connects the moving plate 10 and the moving plate 12 to ensure that the movement between the two can be transmitted synchronously. The moving plate 12 is fixedly connected to the front side of the connecting plate 11. The moving plate 12 moves under the drive of the moving plate 10. The fixed plate 13 on the top of the moving plate 12 is used to install the clamping assembly. The fixed plate 13 is fixedly connected to the top of the moving plate 12. The fixed plate 13 provides a fixed position for the clamping assembly to ensure that the clamping assembly remains stable during the operation of the equipment. The clamping assembly for fixing the wafer is fixedly connected to the top of the fixed plate 13. The clamping assembly is used to fix the wafer to ensure that the wafer does not move during the wafer dicing process, thus ensuring the accuracy and quality of dicing.
[0034] Reference Figure 2 and Figure 4 The clamping assembly includes a worktable 14, which provides a mounting base for other components of the clamping assembly and ensures that the entire clamping assembly is stable in the equipment. The bottom of the worktable 14 is fixedly connected to the top of the fixed plate 13. A cylinder 15 is fixedly connected to the inner wall of the worktable 14. The cylinder 15 provides power and drives the push plate 16 to move through the extension and retraction movement of the drive end.
[0035] A push plate 16 is fixedly connected to the drive end of the cylinder 15. The push plate 16 moves under the action of the cylinder 15, thereby driving the rotation shaft 17 to move. Two rotation shafts 17 are fixedly connected to the top of the push plate 16. The rotation shafts 17 move under the action of the push plate 16, converting the linear motion of the push plate 16 into the rotational motion of the rotation plate 18. Rotation plates 18 are fixedly connected to the outside of the two rotation shafts 17. The rotation plates 18 rotate under the action of the rotation shafts 17, changing their relative position to the fixed plate 18. Fixed plates 19 are rotatably connected to the opposite side of the two rotation plates 18. The fixed plates 19 cooperate with the rotation plates 18 and move under the action of the rotation plates 18 to apply clamping force to the wafer. A moving block 20 is fixedly connected to the front side of the fixed plate 19. The moving block 20 assists the movement of the fixed plate 19 or cooperates with other components during the clamping process to ensure the stability and accuracy of the clamping action.
[0036] Reference Figures 1 to 3 The other side of the rotating plate 2 9 is rotatably connected to the rear bottom of the rotating plate 1 7, serving to connect and transmit motion. Through this rotatable connection with the rotating plate 1 7, the rotating plate 1 7 can be adjusted according to its movement state, thereby coordinating the actions of other components and ensuring the smooth and orderly movement of the entire equipment. The inner wall of the rotating plate 1 7 has a slot 1, which serves multiple purposes: firstly, it reduces the weight of the rotating plate 1 7, lowering the overall weight load of the equipment; secondly, it provides space or channels for installing other components, facilitating equipment assembly and maintenance. The bottom of the movable plate 2 12 is slidably connected to the top of the support plate 2, responsible for transmitting motion and supporting subsequent components. Through its slidable connection with the support plate 2, it can slide smoothly along the top of the support plate 2 during equipment operation, ensuring the stability and straightness of the movable plate 2 12's movement. The outer side of the fixed plate 1 13 is slidably connected to the top of the outer shell 1, providing an installation base for the clamping assembly. The sliding connection with the outer casing 1 allows the fixing plate 13 to move stably within a certain range, thereby adjusting the position of the clamping assembly;
[0037] A guide plate 22 is slidably connected to the bottom of the push plate 16. The bottom of the guide plate 22 is fixedly connected to the inner wall of the worktable 14. A guide plate 21 is slidably connected to the bottom of the moving block 20. The bottom of the guide plate 21 is fixedly connected to the inner wall of the worktable 14. The push plate 16 moves linearly under the action of the cylinder 15. The guide plate 2 provides guidance for the push plate 16, ensuring that the push plate 16 always moves in the correct direction during movement. The guide plate 2, fixed to the inner wall of the worktable 14, ensures its own stability, thereby making the movement of the push plate 16 more accurate and reliable. Two horizontal plates are fixedly connected to the bottom of the cylinder 15. The cylinder 15 serves as a power source, providing power to the push plate 16. The two horizontal plates at the bottom can increase the installation stability of the cylinder 15, preventing the cylinder 15 from shaking or shifting during operation, thereby ensuring that the push plate 16 can obtain stable power output. The top of the worktable 14 has a slot 2, which provides an installation base for the various components of the clamping assembly. The top slot 2 has multiple uses, such as providing space for the installation of other components, or providing a channel for the entry, exit, or operation of the wafer during wafer clamping. A fixed block 23 is fixedly connected to the top of the movable block 20, and a clamp 24 is fixedly connected to the top of the fixed block 23. The movable block is connected to the clamp through the fixed block, transmitting its movement to the clamp. The fixed block serves to connect and transmit force, ensuring that the clamp can accurately follow the movement of the movable block.
[0038] Working Principle: When the semi-automatic wafer dicing machine moves its worktable 14 left and right, the motor 3 is started. The motor 3 drives the rotating rod 4 to rotate, which in turn rotates the rotating disk 5. This causes the rotating shaft 6 on the rotating disk 5 to rotate as well. The rotating shaft 6 rotates within the slot of the rotating plate 7, causing the rotating plate 7 to rotate. This, in turn, moves the moving plate 10. During the movement of the rotating plate 7, the second rotating plate 9 extends the distance of the rotating plate 7, while the fixed rod 8 provides a limit. The moving plate 10 is connected to the connecting plate 11, which moves accordingly. This causes the second moving plate 12 to rotate within the support plate 2, thereby moving the fixed plate 13 and the worktable 14. This achieves left and right movement of the worktable 14 and allows for flexible adjustment of the wafer position, facilitating precise dicing operations. This increases the ease of operation of the equipment and improves production efficiency.
[0039] Finally, it should be noted that the above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Although the present utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.
Claims
1. An improved semi-automatic wafer dicing machine, comprising a housing (1), characterized in that: A support plate (2) is fixedly connected to the inner wall of the outer shell (1). A motor (3) is fixedly connected to the front side of the support plate (2). A rotating rod (4) is fixedly connected to the drive end of the motor (3). A rotating disk (5) is fixedly connected to the rear side of the rotating rod (4). A rotating shaft (6) is fixedly connected to the rear side of the rotating disk (5). A rotating plate (7) is slidably connected to the outside of the rotating shaft (6). A moving plate (10) is fixedly connected to the top of the rotating plate (7). A fixing rod (8) is fixedly connected to the rear side of the support plate (2). A rotating plate (9) is rotatably connected to the outside of the fixing rod (8). A connecting plate (11) is fixedly connected to the front side of the moving plate (10). A moving plate (12) is fixedly connected to the front side of the connecting plate (11). A fixing plate (13) is fixedly connected to the top of the moving plate (12). A clamping assembly for fixing the wafer is fixedly connected to the top of the fixing plate (13).
2. The improved semi-automatic wafer dicing machine according to claim 1, characterized in that: The clamping assembly includes a worktable (14), the bottom of which is fixedly connected to the top of the fixed plate (13). A cylinder (15) is fixedly connected to the inner wall of the worktable (14). A push plate (16) is fixedly connected to the driving end of the cylinder (15). Two rotating shafts (17) are fixedly connected to the top of the push plate (16). Rotating plates (18) are fixedly connected to the outside of the two rotating shafts (17). Fixed plates (19) are rotatably connected to the opposite sides of the two rotating plates (18). A moving block (20) is fixedly connected to the front side of the fixed plate (19).
3. The improved semi-automatic wafer dicing machine according to claim 1, characterized in that: The other side of the rotating plate 2 (9) is rotatably connected to the bottom rear side of the rotating plate 1 (7), and the inner wall of the rotating plate 1 (7) is provided with a slot 1.
4. The improved semi-automatic wafer dicing machine according to claim 1, characterized in that: The bottom of the movable plate 2 (12) is slidably connected to the top of the support plate (2), and the outside of the fixed plate 1 (13) is slidably connected to the top of the outer shell (1).
5. An improved semi-automatic wafer dicing machine according to claim 2, characterized in that: The bottom of the push plate (16) is slidably connected to a guide plate (22), and the bottom of the guide plate (22) is fixedly connected to the inner wall of the workbench (14).
6. An improved semi-automatic wafer dicing machine according to claim 2, characterized in that: The bottom of the movable block (20) is slidably connected to a guide plate (21), and the bottom of the guide plate (21) is fixedly connected to the inner wall of the workbench (14).
7. An improved semi-automatic wafer dicing machine according to claim 2, characterized in that: The bottom of the cylinder (15) is fixedly connected to two horizontal plates, and the top of the workbench (14) is provided with a slot.
8. An improved semi-automatic wafer dicing machine according to claim 2, characterized in that: The top of the movable block (20) is fixedly connected to a fixed block (23), and the top of the fixed block (23) is fixedly connected to a clamp (24).