Electronic-grade polycrystalline silicon bagging device
By optimizing the structure and materials of the polysilicon bagging device and combining it with a filtration and blowing/suction system, the problem of fragments and dust generated by silicon block impact and friction was solved, thereby improving the purity of polysilicon and the success rate of downstream processes.
Patent Information
- Application Number
- CN202520032100.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-01-07
- Publication Date
- 2025-12-02
- Estimated Expiration
- 2035-01-07
AI Technical Summary
In the existing polysilicon bagging process, unreasonable mechanical device design leads to silicon block impact and friction, generating fragments and dust. In addition, improper equipment materials introduce metal impurities, affecting the purity of polysilicon and the success rate of downstream processes.
The system employs a combination design of unloading mechanism, feeding mechanism, blowing mechanism and suction mechanism. It uses filter plate and suction system to separate silicon material from impurities, and combines nitrogen or argon gas to blow away impurities and debris during the transmission process. Polyvinylidene fluoride material is used to reduce friction and an isolation layer is set to prevent contamination.
This effectively reduces debris and dust during transport, improves the purity and quality of polysilicon, and ensures the smooth operation of downstream processes.
Smart Images
Figure CN223618970U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of polycrystalline silicon production technology, and in particular to an electronic-grade polycrystalline silicon bagging device. Background Technology
[0002] Electronic-grade polysilicon is a crucial raw material for the production of high-end electronic devices and semiconductor materials. Its purity and processing quality directly affect the performance and reliability of downstream products. In the polysilicon production process, silicon rods taken from the reduction furnace undergo crushing, cleaning, drying, and bagging to ultimately form sturdy, block-shaped silicon material that meets requirements for use in downstream monocrystalline silicon pulling processes. The bagging process significantly impacts the purity and quality of the polysilicon, especially as avoiding the generation of fragments and dust during bagging and minimizing external contamination sources are essential for improving product quality.
[0003] In existing polysilicon bagging processes, mechanical or manual bagging methods are commonly used. Traditional mechanical devices, due to their flawed design, are prone to impacts and friction between silicon blocks during the sliding and bagging process, generating significant amounts of debris and dust. Inappropriate material selection can also introduce metallic impurities or contaminants, affecting the purity of the polysilicon. Furthermore, insufficient consideration is given to maintaining a clean environment during bagging; for example, the lack of a dust removal system allows dust and debris to be packaged along with the silicon material, negatively impacting the success rate of downstream monocrystalline silicon pulling processes. These problems result in low-quality polysilicon bagging, hindering product application performance and production efficiency.
[0004] Therefore, there is an urgent need for a higher-quality electronic-grade polysilicon bagging device. This device should improve the bagging quality and purity of electronic-grade polysilicon by reducing the generation of debris and dust through optimized structural design. Utility Model Content
[0005] In view of at least one of the above technical problems, the present invention provides an electronic-grade polycrystalline silicon bagging device, which improves the quality and purity of electronic-grade polycrystalline silicon by adopting an improved impurity removal structure.
[0006] According to a first aspect of the present invention, an electronic-grade polycrystalline silicon bagging device is provided, comprising:
[0007] The unloading mechanism includes a frame and a first material collection assembly fixedly connected to the frame. The first material collection assembly includes a first material collection box and a first filter plate fixed to the top of the first material collection box. A first air intake is also provided on the first material collection box.
[0008] The feeding mechanism includes a conveying component and a second collecting component. The conveying component includes a second filter plate connected to the first filter plate and a feeding plate connected to the other end of the second filter plate. The other end of the feeding plate is a discharge port. The second collecting component is disposed below the second filter plate and includes a second collecting box and a second air intake port opened on the second collecting box.
[0009] A surrounding plate is provided on the outer periphery where the first filter plate, the second filter plate and the feed plate are not connected;
[0010] The blowing mechanism is located above the second filter plate and includes a blower and a fan fixed on the enclosure plate;
[0011] The suction mechanism includes a suction duct and a suction fan connected to the first suction port and the second suction port.
[0012] In some embodiments of this utility model, the first collection box and the second collection box are hinged at the connection point, and the hinge point is covered with an isolation layer.
[0013] In some embodiments of this utility model, the unloading mechanism also has a lifting component, including a push rod fixedly connected to the bottom of the first collection box, and a motor that drives the push rod to rotate the first collection box, wherein the rotation angle of the first collection box is 0° to 45°.
[0014] In some embodiments of this utility model, the holes on the first filter plate and the second filter plate are square.
[0015] In some embodiments of this utility model, the holes on the first filter plate and the second filter plate are circular.
[0016] In some embodiments of this utility model, the materials of the enclosure plate, the first filter plate, the second filter plate and the feeding plate are polyvinylidene fluoride.
[0017] In some embodiments of this utility model, the first air intake and the second air intake are also equipped with filters.
[0018] In some embodiments of this utility model, the air volume of the blowing mechanism is 200-500 m² / h.
[0019] In some embodiments of this utility model, the gas inside the blowing mechanism is nitrogen or argon.
[0020] In some embodiments of this utility model, the discharge port is further provided with a support platform, on which a bag is placed, the bag opening is fitted onto the discharge port, and a latex layer is provided on the support platform.
[0021] The beneficial effects of this utility model are as follows: By cooperating with the unloading mechanism and the feeding mechanism, this utility model uses the first filter plate and the second filter plate to separate silicon material from impurities, effectively reducing impurities and debris generated by the impact and friction of silicon blocks during the transmission process, and reducing the carrying of impurities and debris on electronic-grade polysilicon; the suction ports set in the first collection box and the second collection box, combined with the suction pipe and the suction fan, can efficiently collect impurities and debris generated during the bagging process and prevent them from entering the packaging bag; the blowing mechanism blows towards the second filter plate, carrying away impurities and debris generated by collisions during the transmission process, thereby improving the quality and purity of electronic-grade polysilicon after bagging. Attached Figure Description
[0022] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0023] Figure 1 This is a schematic diagram of the electronic-grade polycrystalline silicon bagging device in an embodiment of this utility model;
[0024] Figure 2 This is a schematic diagram of the unloading mechanism and the conveying mechanism in the electronic-grade polycrystalline silicon bagging device in this embodiment of the present invention;
[0025] Figure 3 This is a schematic diagram of the structure of the first filter plate and the second filter plate in the electronic-grade polycrystalline silicon bagging device in this embodiment of the present invention;
[0026] Figure 4 This is a schematic diagram of the structure of the first material collection component and the second material collection component in the electronic-grade polycrystalline silicon bagging device in this embodiment of the present invention;
[0027] Figure 5 This is a schematic diagram of the internal structure of the first and second material collection components in the electronic-grade polycrystalline silicon bagging device in this embodiment of the present invention.
[0028] Figure 6 This is a schematic diagram of the structure of the lifting component in the electronic-grade polycrystalline silicon bagging device in this embodiment of the present invention when it is pushed to the highest position.
[0029] Reference numerals: 1. Unloading mechanism; 11. Frame; 12. First collection assembly; 12a. First collection box; 12b. First filter plate; 12c. First air intake; 13. Isolation layer; 14. Lifting assembly; 14a. Push rod; 2. Discharge mechanism; 21. Conveying assembly; 21a. Second filter plate; 21b. Discharge plate; 21c. Discharge port; 22. Second collection assembly; 22a. Second collection box; 22b. Second air intake; 23. Filter screen; 24. Supporting platform; 3. Enclosure; 4. Blowing mechanism; 41. Blower; 5. Suction mechanism; 51. Suction pipe. Detailed Implementation
[0030] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present utility model. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments.
[0031] It should be noted that when an element is referred to as being "fixed to" another element, it can be directly attached to the other element or there may be an intervening element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or there may be an intervening element. The terms "vertical," "horizontal," "left," "right," and similar expressions used herein are for illustrative purposes only and do not represent the only possible implementation.
[0032] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. The terminology used in this specification is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.
[0033] like Figures 1 to 6 The electronic-grade polysilicon bagging apparatus shown includes:
[0034] The unloading mechanism 1 includes a frame 11 and a first collecting assembly 12 fixedly connected to the frame 11. The first collecting assembly 12 includes a first collecting box 12a and a first filter plate 12b fixed to the top of the first collecting box 12a. A first suction port 12c is also provided on the first collecting box 12a. It should be noted that the first collecting box 12a can be placed horizontally, tilted, or rotated at multiple angles by power.
[0035] The feeding mechanism 2 includes a conveying component 21 and a second collecting component 22. The conveying component 21 includes a second filter plate 21a connected to the first filter plate 12b, and a feeding plate 21b connected to the other end of the second filter plate 21a. The other end of the feeding plate 21b is a discharge port 21c. The second collecting component 22 is located below the second filter plate 21a and includes a second collecting box 22a and a second suction port 22b opened on the second collecting box 22a.
[0036] The enclosure 3 is disposed on the outer periphery of the first filter plate 12b, the second filter plate 21a, and the feed plate 21b, where they are not connected. The enclosure 3 serves to guide the electronic-grade polysilicon passing through the first collection box 12a and the second collection box 22a.
[0037] The blowing mechanism 4 is located above the second filter plate 21a and includes a blower 41 fixed to the surrounding plate 3 and a fan. The blowing mechanism 4 is used to reduce impurities and debris on the polycrystalline silicon, thereby improving the overall purity of the polycrystalline silicon.
[0038] The suction mechanism 5 includes a suction duct 51 connected to the first suction port 12c and the second suction port 22b, and a suction fan. The suction mechanism 5 absorbs airflow, making it easy to collect impurities and debris, preventing them from scattering outside.
[0039] like Figure 1 As shown, the process of electronic-grade polysilicon from unloading to bagging includes the following steps: First, the produced electronic-grade polysilicon is placed into the first collection box 12a of the unloading mechanism 1 via a conveying device or manually. After entering the first collection box 12a, large pieces of silicon fall onto the first filter plate 12b, while smaller fragments and dust are promptly sucked away by the suction pipe 51 connected to the first suction port 12c and the suction fan, thus completing the initial separation and cleaning of the silicon. Next, the silicon is transferred from the first filter plate 12b to the second filter plate 21a of the feeding mechanism 2. The second filter plate 21a, in cooperation with the blowing mechanism 4, further removes fine fragments and dust generated on the surface of the silicon due to collision or friction. The cleaned silicon slides down the feeding plate 21b on the second filter plate 21a. The outlet 21c of the feeding plate 21b is connected to the packaging bag, and the silicon slides smoothly into the packaging bag through the feeding plate 21b.
[0040] This invention utilizes the cooperation of the unloading mechanism 1 and the feeding mechanism 2, along with the first filter plate 12b and the second filter plate 21a, to separate silicon material from impurities. This effectively reduces impurities and debris generated by the impact and friction of silicon blocks during transport, thus reducing the amount of impurities and debris carried on electronic-grade polysilicon. The suction ports of the first collection box 12a and the second collection box 22a, combined with the suction pipe 51 and the suction fan, can efficiently collect impurities and debris generated during the bagging process, preventing them from entering the packaging bag. The blowing mechanism 4 blows the material towards the second filter plate 21a, carrying away impurities and debris generated by collisions during transport, thereby improving the quality and purity of the electronic-grade polysilicon after bagging.
[0041] like Figure 5 As shown, to prevent impurities from scattering at the connection between the first collection box 12a and the second collection box 22a, and to ensure that the connection does not affect the purity of the polysilicon, the connection between the first collection box 12a and the second collection box 22a is hinged, and the hinge is covered with an isolation layer 13. This effectively prevents the leakage of fragments or dust from the silicon material during transmission due to gaps at the connection. At the same time, the isolation layer 13 prevents external contaminants from entering the device through the connection and causing secondary contamination of the silicon material.
[0042] like Figure 1 , Figure 6 As shown, the unloading mechanism 1 also has a lifting assembly 14, including a push rod 14a fixedly connected to the bottom of the first collection box 12a, and a motor that drives the push rod 14a to rotate the first collection box 12a. The rotation angle of the first collection box 12a is 0° to 45°. By setting the lifting assembly 14, the tilt angle of the first collection box 12a can be flexibly adjusted according to the loading of silicon material and the transmission requirements, ensuring that the silicon material can smoothly slide down to the unloading mechanism 2, avoiding the silicon material from being piled up or stuck, which would affect the transmission efficiency. The design of this lifting assembly 14 can reduce the impact and friction of the silicon material, thereby further reducing the generation of broken material and dust.
[0043] In some embodiments of this invention, the holes on the first filter plate 12b and the second filter plate 21a are square. This effectively separates silicon material from debris. The optimized hole size ensures that larger silicon blocks can pass through smoothly while blocking fine debris and dust, preventing them from entering subsequent conveying and bagging stages, thereby improving the purity of the silicon material. The square hole structure is simple in design, uniformly distributed, has good strength and filtration effect, and is not easily deformed or clogged, further improving the durability and filtration efficiency of the filter plate. It should be noted that the side length of the square can be 1mm, or it can be set according to the diameter of the impurities to be filtered as needed.
[0044] Similar to the above-mentioned design, the holes on the first filter plate 12b and the second filter plate 21a are circular. This serves the same purpose as the square hole design described above, ensuring a more uniform mechanical structure between the first filter plate 12b and the second filter plate 21a, reducing the likelihood of deformation or clogging. It should be noted that the diameter of the circle can be 1mm, or it can be set according to the diameter of the impurities to be filtered.
[0045] To reduce debris generated by friction during polycrystalline silicon transport, in some embodiments of this invention, the enclosure plate 3, the first filter plate 12b, the second filter plate 21a, and the feed plate 21b are made of polyvinylidene fluoride (PVDF). PVDF possesses excellent corrosion resistance and high-temperature resistance, effectively resisting the erosion of external chemicals during device operation, ensuring the stability and durability of the device. Furthermore, the smooth surface and low coefficient of friction of PVDF reduce friction and impact on the silicon material during transport, further reducing debris and dust generation, while preventing contamination of the silicon material due to material wear or shedding, thereby improving the purity and quality of electronic-grade polycrystalline silicon.
[0046] refer to Figure 4 , Figure 5 As shown, the first air intake 12c and the second air intake 22b are also equipped with filters 23. These filters can effectively intercept larger debris and dust particles during the air intake process, preventing them from entering the air intake duct 51 and the air intake fan, thus avoiding a decrease in equipment operating efficiency or malfunction due to dust accumulation or blockage.
[0047] To improve the removal of impurities and debris from the polycrystalline silicon surface, in some embodiments of this invention, the airflow of the blowing mechanism 4 is 200-500 m² / h. The airflow rate set in this invention provides sufficient airflow intensity during transmission to promptly blow away debris and dust generated on the silicon surface due to collisions or friction, ensuring the purity of the silicon material before entering the bagging stage. Simultaneously, this airflow range is optimized to ensure effective removal of debris and dust while avoiding silicon material displacement or unnecessary loss due to excessive airflow, thereby improving the stability of the device operation and the efficiency of silicon material transmission, ultimately improving the bagging quality and product purity of electronic-grade polycrystalline silicon.
[0048] To achieve higher purity on the polycrystalline silicon surface, in some embodiments of this invention, the gas inside the blowing mechanism 4 is nitrogen or argon. Using nitrogen or argon as the gas medium inside the blowing mechanism 4 effectively prevents the silicon material from contacting oxygen or moisture in the air during transport and bagging, thereby preventing oxidation or moisture absorption on the silicon surface and forming a protective film to ensure the purity and quality of electronic-grade polycrystalline silicon. Simultaneously, nitrogen and argon, as inert gases, do not introduce impurities or contaminants, further improving the chemical stability of the silicon material.
[0049] like Figure 1 As shown, the outlet 21c also has a support platform 24, on which the bag is placed, with the bag opening fitted over the outlet 21c. A latex layer is provided on the support platform 24. By covering the surface with a latex layer, the impact force during bagging of the silicon material can be effectively buffered, reducing direct impact between the silicon material and the bottom of the bag, thereby reducing the generation of fragments and dust. At the same time, the latex layer has good anti-slip properties, which can stably fix the bag, preventing spillage and contamination caused by bag slippage or tilting during bagging, thus improving bagging efficiency and quality.
[0050] Those skilled in the art should understand that this utility model is not limited to the above embodiments. The embodiments and descriptions in the specification are merely illustrative of the principles of this utility model. Various changes and modifications can be made to this utility model without departing from its spirit and scope, and all such changes and modifications fall within the scope of the claimed utility model. The scope of protection of this utility model is defined by the appended claims and their equivalents.
Claims
1. A bagging device for electronic-grade polycrystalline silicon, characterized in that, include: The unloading mechanism includes a frame and a first material collection assembly fixedly connected to the frame. The first material collection assembly includes a first material collection box and a first filter plate fixed to the top of the first material collection box. A first air intake is also provided on the first material collection box. The feeding mechanism includes a conveying component and a second collecting component. The conveying component includes a second filter plate connected to the first filter plate and a feeding plate connected to the other end of the second filter plate. The other end of the feeding plate is a discharge port. The second collecting component is disposed below the second filter plate and includes a second collecting box and a second air intake port opened on the second collecting box. A surrounding plate is provided on the outer periphery where the first filter plate, the second filter plate and the feed plate are not connected; The blowing mechanism is located above the second filter plate and includes a blower and a fan fixed on the enclosure plate; The suction mechanism includes a suction duct and a suction fan connected to the first suction port and the second suction port.
2. The electronic-grade polycrystalline silicon bagging device according to claim 1, characterized in that, The first collection box and the second collection box are hinged at the connection point, and the hinge point is covered with an isolation layer.
3. The electronic-grade polycrystalline silicon bagging device according to claim 2, characterized in that, The unloading mechanism also has a lifting assembly, including a push rod fixedly connected to the bottom of the first collection box, and a motor that drives the push rod to rotate the first collection box, wherein the rotation angle of the first collection box is 0° to 45°.
4. The electronic-grade polycrystalline silicon bagging device according to claim 1, characterized in that, The holes on the first and second filter plates are square.
5. The electronic-grade polycrystalline silicon bagging device according to claim 1, characterized in that, The holes on the first and second filter plates are circular.
6. The electronic-grade polycrystalline silicon bagging device according to claim 1, characterized in that, The enclosure, the first filter plate, the second filter plate, and the feed plate are all made of polyvinylidene fluoride.
7. The electronic-grade polycrystalline silicon bagging device according to claim 1, characterized in that, Both the first and second air intakes are equipped with filters.
8. The electronic-grade polycrystalline silicon bagging device according to claim 1, characterized in that, The air volume of the blowing mechanism is 200-500㎡ / h.
9. The electronic-grade polycrystalline silicon bagging device according to claim 1, characterized in that, The gas inside the blowing mechanism is nitrogen or argon.
10. The electronic-grade polycrystalline silicon bagging device according to claim 1, characterized in that, The discharge port also has a support platform, on which the bag is placed, with the bag opening fitted over the discharge port, and a latex layer is provided on the support platform.