Wafer drying device

Abstract

The utility model discloses a wafer drying device, comprising a rotating table which comprises a carrying table and a driving part; the driving part is connected with the bottom of the carrying table; the driving part is used for driving the carrying table to rotate around the center of the carrying table on the plane where the carrying table is located; the carrying table drives the wafer to rotate along with the carrying table, so that water on the surface of the wafer is separated from the surface of the wafer under the action of centrifugal force; and the water retaining cover is arranged around the rotating table and is used for blocking water thrown out by high-speed rotation. According to the wafer drying device provided by the utility model, the wafer is driven to rotate by virtue of the rotating table, and water on the surface of the wafer is spin-dried by virtue of centrifugal force of high-speed rotation, so that the wafer is fully dried, the drying efficiency is remarkably improved, and meanwhile, the problem of impurity residues is solved.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor processing equipment technology, and in particular to a wafer drying device. Background Technology

[0002] During semiconductor manufacturing, wafers may have water stains on their surface after certain testing processes. In such cases, thorough drying is necessary to ensure the wafers are clean and will not affect subsequent processes. Existing wafer drying equipment typically involves placing an entire wafer cassette into a drying chamber for continuous drying over a long period. This method is not only inefficient but also prone to problems such as incomplete drying and impurity residue. Utility Model Content

[0003] The purpose of this invention is to provide a wafer drying device that can fully dry wafers and improve drying efficiency.

[0004] To achieve the above objectives, this utility model is implemented through the following technical solution:

[0005] A wafer drying apparatus includes: a rotating stage, the rotating stage including a platform and a drive unit; the drive unit is connected to the bottom of the platform; the drive unit is used to drive the platform to rotate about its center in its plane; the platform drives the wafer to rotate with it, so that water on the surface of the wafer is separated from the surface of the wafer under the action of centrifugal force; and a water baffle, which is arranged around the rotating stage to block water thrown out by high-speed rotation.

[0006] Optionally, it further includes: a support platform, the support platform including a support frame and a table surface disposed on the support frame; the platform is located above the table surface, the drive unit is disposed through the table surface; and the water baffle is disposed on the table surface.

[0007] Optionally, the driving unit includes a rotating part and a lifting platform. The rotating part is used to drive the platform to rotate. The lifting platform is used to lift the platform carrying the wafer, so that it can move up and down between a lower working position and a higher loading position. When it is in the working position, the height of the plane on which the wafer is located is lower than the upper edge of the water shield. When it is in the loading position, the height of the plane on which the wafer is located is higher than the upper edge of the water shield.

[0008] Optionally, the stage further includes an adsorption device for providing negative pressure between the back side of the wafer and the bearing surface of the stage, so that the back side of the wafer can be adsorbed and fixed onto the bearing surface.

[0009] Optionally, it also includes a blowing device, disposed above the rotating stage, for blowing air onto the upper surface of the wafer.

[0010] Optionally, it also includes a heating device disposed on the blower and / or the rotating table to accelerate the evaporation of residual moisture.

[0011] Optionally, it further includes: a wafer transfer device for transferring the wafer from other equipment to the rotary table; or, transferring the wafer from the rotary table to other equipment.

[0012] Optionally, it also includes a control unit for controlling the start and stop of the rotary table, blowing device, heating device or adsorption device.

[0013] Optionally, the rotation speed of the rotary table is not less than 1800 revolutions per minute.

[0014] Optionally, the water-blocking cover includes an outer cover and an inner cover, with a receiving groove formed between the outer cover and the inner cover. The lower part of the outer cover of the water-blocking cover tapers inward to form an upward slope, which is used to cooperate with the receiving groove to collect water blocked by the water-blocking cover. A drain outlet is provided at the bottom of the receiving groove to discharge the water collected by the water-blocking cover.

[0015] This utility model has the following technical effects:

[0016] The wafer drying device provided by this utility model uses a rotating table to drive the wafer to rotate, and uses the centrifugal force of high-speed rotation to shake off the water on the surface of the wafer, so that the wafer is fully dried, which significantly improves the drying efficiency and solves the problem of impurity residue.

[0017] The support platform is designed to both support the wafer drying apparatus and facilitate its movement. The fixed chuck is used to limit the wafer's edge, ensuring the wafer's center is centered on the rotary table. The air blowing device blows air onto the upper surface of the wafer to accelerate the drying process. The heating device raises the wafer's temperature to further accelerate the drying process. Attached Figure Description

[0018] Figure 1 This is a three-dimensional structural schematic diagram of a wafer drying apparatus provided in an embodiment of the present invention;

[0019] Figure 2 This is a longitudinal cross-sectional structural diagram of a wafer drying apparatus provided in an embodiment of the present invention. Detailed Implementation

[0020] The wafer drying apparatus proposed in this utility model will be further described in detail below with reference to the accompanying drawings and specific embodiments. The advantages and features of this utility model will become clearer from the following description. It should be noted that the drawings are in a very simplified form and use non-precise proportions, only for the purpose of conveniently and clearly illustrating the embodiments of this utility model. Please refer to the drawings to make the purpose, features, and advantages of this utility model more apparent and understandable. It should be understood that the structures, proportions, sizes, etc., depicted in the accompanying drawings are only for the purpose of assisting those skilled in the art in understanding and reading the content disclosed in the specification, and are not intended to limit the implementation conditions of this utility model. Therefore, they have no substantial technical significance. Any modifications to the structure, changes in proportions, or adjustments to the size, without affecting the effects and objectives achieved by this utility model, should still fall within the scope of the technical content disclosed in this utility model.

[0021] Combination Figure 1 and Figure 2 As shown, this embodiment provides a wafer drying apparatus, including: a rotating stage 20, which includes a platform 201 and a driving unit 21; the driving unit 21 is connected to the bottom of the platform 201; the driving unit 21 is used to drive the platform 201 to rotate around its center in its plane. The platform 201 is used to carry a wafer W and drive the wafer W to rotate with it, so that water on the surface of the wafer W is separated from the surface of the wafer W under the action of centrifugal force; a water baffle 30 is arranged around the rotating stage 20 to block water thrown out by high-speed rotation.

[0022] The wafer drying apparatus provided in this embodiment uses a rotary table to drive the wafer to rotate. The centrifugal force of the high-speed rotation is used to spin the water off the surface of the wafer. The process of spinning the water also carries away the impurities mixed in with the water, and the wafer can be fully dried, which significantly improves the drying efficiency and solves the problem of impurity residue.

[0023] Please continue to refer to this. Figure 1 or Figure 2 As shown, it also includes: a support platform 10, which includes a support frame 103 and a table surface 101 disposed on the support frame 103; a carrier 201 located above the table surface 101, and a drive unit 21 disposed through the table surface 101; and a water baffle 30 disposed on the table surface 101. The support platform not only supports the wafer drying device but also facilitates its movement.

[0024] The support platform 10 also includes drive wheels 102, which are mounted on the legs of the support frame 103 to facilitate the movement of the wafer drying device.

[0025] Please continue to refer to this. Figure 2As shown, in this embodiment, the driving unit 21 includes a rotating unit 203 and a lifting platform 204. The rotating unit 203 is used to drive the platform 201 to rotate. The lifting platform 204 is used to lift the platform 201 carrying the wafer W, so that it can move up and down between a lower working position and a higher loading position. When it is in the working position, the height of the plane where the wafer W is located is lower than the upper edge of the water shield 30. When it is in the loading position, the height of the plane where the wafer W is located is higher than the upper edge of the water shield 302.

[0026] Please continue to refer to this. Figure 2 As shown, the rotating part 203 includes a rotating shaft housing part 202 and a rotating shaft part disposed in the rotating shaft housing part 202. It can be understood that a bearing is provided in the rotating shaft housing part 202, and the rotating shaft part is disposed through the bearing to realize rotation.

[0027] The lifting platform 204 is a motor, which is located below the rotating part 203. The output shaft of the motor is connected to the bottom end of the rotating shaft housing part 202. It is used to drive the driving part 21 and the stage 201 to move in the vertical direction, thereby realizing the wafer W in the working position or loading position.

[0028] Additionally, in this embodiment, the stage 201 further includes a fixing chuck (not shown in the figure), disposed at the edge of the stage 201, for guiding and limiting the edge of the wafer W so that the wafer W is coaxially disposed with the stage 201. The fixing chuck is used to limit the edge of the wafer W to ensure that the wafer W is concentrically disposed with the stage 201.

[0029] Please continue to refer to this. Figure 2 As shown, in this embodiment, the stage 201 further includes an adsorption device 50, used to provide negative pressure between the back side of the wafer W and the bearing surface of the stage 201, so that the back side of the wafer W can be adsorbed and fixed onto the bearing surface. This is used to prevent the wafer W from flying off during rotation.

[0030] Preferably, the adsorption device 50 includes a gas channel and a vacuum pump. The gas channel is formed by the hollow interior of the rotating shaft. A plurality of gas through holes communicating with the gas channel are distributed on the bearing surface of the stage 201. The vacuum pump provides adsorption force to the back side of the wafer W through the gas channel and the gas through holes, thereby adsorbing and fixing the wafer W on the stage 201.

[0031] In this embodiment, please continue to refer to Figure 1 As shown, it also includes a blower 40, which is disposed above the rotary table 20, for blowing air onto the upper surface of the wafer W.

[0032] In this embodiment, the blowing device 40 includes a support 401 disposed on the table 101; and an air knife 402 with an air outlet, which is elongated and disposed on the support 401 and suspended above the rotating table, for blowing air onto the surface of the wafer W. The blowing device 40 is used to blow air onto the surface of the wafer W to accelerate the drying process.

[0033] It is understood that the air knife 402 has a long slit on one side facing the surface of the wafer W as an air outlet, and an air inlet on one side for air to be introduced into the air knife 402.

[0034] In this embodiment, a heating device is also included, disposed on the blower and / or the rotating table, to accelerate the evaporation of residual moisture.

[0035] For example, the heating device is an electric heating device, wherein the heater is disposed in the stage 201 to slightly increase the temperature of the wafer W in order to improve the wafer drying efficiency.

[0036] Alternatively, for example, the heating device is disposed inside the air knife 402 to heat the gas inside the air knife 402, thereby blowing hot air onto the surface of the wafer, thus slightly raising its temperature and further improving the wafer drying efficiency.

[0037] In this embodiment, the device further includes a wafer transfer device (not shown in the figure) for transferring the wafer W from other equipment to the rotary table 20; or, transferring the wafer W from the rotary table 20 to other equipment (e.g., semiconductor processing equipment for subsequent wafer processing). Specifically, the wafer transfer device is preferably a suction cup or other device specifically designed for wafers, such as an adsorption device or gripping device.

[0038] In this embodiment, a control unit (not shown in the figure) is also included to control the start and stop of the rotary table 20, the blowing device 40, the heating device or the adsorption device 50.

[0039] Those skilled in the art should understand that for the same wafer drying apparatus, the required drying time is generally similar when drying wafers in a certain state. Therefore, the drying time in this embodiment is controlled by the control unit. In other complex scenarios, the control unit can use a vision sensor to acquire images of the wafer surface to further distinguish whether the wafer has been dried, thereby more efficiently controlling the start and stop of the rotary table 20, the blowing device 40, the heating device, or the adsorption device 50.

[0040] In this embodiment, the rotation speed of the rotary table is not less than 1800 revolutions per minute; otherwise, the drying process may not be able to be achieved normally. Preferably, in this embodiment, the rotation speed of the rotary table is greater than or equal to 2400 revolutions per minute.

[0041] In this embodiment, the water-blocking cover 30 includes an outer cover 301 and an inner cover 302, with a receiving groove 304 formed between the outer cover 301 and the inner cover 302. The lower part of the outer cover 301 of the water-blocking cover 30 tapers inward to form an upward inclined surface 303, which is used to cooperate with the receiving groove 304 to collect water blocked by the water-blocking cover 30. A drain outlet 305 is provided at the bottom of the receiving groove 304 to discharge the water collected by the water-blocking cover 30.

[0042] In summary, the wafer drying apparatus provided in this embodiment uses a rotary table to drive the wafer to rotate, and uses the centrifugal force of high-speed rotation to spin off the water on the surface of the wafer, so that the wafer is fully dried, which significantly improves the drying efficiency and solves the problem of impurity residue.

[0043] The support platform not only supports the wafer drying device but also facilitates its movement. The fixed chuck guides and limits the wafer edges to ensure the wafer's center is centered on the rotary table. The air blowing device blows air onto the upper surface of the wafer to accelerate the drying process. The heating device slightly raises the temperature of the wafer to accelerate the evaporation of residual moisture, thereby speeding up the drying process and improving drying efficiency.

[0044] It should be noted that, in this document, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Unless otherwise specified, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0045] In the description of this utility model, it should be understood that the terms "center," "height," "thickness," "upper," "lower," "vertical," "horizontal," "top," "bottom," "inner," "outer," "axial," "radial," and "circumferential," etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the accompanying drawings and are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. In the description of this utility model, unless otherwise stated, "a plurality of" means two or more.

[0046] In the description of this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," "joining," and "fixing" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0047] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0048] Although the present invention has been described in detail through the above preferred embodiments, it should be understood that the above description should not be considered as a limitation of the present invention. Various modifications and substitutions to the present invention will be apparent to those skilled in the art after reading the above content. Therefore, the scope of protection of the present invention should be defined by the appended claims.

Claims

1. A wafer drying apparatus, characterized in that, include: A rotating stage, comprising a stage and a drive unit; the drive unit is connected to the bottom of the stage; the drive unit is used to drive the stage to rotate about its center in its plane; the stage drives the wafer to rotate with it, so that water on the surface of the wafer is separated from the surface of the wafer under the action of centrifugal force; A water shield is installed around the rotating platform to block water that is thrown out by the high-speed rotation.

2. The wafer drying apparatus as described in claim 1, characterized in that, Also includes: A support platform, the support platform including a support frame and a table surface disposed on the support frame; The platform is located above the table surface, and the drive unit is disposed through the table surface; The water-blocking cover is installed on the platform.

3. The wafer drying apparatus as described in claim 1, characterized in that, The drive unit includes a rotating part and a lifting platform, and the rotating part is used to drive the platform to rotate. The lifting platform is used to lift and lower the carrier platform that carries the wafer, enabling it to move between a lower working position and a higher loading position. When in the working position, the height of the plane on which the wafer is located is lower than the upper edge of the water shield, and when in the loading position, the height of the plane on which the wafer is located is higher than the upper edge of the water shield.

4. The wafer drying apparatus as described in claim 1, characterized in that, The stage further includes an adsorption device for providing negative pressure between the back side of the wafer and the bearing surface of the stage, so that the back side of the wafer can be adsorbed and fixed onto the bearing surface.

5. The wafer drying apparatus as described in claim 1, characterized in that, It also includes a blower device, which is located above the rotating table, for blowing air onto the upper surface of the wafer.

6. The wafer drying apparatus as described in claim 5, characterized in that, Also includes: A heating device is provided on the blower and / or the rotating table to accelerate the evaporation of residual moisture.

7. The wafer drying apparatus as described in claim 1, characterized in that, Also includes: A wafer transfer device for transferring the wafer from other equipment to the rotary table; or, transferring the wafer from the rotary table to other equipment.

8. The wafer drying apparatus as described in claim 1, characterized in that, Also includes: The control unit is used to control the start and stop of the rotary table, blowing device, heating device or adsorption device.

9. The wafer drying apparatus as described in claim 1, characterized in that, The rotational speed of the rotary table is not less than 1800 revolutions per minute.

10. The wafer drying apparatus as described in claim 1, characterized in that, The water-blocking cover includes an outer cover and an inner cover, with a receiving groove formed between the outer cover and the inner cover. The lower part of the outer cover of the water-blocking cover tapers inward to form an upward slope, which is used to cooperate with the receiving groove to collect water blocked by the water-blocking cover. A drain outlet is located at the bottom of the receiving tank to drain the water collected by the water-blocking cover.

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