Anti-stress microneedle module and probe

Abstract

An anti-stress microneedle module comprises a test seat and probes arranged in the test seat. The probe comprises an elastic connecting section, and a first contact part and a second contact part which are respectively positioned at two ends of the connecting section; the first contact part is used for being in contact with a test circuit board, the second contact part is used for being in contact with a to-be-tested circuit board, and the connecting section comprises a winding-shaped single spring structure formed by alternately connecting straight line parts and bent parts along the length direction of the connecting section; the width of the bent part is larger than that of the linear part, and the width of the section, close to the linear part, of the bent part is gradually decreased till the bent part is smoothly connected with the linear part. According to the utility model, the stress resistance of the probe of the microneedle module is improved, and the service life of the probe is prolonged.

Description

Technical Field

[0001] This utility model relates to circuit board testing devices, and more particularly to board-to-board connection testing devices that use a probe structure for contact conduction. Background Technology

[0002] In the manufacturing or repair of electronic products such as mobile phones, when it is necessary to test the conductivity or electrical performance of electronic components such as the motherboard, a micro-needle test module (or socket) composed of multiple elastic probes (also called springs) is generally used in conjunction with other components to form a test device for the corresponding tests. CN205941605U discloses a contact conductive structure, in which the conductive element 12 is an elastic probe. Figure 1 The probe includes a central, elastically bent connecting segment 123 and a first contact portion 121 and a second contact portion 122 located at both ends of the connecting segment. The connecting segment is a meandering shape consisting of two parallel springs with alternating straight and curved portions along its length (Z-direction), capable of expansion and contraction along the Z-direction. In this type of probe, the straight and curved portions of the connecting segment have the same width. During use, the elastic portion of the probe is repeatedly pressed, causing stress concentration and making the curved portions of the connecting segment prone to breakage, thus affecting the probe's service life. Summary of the Invention

[0003] This invention addresses the problem of probe breakage in existing microneedle modules by proposing a stress-resistant microneedle module, comprising a test base and probes arranged within the test base. Each probe includes an elastic connecting section and a first contact portion and a second contact portion located at both ends of the connecting section. The first contact portion is used to contact a test circuit board, and the second contact portion is used to contact the device under test. Specifically, the connecting section comprises a meandering single-spring structure with alternating straight and curved portions along its length. The width of the curved portion is greater than the width of the straight portion, and the width of the curved portion gradually decreases towards the straight portion until it smoothly connects with the straight portion.

[0004] Furthermore,

[0005] The probe is provided with at least one overpressure protection limiting point; the overpressure protection limiting point is a protrusion that is provided on the outer edge surface of the connecting segment, or / and the outer edge surface of the connection between the first contact part and the connecting segment, and is higher than its outer edge surface.

[0006] The curved portion is arc-shaped.

[0007] The distance between the two ends of the arc is greater than the distance between the two straight sections connected by the curved section.

[0008] The probes are arranged symmetrically in two groups along the width direction within the test holder; the first contact parts of the two groups of probes are evenly arranged near the center line of the left and right symmetry axis, close to each other; if the first contact part and the second contact part of one group of probes are located on the same side of its own width direction, then the first contact part and the second contact part of the other group of probes are located on the left and right sides of its own width direction.

[0009] This invention also proposes a probe, which includes an elastic connecting segment and a first contact portion and a second contact portion located at both ends of the connecting segment. The first contact portion is used to contact a test circuit board, and the second contact portion is used to contact a circuit board under test. In particular, the connecting segment includes a meandering single spring structure in which straight and curved portions are alternately connected along the length of the connecting segment; the width of the curved portion is greater than the width of the straight portion, and the width of the curved portion gradually decreases to smoothly connect with the straight portion at a point near the straight portion.

[0010] Furthermore,

[0011] The probe is provided with at least one overpressure protection limit point.

[0012] The overpressure protection limiting point is set at the connection between the first contact portion of the probe and the connecting segment, and / or on the connecting segment near the first contact portion.

[0013] The curved portion is arc-shaped.

[0014] The distance between the two ends of the arc is greater than the distance between the two straight sections connected by the curved section.

[0015] The overpressure protection limiting point is a protrusion that is set on the outer edge of the connecting section, or / and the outer edge of the connection between the first contact part and the connecting section, and is higher than its outer edge.

[0016] Compared with the prior art, the beneficial effects of this utility model are: widening the width of the probe bending part, and the width of the bending part gradually changes to smoothly connect with the straight part, which can avoid stress concentration, improve the stress resistance of the probe of the micro needle module, and improve the service life of the probe, with more than 100,000 uses.

[0017] The probe's left-right pin structure allows the distance between the first contact pins of the two sets of probes arranged on the left and right to be less than or equal to 0.25mm. This makes it more suitable for test circuit boards with small pad spacing. Attached Figure Description

[0018] Figure 1 A schematic diagram of the structure of the probe 12 that contacts a conductive structure in the prior art;

[0019] Figure 2 A cross-sectional axonometric projection schematic diagram of the microneedle module in this preferred embodiment;

[0020] Figure 3 Axonometric projection schematic diagram of the separated state of each component of the microneedle module in this preferred embodiment;

[0021] Figure 4 A schematic diagram of the probe structure in this preferred embodiment;

[0022] Figure 5 A cross-sectional orthographic projection schematic diagram of the microneedle module in this preferred embodiment 2;

[0023] Figure 6 Axonometric projection schematic diagram of the separated components of the microneedle module in this preferred embodiment 2.

[0024] Labeling instructions: 1 probe, 11 first contact part, 13 second contact part, 14 connecting section, 141 straight part of connecting section, 142 bent part of connecting section, 101 left probe, 102 right probe, 2 test seat, 22 glue core, 23 base, 24 needle groove plate, 25 limiting plate, 26 floating plate, 27 glue core bottom frame, 5 overpressure protection limit point, 7 test piece. Detailed Implementation

[0025] The preferred embodiments of this utility model will now be described in detail with reference to the accompanying drawings.

[0026] Example 1, see Figures 2 to 3 A stress-resistant microneedle module includes a test socket 2 and probes 1 arranged within the test socket; see also Figure 2 The test base 2 includes a core 22, a base 23, a needle groove plate 24, and a limiting plate 25. The core 2 is installed in the base 23, the needle groove plate 24 is installed on the base 23 by a spring, and the limiting plate 25 is set on the needle groove plate 24. The test piece 7 is limited in the corresponding slot of the limiting plate 25. The probes 1 are arranged in an orderly manner in the core 22, and the first contact part 11 and the second contact part 13 of the probes extend out of the base 23 and the needle groove plate 24, respectively, for electrical connection with the test piece 7 and the measuring device.

[0027] See Figure 4The probe's width direction is taken as the X-axis, and its length direction as the Y-axis. The first contact portion 11 and the second contact portion 13 of the probe 1 are located at the two ends of the elastic connecting segment 14 along its length direction (Y direction). The connecting segment 14 is a meandering single spring structure consisting of a straight portion 141 and a curved portion 142 alternately connected along the Y direction, capable of expansion and contraction along the Y direction. The straight and curved portions of the connecting segment are designed with unequal widths: where the stress is high, the spring width is widened, meaning that the width W0 of the curved portion 110, which bears greater stress, is greater than the width W1 of the straight portion 141, which bears less stress, and the width of the curved portion gradually decreases towards the straight portion until it smoothly connects with the straight portion. This effectively solves the problem of stress concentration and breakage at the curved portion when the connecting segment is compressed, thereby improving the probe's service life. Tests have shown that probes with this structure can withstand more than 100,000 presses during use.

[0028] like Figure 3 As shown, a raised overpressure limiting point 5, higher than its outer edge, is provided on the outer edge surface at the intersection of the curved and straight portions of the probe's connecting section. This overpressure limiting point 5 can be located at a location where the connecting section experiences greater stress when compressed, such as the connecting section near the pre-compressed first contact portion 11 or the connecting section near the first contact portion 11. When the microneedle module is performing testing, the first contact portion 11 of the probe 1 extending from the bottom of the test base is pre-compressed and fixed to the PCB board. The test piece is then pressed onto the second contact portion 13 at the top of the test base, and the probe is squeezed towards the bottom of the test base. Therefore, the connecting section closer to the pre-compressed first contact portion 11 will bear greater pressure. When the test piece is pressed onto the second contact portion 13 and the connecting section 11 is squeezed against the first contact portion 11, the overpressure limiting point 5 applies force in the opposite direction, preventing excessive deformation of the continuous portion and preventing probe breakage due to stress concentration.

[0029] While ensuring that the elasticity of the probe's connecting section is sufficient to meet the testing requirements, the same overpressure limiting point 5, which protrudes above its outer edge, can also be set on one or more other outer edges of the connecting section.

[0030] Of course, the overpressure limiting points 5 can also be set only on the outer edge surface of the connection between the connecting section and the first contact part 10; or they can be set on other outer edge surfaces of the connecting section at the same time to obtain a better stress resistance effect.

[0031] See Figure 3The connecting segment 14 has a curved section 142 that connects to two adjacent straight sections 141. The distance D1 between the two ends of the curved section is greater than the distance D2 between the two straight sections connected by the curved section 142. With this structural design, when the microneedle module is performing testing, the test piece is pressed onto the second contact section 13 on the top of the test seat in sequence. When the probe is squeezed towards the bottom of the test seat, the connecting segment is compressed by force, and the length of the connecting segment becomes shorter, but the width of the connecting segment does not become wider. This can reduce the generation and propagation of fatigue cracks and improve the durability and service life of the probe.

[0032] Example 2, see Figure 5 and Figure 6 This is a stress-resistant microneedle module and probe with a left-right structure. The structure of this microneedle module is basically the same as that of Embodiment 1, including a test seat 2 and two sets of probes 101 and 102 arranged in the test seat; the test seat 2 includes a rubber core bottom frame 27 and a floating plate 26; see also Figure 5 The two sets of probes 101 and 102 are symmetrically arranged in the bottom frame of the core along the probe width direction (X direction), and the float plate 26 is set on the bottom frame 27 of the core. The first contact portion 11 and the second contact portion 13 of each set of probes extend out of the bottom frame 27 of the core and the float plate 26, respectively, for electrical connection with the test piece 7 and the measuring device. The connection section of each probe in this example has the same structure as the connection section of the probe in Embodiment 1. The difference between the two sets of probes in this example is that the first contact portion 11 and the second contact portion 13 of one set of probes are located on the same side of their own width direction, while the first contact portion 11 and the second contact portion 13 of the other set of probes are located on the left and right sides of their own width direction. Moreover, the first contact portion 11 of both sets of probes is set at a position close to the left and right axis of symmetry OA. Figure 5 and Figure 6 As shown, two sets of probes 101 and 102 are symmetrically arranged on the test socket along the probe width direction (X direction). The first contacts 11 of both sets of probes are located near the axis of symmetry OA. The first contact portion 11 and the second contact portion 11 of each probe in the left-hand probe set 101 are located on the same side (right side) of its own width direction; while the first contact portion 11 and the second contact portion 13 of the probes in the right-hand probe set 102 are located on the left and right sides of its own width direction, respectively. The reverse is also true. The different structures of these two sets of probes allow for a smaller spacing between the first contact feet of the two sets of probes arranged on the left and right sides of the microneedle module. This spacing can be less than or equal to 0.25 mm, which is suitable for testing test pieces with smaller pad spacing.

[0033] The probe structures described in the above embodiments are particularly suitable for products with a probe width W less than or equal to 1.2 mm. All probes are integral structures and can be manufactured using etching, laser processing, photolithography, stamping, or other methods.

[0034] It should be understood that the above embodiments are only used to illustrate the technical solutions of this utility model, and are not intended to limit it. Those skilled in the art can modify the technical solutions described in the above embodiments, or make equivalent substitutions for some of the technical features; and these modifications and substitutions should all fall within the protection scope of the appended claims of this utility model.

Claims

1. A stress-resistant microneedle module, comprising a test socket and probes arranged within the test socket; the probes include an elastic connecting section and a first contact portion and a second contact portion located at both ends of the connecting section; the first contact portion is used to contact a test circuit board, and the second contact portion is used to contact a device under test, characterized in that: The connecting segment comprises a single spring structure in a meandering shape, with straight and curved sections alternately connected along the length of the connecting segment; the width of the curved section is greater than the width of the straight section, and the width of the curved section gradually decreases towards the straight section until it smoothly connects with the straight section.

2. The stress-resistant microneedle module according to claim 1, characterized in that: The probe is provided with at least one overpressure protection limiting point; the overpressure protection limiting point is a protrusion that is provided on the outer edge surface of the connecting segment, or / and the outer edge surface of the connection between the first contact part and the connecting segment, and is higher than its outer edge surface.

3. The stress-resistant microneedle module according to claim 1, characterized in that: The curved portion is arc-shaped.

4. The stress-resistant microneedle module according to claim 3, characterized in that: The distance between the two ends of the arc is greater than the distance between the two straight sections connected by the curved section.

5. The stress-resistant microneedle module according to claim 1, characterized in that: The probes are arranged symmetrically in two groups along the width direction within the test holder; the first contact parts of the two groups of probes are evenly arranged near the center line of the left and right symmetry axis, close to each other; if the first contact part and the second contact part of one group of probes are located on the same side of its own width direction, then the first contact part and the second contact part of the other group of probes are located on the left and right sides of its own width direction.

6. A probe, the probe comprising a resilient connecting segment and a first contact portion and a second contact portion located at both ends of the connecting segment, the first contact portion being used to contact a test circuit board, and the second contact portion being used to contact a circuit board under test, characterized in that: The connecting segment comprises a single spring structure in a meandering shape, with straight and curved sections alternately connected along the length of the connecting segment; the width of the curved section is greater than the width of the straight section, and the width of the curved section gradually decreases towards the straight section until it smoothly connects with the straight section.

7. The probe according to claim 6, characterized in that: The probe is provided with at least one overpressure protection limit point.

8. The probe according to claim 6, characterized in that: The curved portion is arc-shaped.

9. The probe according to claim 8, characterized in that: The distance between the two ends of the arc is greater than the distance between the two straight sections connected by the curved section.

10. The probe according to claim 7, characterized in that: The overpressure prevention limiting point is a protrusion that is set on the outer edge surface of the connecting section, or / and the outer edge surface of the connection between the first contact part and the connecting section, and is higher than its outer edge surface.

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