Gluing and developing machine for environment control grade zoning

Abstract

The utility model relates to the technical field of gluing developers, and discloses an environment control grade zoning gluing developer, which comprises a wafer box station, a multifunctional module, a hot plate unit, a process mechanical arm I, a process mechanical arm II, a rotating unit and an interface station, the hot plate unit, the second process mechanical arm and the interface station are connected to form a photoresist area, the rotating unit is symmetrically arranged relative to the first process mechanical arm to serve as a precision area, and the wafer box station, the multifunctional module and the first process mechanical arm of the rotating unit serve as a general cleaning area. According to the utility model, the architecture of the gluing and developing equipment is re-conceived, so that the environment of the gluing and developing equipment is subjected to zoning control, and a precise control area and a photoresist area do not influence each other; the two environment areas of the rotating unit and the hot plate unit are separated from each other, so that the rotating unit cannot influence the hot plate unit.

Description

Technical Field

[0001] This utility model relates to the field of coating and developing machine technology, specifically a coating and developing machine with environmental control level zoning. Background Technology

[0002] Different environments need to be set up for different processes in coating and developing equipment. Some processes have high environmental requirements, such as coating and developing processes in the rotating unit, while others have lower environmental requirements, such as wafer cell station systems. The environmental requirements for various processes in existing coating and developing equipment are summarized in the table below:

[0003]

[0004] It should be noted that the more "+" signs there are in the regional environmental pressure, the greater the pressure, and the pressure of the lithography equipment (SCANNER) is greater than that of the IFB.

[0005] In the existing technology, on the one hand, the existing coating and developing equipment does not divide and control the environment based on regions; on the other hand, the precision area is small and the photoresist area is large, and the area distribution of the two is scattered, without centralized control. Utility Model Content

[0006] (a) Technical problems to be solved

[0007] To address the shortcomings of existing technologies, this utility model provides a coating and developing machine with environmental control level zoning, which solves the problem that the process areas within the coating and developing equipment are not rationally divided in the existing technology, and that the precision area and photoresist area are scattered, making it inconvenient to centrally control the environment.

[0008] (II) Technical Solution

[0009] To achieve the above objectives, this utility model provides the following technical solution:

[0010] A photoresist coating and developing machine with environmental control level zoning includes a wafer cassette station, a multi-functional module, a hot plate unit, a first process robotic arm and a second process robotic arm, a rotating unit, and an interface station. An intermediate unit is arranged between the rotating unit and the hot plate unit. The rotating unit uses the first process robotic arm and the intermediate unit to transfer wafers, and the hot plate unit uses the second process robotic arm and the intermediate unit to transfer wafers. The hot plate unit, the second process robotic arm, and the interface station are connected to form a photoresist area. The rotating unit is symmetrically arranged with respect to the first process robotic arm as a precision area, and the wafer cassette station, the multi-functional module, and the first process robotic arm of the rotating unit serve as a general cleaning area.

[0011] Preferably, the photoresist used in the rotating unit of the coating and developing machine is an I-line photoresist.

[0012] Preferably, chemical filters are not installed inside the rotating unit or in the process robotic arm that cooperates with the rotating unit.

[0013] Preferably, air cleaning control is performed in general clean areas through a fresh air system.

[0014] Preferably, the photoresist area in the photoresist zone is cleaned and controlled by a fresh air system, and the photoresist area is treated with chemical liquid filtration by a chemical filter.

[0015] Preferably, a fresh air system and a temperature and humidity control box are used to control the air cleanliness and temperature and humidity in precision areas.

[0016] Preferably, the regional pressure of the general cleaning area, the photoresist area, and the precision area increases sequentially from small to large.

[0017] (III) Beneficial Effects

[0018] This utility model has the following beneficial effects:

[0019] This environmentally controlled, zoned photoresist coating and developing machine separates the rotating unit and the hot plate unit using an intermediate unit. Process robotic arms are installed on each unit, connecting the hot plate unit to the interface station. Excluding the rotating unit, this forms a unified photoresist area, reducing its size and allowing for centralized management, thus facilitating environmental control. The entire photoresist coating and developing equipment architecture has been redesigned to achieve zoned environmental control, ensuring that the precision control area and the photoresist area do not interfere with each other. By isolating the rotating unit and the hot plate unit's environmental areas, the rotating unit will not affect the hot plate unit. Attached Figure Description

[0020] Figure 1 This is a schematic diagram of the partitions of the existing coating and developing equipment;

[0021] Figure 2 This is a schematic diagram of the layout structure of the coating and developing equipment of this utility model;

[0022] Figure 3 This is a schematic diagram of the partitioning of this utility model.

[0023] In the diagram: 1. Wafer box station; 2. Multifunctional module; 3. Rotating unit; 4. Intermediate unit; 5. Hot plate unit; 6. Interface station; 7. Process robotic arm one; 8. Process robotic arm two. Detailed Implementation

[0024] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0025] Please see Figure 2 This utility model provides a technical solution: an environmental control level zoned photoresist coating and developing machine, including a wafer cassette station 1, a multi-functional module 2, a hot plate unit 5, a first process robotic arm 7, a second process robotic arm 8, a rotating unit 3, and an interface station 6. The machine is characterized in that: an intermediate unit 4 is arranged between the rotating unit 3 and the hot plate unit 5; the rotating unit 3 and the hot plate unit 5 are connected to the intermediate unit 4 via independent process robotic arms 7 for wafer transfer; the hot plate unit 5 and the interface station 6 are connected to form a complete photoresist area; the rotating units 3 are symmetrically arranged as a precision area; and the wafer cassette station 1, the multi-functional module 2, and the process robotic arms 7 of the rotating unit 3 serve as a general cleaning area.

[0026] This invention separates the rotating unit 3 and the hot plate unit 5, placing the hot plate unit 5 together with the interface station 6 of the same environmental control level to form a centralized photoresist area, facilitating control. An intermediate unit 4 separates the rotating unit 3 and the hot plate unit 5, preventing the precision area of ​​the rotating unit 3 from affecting the photoresist area of ​​the hot plate unit 5. Separate process robotic arms 7 are provided, connecting the hot plate unit 5 to the interface station 6, eliminating the rotating unit 3 and forming a complete photoresist area. This reduces the area of ​​the photoresist area and allows for centralized management, facilitating environmental control.

[0027] In this embodiment, the photoresist used in the rotating unit 3 of the coating and developing machine is an I-line photoresist.

[0028] like Figure 2-3 As shown, the coating and developing equipment in this solution includes a wafer cassette station 1 (CSB), a multi-functional module 2 (MPB), a rotating unit 3 (SPIN), a process robotic arm 7 (PRA), an intermediate unit 4 (MIDDLE), a hot plate unit 5 (BAKE), and an interface station 6 (IFB). The units are interconnected. Figure 2 The arrangement is as shown.

[0029] In this design, an intermediate unit 4 (MIDDLE) is placed between the rotating unit and the hot plate unit 5 to transfer the wafer, and the pressure of the intermediate unit 4 is lower than that of the rotating unit and the hot plate unit. This ensures that both the rotating unit and the hot plate unit 5 are under positive pressure relative to the intermediate unit 4, guaranteeing their cleanliness. Furthermore, the pressure of the lithography equipment (SCANNER) is higher than that of the hot plate unit 5. If the rotating unit and the hot plate unit 5 are connected, and the pressure of the rotating unit is higher than that of the hot plate unit 5, there is a risk that the pressure of the rotating unit will leak into the hot plate unit 5, potentially causing the pressure of the hot plate unit 5 to exceed the pressure of the lithography equipment (SCANNER), resulting in internal contamination of the lithography equipment (SCANNER).

[0030] Chemically Amplified Resist (CAR) is used in ArF, KrF, and DUV photoresist coating and developing equipment. During the photolithography and developing process, acids are generated within the photoresist, which in turn promote the development process. Therefore, if the photoresist contains alkaline components, such as ammonia, it will neutralize the acids, making it difficult to break the chemical chains within the photoresist, resulting in poor development and thus defective products. Therefore, it is necessary to ensure that the ammonia concentration in the filtered photoresist is below 1 ppb.

[0031] In this embodiment, chemical filters are omitted from both the rotating unit 3 and the process robotic arm 7 that cooperates with the rotating unit 3. The photoresist coating and developing equipment in this solution is an I-line system, and the photoresist used is not a chemically amplified photoresist. If chemical filters were installed in the multifunctional module 2 and the rotating unit 3 (including the process robotic arm 7 SPIN-PRA that cooperates with the rotating unit) according to existing methods, it would result in excessive environmental control, increasing equipment costs without improving process performance. Therefore, chemical filters can be omitted from the rotating unit 3 and the process robotic arm 7 in this solution, thereby reducing costs.

[0032] In this embodiment, a fresh air system is used to control the air cleanliness of the general clean area.

[0033] In this embodiment, the air cleaning control of the photoresist area in the photoresist zone is performed by a fresh air system, and the photoresist area is chemically filtered by a chemical filter.

[0034] In this embodiment, a fresh air system and a temperature and humidity control box are used to control the air cleanliness and temperature and humidity of the precision area.

[0035] In this embodiment, the pressure in the general cleaning area, photoresist area, and precision area increases sequentially. This scheme uses different colored boxes to select different environmental control areas: green for the precision area, yellow for the photoresist area, and black for the general area. The control methods for each area are summarized in the table below:

[0036]

[0037] This solution redesigns the architecture of the photoresist coating and developing equipment, enabling zoned control of the equipment's environment, ensuring that the precision control area and the photoresist area do not interfere with each other.

[0038] It should be noted that, in this document, relational terms such as "first" and "second" are used merely to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, the phrase "comprising an element defined as..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0039] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A coating and developing machine with environmental control level zoning, comprising a wafer cell station, a multi-functional module, a hot plate unit, a first process robotic arm and a second process robotic arm, a rotating unit, and an interface station, characterized in that: An intermediate unit is arranged between the rotating unit and the hot plate unit. The rotating unit uses a process robotic arm one to transfer the wafer to the intermediate unit, and the hot plate unit uses a process robotic arm two to transfer the wafer to the intermediate unit. The hot plate unit, the process robotic arm two, and the interface station are connected to form a photoresist area. The rotating unit is arranged symmetrically with respect to the process robotic arm one as a precision area, and the wafer cassette station, the multi-functional module, and the process robotic arm one of the rotating unit serve as a general cleaning area.

2. The coating and developing machine for environmental control level zoning according to claim 1, characterized in that: The photoresist used in the rotating unit of the coating and developing machine is I-line photoresist.

3. The coating and developing machine for environmental control level zoning according to claim 2, characterized in that: Chemical filters are eliminated from the rotating unit and the process robotic arm that works with the rotating unit.

4. A coating and developing machine for environmental control level zoning according to claim 2 or 3, characterized in that: Air purification and control are achieved in general clean areas through a fresh air system.

5. A coating and developing machine for environmental control level zoning according to claim 4, characterized in that: The air in the photoresist area is cleaned and controlled by a fresh air system, and the photoresist area is treated with chemical liquid by a chemical filter.

6. The coating and developing machine for environmental control level zoning according to claim 5, characterized in that: The system uses a fresh air system and a temperature and humidity control box to control the air cleanliness and temperature and humidity in precision areas.

7. A coating and developing machine for environmental control level zoning according to claim 6, characterized in that: The regional pressure of the general cleaning area, photoresist area, and precision area increases sequentially from low to high.

Images