Air-cooling and water-cooling integrated radiator for CPU (Central Processing Unit)
By designing an integrated air-cooled and water-cooled heatsink, combining a heat dissipation aluminum plate, a micro-channel toothed heatsink, and a silent micro pump, the problem of poor heat dissipation and high noise of traditional heatsinks under high power is solved, achieving efficient and quiet CPU cooling, suitable for miniaturized devices.
Patent Information
- Application Number
- CN202520282602.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-02-21
- Publication Date
- 2025-12-02
- Estimated Expiration
- 2035-02-21
AI Technical Summary
Traditional CPU coolers are ineffective at high power settings and pose problems such as coolant leakage risk, high noise, complex installation, and large space occupation.
It adopts an integrated air-cooled and water-cooled heat sink, which combines a heat dissipation aluminum plate, a micro-channel toothed heat sink, a copper block, heat dissipation fins, an axial fan, a micro pump, and copper pipes to form a highly efficient heat dissipation circulation system. It uses heat transfer oil and a silent micro pump for heat dissipation, and has a compact design that occupies little space.
Significantly improves heat dissipation efficiency, reduces CPU temperature, ensures stable performance, reduces noise, adapts to miniaturized devices, and expands the range of applications.
Smart Images
Figure CN223624585U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of heat sink technology, and in particular to a CPU air-cooled and water-cooled integrated heat sink. Background Technology
[0002] With the rapid development of computer technology, the performance of CPUs has been continuously improved, and their power consumption and heat generation have also increased dramatically.
[0003] Traditional CPU coolers, such as common low-pressure air coolers and simple liquid coolers, are gradually revealing many shortcomings. Low-pressure air coolers are limited by the area of the heat sink fins and the efficiency of airflow, resulting in poor heat dissipation when dealing with high-power CPUs. This can easily lead to CPU overheating and frequency reduction, affecting the overall performance of the computer. While ordinary liquid coolers have good heat dissipation potential, they have problems such as the risk of coolant leakage, loud pump noise, complex installation, and the heat sink occupying a large amount of case space. Utility Model Content
[0004] This utility model addresses the shortcomings of existing technologies by providing the following technical solution: a CPU air-cooled and water-cooled integrated heat sink, comprising a heat sink aluminum plate, a mounting groove formed on the rear surface of the heat sink aluminum plate, and a micro-channel toothed heat sink embedded inside the mounting groove; a copper block fixedly mounted on the rear surface of the heat sink aluminum plate, the copper block being in contact with the micro-channel toothed heat sink and located directly behind the micro-channel toothed heat sink; several equally spaced heat sink fins welded to the front surface of the heat sink aluminum plate, and copper tubes fixedly inserted inside the heat sink fins; an axial fan rotatably mounted inside the heat sink fins; a liquid flow channel formed inside the heat sink aluminum plate, the liquid flow channel being located around the micro-channel toothed heat sink; both ends of the copper tubes being sealed and connected to the two ports of the liquid flow channel; a micro pump fixedly mounted on one side of the front surface of the heat sink aluminum plate, and the inlet and outlet of the micro pump being sealed and connected to the copper tubes respectively.
[0005] As an improvement to the above technical solution, the heat dissipation aluminum plate and the microchannel toothed heat sink are fixedly connected by brazing.
[0006] As an improvement to the above technical solution, the heat-conducting liquid filled inside the liquid flow channel and copper pipe is heat-conducting oil, and the micro pump is a small and quiet pump body.
[0007] As an improvement to the above technical solution, a micro motor is provided on the rear side of the axial fan. The micro motor is fixedly mounted on the surface of the heat dissipation aluminum plate. The heat dissipation fins are aluminum alloy components and are sheet-like structures formed by stamping process.
[0008] As an improvement to the above technical solution, each of the heat dissipation fins has a circular hole channel inside, and the copper tube is inserted into the circular hole channel. The copper tube and the heat dissipation fin are fixedly connected by brazing, and a connecting plate is fixedly installed between several heat dissipation fins.
[0009] As an improvement to the above technical solution, some of the heat dissipation fins are arc-shaped, and the copper pipe is also arc-shaped.
[0010] The beneficial effects of this utility model are:
[0011] By incorporating heat dissipation fins, an axial fan, a micro pump, and copper pipes on the front surface of the heat dissipation aluminum plate, the heat dissipation efficiency is significantly improved compared to traditional down-draft air coolers and water coolers. This allows the computer CPU to dissipate heat under high load, reducing its temperature and ensuring stable CPU performance. This greatly enhances the overall cooling effect of the device. Furthermore, the compact design reduces the space occupied by the device compared to traditional water coolers, making it perfectly suited for miniaturized computer equipment and expanding its application range. The use of a silent micro pump also reduces noise during heat dissipation. Attached Figure Description
[0012] Figure 1 This is a three-dimensional structural diagram of the present invention;
[0013] Figure 2 This is an exploded structural diagram of the present invention;
[0014] Figure 3 This is a diagram showing the internal structure of the heat dissipation aluminum plate in this utility model.
[0015] Reference numerals: 10, heat dissipation aluminum plate; 20, heat dissipation fins; 201, round hole channel; 202, connecting plate; 30, axial fan; 40, micro pump; 50, copper pipe; 60, microchannel toothed radiator; 70, copper block; 80, mounting slot; 90, liquid flow channel. Detailed Implementation
[0016] To make the objectives, technical solutions, and advantages of this utility model clearer, the following provides a more detailed description of the utility model. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the scope of the utility model.
[0017] Please see Figure 1-3This utility model provides a technical solution: a CPU air-cooled and water-cooled integrated heat sink, including a heat sink aluminum plate 10. A mounting groove 80 is formed on the rear surface of the heat sink aluminum plate 10, and a microchannel toothed heat sink 60 is embedded inside the mounting groove 80. A copper block 70 is fixedly mounted on the rear surface of the heat sink aluminum plate 10, and the copper block 70 is in contact with the microchannel toothed heat sink 60, with the copper block 70 located directly behind the microchannel toothed heat sink 60. A plurality of equally spaced heat sinks are welded to the front surface of the heat sink aluminum plate 10. The heat sink fins 20 are fixedly connected to copper pipes 50 inside the heat sink fins 20. An axial fan 30 is rotatably installed on the inner side of the heat sink fins 20. A liquid flow channel 90 is also opened inside the heat sink aluminum plate 10. The liquid flow channel 90 is located around the micro-channel toothed heat sink 60. The two ends of the copper pipe 50 are respectively sealed and connected to the two ports of the liquid flow channel 90. A micro pump 40 is fixedly installed on one side of the front surface of the heat sink aluminum plate 10. The inlet and outlet of the micro pump 40 are respectively sealed and connected to the copper pipe 50.
[0018] In this embodiment, heat dissipation fins 20, axial fan 30, micro pump 40, and copper pipe 50 are respectively arranged on the front surface of heat dissipation aluminum plate 10. With the cooperation of heat dissipation aluminum plate 10, copper pipe 50, and heat dissipation fins 20, the heat dissipation efficiency is significantly improved compared with traditional down-draft air coolers and water coolers. It enables the computer CPU to dissipate heat under high load, thereby reducing its temperature and ensuring stable CPU performance. This greatly improves the overall heat dissipation effect of the device. In addition, the overall structure is compact and occupies less chassis space than traditional water coolers, thus perfectly adapting to miniaturized computer equipment and expanding its application range. The use of silent micro pump 40 can reduce the noise generated during heat dissipation.
[0019] Specifically, the heat dissipation aluminum plate 10 and the microchannel toothed heat sink 60 are fixedly connected by brazing.
[0020] Specifically, the liquid flow tank 90 and the copper pipe 50 are filled with heat-conducting liquid, which is heat-conducting oil, and the micro pump 40 is a small and quiet pump body.
[0021] Specifically, a micro motor is provided on the rear side of the axial fan 30. The micro motor is fixedly mounted on the surface of the heat dissipation aluminum plate 10. The heat dissipation fins 20 are aluminum alloy components and are sheet-like structures formed by stamping process.
[0022] Specifically, each heat dissipation fin 20 has a circular hole channel 201 inside, and a copper tube 50 is inserted into the circular hole channel 201. The copper tube 50 and the heat dissipation fin 20 are fixedly connected by brazing. A connecting plate 202 is fixedly installed between several heat dissipation fins 20. Several heat dissipation fins 20 are arc-shaped, and the copper tube 50 is also arc-shaped.
[0023] In this embodiment, the CPU cooler consists of a heat dissipation aluminum plate 10, copper pipes 50, an array of heat dissipation fins 20, a micro-channel shovel-tooth heatsink 60, an axial fan 30, a micro-pump 40, and a circulating water cooling system. These components work together to form a highly efficient heat dissipation system. The copper block 70 welded to the bottom ensures a tight fit with the CPU top cover, resulting in low contact thermal resistance. A liquid flow channel 90 is provided inside the heat dissipation aluminum plate 10. When the micro-pump 40 is activated, it works in conjunction with the copper pipes 50 to form a closed-loop water circuit, rapidly transferring the heat generated by the CPU to the heat dissipation aluminum plate 10 (i.e., the water cooling plate), and then to the heat dissipation fins 20 for cooling. The copper pipes 50 are made of bent copper tubing, filled with a heat-conducting liquid, including but not limited to, thermal oil. One end of the copper pipe 50 is tightly welded to the array of heat dissipation fins 20, utilizing the micro-pump... Driven by the 40, the heat generated by the CPU is quickly transferred from the evaporation end to the condensation end, achieving efficient heat dissipation. The heat dissipation fins 20 of the array are made of aluminum alloy components and are made into a unique sheet structure through stamping process. Compared with traditional flat fins, this greatly increases the heat dissipation area. The adjacent heat dissipation fins 20 maintain a precise and equal spacing, which allows the air to flow evenly and smoothly, improving the heat exchange efficiency. The micro pump 40 circulating water cooling system includes a small, quiet micro pump 40, copper pipes 50, and the inlet and outlet of the micro pump 40 are sealed and welded. Driven by the micro pump 40, the coolant circulates in the liquid flow channel 90 opened inside the copper pipes 50 and the heat dissipation aluminum plate 10. After absorbing heat, it is dissipated through the heat dissipation fins 20 and then blown away by the axial fan 30, thereby further increasing the heat dissipation effect.
[0024] The above embodiments are only used to illustrate the technical solution of this utility model, and are not intended to limit it.
Claims
1. A CPU air-cooled and water-cooled integrated heat sink, comprising a heat dissipation aluminum plate (10), characterized in that: The rear surface of the heat dissipation aluminum plate (10) is provided with a mounting groove (80), and a microchannel toothed radiator (60) is embedded inside the mounting groove (80). A copper block (70) is fixedly installed on the rear surface of the heat dissipation aluminum plate (10), and the copper block (70) is in contact with the microchannel toothed radiator (60). The copper block (70) is located directly behind the microchannel toothed radiator (60). A number of equally spaced heat dissipation fins (20) are welded to the front surface of the heat dissipation aluminum plate (10), and the heat dissipation fins (20) are fixedly inserted inside. A copper pipe (50) is connected to the heat dissipation fins (20), and an axial fan (30) is rotatably installed on the inner side of the heat dissipation fins (20). A liquid flow channel (90) is also opened inside the heat dissipation aluminum plate (10), and the liquid flow channel (90) is located around the micro-channel toothed heat sink (60). The two ends of the copper pipe (50) are respectively sealed and connected to the two ports of the liquid flow channel (90). A micro pump (40) is fixedly installed on one side of the front surface of the heat dissipation aluminum plate (10), and the inlet and outlet of the micro pump (40) are respectively sealed and connected to the copper pipe (50).
2. The CPU air-cooled / water-cooled integrated heatsink according to claim 1, characterized in that: The heat dissipation aluminum plate (10) and the microchannel toothed radiator (60) are fixedly connected by brazing.
3. A CPU air-cooled / water-cooled integrated heatsink according to claim 1, characterized in that: The liquid flow channel (90) and the copper pipe (50) are filled with heat-conducting liquid, which is heat-conducting oil. The micro pump (40) is a small and quiet pump body.
4. A CPU air-cooled / water-cooled integrated heatsink according to claim 1, characterized in that: A micro motor is provided on the rear side of the axial fan (30). The micro motor is fixedly installed on the surface of the heat dissipation aluminum plate (10). The heat dissipation fins (20) are aluminum alloy components and are sheet-like structures formed by stamping process.
5. A CPU air-cooled / water-cooled integrated heatsink according to claim 1, characterized in that: Each of the heat dissipation fins (20) has a circular hole channel (201) inside, and the copper tube (50) is inserted into the circular hole channel (201). The copper tube (50) and the heat dissipation fins (20) are fixedly connected by brazing, and a connecting plate (202) is fixedly installed between several heat dissipation fins (20).
6. A CPU air-cooled / water-cooled integrated heatsink according to claim 1, characterized in that: Several of the heat dissipation fins (20) are arc-shaped, and the copper tube (50) is also arc-shaped.