Conductive film and electronic equipment using same
By setting an interference composite film structure with conductive film layers of high extinction coefficient and low extinction coefficient in a conductive film, the problems of low hardness and poor adhesion caused by increasing carbon content in conductive films are solved, achieving a black decorative effect with low brightness and high adhesion.
Patent Information
- Application Number
- CN202422993862.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-04
- Publication Date
- 2025-12-02
- Estimated Expiration
- 2034-12-04
AI Technical Summary
When existing conductive films increase carbon content to achieve a black decorative finish, problems such as low hardness, poor adhesion, and film peeling occur.
At least two interference composite film structures are used. Each interference composite film consists of a high extinction coefficient conductive film layer and a low extinction coefficient conductive film layer stacked on top of each other. The brightness is reduced by utilizing the principle of fiber reflection, while maintaining conductivity, thus avoiding the increase in internal stress caused by the increase in carbon content.
It achieves a low-gloss black decorative effect while improving the adhesion and hardness of the conductive film, thus avoiding the problem of film peeling.
Smart Images
Figure CN223624744U_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of coating technology, specifically to a conductive thin film and an electronic device using the conductive thin film. Background Technology
[0002] Conductive thin films are widely used in 3C products. There are many materials that can make conductive thin films both black and conductive, such as chromium carbide, tungsten carbide, zirconium carbide, and diamond-like layers. These black conductive thin films mainly achieve their black color (i.e., non-reflective or only reflecting a small amount of light) by gradually increasing the carbon content in the film layer.
[0003] However, as the carbon content in the film increases, the internal stress of the conductive film gradually increases, resulting in low hardness and poor adhesion of the finished product, which can easily cause problems such as product surface delamination. Utility Model Content
[0004] To address the shortcomings of the existing technology, it is necessary to provide a conductive film that exhibits low brightness while also possessing high adhesion and high hardness. Furthermore, it is also necessary to provide an electronic device incorporating this conductive film.
[0005] This application provides a conductive thin film, including a substrate layer, a base layer, and at least two interference composite films. The base layer is formed on the surface of the substrate layer, and the interference composite films are formed on the surface of the base layer. The interference composite films include a high extinction coefficient conductive film layer and a low extinction coefficient conductive film layer. In each interference composite film, the high extinction coefficient conductive film layer is disposed between the low extinction coefficient conductive film layer and the base layer.
[0006] This application incorporates at least two interference composite films within a conductive thin film. Each interference composite film consists of a high-extinction-coefficient conductive film layer and a low-extinction-coefficient conductive film layer stacked on top of each other, with the high-extinction-coefficient conductive film layer positioned between the low-extinction-coefficient conductive film layer and the underlayer. When light is incident through the low-extinction-coefficient conductive film layer of the outermost interference composite film, this low-extinction-coefficient conductive film layer, due to its low extinction coefficient, causes most of the light to enter the next high-extinction-coefficient conductive film layer. The high-extinction-coefficient conductive film layer then absorbs a portion of the light, leaving only a small portion to enter the next low-extinction-coefficient conductive film layer. At this point, according to the principle of fiber optic reflection, the light undergoes multiple reflections within the low-extinction-coefficient conductive film layer, making it difficult for the light to pass through the conductive thin film, thereby reducing brightness. Moreover, each layer of the interference composite film is conductive. Therefore, while reflecting light using a layered stacked fiber-like reflection principle to reduce brightness, it also makes the conductive film conductive. This avoids the problems of poor adhesion, low hardness, and film detachment in the finished product caused by the increase in internal hardness of the conductive film with the increase of carbon content in related technologies.
[0007] In some embodiments of this application, there are two interference composite films, including a first interference composite film and a second interference composite film, wherein the first interference composite film is disposed between the second interference composite film and the underlayer.
[0008] In some embodiments of this application, in the first interference composite film, the thickness of the high extinction coefficient conductive film layer is 900 nm to 1000 nm, and the thickness of the low extinction coefficient conductive film layer is 60 nm to 80 nm.
[0009] In some embodiments of this application, in the second interference composite film, the thickness of the high extinction coefficient conductive film layer is 20 nm to 30 nm, and the thickness of the low extinction coefficient conductive film layer is 70 nm to 90 nm.
[0010] In some embodiments of this application, the material of the high extinction coefficient conductive film layer of the first interference composite film is CrSiN.
[0011] In some embodiments of this application, the material of the high extinction coefficient conductive film layer of the second interference composite film is CrC.
[0012] In some embodiments of this application, the material of the low extinction coefficient conductive film layer is DLC.
[0013] In some embodiments of this application, the material used for the underlayer is CrSi.
[0014] In some embodiments of this application, the thickness of the underlayer is 140 nm to 150 nm.
[0015] Another aspect of this application provides an electronic device, including a conductive element and the aforementioned conductive film. Attached Figure Description
[0016] Figure 1 This is a schematic diagram of a conductive thin film structure according to one embodiment of this application.
[0017] Explanation of key component symbols:
[0018] Substrate layer 100
[0019] 200 at the bottom
[0020] Interference composite film 300
[0021] First Interference Composite Film 310
[0022] Second interference composite film 320
[0023] High extinction coefficient conductive film layer 301
[0024] Low extinction coefficient conductive film layer 302
[0025] The following detailed description, in conjunction with the accompanying drawings, will further illustrate this application. Detailed Implementation
[0026] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present utility model. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments.
[0027] It should be noted that when a component is considered to be "connected" to another component, it can be directly connected to the other component or may also have a component that is centrally located. When a component is considered to be "located" on another component, it can be directly located on the other component or may also have a component that is centrally located.
[0028] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.
[0029] In existing conductive films, a gradual gradient increase in carbon content is primarily used. As the carbon content increases, the material's brightness decreases, and the color changes from gray to black. Gradient-type films not only enhance blackness but also improve adhesion between the film and the substrate surface. These films achieve their black color (non-reflective or reflecting only a small amount of light) by progressively increasing the carbon content, causing light to be gradually absorbed as it enters the film. However, increasing the carbon content is accompanied by a gradual increase in internal stress within the film, resulting in lower hardness and poor adhesion, making the film prone to detachment from the product surface.
[0030] Please see Figure 1 This application provides a conductive thin film, including a substrate layer 100, a substrate layer 200, and at least two interference composite films 300. The substrate layer 200 is formed on the surface of the substrate layer 100, and the interference composite films 300 are formed on the surface of the substrate layer 200. The interference composite film 300 includes a high extinction coefficient conductive film layer 301 and a low extinction coefficient conductive film layer 302. The high extinction coefficient conductive film layer 301 is disposed between the low extinction coefficient conductive film layer 302 and the substrate layer 200.
[0031] This application incorporates at least two interference composite films 300 within a conductive thin film. Each interference composite film 300 consists of a high extinction coefficient conductive film layer 301 and a low extinction coefficient conductive film layer 302 stacked on top of each other, with the high extinction coefficient conductive film layer 301 located between the low extinction coefficient conductive film layer 302 and the underlayer 200. When light is incident through the low extinction coefficient conductive film layer 302 of the outermost interference composite film 300, this low extinction coefficient conductive film layer 302, due to its low extinction coefficient, causes most of the light to enter the next high extinction coefficient conductive film layer 301, while the high extinction coefficient conductive film layer 301 eliminates a portion of the light. Finally, a small portion of the light enters the next low extinction coefficient conductive film layer 302. At this point, according to the principle of fiber optic reflection, the light undergoes multiple reflections within the low extinction coefficient conductive film layer 302, making it difficult for the light to pass through the conductive thin film, thereby reducing brightness. Moreover, each layer of the interference composite film 300 is conductive. Therefore, while reflecting light using a layered stacked fiber-optic reflection principle to reduce brightness, it also makes the conductive film conductive. This avoids the problems of poor adhesion, low hardness, and film detachment in the finished product caused by the increase in internal hardness of the conductive film with the increase of carbon content in related technologies.
[0032] In some embodiments of this application, there may be two interference composite films 300, including a first interference composite film 310 and a second interference composite film 320, wherein the first interference composite film 310 is disposed between the second interference composite film 320 and the underlayment 200.
[0033] In some embodiments of this application, in the first interference composite film 310, the thickness of the high extinction coefficient conductive film layer 301 is 900 nm to 1000 nm, and the thickness of the low extinction coefficient conductive film layer 302 is 60 nm to 80 nm. The two-layer structure design of the first interference composite film 310 produces multiple reflections and interference effects, thereby significantly enhancing the selective absorption and reflection characteristics of light. The high extinction coefficient conductive film layer 301 effectively absorbs light energy, while the low extinction coefficient conductive film layer 302 regulates transmission and reflection, optimizing the overall film's performance for specific wavelengths of light and contributing to an excellent black appearance. When light passes through the low extinction coefficient conductive film layer 302 in the second interference composite film 320, the light is easily drawn into the film layer due to the low extinction coefficient of the low extinction coefficient conductive film layer 302 in the second interference composite film 320. After secondary interference by the high extinction coefficient conductive film layer 301 in the second interference composite film 320, the light enters the low extinction coefficient conductive film layer 302 in the first interference composite film 310. When light reaches the high extinction coefficient conductive film layer 301 in the first interference composite film 310, due to the high extinction coefficient characteristic of the high extinction coefficient conductive film layer 301 in the first interference composite film 310, it undergoes multiple total internal reflections between the high extinction coefficient conductive film layer 301 and the low extinction coefficient conductive film layer 302 in the first interference composite film 310. Based on the principle of optical fiber reflection, a low brightness effect is achieved.
[0034] In some embodiments of this application, in the second interference composite film 320, the thickness of the high extinction coefficient conductive film layer 301 is 20 nm to 30 nm, and the thickness of the low extinction coefficient conductive film layer 302 is 70 nm to 90 nm. The refractive index and extinction coefficient in the PVD film can significantly affect its color and optical properties. The higher the brightness of a high reflectivity material, the closer it is to a metallic luster. Both the high extinction coefficient conductive film layer 301 in the first interference composite film 310 and the high extinction coefficient conductive film layer 301 in the second interference composite film 320 are high refractive index and high extinction coefficient materials. However, in this application, the high extinction coefficient conductive film layer 301 in the second interference composite film 320 is set to a relatively small thickness of 20-30 nm, so that the brightness of the high extinction coefficient conductive film layer 301 in the second interference composite film 320 originates from the substrate layer 100 and only participates in part of the interference. When light penetrates the low extinction coefficient conductive film layer 302 in the second interference composite film 320 and reaches the high extinction coefficient conductive film layer 301, a small amount of light is reflected. Due to the thinner thickness of the high extinction coefficient conductive film layer 301, the light directly penetrates it and reaches the low extinction coefficient conductive film layer 302 in the first interference composite film 310 below. Upon contact with the high extinction coefficient conductive film layer 301 in the first interference composite film 310, the light is reflected back to the high extinction coefficient conductive film layer 301 in the second interference composite film 320. Because the light reaches the Brewster angle, it undergoes total internal reflection again, forming an optical fiber path. This reduces brightness and creates a black decorative effect.
[0035] In some embodiments of this application, the high extinction coefficient conductive film layer 301 of the first interference composite film 310 can be made of CrSiN. CrSiN possesses unique optical and mechanical properties, and its high extinction coefficient makes it highly effective in both light reflection and absorption, thus enabling its use in multilayer interference film structures. CrSiN material exhibits good wear resistance and chemical stability, allowing it to maintain its optical properties even in harsh environments.
[0036] In some embodiments of this application, the high extinction coefficient conductive film layer 301 of the second interference composite film 320 can be made of CrC. CrC has high hardness and wear resistance, providing good surface protection and reducing the risk of wear and scratches. This property, combined with the high hardness of DLC (diamond-like carbon), enables the entire film system to remain stable under extreme conditions. CrC also has relatively good thermal conductivity, which helps maintain the thermal stability of the film under high-power light sources or hot loads, reducing the risk of thermal damage.
[0037] In some embodiments of this application, the low extinction coefficient conductive film layer 302 is made of DLC (diamond-like carbon). DLC is a thin film material with excellent optical and mechanical properties. Through interference effects, it interacts with other film layers (such as CrSiN) to enhance the reflection or transmission characteristics of light at specific wavelengths. By combining CrSiN and DLC, multilayer film structures with high reflectivity and specific spectral characteristics can be designed. This also solves the problem in current technologies where the internal hardness of gradient-type film layers increases with increasing carbon content, leading to poor adhesion, low hardness, and film delamination in the finished product.
[0038] By combining CrSiN, CrC, and DLC materials through this multilayer film structure design, excellent performance characteristics can be achieved. Utilizing a layered sandwich structure, a low extinction coefficient conductive film layer 302 and a high extinction coefficient conductive film layer 301 are stacked separately. This allows light to be trapped within the film layers through total internal reflection after interference and reflection, reducing its brightness. The first high extinction coefficient conductive film layer 301311, the first low extinction coefficient conductive film layer 302312, the second high extinction coefficient conductive film layer 301321, and the second low extinction coefficient conductive film layer 302322 all employ highly conductive PVD films to simultaneously achieve both conductive performance and a black decorative finish.
[0039] In some embodiments of this application, the material of the base layer 200 can be CrSi.
[0040] In some embodiments of this application, the thickness of the underlayer 200 is 140 nm to 150 nm.
[0041] This application, in another aspect, provides an electronic device including a conductive element and the aforementioned conductive film. By employing the conductive film provided in this application, the conductive element possesses excellent black decorative properties and excellent conductivity, solving the problems in the prior art where the internal hardness of a gradient film increases with increasing carbon content, resulting in poor adhesion, low hardness, and film delamination in the finished product. The conductive element provided in this application achieves the effect of both black decorative properties and conductivity.
[0042] The above embodiments are only used to illustrate the technical solutions of this application and are not intended to limit it. Although this application has been described in detail with reference to preferred embodiments, those skilled in the art should understand that modifications or equivalent substitutions can be made to the technical solutions of this application without departing from the spirit and substance of the technical solutions of this application.
Claims
1. A conductive thin film, characterized in that, include: Substrate layer; The underlayer is formed on the surface of the substrate layer; and At least two interference composite films are formed on the substrate surface. The interference composite film includes a high extinction coefficient conductive film layer and a low extinction coefficient conductive film layer. In each interference composite film, the high extinction coefficient conductive film layer is disposed between the low extinction coefficient conductive film layer and the substrate.
2. The conductive thin film according to claim 1, characterized in that, There are two interference composite films, including a first interference composite film and a second interference composite film, with the first interference composite film disposed between the second interference composite film and the underlayer.
3. The conductive thin film according to claim 2, characterized in that, In the first interference composite film, the thickness of the high extinction coefficient conductive film layer is 900 nm to 1000 nm, and the thickness of the low extinction coefficient conductive film layer is 60 nm to 80 nm.
4. The conductive thin film according to claim 2, characterized in that, In the second interference composite film, the thickness of the high extinction coefficient conductive film layer is 20 nm to 30 nm, and the thickness of the low extinction coefficient conductive film layer is 70 nm to 90 nm.
5. The conductive thin film according to claim 2, characterized in that, The high extinction coefficient conductive film layer of the first interference composite film is made of CrSiN.
6. The conductive thin film according to claim 2, characterized in that, The material of the high extinction coefficient conductive film layer of the second interference composite film is CrC.
7. The conductive thin film according to claim 1, characterized in that, The material of the low extinction coefficient conductive film layer is DLC.
8. The conductive thin film according to claim 1, characterized in that, The material used for the underlayer is CrSi.
9. The conductive thin film according to claim 1, characterized in that, The thickness of the substrate is 140nm to 150nm.
10. An electronic device, characterized in that, Includes a conductive element, said conductive element having a conductive thin film as described in any one of claims 1-9.