Semiconductor device die bonding track and dispensing double-swing-arm die bonding equipment
By using a semiconductor device die bonding track and a dual-swing arm die bonding device for dispensing, the problem of insufficient contact time between the substrate and the wafer was solved, enabling synchronous movement and dispensing, and improving the accuracy and stability of the die bonding equipment.
Patent Information
- Application Number
- CN202423116551.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-17
- Publication Date
- 2025-12-02
- Estimated Expiration
- 2034-12-17
AI Technical Summary
In existing die bonding equipment, the area on the substrate coated with adhesive cannot come into contact with the wafer for a long time, which reduces the adhesive's bonding ability and affects the wafer's bonding effect.
The semiconductor device die bonding track and dispensing double swing arm die bonding equipment adopts the synchronous control of wafer and substrate movement through track assembly, and realizes the synchronous operation of wafer pick-up and dispensing by combining dispensing double swing arm, reducing the movement control device and improving accuracy and stability.
It improves the precision and efficiency of die bonding equipment, reduces adhesive contact time, avoids adhesive failure, and ensures stable wafer bonding.
Smart Images
Figure CN223624941U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of die bonding equipment technology, specifically a die bonding track and a double swing arm die bonding device for semiconductor devices. Background Technology
[0002] Die bonders are key pieces of equipment in the packaging processes for LEDs, semiconductor chips, and camera mounters. A die bonder mainly consists of a material handling mechanism, a material pushing mechanism, a dispensing mechanism, a dispensing platform, a swing arm mechanism, a die bonding platform, a die finding platform, fixtures, and a material unloading mechanism.
[0003] The operation of the die bonding system includes the following steps: ① Image recognition, positioning, and image processing of the LED chip and LED support board. ② Applying adhesive to a given position on the LED support board using a silver paste pickup device. ③ Accurately placing the LED chip at the adhesive application point using a chip pick-up device. The operating principle of this equipment encompasses related technologies of opto-mechatronics systems, including high-speed precision positioning control, vision positioning control, and pneumatic pick-up control.
[0004] In existing die bonding equipment, a certain amount of adhesive (usually a special kind of adhesive) is first applied to the substrate. Then, a single swing arm is used to control the wafer pick-up head to pick up multiple wafers one by one and fix them onto the substrate coated with adhesive. The area on the substrate coated with adhesive cannot come into contact with the wafer for a long time, which reduces the adhesive's bonding ability and thus affects the wafer fixing effect. Utility Model Content
[0005] The purpose of this invention is to provide a semiconductor device die bonding track and a double-swing arm die bonding device for dispensing adhesive, so as to solve the problems mentioned in the background art.
[0006] To achieve the above objectives, this utility model provides the following technical solution: a semiconductor device die bonding track, comprising a worktable and a track assembly, wherein the track assembly is mounted on the worktable, and the track assembly includes two first tracks and a second track symmetrically arranged on both sides of the worktable, with a movable frame disposed on the first and second tracks, and a screw assembly disposed inside both the first and second tracks, the screw assembly being used to control the movable frame to move along a first direction, and a linear drive mechanism being disposed on the worktable, the linear drive mechanism being used to control the movable frame to move along a second direction, wherein the first direction is parallel to the first track, and the first and second directions are perpendicular to each other; a wafer and a substrate are respectively disposed on both sides of the movable frame.
[0007] As a further embodiment of this utility model: the screw assembly includes an adjusting screw and an adjusting sleeve, the adjusting screw being rotatably connected to the first track and the second track, the adjusting sleeve being threadedly connected to the adjusting screw, and the adjusting sleeve being slidably connected to the first track and the second track.
[0008] As a further embodiment of this utility model: one end of the adjusting screw inside the first track and the second track is connected by a first synchronous belt drive to maintain the synchronous rotation of the two adjusting screws. A first motor is fixedly installed on the second track, and the output end of the first motor is fixedly connected to the adjusting screw inside the second track.
[0009] A dispensing dual-swing arm die bonder includes the aforementioned semiconductor device die bonder track, and further includes a first swing arm, a second swing arm, and a drive control mechanism. The drive control mechanism includes a frame, a fixed shaft, a gearbox, and a drive assembly. The fixed shaft is fixedly mounted on the frame, and a first rotating shaft and a second rotating shaft are sleeved on the fixed shaft. The first swing arm is connected to the second rotating shaft, and the second swing arm is connected to the first rotating shaft.
[0010] As a further embodiment of this utility model: the gearbox is provided with a first bevel gear, a second bevel gear and a third bevel gear inside, the third bevel gear meshes with the first bevel gear and the second bevel gear, and the first bevel gear is fixedly connected to the first rotating shaft, and the second bevel gear is fixedly connected to the second rotating shaft.
[0011] As a further embodiment of this utility model: the drive assembly includes a housing and a control shaft rotatably mounted inside the housing. A fourth bevel gear and a fifth bevel gear are symmetrically arranged on both sides of the control shaft. Both the fourth bevel gear and the fifth bevel gear are half-bevel gear structures. A second motor is also mounted on the housing. A sixth bevel gear is fixedly mounted on the output end of the second motor. The sixth bevel gear meshes with the fourth bevel gear and the fifth bevel gear.
[0012] As a further embodiment of this utility model: a first gear and a second gear are provided on the frame. The first gear is fixedly connected to the first rotating shaft, and the second gear is rotatably mounted on the frame and meshes with the first gear. A lifting screw is threadedly connected to the second swing arm, and the lifting screw is drivenly connected to the rotating shaft of the second gear through a second synchronous belt. A lifting seat is also threadedly connected to the lifting screw, and the lifting seat is fixedly connected to the dispensing head. The dispensing head is slidably connected to the second swing arm.
[0013] Compared with the prior art, the beneficial effects of this utility model are as follows: This utility model sets up a track assembly to simultaneously control the movement of the wafer and the substrate, reducing the number of movement control devices in the die bonding equipment, lowering the manufacturing cost of the fixing equipment, and maintaining the synchronization of the wafer and substrate movement positions, thus improving the accuracy of the die bonding equipment; The dual-arm die bonding equipment for dispensing provided by this utility model also includes a first arm, a second arm, and a drive control mechanism. The gearbox and drive assembly drive the first arm and the second arm to rotate crosswise, realizing the synchronous operation of wafer pick-up and dispensing, improving the working efficiency of the die bonding equipment while reducing the contact time between the wafer and the adhesive, avoiding adhesive failure, and improving the stability of wafer fixing. Attached Figure Description
[0014] Figure 1 A schematic diagram of a die bonding track and a double-swing arm die bonding device for semiconductor devices;
[0015] Figure 2 A schematic diagram of the die-bonding track structure of a semiconductor device;
[0016] Figure 3 This is a schematic diagram of a dual-swing arm die bonding equipment for dispensing adhesive.
[0017] Figure 4 A side view of a semiconductor device die bonding track and a dual-swing arm die bonding equipment for dispensing adhesive.
[0018] Figure 5 This is a schematic diagram of the drive component in a semiconductor device die bonding track and dispensing double-swing arm die bonding equipment.
[0019] In the diagram: 10-Workbench, 20-Rail assembly, 21-First rail, 22-Second rail, 23-Adjusting screw, 24-Adjusting sleeve, 25-Moving frame, 26-Linear drive mechanism, 27-First motor, 28-First synchronous belt, 30-Wafer, 40-Substrate, 50-First swing arm, 51-Wafer pick-up head, 60-Second swing arm, 61-Lifting screw, 62-Lifting seat, 63-Dispensing head, 70-Drive control mechanism, 71-Frame, 72-Fixed shaft, 73-Gearbox, 731-First rotating shaft, 732-Second rotating shaft, 733-First bevel gear, 734-Second bevel gear, 735-Third bevel gear, 74-Drive assembly, 741-Fourth bevel gear, 742-Fifth bevel gear, 743-Sixth bevel gear, 744-Second motor, 75-First gear, 76-Connecting shaft, 77-Second gear, 78-Second synchronous belt. Detailed Implementation
[0020] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.
[0021] Please see Figures 1-2 In this embodiment of the present invention, a die-bonding track for a semiconductor device includes a worktable 10 and a track assembly 20 mounted on the worktable 10. The track assembly 20 includes two symmetrically arranged first tracks 21 and second tracks 22 on both sides of the worktable 10. The first tracks 21 and second tracks 22 are parallel to each other, and a movable frame 25 is provided on the first tracks 21 and second tracks 22. A screw assembly is provided inside each of the first tracks 21 and second tracks 22. The screw assembly is used to control the movable frame 25 to move along a first direction. A linear drive mechanism 26 is also provided on the worktable 10. The linear drive mechanism 26 is used to control the movable frame 25 to move along a second direction. The first direction is parallel to the first track 21, and the first and second directions are perpendicular to each other. Figure 1 For example, the second direction is horizontal; wafers 30 and substrates 40 are respectively arranged on both sides of the moving frame 25. When the moving frame 25 moves along the first or second direction, wafers 30 and substrates 40 move synchronously. It can be understood that by controlling the movement of wafers 30 and substrates 40 simultaneously through the track assembly 20, the number of movement control devices in the die bonding equipment is reduced, the manufacturing cost of the die bonding equipment is reduced, and the synchronicity of the movement positions of wafers 30 and substrates 40 is maintained, thereby improving the accuracy of the die bonding equipment.
[0022] Furthermore, in this embodiment, the screw assembly includes an adjusting screw 23 and an adjusting sleeve 24. The adjusting screw 23 is rotatably connected to the first track 21 and the second track 22. The adjusting sleeve 24 is threadedly connected to the adjusting screw 23 and slidably connected to the first track 21 and the second track 22. The adjusting screw 23 drives the adjusting sleeve 24 along the first track 21 and the second track 22. One end of the adjusting screw 23 inside the first track 21 and the second track 22 is connected by a first synchronous belt 28 to maintain the synchronous rotation of the two adjusting screws 23. A first motor 27 is fixedly installed on the second track 22, and the output end of the first motor 27 is fixedly connected to the adjusting screw 23 inside the second track 22. In addition, in this embodiment, the linear drive mechanism 26 can also use a screw assembly to adjust the lateral movement position of the moving frame 25. The linear drive mechanism 26 can also use other devices in the prior art, such as a cylinder or an electrically driven telescopic rod.
[0023] This application also discloses a dispensing dual-swing arm die bonder, which includes the aforementioned semiconductor device die bonder track, and further includes a first swing arm 50, a second swing arm 60, and a drive control mechanism 70. The drive control mechanism 70 includes a frame 71, a fixed shaft 72, a gearbox 73, and a drive assembly 74. The fixed shaft 72 is fixedly mounted on the frame 71, and a first rotating shaft 731 and a second rotating shaft 732 are sleeved on the fixed shaft 72. The first swing arm 50 is connected to the second rotating shaft 732, and the second swing arm 60 is connected to the first rotating shaft 731. When the first rotating shaft 731 and the second rotating shaft 732 rotate on the fixed shaft 72, the first rotating shaft 731 drives the second swing arm 60 to rotate, and the second rotating shaft 732 drives the first swing arm 50 to rotate. The gearbox 73 and drive assembly 74 are used to drive the first swing arm 50 and the second swing arm 60 to rotate in an alternating manner. A wafer pick-up head 51 is mounted on the first swing arm 50, and a dispensing head 63 is mounted on the second swing arm 60. When the wafer pick-up head 51 is above the wafer 30 and begins to pick up the wafer on the wafer 30, the dispensing head 63 is above the substrate 40 and begins to dispense adhesive at the bonding position on the substrate 40. The bonding position is used to fix the wafer. After the wafer pick-up head 51 picks up the wafer, the dispensing head 63 completes the dispensing. Subsequently, the first swing arm 50 and the second swing arm 60 rotate in an alternating manner. After the first swing arm 50 rotates to above the substrate 40, the wafer pick-up head 51 fixes the wafer to the bonding position on the substrate 40. The second swing arm 60 rotates to be suspended above the wafer 30, realizing the alternating operation of dispensing and die bonding.
[0024] Furthermore, in this embodiment, the gearbox 73 is internally provided with a first bevel gear 733, a second bevel gear 734, and a third bevel gear 735. The third bevel gear 735 meshes with the first bevel gear 733 and the second bevel gear 734. The first bevel gear 733 is fixedly connected to the first rotating shaft 731, and the second bevel gear 734 is fixedly connected to the second rotating shaft 732. When the third bevel gear 735 rotates, it controls the rotation of the first bevel gear 733 and the second bevel gear 734. The rotations of the first bevel gear 733 and the second bevel gear 734 are opposite, thereby controlling the first rotating shaft 731 and the second rotating shaft 732 to rotate in opposite directions, thereby realizing the cross motion of the first swing arm 50 and the second swing arm 60. Further... In this embodiment, the drive assembly 74 includes a housing and a control shaft rotatably mounted inside the housing. A fourth bevel gear 741 and a fifth bevel gear 742 are symmetrically arranged on both sides of the control shaft. Both the fourth bevel gear 741 and the fifth bevel gear 742 are semi-bevel gear structures. A second motor 744 is also mounted on the housing. A sixth bevel gear 743 is fixedly mounted on the output end of the second motor 744. The sixth bevel gear 743 meshes with the fourth bevel gear 741 and the fifth bevel gear 742. When the second motor 744 is working, it drives the sixth bevel gear 743 to rotate. The fifth bevel gear 742 intermittently contacts the fourth bevel gear 741 and the fifth bevel gear 742, thereby driving the control shaft to intermittently adjust the rotation direction.
[0025] In this embodiment, the frame 71 is provided with a first gear 75 and a second gear 77. The first gear 75 is fixedly connected to the first rotating shaft 731, and the second gear 77 is rotatably mounted on the frame 71 and meshes with the first gear 75. A lifting screw 61 is threadedly connected to the second swing arm 60. The lifting screw 61 is driven by the rotating shaft of the second gear 77 through a second synchronous belt 78. A lifting seat 62 is also threadedly connected to the lifting screw 61. The lifting seat 62 is fixedly connected to the dispensing head 63, and the dispensing head 63 is slidably connected to the second swing arm 60. During the cross rotation of the first swing arm 50 and the second swing arm 60, the lifting screw 61 adjusts the height of the dispensing head 63 through the lifting seat 62.
[0026] It will be apparent to those skilled in the art that this invention is not limited to the details of the exemplary embodiments described above, and that it can be implemented in other specific forms without departing from the spirit or essential characteristics of this invention. Therefore, the embodiments should be considered illustrative and non-limiting in all respects, and the scope of this invention is defined by the appended claims rather than the foregoing description. Thus, it is intended that all variations falling within the meaning and scope of equivalents of the claims be included within this invention. No reference numerals in the claims should be construed as limiting the scope of the claims.
Claims
1. A die-bonding track for a semiconductor device, characterized in that, The system includes a worktable (10) and a track assembly (20). The track assembly (20) is mounted on the worktable (10). The track assembly (20) includes two symmetrically arranged tracks, a first track (21) and a second track (22), on both sides of the worktable (10). A movable frame (25) is provided on the first track (21) and the second track (22). A screw assembly is provided inside the first track (21) and the second track (22). The screw assembly is used to control the movable frame (25) to move along a first direction. A linear drive mechanism (26) is also provided on the worktable (10). The linear drive mechanism (26) is used to control the movable frame (25) to move along a second direction. The first direction is parallel to the first track (21), and the first direction and the second direction are perpendicular to each other. A wafer (30) and a substrate (40) are respectively provided on both sides of the movable frame (25).
2. The die-bonding track for a semiconductor device according to claim 1, characterized in that, The screw assembly includes an adjusting screw (23) and an adjusting sleeve (24). The adjusting screw (23) is rotatably connected to the first track (21) and the second track (22). The adjusting sleeve (24) is threadedly connected to the adjusting screw (23) and is slidably connected to the first track (21) and the second track (22).
3. The die-bonding track for a semiconductor device according to claim 2, characterized in that, One end of the adjusting screw (23) inside the first track (21) and the second track (22) is connected by a first synchronous belt (28) to maintain the synchronous rotation of the two adjusting screws (23). A first motor (27) is fixedly installed on the second track (22), and the output end of the first motor (27) is fixedly connected to the adjusting screw (23) inside the second track (22).
4. A dispensing double-swing arm die bonding device, characterized in that, The semiconductor device die bonding track as described in any one of claims 1-3 further includes a first swing arm (50), a second swing arm (60), and a drive control mechanism (70). A wafer pick-up head (51) is mounted on the first swing arm (50), and a dispensing head (63) is mounted on the second swing arm (60). The drive control mechanism (70) includes a frame (71), a fixed shaft (72), a gearbox (73), and a drive assembly (74). The fixed shaft (72) is fixedly mounted on the frame (71), and a first rotating shaft (731) and a second rotating shaft (732) are sleeved on the fixed shaft (72). The first swing arm (50) is connected to the second rotating shaft (732), and the second swing arm (60) is connected to the first rotating shaft (731).
5. The dispensing double-swing arm die bonding device according to claim 4, characterized in that, The gearbox (73) is equipped with a first bevel gear (733), a second bevel gear (734) and a third bevel gear (735). The third bevel gear (735) meshes with the first bevel gear (733) and the second bevel gear (734). The first bevel gear (733) is fixedly connected to the first rotating shaft (731), and the second bevel gear (734) is fixedly connected to the second rotating shaft (732).
6. The dispensing double-swing arm die bonding device according to claim 5, characterized in that, The drive assembly (74) includes a housing and a control shaft rotatably mounted inside the housing. A fourth bevel gear (741) and a fifth bevel gear (742) are symmetrically arranged on both sides of the control shaft. Both the fourth bevel gear (741) and the fifth bevel gear (742) are half bevel gear structures. A second motor (744) is also mounted on the housing. A sixth bevel gear (743) is fixedly mounted on the output end of the second motor (744). The sixth bevel gear (743) meshes with the fourth bevel gear (741) and the fifth bevel gear (742).
7. The dispensing double-swing arm die bonding device according to claim 6, characterized in that, The frame (71) is provided with a first gear (75) and a second gear (77). The first gear (75) is fixedly connected to the first rotating shaft (731). The second gear (77) is rotatably mounted on the frame (71) and meshes with the first gear (75). A lifting screw (61) is threadedly connected to the second swing arm (60). The lifting screw (61) is connected to the rotating shaft of the second gear (77) via a second synchronous belt (78). A lifting seat (62) is also threadedly connected to the lifting screw (61). The lifting seat (62) is fixedly connected to the dispensing head (63). The dispensing head (63) is slidably connected to the second swing arm (60).