Heat dissipation paste attaching device

Abstract

The utility model relates to a heat dissipation paste attaching device. The heat dissipation patch attaching device comprises an attaching head assembly, the attaching head assembly comprises an attaching head and a rotary driving part, the attaching head is used for attaching a heat dissipation patch, and the rotary driving part is connected with the attaching head and used for driving the attaching head to rotate around a rotating shaft; the first driving device is connected with the attaching head assembly and used for driving the attaching head assembly to move in the first direction; the second driving device is connected with the first driving device and used for driving the first driving device to move in the second direction; the third driving device is connected with the second driving device and used for driving the second driving device to move in the third direction; wherein the first direction, the second direction and the third direction intersect in pairs. In this way, automatic attaching of the heat dissipation paste can be achieved, and the attaching efficiency and precision are high.

Description

Technical Field

[0001] This application relates to the field of chip packaging technology, and in particular to a thermal pad attaching device. Background Technology

[0002] Flip chip technology, also known as "flip chip packaging" or "flip chip packaging method," is a type of chip packaging technology. Flip film, also called COF (Chip on Flex), is a representative of flip chip technology. Specifically, in flip film packaging, the chip is connected to the conductive path of a flexible circuit board via wire bonding and fixed with special adhesives or soldering techniques.

[0003] Chip-on-chip technology is commonly used in LCD displays, tablets, and other electronic products that require highly flexible or thin designs. As the power of driver chips increases, the heat dissipated by the chip-on-chip during operation also increases. If this heat cannot be effectively dissipated, it will affect the chip's performance and usability.

[0004] In related technologies, thermal pads are often attached to the surface of the flip-chip film to quickly conduct away the heat generated by the film. However, manually attaching the thermal pads results in low attachment precision, leading to poor heat dissipation for the flip-chip film. Utility Model Content

[0005] Therefore, it is necessary to provide a high-precision thermal pad application device to address the problem of low application accuracy in manual application of thermal pads.

[0006] This application provides a heat dissipation sticker attachment device, including:

[0007] The attachment head assembly includes an attachment head and a rotary drive. The attachment head is used to attach heat dissipation stickers, and the rotary drive is connected to the attachment head to drive the attachment head to rotate around a pivot.

[0008] The first driving device is connected to the attachment head assembly and is used to drive the attachment head assembly to move in the first direction;

[0009] A second driving device, connected to the first driving device, is used to drive the first driving device to move along a second direction; and

[0010] The third drive unit is connected to the second drive unit and is used to drive the second drive unit to move in a third direction.

[0011] Among them, the first direction, the second direction, and the third direction intersect each other in pairs.

[0012] In one embodiment, the attachment head assembly further includes a connecting component and a buffer structure. The connecting component is connected between the attachment head and the rotary drive. The connecting component and the attachment head can move relative to each other in a direction parallel to the axis of rotation. The buffer structure is disposed between the connecting component and the attachment head.

[0013] In one embodiment, the buffer structure includes an elastic element that is compressed between the connecting assembly and the attachment head.

[0014] In one embodiment, the attachment head assembly further includes a buffer slide rail and a buffer slider, one of which is connected to the connecting assembly and the other is connected to the attachment head, and the buffer slide rail and the buffer slider slide in a direction parallel to the axis of rotation.

[0015] In one embodiment, the attachment head assembly further includes a balance adjustment device connected between the rotary drive and the attachment head, the balance adjustment device being used to adjust the levelness of the attachment surface of the attachment head.

[0016] In one embodiment, the balance adjustment device includes an adapter plate, an adjustment plate, a set screw, and a bolt. The adapter plate is connected to the rotary drive component, the adjustment plate is located between the attachment head and the adapter plate, and the adjustment plate is connected to the attachment head. The adjustment plate is connected to the adapter plate via the set screw and the bolt.

[0017] In one embodiment, the third drive device includes a linear motor drive device connected to the second drive device.

[0018] In one embodiment, the first driving device includes a first driving member, a first lead screw, and a first nut. The first driving member is connected to the first lead screw, the first lead screw extends along a first direction and is threadedly engaged with the first nut, and the first nut is connected to the attachment head assembly; and / or

[0019] The second driving device includes a second driving member, a second lead screw, and a second nut. The second nut is connected to the second driving device, the second lead screw is threadedly engaged with the second nut, and the second driving member is connected to the second lead screw.

[0020] In one embodiment, the heat dissipation patch attaching device further includes at least two position detectors, each position detector including a transmitter and a corresponding receiver, one of the transmitter and receiver of all position detectors is mounted on the second driving device and is spaced apart from each other along the first direction, and the other of the transmitter and receiver of all position detectors is mounted on the attachment head assembly; the position detectors are used to detect the position of the attachment head assembly.

[0021] In one embodiment, the attachment head has an adsorption surface for adsorbing the heat dissipation patch, and the attachment head also has a vacuum adsorption hole, one end of which penetrates the adsorption surface.

[0022] The aforementioned thermal pad application device first uses the movement of the first driving device, second driving device, third driving device, and rotary driving component to drive the application head assembly to pick up the thermal pad at a station storing the thermal pad. After picking it up, it can then accurately move to the application station and accurately apply the thermal pad onto the flip-chip film. Therefore, the thermal pad application device of this application can achieve automatic application of thermal pads with high efficiency and accuracy. Attached Figure Description

[0023] Figure 1 This is a three-dimensional structural diagram of the heat dissipation sticker application device in one or more embodiments of this application.

[0024] Figure 2 for Figure 1 The diagram shows a three-dimensional structure of the attachment head assembly in the heat dissipation patch attachment device.

[0025] Figure 3 for Figure 2 The exploded view of the attachment head assembly is shown.

[0026] Figure 4 for Figure 2 The diagram shows a partial structural design of the attachment head assembly.

[0027] Figure 5 for Figure 4 An exploded view of a portion of the structure in the attachment head assembly is shown.

[0028] Figure 6 for Figure 1 A three-dimensional structural diagram of the first driving device and the attachment head assembly in the heat dissipation patch attachment device shown.

[0029] Figure 7 for Figure 1 A three-dimensional structural diagram of the second driving device in the heat dissipation patch application device shown.

[0030] Figure 8 for Figure 7 The diagram shows a three-dimensional structure of the second drive device from another perspective.

[0031] Figure 9 for Figure 1 A three-dimensional structural diagram of the third driving device in the heat dissipation patch application device shown. Attached Figure Description

[0033] The device includes a heat dissipation sticker application device 100, an application head assembly 10, an application head 11, an application surface 111, a vacuum adsorption hole 112, a rotary drive component 12, a rotating shaft 121, a connecting assembly 13, a first connecting seat 131, a second connecting seat 132, a buffer structure 14, a buffer slide rail 15, a buffer slider 16, a balance adjustment device 17, an adapter plate 171, an adjustment plate 172, a set screw 173, a bolt 174, an application head mounting seat 18, a first drive device 20, a first drive component 21, a first mounting seat 22, a first slide rail 23, a first slider 24, a second drive device 30, a second drive component 31, a second lead screw 32, a second nut 33, a second mounting seat 34, a base plate 341, a side plate 342, a second slide rail 35, a second slider 36, a third drive device 40, a square tube seat 45, a drag chain mechanism 48, a transmitter end 50, and a receiver end 60. Detailed Implementation

[0034] To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, the specific embodiments of this application are described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of this application. However, this application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this application. Therefore, this application is not limited to the specific embodiments disclosed below.

[0035] In the description of this application, it should be understood that if terms such as "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" appear, these terms indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0036] Furthermore, where the terms "first" and "second" appear, these terms are for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined with "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, where the term "multiple" appears, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0037] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0038] In this application, unless otherwise expressly specified and limited, the use of descriptions such as "above" or "below" the second feature indicates that the first and second features are in direct contact or indirect contact via an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. Similarly, "below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0039] It should be noted that if an element is referred to as being "fixed to" or "set on" another element, it can be directly on the other element or there may be an intervening element. If an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intervening element. If so, the terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used in this application are for illustrative purposes only and do not represent the only possible implementation.

[0040] Figure 1 A three-dimensional structural schematic diagram of a heat dissipation patch attaching device according to an embodiment of this application is shown. Figure 2 for Figure 1 The diagram shows a three-dimensional structure of the application head assembly in the heat dissipation patch application device. Figure 3 for Figure 2 The exploded view of the attachment head assembly is shown. (See attached diagram.) Figures 1-3An embodiment of this application provides a heat dissipation patch attaching device 100, including an attaching head assembly 10, a first driving device 20, a second driving device 30, and a third driving device 40. The attaching head assembly 10 includes an attaching head 11 and a rotary driving member 12. The attaching head 11 is used to attach a heat dissipation patch, and the rotary driving member 12 is connected to the attaching head 11 and drives the attaching head 11 to rotate around a rotating shaft 121. The first driving device 20 is connected to the attaching head assembly 10 and drives the attaching head assembly 10 to move along a first direction Z. The second driving device 30 is connected to the first driving device 20 and drives the first driving device 20 to move along a second direction Y. The third driving device 40 is connected to the second driving device 30 and drives the second driving device 30 to move along a third direction X. The first direction Z, the second direction Y, and the third direction X intersect each other.

[0041] The attachment head 11 is a component used to directly contact the heat sink for attaching the heat sink. The attachment head 11 can pick up the heat sink by adsorption and then perform the attachment work, or it can pick up the heat sink by other means.

[0042] The rotary drive 12 is connected to the attachment head 11 via its rotation shaft 121. Specifically, the rotary drive 12 is a rotary motor. The connection between the rotary drive 12 and the attachment head 11 can be direct or indirect. In the embodiments of this application, the connection between the rotary drive 12 and the attachment head 11 is indirect, and the indirect connection component will be described in detail below.

[0043] The first drive device 20, the second drive device 30, and the third drive device 40 can be electric drive devices, or hydraulic or pneumatic drive devices, and there is no specific limitation.

[0044] In the embodiments of this application, the first direction Z, the second direction Y, and the third direction X are all perpendicular to each other.

[0045] In the actual operation of the thermal pad application device 100, the application head assembly 10 is first driven by the movement of the first driving device 20, the second driving device 30, the third driving device 40, and the rotary driving component 12 to pick up the thermal pad at the station where it is stored. After picking it up, it can then move accurately to the application station to accurately apply the thermal pad onto the flip-chip film. Therefore, the thermal pad application device 100 of this application can achieve automatic application of thermal pads with high efficiency and accuracy.

[0046] It should be noted that, typically, the orientation of the heatsink pickup station and the application station differs by a certain angle, such as 90 degrees. Therefore, the rotary drive 12 can drive the application head 11 to rotate and change its orientation. Additionally, after picking up the heatsink, a CCD camera may be needed to align the flip-chip film and the heatsink. In this case, the rotary drive 12 can also drive the application head 11 to correct its position.

[0047] See Figure 2 and Figure 3 Specifically, in the embodiments of this application, the attachment head 11 has an attachment surface 111, which is used to directly contact the heat dissipation patch. The attachment head 11 also has a vacuum adsorption hole 112, one end of which penetrates the attachment surface 111, so that the attachment head 11 can vacuum adsorb the heat dissipation patch.

[0048] In the embodiments of this application, the attachment head assembly 10 further includes a connecting assembly 13 and a buffer structure 14. The connecting assembly 13 is connected between the attachment head 11 and the rotary drive member 12. The connecting assembly 13 and the attachment head 11 can move relative to each other in a direction parallel to the rotating shaft 121. The buffer structure 14 is disposed between the connecting assembly 13 and the attachment head 11.

[0049] The direction parallel to the rotation axis 121 is the Z direction.

[0050] Since the connecting assembly 13 connects the application head 11 and the rotary drive 12, the application head 11 can be rotated via the connecting assembly 13 when the rotary drive 12 is activated. Furthermore, since the connecting assembly 13 and the application head 11 can move relative to each other in a direction parallel to the rotation axis 121, the existence of the connecting assembly 13 ensures that the rotational movement of the application head 11 and its movement along the rotation axis 121 do not interfere with each other.

[0051] In addition, when the attachment head 11 attaches the heat dissipation sticker to the flip film, the buffer structure 14 buffers the interaction force between the attachment head 11 and the flip film, thereby reducing the risk of the attachment head 11 damaging the flip film due to excessive pressure during the application of the heat dissipation sticker.

[0052] Specifically, the buffer structure 14 includes an elastic element that is compressed between the connecting assembly 13 and the attachment head 11.

[0053] The method of buffering the interaction force between the attachment head 11 and the flip-chip film by using the elasticity of the elastic element is simple and reliable. Furthermore, the elastic element can provide a force to keep the attachment head 11 away from the connecting component 13, thereby enabling the heat dissipation sticker on the attachment head 11 to remain in contact with the flip-chip film, resulting in better adhesion.

[0054] The elastic element can be a spring or other elastic components, such as rubber parts.

[0055] In an embodiment of this application, the buffer structure 14 includes at least two springs, which are spaced apart from each other around the pivot 121.

[0056] Continue reading Figure 2 and Figure 3 Furthermore, the attachment head assembly 10 also includes a buffer slide rail 15 and a buffer slider 16. One of the buffer slide rail 15 and the buffer slider 16 is connected to the connecting assembly 13, and the other is connected to the attachment head 11. The buffer slide rail 15 and the buffer slider 16 slide in a direction parallel to the axis of rotation.

[0057] The buffer slide rail 15 and buffer slider 16 enable smoother and more stable relative movement between the connecting assembly 13 and the attachment head 11 in a direction parallel to the rotating shaft 121, making the buffering more effective.

[0058] Specifically, the buffer slide rail 15 is connected to the connecting assembly 13, and the buffer slider 16 is connected to the attachment head 11.

[0059] More specifically, the connecting assembly 13 includes a first connecting seat 131 and a second connecting seat 132. The first connecting seat 131 is connected to the rotary drive member 12 and has a shaft hole connected to the rotation shaft 121 of the rotary drive member 12. The second connecting seat 132 is connected to the first connecting seat 131 and has an extension plate extending away from the rotary drive member 12. The extension plate can be used to mount the buffer slide rail 15.

[0060] Please see Figures 3-5 In the embodiments of this application, the attachment head assembly 10 further includes a balance adjustment device 17, which is connected between the rotary drive member 12 and the attachment head 11. The balance adjustment device 17 is used to adjust the levelness of the attachment surface 111 of the attachment head 11.

[0061] The levelness of the attachment surface 111 refers to the angle between the attachment surface 111 and the horizontal plane.

[0062] By adjusting the attachment head 11 with the balance adjustment device 17, the attachment surface 111 of the attachment head 11 can be made as parallel as possible to the horizontal plane. This allows for a more balanced force to be applied to the flip film during the application of the heat sink, resulting in a better attachment effect and less damage to the flip film.

[0063] Specifically, the attachment head assembly 10 also includes an attachment head mounting base 18, a balance adjustment device 17 connected between the attachment head mounting base 18 and the attachment head 11, and the attachment head mounting base 18 connected to the rotary drive member 12. More specifically, the attachment head mounting base 18 is connected to the aforementioned buffer slider 16. The placement of the attachment head mounting base 18 provides mounting conditions for the balance adjustment device 17 and allows the balance adjustment device 17 and the attachment head 11 to be connected as a whole to the buffer slider 16, improving the reliability of the connection.

[0064] The balance adjustment device 17 includes an adapter plate 171, an adjustment plate 172, a set screw 173, and a bolt 174. The adapter plate 171 is connected to the rotary drive component 12. The adjustment plate 172 is located between the attachment head 11 and the adapter plate 171, and the adjustment plate 172 is connected to the attachment head 11. The adjustment plate 172 is connected to the adapter plate 171 through the set screw 173 and the bolt 174.

[0065] Specifically, the adapter plate 171 is connected to the attachment head mounting base 18.

[0066] When the set screw 173 is rotated, the adjusting plate 172 is pushed out by the set screw 173 and moves away from the adapter plate 171. When the bolt 174 is rotated, the adjusting plate 173 is pulled back by the bolt 174 and moves closer to the adapter plate 171. In this way, the levelness of the attachment surface 111 of the attachment head 11 can be adjusted.

[0067] In embodiments of this application, the number of set screws 173 and bolts 174 can be multiple, with the multiple set screws 173 and bolts 174 distributed at intervals to adjust the levelness of the attachment surface 111 of the attachment head 11 from different positions. Specifically, there are four set screws 173 and four bolts 174, with the four set screws 173 located at the four opposite corners of the adapter plate 171, and the four bolts 174 respectively positioned close to the four set screws 173.

[0068] The adjustment of the level of the attachment surface 111 of the attachment head 11 is achieved by the cooperation of the adapter plate 171, the adjusting plate 172, the set screw 173 and the bolt 174. This method is simple and precise.

[0069] like Figure 6 As shown in the embodiments of this application, the first driving device 20 includes a first driving member 21, a first lead screw and a first nut. The first driving member 21 is connected to the first lead screw, which extends along the first direction Z and is threadedly engaged with the first nut. The first nut is connected to the attachment head assembly 10.

[0070] When the first drive device 20 is started, the first drive member 21 can drive the first lead screw to rotate, thereby causing the first nut to move along the first direction Z, so as to drive the attachment head assembly 10 to move along the first direction Z.

[0071] like Figure 7 and Figure 8 As shown, the second driving device 30 includes a second driving member 31, a second lead screw 32 and a second nut 33. The second driving member 31 is connected to the second lead screw 32. The second lead screw 32 extends along the second direction Y and is threadedly engaged with the second nut 33. The second nut 33 is connected to the first driving device 20.

[0072] When the second drive device 30 is started, the second drive member 31 can drive the second lead screw 32 to rotate, thereby causing the second nut 33 to move along the second direction Y, so as to drive the first drive device 20 as a whole along the second direction Y.

[0073] The aforementioned method of achieving movement through the engagement of a lead screw and nut is smoother and more precise.

[0074] The first driving device 20 and the second driving device 30 in the embodiments of this application are described in detail below.

[0075] See Figure 6 The first driving device 20 also includes a first mounting base 22, a first slide rail 23 and a first slider 24. The first mounting base 22 is connected to the second driving device 30. The first driving member 21, the first lead screw and the first slide rail 23 are all mounted on the first mounting base 22. The first slider 24 is connected to the first nut and slides in cooperation with the first slide rail 23 in the first direction Z. The attachment head assembly 10 is connected to the first slider 24, specifically to the rotary driving member 12 on the attachment head assembly 10.

[0076] See Figure 7 and Figure 8 The second driving device 30 further includes a second mounting base 34, a second slide rail 35, and a second slider 36. The second mounting base 34 is connected to the third driving device 40. The second driving member 31, the second lead screw 32, and the second slide rail 35 are all mounted on the second mounting base 34. The second slider 36 is connected to the second nut 33 and slides along the second direction Y with the second slide rail 35. The first driving device 20 is connected to the second slider 36, specifically to the first mounting base 22. More specifically, the second mounting base 34 includes a base plate 341 and a side plate 342. One side of the base plate 341 is connected to the third driving device 40, and the side plate 342 is connected to the opposite edge of the base plate 341. The second driving member 31 and the second lead screw 32 are both mounted on the base plate 341, and the second slide rail 35 is located on the side of the side plate 342 facing away from the base plate 341. This arrangement ensures that the second driving device 30 is subjected to balanced forces, thus making its movement more stable.

[0077] like Figure 9 As shown in the embodiments of this application, the third driving device 40 includes a linear motor driving device, which is connected to the second driving device 30.

[0078] Before the thermal pad attaching device 100 attaches the thermal pad, the attaching head 11 needs to move to the station where the thermal pad is stored to pick up the thermal pad. After picking up the thermal pad, the attaching head 11 is aligned with the flip-chip film. The third drive device 40 is used more frequently in the entire attaching process because it can drive the second drive device 30, the first drive device 20 on the second drive device 30 and the attaching head assembly 10 as a whole. Compared with the servo motor drive, the linear motor drive device has a faster motion response speed, which is more conducive to improving the production cycle and saving production time.

[0079] Specifically, the third drive unit 40 is fixed above the square tube base 45, and the side of the square tube base 45 is provided with a drag chain mechanism 48.

[0080] Combination Figure 2 and Figure 7 In some embodiments, the heat dissipation patch attaching device 100 further includes at least two position detectors. Each position detector includes a transmitter 50 and a corresponding receiver 60. One of the transmitters 50 and receivers 60 of all position detectors is mounted on the second driving device 30 and is spaced apart from each other along the first direction Z. The other of the transmitters 50 and receivers 60 of all position detectors is mounted on the attachment head assembly 10. The position detectors are used to detect the position of the attachment head assembly 10.

[0081] The attachment head assembly 10 can attach a heat dissipation patch to the flip-chip film along the first direction Z. Therefore, by setting multiple position detectors spaced apart along the first direction Z, the position of the attachment head assembly 10 in the first direction Z can be detected in real time, reducing the risk of the attachment head assembly 10 moving beyond its travel distance in the first direction Z and applying excessive pressure to the flip-chip film. In addition, the second drive device 30 has a larger installation space than the first drive device 20. Therefore, mounting the transmitters 50 or receivers 60 of all position detectors to the second drive device 30 can improve installation reliability, thereby improving detection reliability.

[0082] Specifically, the position detector is a photoelectric through-beam sensor. One of the transmitter 50 and receiver 60 of all position detectors is mounted on the second slider 36 of the second drive device 30.

[0083] In the embodiments of this application, the position detectors include three, namely the upper limit position detector, the middle position detector and the lower limit position detector, which are arranged sequentially from top to bottom along the first direction Z.

[0084] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0085] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.

Claims

1. A heat dissipation patch application device, characterized in that, include: An attachment head assembly includes an attachment head and a rotary drive. The attachment head is used to attach a heat dissipation sticker, and the rotary drive is connected to the attachment head and is used to drive the attachment head to rotate around a pivot. A first driving device is connected to the attachment head assembly and is used to drive the attachment head assembly to move along a first direction; The second driving device is connected to the first driving device and is used to drive the first driving device to move in the second direction. as well as The third driving device is connected to the second driving device and is used to drive the second driving device to move in a third direction; The first direction, the second direction, and the third direction intersect each other.

2. The heat dissipation patch attaching device according to claim 1, characterized in that, The attachment head assembly further includes a connecting component and a buffer structure. The connecting component is connected between the attachment head and the rotary drive component. The connecting component and the attachment head can move relative to each other in a direction parallel to the rotation axis. The buffer structure is disposed between the connecting component and the attachment head.

3. The heat dissipation patch attaching device according to claim 2, characterized in that, The buffer structure includes an elastic element, which is compressed and disposed between the connecting assembly and the attachment head.

4. The heat dissipation patch attaching device according to claim 2, characterized in that, The attachment head assembly further includes a buffer slide rail and a buffer slider. One of the buffer slide rail and the buffer slider is connected to the connecting assembly, and the other is connected to the attachment head. The buffer slide rail and the buffer slider slide in a direction parallel to the rotation axis.

5. The heat dissipation patch attaching device according to claim 1, characterized in that, The attachment head assembly also includes a balance adjustment device connected between the rotary drive and the attachment head, which is used to adjust the levelness of the attachment surface of the attachment head.

6. The heat dissipation patch attaching device according to claim 5, characterized in that, The balance adjustment device includes an adapter plate, an adjustment plate, a set screw, and a bolt. The adapter plate is connected to the rotary drive component. The adjustment plate is located between the attachment head and the adapter plate, and is connected to the attachment head. The adjustment plate is connected to the adapter plate through the set screw and the bolt.

7. The heat dissipation patch attaching device according to any one of claims 1 to 6, characterized in that, The third driving device includes a linear motor driving device, which is connected to the second driving device.

8. The heat dissipation patch attaching device according to any one of claims 1 to 6, characterized in that, The first driving device includes a first driving member, a first lead screw, and a first nut. The first driving member is connected to the first lead screw, which extends along the first direction and is threadedly engaged with the first nut. The first nut is connected to the attachment head assembly; and / or The second driving device includes a second driving member, a second lead screw, and a second nut. The second nut is connected to the second driving device, the second lead screw is threadedly engaged with the second nut, and the second driving member is connected to the second lead screw.

9. The heat dissipation patch attaching device according to any one of claims 1 to 6, characterized in that, The heat dissipation patch attaching device further includes at least two position detectors. Each position detector includes a transmitter and a corresponding receiver. One of the transmitter and receiver of all the position detectors is mounted on the second driving device and is spaced apart from each other along the first direction. The other of the transmitter and receiver of all the position detectors is mounted on the attachment head assembly. The position detector is used to detect the position of the attachment head assembly.

10. The heat dissipation patch attaching device according to any one of claims 1 to 6, characterized in that, The attachment head has an adsorption surface for adsorbing heat dissipation stickers, and the attachment head also has a vacuum adsorption hole, one end of which penetrates the adsorption surface.

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