Silicon wafer suction cup with reverse blowing device

Abstract

The silicon wafer sucker comprises a silicon wafer sucker body, a reverse blowing block is arranged at the upper end of the silicon wafer sucker body, four sets of reverse blowing devices are additionally arranged at eight hollowed-out positions of the sucker, when a silicon wafer reaches the position above a material box, an adsorption electromagnetic valve is closed, reverse blowing electromagnetic valves are opened at the same time, and the reverse blowing block is arranged at the upper end of the silicon wafer sucker body. The fixing mode of the back flushing block is that the back flushing block can rotate by 360 degrees after being fixed through a bolt, the angle of the back flushing block is convenient to adjust, an air pipe connector M4 is reserved in the head, a back flushing air hole is reserved in the bottom, the interiors of the two connectors are communicated, and the back flushing device adopts position control logic. Position information of the linear motor is collected, when the position of the linear motor reaches a designated position, a control signal is sent to the plc, the plc controls the electromagnetic valve to be opened by outputting the control signal and automatically closed after delaying 30 ms, and the control mode has the advantages of being accurate in control and shorter in triggering time.

Description

Technical Field

[0001] This utility model belongs to the technical field of silicon wafer suction cups with a back-blowing device, specifically relating to a silicon wafer suction cup with a back-blowing device. Background Technology

[0002] A silicon wafer chuck equipped with a backflush device is a piece of equipment used in semiconductor manufacturing and processing. It is mainly used to provide stable gripping and releasing functions during the handling and assembly of silicon wafers. Through its built-in backflush device, the chuck can quickly release the silicon wafer after it has been adsorbed by a reverse airflow, reducing damage and contamination to the surface of the silicon wafer. This design improves the efficiency and safety of operation and ensures the integrity and accuracy of the silicon wafer during the production process.

[0003] Currently, medium and high-speed sorting machines mainly adopt the following two feeding methods. The first method uses a flexible, large-contact-surface suction cup with a linear motor to feed the suction cup. The second method uses a linear suction with a belt and suction block for feeding. The suction cup feeding process is as follows: silicon wafer trigger station photoelectric - suction cup opens for suction - wafer sensor triggers - suction cup moves laterally to the feeding box - suction closes. The current capacity requirement is 12,500, and the entire process must not exceed 600ms, otherwise it will lead to suction cup adsorption failure. During the process of the suction cup releasing the silicon wafer, the silicon wafer often falls off due to delay, and the suction cup times out alarms and stops working. The reason is that the contact area between the suction cup and the silicon wafer is too large. After the adsorption is closed, the wafer and the suction cup sponge cannot detach quickly due to static electricity, dirt, etc. This causes delays in the suction cup unloading cycle, making it impossible to meet production capacity. The suction cup uses sponge as a medium. Its advantages are that the flexible, large contact surface of the suction cup can ensure the uniform distribution of suction force and the high cleanliness requirements when contacting silicon wafers, making it more friendly to thin wafers. The disadvantage is that it can cause static electricity to be generated in the suction cup and cannot be released. Often, after the wafer is closed and adsorbed, it cannot be released, or the release time is incorrect, resulting in significant losses such as wafer flying and wafer stacking. Utility Model Content

[0004] The purpose of this utility model is to provide a silicon wafer chuck equipped with a back-blowing device to solve the problems mentioned in the background art. Currently, medium and high-speed sorting machines mainly use the following two feeding methods: the first method uses a flexible large contact surface chuck with a linear motor to cooperate with the chuck feeding method; the second method uses linear adsorption with a belt and adsorption block for feeding. The chuck feeding process is as follows: silicon wafer trigger station photoelectric - chuck opens for adsorption - wafer sensor triggers - chuck moves laterally to the feeding box - adsorption closes. Currently, the capacity requirement is 12,500, and the entire process must not exceed 600ms, otherwise it will lead to chuck adsorption failure. During the process of chuck releasing silicon wafers, silicon wafers often fall off due to delay, and the chuck times out alarms and stops working. The cause is that the contact surface between the chuck and the silicon wafer is too large. After adsorption is closed, the wafer and the chuck sponge cannot quickly detach due to static electricity, dirt, etc. This causes delays in the suction cup unloading cycle, making it impossible to meet production capacity. The suction cup uses sponge as a medium. Its advantages are that the flexible, large contact surface of the suction cup can ensure the uniform distribution of suction force and the high cleanliness requirements when contacting silicon wafers, making it more friendly to thin wafers. The disadvantage is that it can cause static electricity to be generated in the suction cup and cannot be released. Often, after the wafer is closed for suction, it cannot be released, or the release time is incorrect, resulting in major losses such as wafer flying and wafer stacking.

[0005] To achieve the above objectives, this utility model provides the following technical solution: a silicon wafer suction cup equipped with a back-blowing device, comprising a silicon wafer suction cup body, a back-blowing block provided at the upper end of the silicon wafer suction cup body, a back-blowing air hole provided at the upper end of the silicon wafer suction cup body, a screw installed at the upper end of the back-blowing air hole, multiple hollow holes distributed at the upper end of the silicon wafer suction cup body, airbag columns installed at the four corners of the lower end of the silicon wafer suction cup body, an air nozzle provided at the right end of the airbag column, a protective cover installed at the right end of the air nozzle, and an air film provided at the lower end of the airbag column.

[0006] Preferably, the back-blowing block is installed above the perforated hole.

[0007] Preferably, a fixing bracket is installed at the upper end of the screw.

[0008] Preferably, a nut is installed on the outer wall of the screw.

[0009] Preferably, the fixing bracket is installed on the upper part of the silicon wafer suction cup body by screws at the four corners of the lower end position.

[0010] Preferably, after the protective cover is removed, air can be added to the air nozzle using an air pump.

[0011] Preferably, the nozzle allows gas to enter the interior of the airbag column.

[0012] Preferably, the gas inside the airbag column causes the air film to bulge, and the airbag column is installed at the four lower corners of the silicon wafer chuck body.

[0013] Compared with the prior art, this utility model provides a silicon wafer suction cup equipped with a back-blowing device, which has the following beneficial effects:

[0014] 1. This device adds four sets of back-blowing devices at the eight cutout positions of the suction cup. When the silicon wafer reaches the top of the material box, the suction solenoid valve closes and the back-blowing solenoid valve opens simultaneously. The back-blowing block quickly detaches the silicon wafer. The back-blowing block is fixed by reserving a 4.2 mm diameter through hole at the tail. After being fixed with bolts, it can rotate 360 ​​degrees for easy adjustment of the angle of the back-blowing block. An M4 air pipe connector interface is reserved at the head, and a back-blowing air hole is reserved at the bottom. The two interfaces are internally connected. The back-blowing device control logic adopts position control. The specific logic is as follows: the linear motor position information is collected. When the linear motor reaches the designated position, a control signal is sent to the PLC. The PLC controls the solenoid valve to open through the output control signal and automatically closes after a 30ms delay. The advantage of this control method is that the control is precise and the trigger time is shorter.

[0015] 2. The original air holes were too close to the center point, requiring high air pressure to detach the silicon wafer, which easily damaged the wafer and caused chipping at the corners. This device uses a reverse-blowing mechanism that extends the original reverse-blowing air holes outwards, evenly blowing air onto the four corners of the silicon wafer. A very low air pressure is sufficient to quickly detach the wafer. The reverse-blowing block design fully utilizes the original air holes, using them as fixing holes for the support bracket. It is fixed with M4*10 screws. The reverse-blowing block is 40 mm long and 1 mm wide. The original air pipe is extended and connected to the modified reverse-blowing block. The position utilizes the eight cutouts evenly distributed on the four upper positions. To ensure even and accurate positioning, the reverse-blowing block must be tangent to the cutout edge, evenly distributed on the four cutout positions above and below the suction cup, approximately 15 mm from the edge, ensuring consistent reverse-blowing force. The control uses the original reverse-blowing control system, with the solenoid valve and control signal remaining unchanged. The original air pipe is connected to the existing reverse-blowing block, requiring consistent pipe length to ensure consistent airflow.

[0016] 3. This device has airbag columns installed at the four corners of the lower end of the silicon wafer chuck body. The airbag columns can be inflated through the air nozzles. The gas enters the airbag columns and causes the air film to bulge. This provides a buffer force when the silicon wafer chuck body lands, so as to prevent damage to the silicon wafer chuck body. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of a silicon wafer suction cup structure equipped with a back-blowing device according to the present invention.

[0018] Figure 2This is a schematic diagram of a silicon wafer suction cup airbag column structure equipped with a back-blowing device according to the present invention.

[0019] In the diagram: 1. Silicon wafer suction cup body; 2. Nut; 3. Screw; 4. Fixing bracket; 5. Backflush vent; 6. Backflush block; 7. Hole; 8. Airbag column; 9. Protective cover; 10. Air film; 11. Air nozzle. Detailed Implementation

[0020] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present utility model. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. All other embodiments obtained by those skilled in the art based on the embodiments of the present utility model without creative effort are within the protection scope of the present utility model.

[0021] The utility model provides, for example Figure 1-2 The silicon wafer suction cup shown includes a silicon wafer suction cup body 1, a back-blowing block 6 at the upper end of the silicon wafer suction cup body 1, a back-blowing air hole 5 at the upper end of the silicon wafer suction cup body 1, a screw 3 installed at the upper end of the back-blowing air hole 5, multiple hollow holes 7 distributed at the upper end of the silicon wafer suction cup body 1, airbag columns 8 installed at the four corners of the lower end of the silicon wafer suction cup body 1, an air nozzle 11 at the right end of the airbag column 8, a protective cover 9 installed at the right end of the air nozzle 11, and an air film 10 at the lower end of the airbag column 8.

[0022] When the silicon wafer reaches the top of the material box, the adsorption solenoid valve closes and the backflush solenoid valve opens simultaneously. The backflush block 6 quickly detaches the silicon wafer. The backflush block 6 is fixed by pre-drilling a 4.2 mm diameter through hole at the tail. After being fixed with bolts, it can rotate 360 ​​degrees for easy adjustment of the angle of the backflush block 6. The head has a pre-drilled air pipe connector interface M4, and the bottom has a pre-drilled backflush air hole 5. The two interfaces are internally connected. The backflush device control logic adopts position control. The specific logic is as follows: the linear motor position information is collected. When the linear motor reaches the designated position, a control signal is sent to the PLC. The PLC controls the solenoid valve to open through the output control signal and automatically closes after a 30ms delay.

[0023] like Figure 1 and Figure 2As shown, the backflush block 6 is installed above the hollow hole 7. A fixing bracket 4 is installed at the upper end of the screw 3. A nut 2 is installed on the outer wall of the screw 3. The fixing bracket 4 is installed above the silicon wafer suction cup body 1 by the screws 3 at the four corners of the lower end. After the protective cover 9 is removed, air can be added to the air nozzle 11 by the air pumping device. The air nozzle 11 allows the air to enter the interior of the airbag column 8. The air inside the airbag column 8 causes the air film 10 to inflate. The airbag column 8 is installed at the four corners of the lower end of the silicon wafer suction cup body 1.

[0024] The design of this backflush block 6 mainly makes full use of the existing backflush air hole 5, using this air hole as the fixing hole for the fixed bracket 4, and fixing it with M4*10 screws 3. The backflush block 6 is 40 mm long and 1 mm wide. The original air pipe is extended and connected to the modified backflush block 6. The position is evenly distributed on the top four of the eight hollow positions. In order to ensure uniform and accurate positioning, the backflush block 6 is required to be tangent to the edge of the hollow, and the position is evenly distributed on the top and bottom four hollow positions of the suction cup, about 15 mm away from the edge, to ensure that the backflush force is consistent. The control adopts the original backflush control system, and the solenoid valve and control signal remain unchanged. The original air pipe is connected to the existing backflush block 6, and the air pipe is required to be of consistent length to ensure consistent airflow.

[0025] Finally, it should be noted that the above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Although the present utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A silicon wafer chuck equipped with a back-blowing device, characterized in that, The device includes a silicon wafer suction cup body (1), a back-blowing block (6) at the upper end of the silicon wafer suction cup body (1), a back-blowing air hole (5) at the upper end of the silicon wafer suction cup body (1), a screw (3) at the upper end of the back-blowing air hole (5), multiple hollow holes (7) distributed at the upper end of the silicon wafer suction cup body (1), an airbag column (8) at the four corners of the lower end of the silicon wafer suction cup body (1), an air nozzle (11) at the right end of the airbag column (8), a protective cover (9) at the right end of the air nozzle (11), and an air film (10) at the lower end of the airbag column (8).

2. A silicon wafer chuck equipped with a back-blowing device according to claim 1, characterized in that: The backflush block (6) is installed above the perforated hole (7).

3. A silicon wafer chuck equipped with a back-blowing device according to claim 1, characterized in that: A fixing bracket (4) is installed at the upper end of the screw (3).

4. A silicon wafer chuck equipped with a back-blowing device according to claim 1, characterized in that: A nut (2) is installed on the outer wall of the screw (3).

5. A silicon wafer chuck equipped with a back-blowing device according to claim 3, characterized in that: The fixed bracket (4) is installed on the upper part of the silicon wafer suction cup body (1) by screws (3) at the four corners of the lower end.

6. A silicon wafer chuck equipped with a back-blowing device according to claim 1, characterized in that: After the protective cover (9) is removed, air can be added to the air nozzle (11) through an air pumping device.

7. A silicon wafer chuck equipped with a back-blowing device according to claim 6, characterized in that: The nozzle (11) allows gas to enter the interior of the airbag column (8).

8. A silicon wafer chuck equipped with a back-blowing device according to claim 7, characterized in that: The gas inside the airbag column (8) causes the air film (10) to bulge. The airbag column (8) is installed at the four corners of the lower end of the silicon wafer chuck body (1).

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