Carrying table equipment suitable for wafers of multiple specifications and dimensions

Abstract

The utility model relates to the technical field of semiconductor wafer detection equipment, in particular to carrying table equipment suitable for wafers of multiple specifications and dimensions. The platform deck equipment comprises a traceless suction nozzle and a lifting device, the traceless suction nozzle is used for adsorbing the wafer, and the lifting device can drive the traceless suction nozzle to ascend and descend so as to drive the wafer to move; the carrying table is erected above the traceless suction cup assembly, a first adsorption boss and a second adsorption boss which are different in size are arranged on the carrying table, the heights of the first adsorption boss and the second adsorption boss in the lifting action direction of the traceless suction nozzle are different, and the carrying table is used for driving the first adsorption boss or the second adsorption boss to adsorb a wafer. According to the invention, different adsorption surfaces are arranged on the carrying platform, so that product detection of wafers with different sizes is met, the requirement that the back surface of a specific product cannot be in contact with the product in a large area is met, the problem that the platform needs to be detached and replaced when machine types are changed is solved, the overall layout reduces the space requirement as much as possible, and a detection equipment structure type library is enriched.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor wafer inspection equipment technology, specifically to a stage device suitable for wafers of various sizes. Background Technology

[0002] Wafers are the most basic semiconductor material for making chips, and their quality directly determines the quality of the chips. In the semiconductor industry, there is a type of glass wafer that serves as the carrier for semiconductor wafers. During the manufacturing process of these glass wafers, defects generated during production need to be detected and classified according to the corresponding process technology, thereby facilitating product quality control and the selection of qualified products.

[0003] In related technologies, glass wafers are typically fixed using specialized adsorption equipment before screening and testing. However, these products come in various sizes and process stages, and also require high cleanliness levels. Therefore, the fixation process needs to minimize direct contact with the effective area. Consequently, conventional adsorption equipment is insufficient to meet the fixation requirements of various product types. Utility Model Content

[0004] In related technologies, some special wafer types have high cleanliness requirements and vary in size, making it difficult for conventional adsorption equipment to meet the fixation needs of various types of products.

[0005] In a first aspect, embodiments of this application provide a stage device suitable for wafers of various sizes, comprising:

[0006] A non-marking suction cup assembly includes a non-marking suction nozzle and a lifting device. The non-marking suction nozzle is used to adsorb wafers, and the lifting device can drive the non-marking suction nozzle to move up and down to move the wafers.

[0007] The platform is mounted on top of the non-marking suction cup assembly. The platform is provided with a first adsorption protrusion and a second adsorption protrusion of different sizes. The first adsorption protrusion and the second adsorption protrusion are at different heights in the lifting direction of the non-marking suction nozzle. Both the first adsorption protrusion and the second adsorption protrusion are used to adsorb the wafer.

[0008] In conjunction with the first aspect, in one embodiment, the stage surface 3 is annular, and a through hole is formed at the inner edge of the stage surface for the traceless suction nozzle to pass through.

[0009] In conjunction with the first aspect, in one embodiment, the first adsorption protrusion is disposed along the inner edge above the platform surface, the second adsorption protrusion is disposed along the outer edge above the platform surface, and the height of the first adsorption protrusion in the direction of the upward movement of the traceless suction nozzle is lower than that of the second adsorption protrusion.

[0010] In conjunction with the first aspect, in one embodiment, the through hole is provided with a clearance groove, the shape of which matches the traceless suction nozzle.

[0011] In conjunction with the first aspect, in one embodiment, it further includes: a position adjustment component connected to the non-marking suction cup assembly and the platform surface, the position adjustment component being capable of driving the non-marking suction cup assembly and the platform surface to move in the horizontal and vertical directions.

[0012] In conjunction with the first aspect, in one embodiment, the lifting device includes:

[0013] A lifting rod is mounted on the position adjustment assembly. One end of the lifting rod is provided with a suction nozzle mounting plate, and the suction nozzle mounting plate is provided with the non-marking suction nozzle.

[0014] A lifting cylinder is connected to the lifting rod, and the lifting cylinder is used to drive the lifting rod to perform a lifting action.

[0015] In conjunction with the first aspect, in one embodiment, the lifting device further includes a buffer assembled on the position adjustment assembly, the buffer being used to support and limit the suction nozzle mounting plate.

[0016] In conjunction with the first aspect, in one embodiment, the lifting device further includes: a limiting cylinder, which is assembled on the position adjustment assembly, the limiting cylinder abutting against the suction nozzle mounting plate, the limiting cylinder being used to lift the suction nozzle mounting plate to stop its descent, so that the adsorption surface of the non-marking suction nozzle is on the same horizontal plane as the first adsorption protrusion or the second adsorption protrusion.

[0017] In conjunction with the first aspect, in one embodiment, it further includes: a mounting base on which the lifting device is mounted.

[0018] In conjunction with the first aspect, in one embodiment, the mounting base is provided with a negative pressure monitoring device, which is signal-connected to the traceless suction nozzle, the first adsorption protrusion, and the second adsorption protrusion.

[0019] The beneficial effects of the technical solutions provided in this application include at least the following:

[0020] This application addresses the need for inspecting wafers of varying sizes by setting adsorption surfaces of different heights and sizes on the stage. It also accommodates the requirement that a large area on the back of certain products (such as glass wafers) cannot be in contact with the product, thus resolving the issue of platform replacement required for model changes. The compatibility significantly improves the efficiency of switching between models. The compact overall layout reduces the space requirements of the equipment. This application provides a feasible solution for specific application scenarios and enriches the library of inspection equipment structure types. Attached Figure Description

[0021] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0022] Figure 1 This is a schematic diagram of the platform device in the embodiments of this application;

[0023] Figure 2 This is a partial structural schematic diagram of the platform device in the embodiments of this application;

[0024] Figure 3 This is a schematic diagram of the platform structure in the embodiments of this application;

[0025] Figure 4 This is a schematic diagram of the structure of the non-marking suction cup assembly in the embodiments of this application.

[0026] In the diagram: 1. Non-marking suction nozzle; 2. Lifting device; 21. Lifting rod; 22. Suction nozzle mounting plate; 23. Lifting cylinder; 24. Buffer; 25. Limiting cylinder; 3. Platform surface; 31. First adsorption boss; 32. Second adsorption boss; 33. Clearance groove; 4. Position adjustment component; 5. Mounting base; 6. Negative pressure monitoring device. Detailed Implementation

[0027] To enable those skilled in the art to better understand the present application, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present application, and not all embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present application.

[0028] In related technologies, some special wafer types (such as glass wafers) have high cleanliness requirements and vary in size, making it difficult for conventional adsorption equipment to meet the fixation requirements of various types of products.

[0029] Firstly, such as Figure 1 and Figure 3 As shown, this application provides a stage device suitable for wafers of various sizes, comprising: a non-marking chuck assembly and a stage surface 3; wherein,

[0030] The non-marking suction cup assembly includes a non-marking suction nozzle 1 and a lifting device 2. The non-marking suction nozzle 1 is used for non-marking adsorption of wafers, and the lifting device 2 can drive the non-marking suction nozzle 1 to rise and fall to move the wafer. A platform 3 is placed above the non-marking suction cup assembly. The platform 3 is provided with a first adsorption protrusion 31 and a second adsorption protrusion 32 of different sizes. The first adsorption protrusion 31 and the second adsorption protrusion 32 are at different heights in the direction of the lifting and falling of the non-marking suction nozzle 1. Both the first adsorption protrusion 31 and the second adsorption protrusion 32 are used to adsorb wafers.

[0031] Optionally, the stage surface 3 has a vacuum inlet connected to its side, through which the first adsorption protrusion 31 or the second adsorption protrusion 32 can adsorb the wafer.

[0032] It is understood that in the above embodiments, the first adsorption protrusion 31 and the second adsorption protrusion 32 have different heights. Therefore, when the non-marking nozzle 1 lifts and lowers the wafer, wafers of different sizes will fall onto adsorption surfaces at different heights. This application, by setting adsorption surfaces of different heights and sizes on the platform, meets the product inspection needs of wafers of different sizes. It also meets the need for large areas of the back side of specific products (such as glass wafers) that cannot be in contact with the product, solving the problem of platform replacement required for model changes. Its compatibility greatly improves the efficiency of switching models. The overall layout minimizes space requirements, providing a feasible solution for this specific application scenario and enriching the library of inspection equipment structure types. Furthermore, this application…

[0033] In a first optional embodiment of this application, the platform surface 3 is annular, and the inner and outer ring edges of the platform surface 3 are respectively provided with the first adsorption protrusion 31 and the second adsorption protrusion 32, and the height of the first adsorption protrusion 31 in the upward movement direction of the traceless suction nozzle 1 is lower than that of the second adsorption protrusion 32.

[0034] It is worth noting that the platform 3 of this application is a hollow ring, and the hollow part of the inner ring allows the traceless suction nozzle 1 to be raised and lowered to perform the suction task.

[0035] Furthermore, such as Figure 3 As shown, the inner wall of the inner ring of the platform surface 3 is provided with a relief groove 33 that matches the shape and size of the traceless suction nozzle 1.

[0036] It is worth noting that after the non-marking nozzle 1 rises and adsorbs the wafer, it performs a descent action until it reaches the designated position. When the non-marking nozzle 1 reaches the designated position, it needs to be on the same horizontal plane as the first adsorption boss 31 or the second adsorption boss 32 so that the wafer can be placed on the first adsorption boss 31 or the second adsorption boss 32.

[0037] Furthermore, such as Figure 1 and Figure 3 As shown, the first adsorption protrusion 31 is arranged along the inner circumference of the platform surface 3, and the second adsorption protrusion 32 is arranged along the outer circumference of the platform surface 3. The height of the first adsorption protrusion 31 in the upward movement direction of the traceless suction nozzle 1 is lower than that of the second adsorption protrusion 32. Optionally, the first adsorption protrusion 31 can have an 8-inch adsorption surface, and the adsorption surface of the second adsorption protrusion 32 can have a diameter of 12 inches.

[0038] It is understood that "above" on the platform surface 3 refers to the side of the platform surface 3 that is furthest away from the non-marking suction cup assembly. Simultaneously, both the first suction protrusion 31 and the second suction protrusion 32 are located above the platform surface 3. The first suction protrusion 31 and the second suction protrusion 32 are arranged in a ring shape along the inner and outer circumferential directions. The inner diameter of the first suction protrusion 31 is smaller than the inner diameter of the second suction protrusion 32, and the height of the first suction protrusion 31 in the upward movement direction of the non-marking suction nozzle 1 is lower than that of the second suction protrusion 32.

[0039] It is worth noting that due to certain special characteristics of wafers, the direct contact area of ​​the wafer is on its outer edge, so the first adsorption protrusion 31 is lower than the second adsorption protrusion 32. In this application, the first adsorption protrusion 31 and the second adsorption protrusion 32 are arranged along the inner and outer edges of the annular platform surface 3, thus forming an annular shape that matches the wafer shape. Furthermore, by setting different heights for adsorption surfaces of different sizes, the need for compatibility with multiple products is met. In use, since the traceless suction nozzle 1 passes through the inner ring of the platform surface 3 to adsorb the wafer and then lowers it onto the first adsorption protrusion 31 or the second adsorption protrusion 32, large wafers will not fall to the height of the first adsorption protrusion 31 during the falling process, and therefore will not touch the first adsorption protrusion 31, but will fall onto the larger and higher second adsorption protrusion 32. Small wafers will not touch the second adsorption protrusion 32 when the falling height reaches the level of the second adsorption protrusion 32, but will continue to fall onto the first adsorption protrusion 31.

[0040] In some preferred embodiments, the platform device further includes a position adjustment component 4, which is connected to the non-marking suction cup assembly and the platform surface 3, and the position adjustment component 4 can drive the non-marking suction cup assembly and the platform surface 3 to move in the horizontal and vertical directions.

[0041] In some alternative implementations, the position adjustment component 4 includes a direct drive motor.

[0042] It is worth noting that after the wafer is placed on the adsorption surface and fixed in place, wafer defect detection is still required. At this time, the position adjustment component 4 drives the non-marking suction cup component, the stage surface 3, and the wafer to adjust their height and horizontal position synchronously to facilitate wafer defect detection.

[0043] In some specific implementation methods, such as Figure 2 and Figure 4 As shown, the lifting device 2 includes: a lifting rod 21 and a lifting cylinder 23; wherein,

[0044] A lifting rod 21 is mounted on the position adjustment assembly 4. One end of the lifting rod 21 is provided with a suction nozzle mounting plate 22, and the suction nozzle mounting plate 22 is provided with the non-marking suction nozzle 1. A lifting cylinder 23 is connected to the lifting rod 21 and is used to drive the lifting rod 21 to perform lifting actions.

[0045] It is worth noting that the lifting cylinder 23 can limit the range of motion of the lifting rod 21, making it easy to adjust.

[0046] In some preferred embodiments, the lifting device 2 further includes a buffer 24, which is assembled on the position adjustment assembly 4, and the buffer 24 is used to support and limit the suction nozzle mounting plate 22. Preferably, the height of the buffer 24 is adjustable.

[0047] It is understandable that the buffer 24 is used to buffer the nozzle mounting plate 22 on the one hand, and the range of lifting and lowering movement of the nozzle mounting plate 22 can also be adjusted by adjusting the height of the buffer 24.

[0048] In some optional embodiments, the lifting device 2 further includes a limiting cylinder 25, which is mounted on the position adjustment assembly 4. The limiting cylinder 25 abuts against the nozzle mounting plate 22, and the limiting cylinder 25 is used to limit the range of movement of the nozzle mounting plate 22. Optionally, the limiting cylinder 25 may be a pen-shaped cylinder.

[0049] Furthermore, the limiting cylinder 25 is used to limit the movement range of the lifting nozzle mounting plate 22 to stop its descent, so that the adsorption surface of the non-marking nozzle 1 is on the same horizontal plane as the first adsorption protrusion 31 or the second adsorption protrusion 32.

[0050] It should be noted that, given the dual-acting nature of the lifting cylinder 23, it cannot accommodate height differences on the platform (the nozzle mounting plate 22 and the non-marking nozzle 1 need to be on the same horizontal plane as the first suction boss 31 or the second suction boss 32 after descending to their designated positions). Therefore, a limiting cylinder 25 is used to lift the nozzle mounting plate 22 as a second limiting mechanism during its descent. This, in conjunction with the lifting device 2 and the equipment, allows the descending position of the nozzle mounting plate 22 to automatically switch between two heights, facilitating adaptation to wafers of different sizes.

[0051] Furthermore, the platform equipment also includes: a mounting base 5 on which the lifting device 2 is mounted. The mounting base 5 is equipped with a negative pressure monitoring device 6, which is signal-connected to the traceless suction nozzle 1, the first suction protrusion 31, and the second suction protrusion 32.

[0052] It is understandable that, such as Figure 1 The negative pressure monitoring device 6 shown includes three negative pressure digital displays, which are used to display the negative pressure adsorption status of the traceless suction nozzle 1, the first adsorption protrusion 31, and the second adsorption protrusion 32, respectively.

[0053] The operational flow of the platform equipment in this application includes:

[0054] Step S1: After confirming the size of the wafer, control the lifting cylinder 23 to rise. Once in position, use the loading and unloading robot to place the wafer onto the non-marking nozzle 1 of the nozzle mounting plate 22.

[0055] Step S2: After the traceless suction nozzle 1 is vacuum adsorbed and fixed, the lifting cylinder 23 descends, allowing the non-functional area on the outer edge of the wafer to contact the first adsorption protrusion 31 or the second adsorption protrusion 32.

[0056] Step S3: The first adsorption protrusion 31 or the second adsorption protrusion 32 is vacuum-activated to fix the wafer. The position adjustment component 4 is used to move the equipment in the horizontal and vertical directions to perform wafer defect detection. After the detection is completed, the vacuum adsorption of the first adsorption protrusion 31 or the second adsorption protrusion 32 is turned off.

[0057] Step S4: The lifting cylinder 23 is driven again to rise to the preset position, and the vacuum suction nozzle 1 is closed. The wafer is then removed by the robotic arm, and the entire process is complete.

[0058] In summary, this application satisfies the product inspection of wafers of different sizes by setting adsorption surfaces of different heights and sizes on the stage. It also meets the needs of specific products (such as glass wafers) where the back side cannot be in contact with the product, thus solving the problem of platform replacement required for model changes. The compatibility greatly improves the efficiency of switching models. The overall layout minimizes space requirements, providing a feasible solution for this specific application scenario and enriching the library of inspection equipment structure types.

[0059] In the description of this application, it should be noted that the terms "upper," "lower," etc., indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application. Unless otherwise expressly specified and limited, the terms "installed," "connected," and "linked" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication between two elements. For those skilled in the art, the specific meaning of the above terms in this application can be understood according to the specific circumstances.

[0060] It should be noted that in this application, relational terms such as "first" and "second" are used merely to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0061] The above description is merely a specific embodiment of this application, enabling those skilled in the art to understand or implement this application. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of this application. Therefore, this application is not to be limited to the embodiments shown herein, but is to be accorded the widest scope consistent with the principles and novel features claimed herein.

Claims

1. A stage device suitable for wafers of various sizes, characterized in that, include: The non-marking suction cup assembly includes a non-marking suction nozzle (1) and a lifting device (2). The non-marking suction nozzle (1) is used to adsorb wafers, and the lifting device (2) can drive the non-marking suction nozzle (1) to rise and fall to move the wafers. The platform (3) is mounted on top of the non-marking suction cup assembly. The platform (3) is provided with a first adsorption protrusion (31) and a second adsorption protrusion (32) of different sizes. The first adsorption protrusion (31) and the second adsorption protrusion (32) are at different heights in the lifting direction of the non-marking suction nozzle (1). Both the first adsorption protrusion (31) and the second adsorption protrusion (32) are used to adsorb the wafer.

2. The platform device as described in claim 1, characterized in that: The platform surface 3 is annular, and the inner and outer ring edges of the platform surface (3) are respectively provided with the first adsorption protrusion (31) and the second adsorption protrusion (32), and the height of the first adsorption protrusion (31) in the upward movement direction of the traceless suction nozzle (1) is lower than that of the second adsorption protrusion (32).

3. The platform device as described in claim 2, characterized in that: The first adsorption protrusion (31) is arranged along the inner circumference of the platform surface (3), and the second adsorption protrusion (32) is arranged along the outer circumference of the platform surface (3).

4. The platform device as described in claim 2, characterized in that: The inner wall of the inner ring of the platform 3 is provided with a relief groove (33), the shape of which matches the traceless suction nozzle (1).

5. The platform device as described in claim 1, characterized in that, Also includes: A position adjustment component (4) is connected to the non-marking suction cup assembly and the platform surface (3), and the position adjustment component (4) can drive the non-marking suction cup assembly and the platform surface (3) to move in the horizontal and vertical directions.

6. The platform device as described in claim 5, characterized in that, The lifting device (2) includes: A lifting rod (21) is installed on the position adjustment assembly (4). One end of the lifting rod (21) is provided with a suction nozzle mounting plate (22), and the suction nozzle mounting plate (22) is provided with the non-marking suction nozzle (1). A lifting cylinder (23) is connected to the lifting rod (21), and the lifting cylinder (23) is used to drive the lifting rod (21) to perform lifting action.

7. The platform device as described in claim 6, characterized in that, The lifting device (2) further includes a buffer (24), which is mounted on the position adjustment assembly (4), and the buffer (24) is used to support and limit the nozzle mounting plate (22).

8. The platform device as described in claim 6, characterized in that, The lifting device (2) further includes a limiting cylinder (25), which is mounted on the position adjustment assembly (4). The limiting cylinder (25) abuts against the suction nozzle mounting plate (22). The limiting cylinder (25) is used to lift the suction nozzle mounting plate (22) to stop its descent, so that the adsorption surface of the traceless suction nozzle (1) is on the same horizontal plane as the first adsorption protrusion (31) or the second adsorption protrusion (32).

9. The platform device as described in claim 1, characterized in that, Also includes: Mounting base (5), on which the lifting device (2) is mounted.

10. The platform device as described in claim 9, characterized in that: The mounting base (5) is equipped with a negative pressure monitoring device (6), which is connected to the traceless suction nozzle (1), the first adsorption protrusion (31), and the second adsorption protrusion (32).

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