Die bonding equipment and ejector pin mechanism thereof

Abstract

The utility model provides a die bonding device and an ejector pin mechanism thereof. The ejector pin mechanism comprises a shell, an ejector pin and an elastic piece. One end of the shell is opened to form a containing cavity. The ejector pin is provided with a wafer taking end used for jacking a wafer located on one side of the bearing body, the ejector pin extends into the containing cavity, the wafer taking end is located outside the shell, and the ejector pin is movably connected with the shell. The elastic piece is arranged on the ejector pin in a sleeving manner, one end of the elastic piece is connected with the ejector pin, the other end of the elastic piece is connected with the inner circumferential wall of the shell, and the elastic piece can stretch and retract along with movement of the ejector pin, so that the wafer taking end moves towards the direction of the shell to retract, and the wafer is separated from being jacked and taken. According to the ejector pin mechanism, when the external force borne by the wafer taking end of the ejector pin is larger than the balance force for keeping natural stretching of the elastic piece, the ejector pin can stably retract towards the direction of the shell under the action of the elastic piece, so that the wafer taking end is separated from jacking of the wafer, the wafer is prevented from being damaged by jacking, the integrity of the wafer is ensured, and the wafer taking efficiency is improved. And the picture uniformity and integrity of the display screen are ensured.

Description

Technical Field

[0001] This utility model relates to the field of die bonding equipment technology, and in particular to a die bonding device and its ejector pin mechanism. Background Technology

[0002] Die bonding is a crucial process in industries such as semiconductors, optoelectronics, and electronics. During die bonding, a push pin is often used to lift the wafer attached to the blue film, causing it to detach from the blue film. This process is called die removal, and maintaining stable and uniform stress on the wafer surface is extremely important.

[0003] Currently, in practical applications, such as during the manufacturing process of LED displays, the pressure applied to the wafers during the die-bonding process can fluctuate uncontrollably due to performance variations in the die-bonding equipment, inaccurate parameter settings, or interference from easily damaged components. This unstable pressure acts directly on the wafer, preventing the wafer's underlay from receiving uniform force per unit area. Consequently, the wafer's substrate is punctured, leaving black spots on the wafer surface. This not only damages the uniformity and integrity of the display screen, leading to display abnormalities such as dark spots and dead pixels, but may also affect the lifespan and stability of the display screen. Utility Model Content

[0004] The purpose of this invention is to provide a die bonding device and its ejector pin mechanism that can improve the stability of crystal taking.

[0005] To achieve the above objectives, the present invention adopts the following technical solution:

[0006] According to one aspect of this application, a push pin mechanism is provided for lifting a wafer on a carrier. The push pin mechanism includes:

[0007] The shell has an opening at one end forming a receiving cavity;

[0008] A ejector pin has a pick-up end for picking up a wafer located on one side of a carrier. The ejector pin extends into the receiving cavity and places the pick-up end outside the housing. The ejector pin is movably connected to the housing.

[0009] An elastic element is sleeved on the ejector pin. One end of the elastic element is connected to the ejector pin, and the other end is connected to the inner peripheral wall of the housing. The elastic element can extend and retract as the ejector pin moves, so that the wafer-picking end moves toward the housing to retract, thereby disengaging from the wafer.

[0010] In some embodiments, the ejector pin includes a needle bar and a needle body connected to the needle bar, the end of the needle body facing away from the needle bar forming the crystal-taking end, and the needle bar being movably disposed on the housing;

[0011] The needle bar includes a connected main body and a limiting part. The limiting part is located at the end of the main body facing the opening of the housing, and the outer diameter of the limiting part is larger than the outer diameter of the main body.

[0012] The housing is provided with a limiting protrusion, and the limiting protrusion has a through hole for the main body to pass through; the inner diameter of the through hole is smaller than the outer diameter of the limiting part;

[0013] The elastic element is sleeved on the main body, and the elastic element abuts and is located between the limiting part and the limiting protrusion.

[0014] In some embodiments, the limiting portion includes a limiting segment and a connecting segment, wherein the limiting segment is connected between the connecting segment and the main body portion;

[0015] The outer diameter of the limiting section is larger than the outer diameter of the main body; the outer diameter of the connecting section is larger than the outer diameter of the limiting section, and the outer diameter of the connecting section is larger than the inner diameter of the opening of the housing;

[0016] When the elastic element is in a natural expansion and contraction state, the connecting section and the open end of the housing are spaced apart.

[0017] In some embodiments, the limiting segment is provided with a slider, the housing is provided with a slide rail, the slide rail extends along the length direction of the housing, and the slider slides in cooperation with the slide rail;

[0018] When the elastic element is in a natural expansion and contraction state, the distance between the end of the connecting section facing the main body and the opening end of the housing is consistent with the length of the slide.

[0019] In some embodiments, the limiting segment is provided with a mounting hole, the axial direction of the mounting hole being consistent with the radial direction of the limiting segment; the inner diameter of the mounting hole is adapted to the outer diameter of the slider;

[0020] The housing has two through holes, which are symmetrically arranged about the central axis of the housing; the through holes are oblong holes, and the length direction of the through holes extends along the length direction of the housing, and the two through holes form the slide.

[0021] The slider is inserted through the mounting hole and the two through holes, and the slider can move within the through holes.

[0022] In some embodiments, the needle body is detachably connected to the connecting segment;

[0023] The connecting section includes a body and multiple connecting blocks. The body is connected to the limiting section. The multiple connecting blocks are arranged circumferentially at a distance from one end of the body away from the limiting section. The multiple connecting blocks surround and form a socket. The needle body is inserted into the socket.

[0024] The ejector pin mechanism also includes a locking member, which is sleeved on the connecting section and used to lock the multiple connecting blocks and the pin body.

[0025] In some embodiments, the outer periphery of the connecting segment is provided with an external thread, and the inner peripheral wall of the locking member is provided with an internal thread. The external thread and the internal thread are screwed together to realize the connection and fixation of the multiple connecting blocks and the needle body.

[0026] The external threads are arranged at adjacent ends of the connecting block and the body.

[0027] In some embodiments, the connecting segment includes a guide and a connector, the connector being connected between the guide and the body; the outer diameter of the integral formed by the guides of the plurality of connecting blocks gradually increases toward the limiting segment;

[0028] The inner diameter of the locking member is adapted to the outer diameter of the connecting section.

[0029] In some embodiments, the ejector mechanism further includes a needle cap having a mounting cavity with a top opening, a housing extending into the mounting cavity and movably connected to the needle cap, the housing being movable relative to the needle cap to allow the wafer-fetching end to extend out of the needle cap and eject the wafer; the top of the needle cap is provided with an evacuation hole communicating with its interior.

[0030] The ejector mechanism also includes an adsorption element, which is connected to the needle cap and is used to draw air from above the needle cap to adsorb and fix the carrier.

[0031] According to another aspect of this application, this application also provides a die bonding device, including a host and a die bonding mechanism and a pin mechanism as described in any of the above, wherein the die bonding mechanism and the pin mechanism are arranged vertically at intervals, and both the die bonding mechanism and the pin mechanism are electrically connected to the host, wherein the pins of the pin mechanism are used to lift the wafer on the carrier, and the die bonding mechanism is used to grasp and transfer the lifted wafer.

[0032] As can be seen from the above technical solution, this utility model has at least the following advantages and positive effects:

[0033] In this application, the ejector pin is movably connected to the housing, allowing the ejector pin to move relative to the housing. An elastic element is sleeved on the ejector pin, with its two ends connected to the ejector pin and the housing, respectively. This arrangement not only restricts the position of the elastic element but also provides elastic support for the ejector pin, thereby improving the stability of the ejector pin when picking up the wafer and ensuring uniform force on the wafer.

[0034] Therefore, when the external force on the chip-fetching end of the ejector pin exceeds the balance force of the elastic element maintaining its natural expansion and contraction, the ejector pin can move relative to the housing. At the same time, the elastic element will be compressed and deformed as the ejector pin moves, accumulating elastic potential energy. This allows the chip-fetching end to retract towards the housing, reducing the external force applied to the chip by the chip-fetching end, causing the chip-fetching end to slightly detach from the chip, thus weakening the impact of the chip-fetching end on the chip, or even removing the external force applied to the chip by the chip-fetching end, so that the chip-fetching end completely detaches from the chip, avoiding damage to the chip, thereby ensuring the integrity of the chip and ensuring the processing quality and service life of the display screen.

[0035] When the external force on the crystal-taking end returns to normal, the elastic element recovers its deformation and releases elastic potential energy because the external force is removed. Under the action of elastic potential energy, the ejector pin can move relative to the housing so that the crystal-taking end can be reset in a direction away from the housing, so as to facilitate subsequent crystal-taking work.

[0036] In addition, the timely retraction of the ejector pin is achieved under the elastic support of the elastic element, which can also avoid wear and breakage caused by excessive contact force and friction between the ejector pin and the wafer, thereby improving the service life of the ejector pin. Attached Figure Description

[0037] Figure 1 This is a schematic diagram of the ejector mechanism in this embodiment.

[0038] Figure 2 This is a partial structural diagram of the ejector mechanism in this embodiment.

[0039] Figure 3 yes Figure 2 A cross-sectional view of the central ejector mechanism along the AA direction.

[0040] Figure 4 yes Figure 3 Enlarged structural diagram at point B.

[0041] Figure 5 This is a schematic diagram of the die bonding device in this embodiment.

[0042] The annotations in the attached figures are explained as follows:

[0043] 100. Die bonding equipment; 110. Die bonding mechanism; 1101. Die bonding arm; 1102. Suction nozzle; 120. Ejector mechanism; 1. Housing; 11. Limiting protrusion; 12. Positioning protrusion; 13. First section; 14. Second section; 15. Third section; 16. Perforation; 2. Ejector pin; 21. Pin bar; 211. Main body; 212. Limiting part; 213. Limiting section; 214. Connecting section; 2141. Body; 2142. Connecting block; 2143. Connecting body; 2144. Guide body; 215. Insertion hole; 22. Pin body; 23. Die picking end; 3. Elastic element; 4. Slider; 5. Slide rail; 6. Locking element; 7. Pin cap; 130. Fixing element; 200. Carrier; 300. Wafer. Detailed Implementation

[0044] Typical embodiments embodying the features and advantages of this utility model will be described in detail in the following description. It should be understood that this utility model can have various variations in different embodiments, all of which do not depart from the scope of this utility model, and the descriptions and illustrations therein are for illustrative purposes only and not intended to limit this utility model.

[0045] In the description of this application, it should be understood that, in the embodiments shown in the accompanying drawings, the indications of direction or positional relationships (such as up, down, left, right, front, and back) are merely for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. These descriptions are appropriate when these elements are in the positions shown in the accompanying drawings. If the description of the positions of these elements changes, these directional indications also change accordingly.

[0046] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the stated features. In the description of this application, "a plurality of" means two or more, unless otherwise explicitly specified.

[0047] This application provides a ejector mechanism for the die bonding process in display manufacturing, specifically for lifting wafers onto a carrier. It should be noted that the ejector mechanism in this application is not only applicable to die bonding in display manufacturing, but can also be applied to the manufacturing process of any product requiring die bonding in industries such as semiconductors, optoelectronics, and electronics.

[0048] It should be noted that the carrier mainly serves to fix and protect the wafer during the wafer processing. The two opposite sides of the carrier are the first side and the second side, respectively. The first side has a certain degree of adhesiveness, which is used to bond and fix the wafer to ensure that the wafer remains attached to the first side of the carrier during processing steps such as laser cutting, and to concentrate the wafer on the first side of the carrier to prevent it from scattering.

[0049] The carrier can be a blue film, UV film, etc.

[0050] This application uses the use of a pin mechanism in the die bonding process during the manufacturing of a display screen as an example for illustration.

[0051] The following detailed description of specific embodiments of the ejector mechanism of this application is provided in conjunction with the accompanying drawings.

[0052] Figure 1 This is a schematic diagram of the ejector mechanism in this embodiment. Figure 2 This is a partial structural diagram of the ejector mechanism in this embodiment. Figure 3 for Figure 2 A cross-sectional view of the central ejector mechanism along the AA direction.

[0053] refer to Figures 1-3 The ejector mechanism 120 includes a housing 1, an ejector pin 2, and an elastic element 3. One end of the housing 1 has an opening forming a receiving cavity. The ejector pin 2 has a pick-up end 23 for picking up a wafer 300 located on one side of the carrier 200. The ejector pin 2 extends into the receiving cavity and the pick-up end 23 is located outside the housing 1. The ejector pin 2 and the housing 1 are movably connected. The elastic element 3 is sleeved on the ejector pin 2. One end of the elastic element 3 is connected to the ejector pin 2, and the other end is connected to the inner peripheral wall of the housing 1. The elastic element 3 can extend and retract as the ejector pin 2 moves, causing the pick-up end 23 to move towards the housing 1 and retract, thereby disengaging from picking up the wafer 300.

[0054] In this application, the ejector pin 2 is movably connected to the housing 1, so that the ejector pin 2 can move relative to the housing 1; an elastic element 3 is sleeved on the ejector pin 2, and the two ends of the elastic element 3 are respectively connected to the ejector pin 2 and the housing 1. This arrangement can not only limit the setting position of the elastic element 3, but also the elastic element 3 can play an elastic support role for the ejector pin 2, so as to improve the stability when the ejector pin 2 picks up the wafer 300 and ensure that the wafer 300 is subjected to uniform force. Therefore, when the external force on the chip-fetching end 23 of the ejector pin 2 is greater than the balance force of the elastic element 3 maintaining natural expansion and contraction, the ejector pin 2 can move relative to the housing 1. At the same time, the elastic element 3 will be compressed and deformed as the ejector pin 2 moves, accumulating elastic potential energy. This can achieve the retraction of the chip-fetching end 23 towards the housing 1, thereby reducing the external force applied by the chip-fetching end 23 to the chip 300, so that the chip-fetching end 23 is slightly separated from the chip 300, thus weakening the influence of the chip-fetching end 23 on the chip 300, or even removing the external force applied by the chip-fetching end 23 to the chip 300, so that the chip-fetching end 23 is completely separated from the chip 300, avoiding damage to the chip 300, thereby ensuring the integrity of the chip 300, ensuring the processing quality and service life of the display screen.

[0055] When the external force on the crystal-taking end 23 returns to normal, the elastic element 3 recovers its deformation and releases elastic potential energy because the external force is removed. Under the action of elastic potential energy, the ejector pin 2 can move relative to the housing 1 so that the crystal-taking end 23 is reset in a direction away from the housing 1, so as to facilitate subsequent crystal-taking work.

[0056] In addition, the timely retraction of the ejector pin 2 under the elastic support of the elastic element 3 can also prevent wear and breakage caused by the large contact force and excessive friction between the ejector pin 2 and the wafer 300, thereby improving the service life of the ejector pin 2.

[0057] refer to Figure 2 , Figure 3 One end of the shell 1 is open to form a receiving cavity. In this embodiment, the shell 1 is a columnar hollow structure, which is simple in structure and easy to manufacture.

[0058] The housing 1 has a limiting protrusion 11 inside, and the limiting protrusion 11 has a through hole that communicates with the opening of the housing 1. In this embodiment, the inner diameter of the through hole is smaller than the inner diameter of the opening of the housing 1.

[0059] The housing 1 also includes a positioning protrusion 12, which is spaced apart from the limiting protrusion 11 along the length of the housing 1, with the positioning protrusion 12 located on the side of the limiting protrusion 11 furthest from the opening of the housing 1. In this embodiment, the positioning protrusion 12 has a through hole that communicates with the through hole. The design of the through hole can reduce the weight of the housing 1. The inner diameter of the through hole is smaller than the inner diameter of the through hole.

[0060] Specifically, the shell 1 includes a first segment 13, a second segment 14, and a third segment 15, which are distributed sequentially along the length of the shell 1. The first segment 13 has an opening at the end furthest from the second segment 14. The two ends of the first segment 13 extend through to form a first cavity, the two ends of the second segment 14 extend through to form a second cavity, and the two ends of the third segment 15 extend through to form a third cavity. The first, second, and third cavities are interconnected to form a receiving cavity. The inner diameter of the first segment 13 is larger than the inner diameter of the second segment 14. In this case, the portion of the second segment 14 extending inward beyond the first segment 13 forms a limiting protrusion 11, and the second cavity is formed by a through hole. The inner diameter of the second segment 14 is larger than the inner diameter of the third segment 15. In this case, the portion of the third segment 15 extending inward beyond the second segment 14 forms a positioning protrusion 12, and the third cavity is formed by a through hole.

[0061] refer to Figure 2 and Figure 3 The ejector pin 2 has a pick-up end 23, which is used to pick up the wafer 300 located on one side of the carrier 200, so that the wafer 300 is removed from the carrier 200. The ejector pin 2 extends into the receiving cavity and the pick-up end 23 is located outside the housing 1. The ejector pin 2 is movably connected to the housing 1 and can move relative to the housing 1 so that the pick-up end 23 moves toward the housing 1 and retracts, thereby disengaging from picking up the wafer 300.

[0062] In this embodiment, the ejector pin 2 includes a needle bar 21 and a needle body 22.

[0063] The needle bar 21 is movably connected to the housing 1. The needle bar 21 includes a connected main body 211 and a limiting part 212. In practical application, the needle bar 21 extends into the receiving cavity with the end containing the main body 211, so that the limiting part 212 is located at the end of the main body 211 facing the opening of the housing 1.

[0064] The shape and outer diameter of the main body 211 are adapted to the through hole of the housing 1. Since the inner diameter of the first segment 13 is larger than the inner diameter of the second segment 14, and the inner diameter of the through hole of the positioning protrusion 12 is smaller than the inner diameter of the through hole of the limiting protrusion 11, that is, the outer diameter of the main body 211 is larger than the inner diameter of the through hole, the main body 211 can abut against the positioning protrusion 12 during the movement of the main body 211 in the accommodating cavity. The positioning protrusion 12 can play a positioning role for the main body 211, that is, restrict the main body 211 to move only in the first cavity and the second cavity of the housing 1, thereby limiting the movement range of the needle rod 21.

[0065] In this embodiment, the main body 211 has a first end and a second end. When the external force on the ejector mechanism 120 is within the normal range, the first end of the main body 211 extends into the first cavity, and the second end of the main body 211 extends into the second cavity. There is a gap between the second end of the main body 211 and the positioning protrusion 12, which serves as a space for the main body 211 to move and retract. Furthermore, since the shape and outer diameter of the main body 211 are adapted to the through hole of the housing 1, the main body 211 can slide against the housing 1 to guide the movement of the needle rod 21, thereby improving the stability and smoothness of the rod's movement relative to the housing 1.

[0066] Figure 4 for Figure 3 Enlarged structural diagram at point B.

[0067] refer to Figures 2-4 In this embodiment, the outer diameter of the limiting part 212 is larger than the outer diameter of the main body 211, and the outer diameter of the limiting part 212 is larger than the inner diameter of the through hole of the limiting protrusion 11. When the external force on the ejector mechanism 120 is within the normal range, since the first end of the main body 211 extends into the first cavity, there is a gap between the limiting part 212 and the limiting protrusion 11, which serves as the space for the movement and retraction of the limiting part 212. Specifically, the gap between the limiting part 212 and the limiting protrusion 11 is larger than the gap between the main body 211 and the positioning protrusion 12.

[0068] The shape and outer diameter of the limiting part 212 are adapted to the first cavity of the housing 1, so that the limiting part 212 can slide with the housing 1 to guide the movement of the needle rod 21 and improve the stability and smoothness of the movement of the rod relative to the housing 1.

[0069] In this embodiment, the limiting part 212 includes a limiting segment 213 and a connecting segment 214. The limiting segment 213 is connected between the connecting segment 214 and the main body part 211. The outer diameter of the limiting segment 213 is larger than the outer diameter of the main body part 211.

[0070] The outer diameter of the connecting section 214 is larger than the outer diameter of the limiting section 213, and the outer diameter of the connecting section 214 is larger than the inner diameter of the opening of the housing 1. When the external force on the ejector mechanism 120 is within the normal range, the connecting section 214 and the opening end of the housing 1 are spaced apart. This design allows the connecting section 214 to abut against the end of the housing 1 when the needle bar 21 retracts, and the end of the housing 1 can limit the movement range of the ejector 2 by limiting the connecting section 214.

[0071] When the external force on the ejector mechanism 120 is within the normal range, the interval between the connecting section 214 and the open end of the housing 1 is consistent with the interval between the main body 211 and the positioning protrusion 12. That is, the connecting section 214 and the housing 1 cooperate, and the main body 211 and the positioning protrusion 12 cooperate to jointly limit the needle bar 21, which can improve the consistency of the displacement restriction of the needle bar 21.

[0072] In this embodiment, the connecting segment 214 includes a body 2141 and a plurality of connecting blocks 2142. The body 2141 is connected to the limiting segment 213, and the plurality of connecting blocks 2142 are arranged circumferentially at intervals at one end of the body 2141 away from the limiting segment 213, forming a socket 215. The design of the plurality of connecting blocks 2142 arranged circumferentially at intervals to form the socket 215 allows for the application of external force to the connecting blocks 2142 to move them apart, thereby enlarging the diameter of the socket 215. Furthermore, after the external force applied to the connecting blocks 2142 is removed, the plurality of connecting blocks 2142 can return to their original shape.

[0073] Each connecting block 2142 includes a guide body 2144 and a connector body 2143. The connector body 2143 connects the guide body 2144 and the main body 2141. The outer diameter of the assembly formed by the guide bodies 2144 of the multiple connecting blocks 2142 gradually increases towards the limiting section 213. The outer diameter of the assembly formed by the connector bodies 2143 of the multiple connecting blocks 2142 is consistent with the outer diameter of the main body 2141.

[0074] In this embodiment, the needle body 22 is connected to the needle bar 21, and the end of the needle body 22 away from the needle bar 21 constitutes the crystal-taking end 23.

[0075] In this embodiment, the needle body 22 is detachably connected to the connecting section 214. This facilitates the removal of the needle body 22 from the needle bar 21, allowing for individual replacement and cleaning of the needle body 22. It also facilitates the connection of the needle body 22 to the needle bar 21, enabling quick disassembly and reassembly of the needle body 22. Specifically, the needle body 22 is inserted into a socket 215 formed by multiple connecting blocks 2142. During the insertion process, since the socket 215 is formed by multiple connecting blocks 2142 arranged circumferentially, applying external force to the connecting blocks 2142 allows them to move away from each other, thus enlarging the diameter of the socket 215 and facilitating the insertion of the needle body 22. Furthermore, after removing the applied force, the connecting blocks 2142 return to their original shape, thus securing the needle body 22.

[0076] In other embodiments, the needle body 22 and the needle bar 21 can also be an integral structure, which can improve the structural strength of the ejector pin 2 and simplify the installation steps between the ejector pin 2 and the housing 1.

[0077] In this embodiment, the outer diameter of the crystal-grabbing end 23 gradually decreases in the direction away from the needle bar 21, which makes it convenient for the crystal-grabbing end 23 to pierce the carrier 200 to pick up the wafer 300.

[0078] The end of the needle body 22 opposite to the crystal-taking end 23 is the mounting end. The shape and outer diameter of the mounting end are adapted to the socket 215, so that the mounting end can be inserted into the socket 215 and connected to the connecting section 214.

[0079] In this embodiment, the ejector mechanism 120 further includes a locking member 6, which is sleeved on the connecting section 214 to restrict the movement of the connecting block 2142 and to lock the multiple connecting blocks 2142 and the needle body 22.

[0080] For example, the outer periphery of the connecting segment 214 is provided with external threads, and the inner peripheral wall of the locking member 6 is provided with internal threads. The external threads and internal threads are screwed together to realize the connection and fixation of multiple connecting blocks 2142 and needle body 22. In addition, the threaded connection between the locking member 6 and the connecting segment 214 facilitates the removal of the locking member 6 from the connecting segment 214, thereby facilitating the assembly and disassembly of the needle body 22 from the connecting segment 214. The external threads are arranged at the adjacent ends of the connecting block 2142 and the main body. Specifically, the external threads are located on the outer periphery of the connecting body 2143 of the connecting block 2142 and the main body.

[0081] In other embodiments, the locking member 6 can be a flexible sleeve, that is, it can be directly sleeved onto the connecting section 214 using its elasticity. Alternatively, the locking member 6 and the connecting section 214 can also be engaged by a snap-fit ​​and a slot.

[0082] In this embodiment, the inner diameter of the locking member 6 is adapted to the outer diameter of the connecting section 214. Since the outer diameter of the whole formed by the guides 2144 of the multiple connecting blocks 2142 gradually increases towards the limiting section 213, the guides 2144 can cooperate with the interior of the locking member 6, thus guiding the connection between the locking member 6 and the connecting section 214.

[0083] refer to Figure 3The elastic element 3 is sleeved on the ejector pin 2. One end of the elastic element 3 is connected to the ejector pin 2, and the other end is connected to the inner peripheral wall of the housing 1. This arrangement not only restricts the setting position of the elastic element 3, but also provides elastic support for the ejector pin 2 to improve the stability of the ejector pin 2 when it picks up the wafer 300 and ensures that the wafer 300 is subjected to uniform force. Therefore, when the external force on the chip-fetching end 23 of the ejector pin 2 is greater than the balance force of the elastic element 3 maintaining natural expansion and contraction, the ejector pin 2 can move relative to the housing 1. At the same time, the elastic element 3 will be compressed and deformed as the ejector pin 2 moves, accumulating elastic potential energy. This can achieve the retraction of the chip-fetching end 23 towards the housing 1, thereby reducing the external force applied by the chip-fetching end 23 to the chip 300, so that the chip-fetching end 23 is slightly separated from the chip 300, thus weakening the influence of the chip-fetching end 23 on the chip 300, or even removing the external force applied by the chip-fetching end 23 to the chip 300, so that the chip-fetching end 23 is completely separated from the chip 300, avoiding damage to the chip 300, thereby ensuring the integrity of the chip 300, ensuring the processing quality and service life of the display screen. When the external force on the crystal-taking end 23 returns to normal, the elastic element 3 recovers its deformation and releases elastic potential energy because the external force is removed. Under the action of elastic potential energy, the ejector pin 2 can move relative to the housing 1 so that the crystal-taking end 23 is reset in a direction away from the housing 1, so as to facilitate subsequent crystal-taking work.

[0084] Specifically, the elastic element 3 is sleeved on the main body 211, and the elastic element 3 abuts and is limited between the limiting part 212 and the limiting protrusion 11. When the external force on the ejector mechanism 120 is within the normal range, the elastic element 3 is in a natural expansion and contraction state, which can provide elastic support for the ejector pin 2. When the external force on the crystal-taking end 23 is greater than the balance force for the elastic element 3 to maintain natural expansion and contraction, the ejector pin 2 will move relative to the housing 1, causing the crystal-taking end 23 to retract toward the housing 1. During this process, the limiting part 212 and the limiting protrusion 11 cooperate to gradually compress the elastic element 3, allowing the elastic element 3 to accumulate elastic potential energy.

[0085] Since the distance between the limiting part 212 and the limiting protrusion 11 is greater than the distance between the main body part 211 and the positioning protrusion 12 when the external force on the ejector mechanism 120 is within the normal range, the difference between the two distances is the length of the compressed elastic member 3 when the ejector 2 retracts to its limit.

[0086] In this embodiment, when the retraction degree of the ejector pin 2 reaches its limit, the deformation degree of the elastic element 3 is less than or equal to the compression deformation limit. Thus, the actual retraction range of the ejector pin 2 is limited by the deformation degree of the elastic element 3, thereby ensuring the limit of retraction of the ejector pin 2.

[0087] In this embodiment, the rebound force of the elastic element 3 is 30g to 100g. The rebound force of the elastic element 3 is determined according to the material of the wafer 300 to ensure that the elastic element 3 can deform in time when the force increases, so as to avoid damaging the wafer 300 and ensure the integrity of the wafer 300.

[0088] In this embodiment, the elastic element 3 is a spring.

[0089] refer to Figure 2 and Figure 3 The limiting section 213 is provided with a slider 4, and the housing 1 is provided with a slide rail 5. The slide rail 5 extends along the length direction of the housing 1. The slider 4 and the slide rail 5 slide together, which can further improve the smoothness of the movement of the ejector pin 2.

[0090] When the elastic member 3 is in its natural extension / retraction state, the distance between the end of the connecting section 214 facing the main body 211 and the opening end of the housing 1 is the same as the length of the slide rail 5. Furthermore, the slider 4 is located at the end of the slide rail 5 furthest from the main body 211. Therefore, the cooperation between the slider 4 and the slide rail 5 can also limit the range of movement of the ejector pin 2.

[0091] Specifically, the limiting section 213 is provided with a mounting hole, the axial direction of which is consistent with the radial direction of the limiting section 213. The inner diameter of the mounting hole is adapted to the outer diameter of the slider 4. The housing 1 is provided with two through holes 16, which are symmetrically arranged about the central axis of the housing 1. The through holes 16 are oblong holes, and their length extends along the length of the housing 1. The two through holes 16 form a slide rail 5. The slider 4 passes through the mounting hole and the two through holes 16, and the slider 4 can move within the through holes 16 as the ejector pin 2 moves.

[0092] The slider 4 is detachably connected to the limiting section 213 and the housing 1, which facilitates the removal of the slider 4 from the limiting section 213 and the housing 1, thereby enabling the disassembly of the ejector pin 2 from the housing 1. Similarly, it also facilitates the connection between the ejector pin 2 and the housing 1. Specifically, the width of the through hole 16 is adapted to the outer diameter of the slider 4. Since the inner diameter of the mounting hole is adapted to the outer diameter of the slider 4, the slider 4 can be inserted and engaged with the limiting section 213 and the housing 1 when it is inserted into the mounting hole and the two through holes 16.

[0093] refer to Figure 1 The ejector mechanism 120 also includes a needle cap 7, the top of which is used to support the carrier 200. The needle cap 7 has a mounting cavity with a top opening. The housing 1 extends into the mounting cavity and is movably connected to the needle cap 7. The housing 1 can drive the ejector pin 2 to move relative to the needle cap 7 so that the wafer-picking end 23 can extend out of the needle cap 7 and pierce the carrier 200 to pick up the wafer 300.

[0094] The ejector mechanism 120 also includes an adsorption component, which is connected to the needle cap 7. The top of the needle cap 7 is provided with an air extraction hole that communicates with its interior, so that the adsorption component is connected to the top of the needle cap 7. The adsorption component is used to draw air from the top of the needle cap 7 to adsorb and fix the carrier 200.

[0095] This application also provides a die bonding apparatus 100 for performing the die bonding process in the manufacturing process of a display screen.

[0096] Figure 5 This is a schematic diagram of the die bonding device 100 in this embodiment.

[0097] refer to Figure 5 The die bonding equipment 100 includes a main unit, a die bonding mechanism 110 mounted on the main unit, and a push pin mechanism 120 as described above. The die bonding mechanism 110 and the push pin mechanism 120 are arranged vertically at intervals. Both the die bonding mechanism 110 and the push pin mechanism 120 are electrically connected to the main unit. The push pins 2 of the push pin mechanism 120 are used to lift the wafer 300 on the carrier 200, and the die bonding mechanism 110 is used to grasp and transfer the lifted wafer 300.

[0098] The die bonding mechanism 110 includes a die bonding arm 1101 and a suction component. The die bonding arm 1101 is movably connected to the host and can move relative to the host. The suction component is disposed on the die bonding arm 1101 and is used to adsorb and fix the wafer 300. Specifically, the suction component includes a suction nozzle 1102 and a suction pump. The suction nozzle 1102 is provided with a suction port and is arranged on the die bonding arm 1101 with the suction port facing downwards. The suction pump communicates with the suction nozzle 1102 and draws air above the wafer 300 through the suction port to adsorb and fix the wafer 300.

[0099] The die bonding equipment 100 also includes a fixing member 130, which is horizontally arranged on the main unit. The fixing member 130 is provided with an operating hole that runs vertically through it. The fixing member 130 is used to fix the outer periphery of the carrier 200 on which the wafer 300 is attached, so that the part of the carrier 200 on which the wafer 300 is attached is located at the operating hole. This facilitates the operation of the die bonding mechanism 110 and the ejector pin mechanism 120 through the operating hole.

[0100] The die bonding device 100 also includes a position detector, which is electrically connected to the host and is used to detect the position information of the wafer 300.

[0101] An exemplary workflow of the above-described die bonding apparatus 100 is as follows:

[0102] The carrier 200 with the wafer 300 attached is fixed by the fastener 130. The position detector detects the position information of the wafer 300 on the carrier 200 and transmits the position information of the wafer 300 to the host. The host controls the die bonding arm 1101 to move, so that the suction nozzle 1102 moves above the wafer 300 and aligns the suction hole of the suction nozzle 1102 with the wafer 300. The host controls the die bonding arm 1101 to move downward so that the suction hole moves to the wafer pick-up position (the preset vertical distance between the suction device and the wafer 300 when the suction device picks up the wafer 300).

[0103] Simultaneously, the host controls the pin cap 7 of the ejector mechanism 120 to move its internal structure to below the carrier 200 and align it with the wafer 300. The host controls the adsorption component to adsorb and fix the portion of the carrier 200 below the wafer 300 to be picked up. Then, the host controls the housing 1 to move vertically upward, causing the picking end 23 of the ejector pin 2 to extend out of the pin cap 7 and pierce the carrier 200 to pick up the wafer 300, thereby detaching the wafer 300 from the carrier 200.

[0104] When the ejector pin 2 lifts the wafer 300 to a preset position, the suction unit is controlled to operate to draw air from above the wafer 300 through the suction hole, creating a negative pressure above the wafer 300 to adsorb and fix the wafer 300. Then, the die bonding arm 1101 is controlled to move so that the wafer 300 is aligned and placed in the die bonding position (located on the substrate of the display screen). Then, the suction unit is closed, and the suction nozzle 1102 releases the wafer 300, completing the die bonding.

[0105] In the process of the ejector mechanism 120 picking up the chip 300, when the external force on the picking end 23 exceeds the normal range, that is, when the external force on the picking end 23 of the ejector 2 is greater than the balance force of the elastic element 3 to maintain natural expansion and contraction, the ejector 2 can move relative to the housing 1. At the same time, the elastic element 3 will be compressed and deformed as the ejector 2 moves, and accumulate elastic potential energy. This can realize the retraction of the picking end 23 towards the housing 1, thereby reducing the external force applied by the picking end 23 to the chip 300, so that the picking end 23 is slightly separated from the chip 300, thus weakening the influence of the picking end 23 on the chip 300, or even removing the external force applied by the picking end 23 to the chip 300 so that the picking end 23 is completely separated from the chip 300, avoiding damage to the chip 300, thereby ensuring the integrity of the chip 300, and ensuring the processing quality and service life of the display screen. Furthermore, when the external force on the crystal-taking end 23 returns to normal, the elastic element 3 recovers its deformation and releases elastic potential energy because the external force is removed. Under the action of elastic potential energy, the ejector pin 2 can move relative to the housing 1 so that the crystal-taking end 23 is reset in a direction away from the housing 1, so as to facilitate subsequent crystal-taking work.

[0106] As can be seen from the above technical solution, this utility model has at least the following advantages and positive effects:

[0107] In this application, the ejector pin is movably connected to the housing, allowing the ejector pin to move relative to the housing. An elastic element is sleeved on the ejector pin, with its two ends connected to the ejector pin and the housing, respectively. This arrangement not only restricts the position of the elastic element but also provides elastic support for the ejector pin, thereby improving the stability of the ejector pin when picking up the wafer and ensuring uniform force on the wafer.

[0108] Therefore, when the external force on the chip-fetching end of the ejector pin exceeds the balance force of the elastic element maintaining its natural expansion and contraction, the ejector pin can move relative to the housing. At the same time, the elastic element will be compressed and deformed as the ejector pin moves, accumulating elastic potential energy. This allows the chip-fetching end to retract towards the housing, reducing the external force applied to the chip by the chip-fetching end, causing the chip-fetching end to slightly detach from the chip, thus weakening the impact of the chip-fetching end on the chip, or even removing the external force applied to the chip by the chip-fetching end, so that the chip-fetching end completely detaches from the chip, avoiding damage to the chip, thereby ensuring the integrity of the chip and ensuring the processing quality and service life of the display screen.

[0109] When the external force on the crystal-taking end returns to normal, the elastic element recovers its deformation and releases elastic potential energy because the external force is removed. Under the action of elastic potential energy, the ejector pin can move relative to the housing so that the crystal-taking end can be reset in a direction away from the housing, so as to facilitate subsequent crystal-taking work.

[0110] In addition, the timely retraction of the ejector pin is achieved under the elastic support of the elastic element, which can also avoid wear and breakage caused by excessive contact force and friction between the ejector pin and the wafer, thereby improving the service life of the ejector pin.

[0111] Although the present invention has been described with reference to several typical embodiments, it should be understood that the terminology used is descriptive and exemplary, and not restrictive. Since the present invention can be embodied in many forms without departing from the spirit or essence of the invention, it should be understood that the above embodiments are not limited to any of the foregoing details, but should be interpreted broadly within the spirit and scope defined by the appended claims. Therefore, all variations and modifications falling within the scope of the claims or their equivalents should be covered by the appended claims.

Claims

1. A lifting pin mechanism for lifting a wafer on a carrier, characterized in that, The ejector pin mechanism includes: The shell has an opening at one end forming a receiving cavity; A ejector pin has a pick-up end for picking up a wafer located on one side of a carrier. The ejector pin extends into the receiving cavity and places the pick-up end outside the housing. The ejector pin is movably connected to the housing. An elastic element is sleeved on the ejector pin. One end of the elastic element is connected to the ejector pin, and the other end is connected to the inner peripheral wall of the housing. The elastic element can extend and retract as the ejector pin moves, so that the wafer-taking end moves toward the housing to retract, thereby disengaging from the wafer. A needle cap, the top of which is used to support the carrier; a mounting cavity with a top opening is formed on the needle cap, the housing extends into the mounting cavity and is movably connected to the needle cap, the housing is movable relative to the needle cap so that the wafer-picking end extends out of the needle cap and picks up the wafer.

2. The ejector mechanism according to claim 1, characterized in that, The ejector pin includes a needle rod and a needle body connected to the needle rod. The end of the needle body facing away from the needle rod constitutes the crystal-taking end. The needle rod is movably disposed on the housing. The needle bar includes a connected main body and a limiting part. The limiting part is located at the end of the main body facing the opening of the housing, and the outer diameter of the limiting part is larger than the outer diameter of the main body. The housing is provided with a limiting protrusion, and the limiting protrusion has a through hole for the main body to pass through; the inner diameter of the through hole is smaller than the outer diameter of the limiting part; The elastic element is sleeved on the main body, and the elastic element abuts and is located between the limiting part and the limiting protrusion.

3. The ejector mechanism according to claim 2, characterized in that, The limiting part includes a limiting segment and a connecting segment, wherein the limiting segment is connected between the connecting segment and the main body part; The outer diameter of the limiting section is larger than the outer diameter of the main body; the outer diameter of the connecting section is larger than the outer diameter of the limiting section, and the outer diameter of the connecting section is larger than the inner diameter of the opening of the housing; When the elastic element is in a natural expansion and contraction state, the connecting section and the open end of the housing are spaced apart.

4. The ejector mechanism according to claim 3, characterized in that, The limiting section is provided with a slider, and the housing is provided with a slide rail. The slide rail extends along the length direction of the housing, and the slider slides in cooperation with the slide rail. When the elastic element is in a natural expansion and contraction state, the distance between the end of the connecting section facing the main body and the opening end of the housing is consistent with the length of the slide.

5. The ejector mechanism according to claim 4, characterized in that, The limiting section is provided with a mounting hole, the axial direction of which is consistent with the radial direction of the limiting section; the inner diameter of the mounting hole is adapted to the outer diameter of the slider. The housing has two through holes, which are symmetrically arranged about the central axis of the housing; the through holes are oblong holes, and the length direction of the through holes extends along the length direction of the housing, and the two through holes form the slide. The slider is inserted through the mounting hole and the two through holes, and the slider can move within the through holes.

6. The ejector mechanism according to claim 3, characterized in that, The needle body is detachably connected to the connecting section; The connecting section includes a body and multiple connecting blocks. The body is connected to the limiting section. The multiple connecting blocks are arranged circumferentially at a distance from one end of the body away from the limiting section. The multiple connecting blocks surround and form a socket. The needle body is inserted into the socket. The ejector pin mechanism also includes a locking member, which is sleeved on the connecting section and used to lock the multiple connecting blocks and the pin body.

7. The ejector mechanism according to claim 6, characterized in that, The outer periphery of the connecting section is provided with external threads, and the inner peripheral wall of the locking member is provided with internal threads. The external threads and the internal threads are screwed together to realize the connection and fixation of multiple connecting blocks and the needle body. The external threads are arranged at adjacent ends of the connecting block and the body.

8. The ejector mechanism according to claim 6, characterized in that, The connecting section includes a guide and a connector, the connector being connected between the guide and the body; the outer diameter of the whole formed by the guides of the plurality of connecting blocks gradually increases toward the limiting section; The inner diameter of the locking member is adapted to the outer diameter of the connecting section.

9. The ejector mechanism according to claim 1, characterized in that, The top of the needle cap is provided with an air extraction hole that communicates with its interior; The ejector mechanism also includes an adsorption element, which is connected to the needle cap and is used to draw air from above the needle cap to adsorb and fix the carrier.

10. A die bonding apparatus, characterized in that, The device includes a host computer, a die bonding mechanism disposed on the host computer, and a pin mechanism as described in any one of claims 1 to 9. The die bonding mechanism and the pin mechanism are arranged vertically at intervals. Both the die bonding mechanism and the pin mechanism are electrically connected to the host computer. The pins of the pin mechanism are used to lift the wafer on the carrier. The die bonding mechanism is used to grasp and transfer the lifted wafer.

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